CN113192911A - Micro-channel radiator - Google Patents
Micro-channel radiator Download PDFInfo
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- CN113192911A CN113192911A CN202110479141.6A CN202110479141A CN113192911A CN 113192911 A CN113192911 A CN 113192911A CN 202110479141 A CN202110479141 A CN 202110479141A CN 113192911 A CN113192911 A CN 113192911A
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- 239000007788 liquid Substances 0.000 claims abstract description 118
- 239000007787 solid Substances 0.000 claims abstract description 52
- 238000010438 heat treatment Methods 0.000 claims abstract description 40
- 230000003014 reinforcing effect Effects 0.000 claims description 31
- 238000003825 pressing Methods 0.000 claims description 17
- 238000009434 installation Methods 0.000 abstract description 18
- 230000000149 penetrating effect Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 15
- 230000000694 effects Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
The invention discloses a microchannel radiator, which comprises a microchannel plate, wherein a plurality of hollow microchannels penetrating through two ends of the microchannel plate are arranged in the microchannel plate, one end of each microchannel is a liquid inlet end, the other end of each microchannel is a liquid outlet end, one surface of the microchannel plate is a mounting surface of a heating device, solid parts are arranged on two sides of the microchannel plate, which are positioned on the hollow microchannels, and mounting parts for fixedly mounting the heating devices are arranged on the solid parts; the thickness h of the microchannel plate is less than 5 mm. According to the technical scheme, the installation part for fixedly installing the heating device is arranged on the solid part, the heating device is fixedly connected with the microchannel plate through the installation part, and the heating device is attached to the installation surface of the microchannel plate, so that the problem that the heating device cannot be directly installed and fixed on the microchannel plate is solved.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a micro-channel heat sink.
Background
With the development of power device technology, the thermal power density is higher and higher, which brings greater and greater challenges to heat dissipation, and more manufacturers consider adopting liquid cooling technology to solve the heat dissipation problem. The traditional water cooling plate is mostly formed into a water channel by machining, pipe burying or drilling, and is high in cost, low in efficiency and not suitable for batch production. With the development and maturity of microchannel technology in recent years, the microchannel heat exchanger has the characteristics of lightness and thinness, and is widely applied to plate-fin heat exchangers. The microchannel structure is directly molded by opening the mold, has low cost, and has a micro porous structure on the cross section, thereby having strong heat dissipation capability. The wall thickness of the micro-channel flat tube structure is generally within 1mm, the minimum aperture of the micro-channel can be 0.2mm, and the structural form of the aperture can be various, such as square, round and various irregular shapes.
Although the micro channel cold plate structure is better in heat dissipation effect than the conventional water cooling plate structure, there are problems in installation if the micro channel structure is too small in size. Therefore, the micro-channel cold plate radiator is not applied to heat dissipation of power devices on a large scale at present, and is mainly limited by the following two reasons:
1. the size of the micro-channel structure plate is usually too light and thin, and devices cannot be directly fixed on the micro-channel structure plate;
2. the micro-channel structure plate is soft due to its thin thickness, and is easy to deform during use, thereby affecting the heat dissipation effect.
Disclosure of Invention
The invention mainly aims to provide a micro-channel radiator, and aims to solve the technical problems that the micro-channel radiator cannot be directly installed and is easy to deform when radiating a power device.
In order to achieve the purpose, the invention provides a microchannel radiator, which comprises a microchannel plate, wherein a plurality of hollow microchannels penetrating through two ends of the microchannel plate are arranged in the microchannel plate, one end of each microchannel is a liquid inlet end, the other end of each microchannel is a liquid outlet end, one surface of the microchannel plate is a mounting surface of a heating device, solid parts are arranged on two sides of the microchannel plate, which are positioned on the hollow microchannels, and mounting parts for fixedly mounting the heating devices are arranged on the solid parts; the thickness h of the microchannel plate is less than 5 mm.
Optionally, the width w1 of the solid part is between 6 and 15mm, and the total width w of the solid part and the microchannel plate is between 40 and 150 mm.
Optionally, the mounting portion is at least one pair of first through holes provided in the solid portion, and the pair of first through holes are respectively located on the solid portions on two sides of the microchannel plate.
Optionally, the solid part and the microchannel plate are integrally molded, or the solid part is formed by extending outwards from the side walls of the microchannel plate at two sides of the hollow microchannel, the width w2 of the hollow microchannel is between 0.3 and 3mm, the wall thickness h1 between the microchannel and the mounting surface of the microchannel plate is between 0.5 and 1.5mm, and the distance between the microchannels is between 0.2 and 1 mm.
Optionally, the thickness h of the microchannel plate is between 3 and 4mm, the thickness w2 of the hollow microchannel is between 0.5 and 2mm, the wall thickness h1 between the microchannel and the installation surface of the microchannel plate is between 0.5 and 1mm, and the distance between the microchannels is between 0.3 and 0.8 mm.
Optionally, the length of the solid portion is equal to the length of the side of the microchannel plate, and the thickness of the solid portion is equal to the thickness of the side of the microchannel plate.
Optionally, the surface of the microchannel plate away from the mounting surface is provided with a reinforcing structure for reinforcing the rigidity of the microchannel plate.
Optionally, the reinforcing structure is a reinforcing pressing block attached to the surface of the microchannel plate away from the mounting surface, and the reinforcing pressing block is provided with a first through hole of a connecting portion connected with the microchannel plate.
Optionally, the mounting portion is at least one pair of first through holes opened on the solid portion, and the pair of first through holes are respectively located on the solid portions on two sides of the microchannel plate; the connecting part is a second through hole which is formed in the reinforcing pressing block and is overlapped with the at least one pair of first through holes; the heating device, the solid part and the reinforcing pressing block are fixedly connected through a bolt nut or a rivet nut.
Optionally, the number of the reinforcing pressing blocks is the same as the number of pairs of the first through holes, and each reinforcing pressing block is provided with a second through hole coinciding with a pair of the first through holes.
Optionally, the liquid inlet collecting portion and the liquid outlet collecting portion are both provided with hollow accommodating cavities, a liquid inlet and a liquid inlet connector communicated with the hollow accommodating cavities are arranged on the liquid inlet collecting portion, a liquid outlet and a liquid outlet connector communicated with the hollow accommodating cavities are arranged on the liquid outlet collecting portion, the liquid inlet connector of the liquid inlet collecting portion is communicated with the liquid inlet end of the micro-channel, and the liquid outlet connector of the liquid outlet collecting portion is communicated with the liquid outlet end of the micro-channel.
Optionally, a liquid inlet end of the microchannel plate is inserted into the liquid inlet connection port of the liquid inlet collecting portion, and a liquid outlet end of the microchannel plate is inserted into the liquid outlet connection port of the liquid outlet collecting portion.
Optionally, the liquid inlet collecting portion is provided with a liquid inlet connecting joint at the liquid inlet, and the liquid outlet collecting portion is provided with a liquid outlet connecting joint at the liquid outlet.
Optionally, an elbow is arranged between the liquid inlet and the liquid inlet connecting joint, and an elbow is arranged between the liquid outlet and the liquid outlet connecting joint.
Optionally, the number of the microchannel plates is multiple, the microchannel plates are communicated end to end, wherein a switching collecting portion is arranged between two adjacent microchannel plates, the switching collecting portion is provided with a hollow accommodating cavity, the switching collecting portion is provided with a first connecting port and a second connecting port, the first connecting port is communicated with a liquid inlet end or a liquid outlet end of one of the two adjacent microchannel plates, and the second connecting port is communicated with a liquid outlet end or a liquid inlet end of the other of the two adjacent microchannel plates.
Optionally, the liquid inlet end or the liquid outlet end of one of the two adjacent microchannel plates is inserted into the first connection port of the adaptor collecting portion, and the liquid outlet end or the liquid inlet end of the other one of the two adjacent microchannel plates is inserted into the second connection port of the adaptor collecting portion.
According to the technical scheme, the installation part for fixedly installing the heating device is arranged on the solid part, the heating device is fixedly connected with the microchannel plate through the installation part, and the heating device is attached to the installation surface of the microchannel plate, so that the problem that the heating device cannot be directly installed and fixed on the microchannel plate is solved; and compared with the prior art, the product cost of the invention can be reduced by more than 80%, and the heat radiation effect is improved by more than 30% compared with the micro-channel radiator formed by machining.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural view of a microchannel plate according to example 1 of the present invention;
FIG. 2 is a schematic structural view of embodiment 1 of the present invention;
FIG. 3 is an exploded view of FIG. 2;
fig. 4 is a schematic structural view of a heat-generating device according to embodiment 1 of the present invention for dissipating heat;
fig. 5 is a schematic structural view of heat dissipation of a plurality of heat generating devices according to embodiment 1 of the present invention;
FIG. 6 is a front view of FIG. 1;
fig. 7 is a schematic structural view of a heat-generating device according to embodiment 2 of the present invention for dissipating heat;
FIG. 8 is a schematic structural view of example 3 of the present invention;
fig. 9 is a schematic structural view of a plurality of heat generating devices according to embodiment 3 of the present invention for dissipating heat;
the reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 10 | |
32 | Liquid inlet connecting joint |
| 11 | Micro-channel | 33 | Elbow |
| 12 | |
40 | Liquid outlet and collecting |
| 10A | |
42 | Liquid outlet connecting joint |
| 10B | |
43 | Elbow |
| 20 | |
50 | |
| 21 | |
51 | Connecting |
| 30 | Liquid |
60 | |
| 31 | |
70 | Switching current-collecting part |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture, and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if the meaning of "and/or" and/or "appears throughout, the meaning includes three parallel schemes, for example," A and/or B "includes scheme A, or scheme B, or a scheme satisfying both schemes A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Example 1
Referring to fig. 1 to 5, the present invention provides a microchannel heat sink, which includes a microchannel plate 10, wherein a plurality of hollow microchannels 11 penetrating through two ends of the microchannel plate 10 are disposed in the microchannel plate 10, one end of each of the microchannels 11 is a liquid inlet end, the other end of each of the microchannels 11 is a liquid outlet end, one surface of the microchannel plate 10 is a mounting surface 12 of a heat generating device 60, solid portions 20 are disposed on two sides of the microchannel plate 10 on the hollow microchannels 11, and a mounting portion 21 for fixedly mounting the heat generating device 60 is disposed on each of the solid portions 20; the thickness h of the microchannel plate 10 is less than 5 mm.
According to the technical scheme, the installation part for fixedly installing the heating device is arranged on the solid part, the heating device is fixedly connected with the microchannel plate through the installation part, and the heating device is attached to the installation surface of the microchannel plate, so that the problem that the heating device cannot be directly installed and fixed on the microchannel plate is solved; and compared with the prior art, the product cost of the invention can be reduced by more than 80%, and the heat radiation effect is improved by more than 30% compared with the micro-channel radiator formed by machining. When the micro-channel heat dissipation device is used, the heating device is fixedly connected with the mounting portion and mounted on the mounting surface, cooling liquid is input into the liquid inlet end of the micro-channel, and the cooling liquid is discharged from the liquid outlet end of the micro-channel after the heating device is subjected to heat dissipation.
The thickness of the two side walls of the existing microchannel plate is thinner, on one hand, to save materials, and on the other hand, to increase the heat conduction effect in practical use, the thickness of the two side walls of the microchannel plate is generally required to be designed to be relatively thinner, so that the two sides of the existing microchannel plate are not designed to be connected with the outside. According to the technical scheme, the installation part for fixedly installing the heating device is arranged on the solid part, the heating device is fixedly connected with the microchannel plate through the installation part, and the heating device is attached to the installation surface of the microchannel plate, so that the problem that the heating device cannot be directly installed and fixed on the microchannel plate is solved.
The invention adopts a mode of arranging solid parts at two sides of the microchannel plate, so that the heat dissipation capability can be ensured only by reflecting the micro characteristic of the microchannel in size, and the microchannel plate needs to have high density of holes, small size of the holes, large number of the holes and small wall thickness. Because the difference of the plate thickness can cause uneven cooling and heating when the microchannel plate is connected with the outside and needs to be welded, and the welding effect is influenced, the total thickness of the microchannel plate can not exceed 5mm, otherwise, the welding can not be directly finished.
Optionally, in this embodiment, the width w1 of the solid portion 20 is between 6 mm and 15mm, and the total width w of the solid portion 20 and the microchannel plate 10 is between 40 mm and 150 mm. The microchannel plate in the prior art is not provided with a solid part, so that the side walls of the microchannel plate at two sides of the hollow microchannel are thin, and a mounting part or an opening cannot be arranged, the width of the solid part in the embodiment is mainly determined according to the position of a device mounting hole, and in order to ensure that the mounting hole can avoid the middle microchannel, the width of the solid part is as small as possible, so that the width w1 of the solid part is between 6 mm and 15 mm. In addition, the total width w of the solid part 20 and the microchannel plate 10 is generally slightly larger than the width of the heating device by 2mm, and the semiconductor power devices have some standard specifications based on the common model selection standard of the semiconductor power devices, so the total width w of the solid part and the microchannel plate is between 40 mm and 150 mm.
Optionally, in this embodiment, the mounting portion 21 is at least one pair of first through holes opened on the solid portion 20, and the pair of first through holes are respectively located on the solid portions 20 at two sides of the microchannel plate 10. Referring to fig. 4 and 5, when the heating device is mounted on the mounting surface, the heating device is fixedly connected to the pair of first through holes through bolts and nuts, and when the number of pairs of the first through holes is multiple, a plurality of heating devices can be simultaneously mounted, that is, one heating device can be correspondingly mounted on one pair of first through holes, or one heating device can be correspondingly mounted on a plurality of pairs of first through holes.
Optionally, in this embodiment, the solid portion 20 is integrally formed with the microchannel plate 10, or the solid portion 20 is formed by extending the side walls of the microchannel plate 10 on both sides of the hollow microchannel 11, and the integral forming can be achieved by mold-opening forming, which can reduce the manufacturing cost. In addition, the total width w of the solid part 20 and the microchannel plate 10 is generally slightly larger than the width of a heating device by 2mm, semiconductor power devices have some standard specifications, and based on the common model selection standard of the semiconductor power devices, the total width w of the solid part 20 and the microchannel plate 10 is between 40 mm and 150mm, the thickness h of the microchannel plate is between 2mm and 5mm, the width w2 of the hollow microchannel is between 0.3 mm and 3mm, and the wall thickness h1 between the microchannel and the installation surface of the microchannel plate is between 0.5 mm and 1.5 mm.
The distance h2 between the microchannel is as small as possible under the condition of guaranteeing the die sinking forming to guarantee that more microchannel holes can be provided, the heat dissipation surface area is increased, the heat dissipation efficiency is improved, and the distance h2 between the microchannels is between 0.2-1 mm.
Optionally, in the embodiment, in order to reduce the production cost while ensuring the heat dissipation effect, the thickness h of the microchannel plate is between 3 and 4mm, the width w2 of the hollow microchannel is between 0.5 and 2mm, the wall thickness h1 between the microchannel and the installation surface of the microchannel plate is between 0.5 and 1mm, and the distance between the microchannels is between 0.3 and 0.8 mm.
In addition, optionally, the length of the solid portion 20 is equal to the length of the side surface of the microchannel plate 10, and the thickness of the solid portion 20 is equal to the thickness of the side surface of the microchannel plate 10. The solid part and the side surface of the microchannel plate are equal in length and thickness, so that the pressure bearing capacity of the microchannel plate can be improved.
The microchannel structure plate of the prior art is soft due to its thin thickness and is prone to deformation during use, and therefore, in this embodiment, the surface of the microchannel plate 10 away from the mounting surface 12 is optionally provided with a reinforcing structure for reinforcing the rigidity of the microchannel plate 10. When the heating device is installed on the installation surface, the surface far away from the installation surface is provided with a reinforcing structure, so that the rigidity of the microchannel plate can be enhanced, and the deformation of the microchannel plate is reduced.
On the basis of the above, optionally, in this embodiment, the reinforcing structure is a reinforcing compact 50 attached to the surface of the microchannel plate 10 away from the mounting surface 12, and a connecting portion 51 connected to the microchannel plate 10 is provided on the reinforcing compact 50. The reinforcing pressing block is connected with the microchannel plate through a connecting part to reinforce the rigidity of the microchannel plate, so that the deformation of the microchannel plate is reduced.
Specifically, the mounting portion 21 is at least one pair of first through holes formed in the solid portion 20, and the pair of first through holes are respectively located on the solid portions 20 on two sides of the microchannel plate 10; the connecting portion 51 is a second through hole that is formed in the reinforcing press block 50 and overlaps with at least one pair of the first through holes; the heating device 60, the solid portion 20 and the reinforcing pressing block 50 are fixedly connected by a bolt nut or a rivet nut. The mode that the heating device, the solid part and the reinforcing pressing block are clamped and fixed is realized through the bolt nut or the rivet nut, on one hand, the reinforcing pressing block plays a role in compressing, and on the other hand, the reinforcing pressing block plays a role in reinforcing the rigidity of the microchannel plate.
Optionally, in this embodiment, the liquid-feeding current-collecting device further includes a liquid-feeding current-collecting portion 30 and a liquid-discharging current-collecting portion 40, the liquid-feeding current-collecting portion 30 and the liquid-discharging current-collecting portion 40 are both provided with a hollow accommodating cavity, the liquid-feeding current-collecting portion 30 is provided with a liquid inlet and a liquid inlet connector 31 communicated with the hollow accommodating cavity, the liquid-discharging current-collecting portion 40 is provided with a liquid outlet and a liquid outlet connector communicated with the hollow accommodating cavity, the liquid inlet connector 31 of the liquid-feeding current-collecting portion 30 is communicated with the liquid inlet end of the microchannel 11, and the liquid outlet connector of the liquid-discharging current-collecting portion 40 is communicated with the liquid outlet end of the microchannel 11. Specifically, in this embodiment, the inlet end of the microchannel plate 10 is inserted into the inlet connection port 31 of the inlet collecting portion 30, and the outlet end of the microchannel plate 10 is inserted into the outlet connection port of the outlet collecting portion 40.
Alternatively, in this embodiment, the liquid inlet collecting portion 30 is provided with a liquid inlet connecting joint 32 at the liquid inlet, and the liquid outlet collecting portion 40 is provided with a liquid outlet connecting joint 42 at the liquid outlet. The liquid inlet collecting part and the liquid outlet collecting part can be quickly connected with an external pipeline through the liquid inlet connecting joint and the liquid outlet connecting joint.
Optionally, in this embodiment, an elbow 33 is disposed between the liquid inlet and the liquid inlet connection joint 42, and an elbow 43 is disposed between the liquid outlet and the liquid outlet connection joint 42. The liquid inlet connecting joint and the liquid outlet connecting joint can be connected with external pipelines in different directions by arranging the elbow, so that the use requirements of different environments are met.
Example 2
Referring to fig. 7, the difference between the present embodiment and embodiment 1 is: the number of the reinforcing pressing blocks 50 is the same as the number of pairs of the first through holes, and each reinforcing pressing block 50 is provided with a mounting hole 51 which is overlapped with a pair of the first through holes. Because the rigidity of the microchannel plate at the position of the first through hole is weakest, the reinforcing pressing blocks are arranged at the pair of first through holes, and each reinforcing pressing block corresponds to the pair of first through holes one to one, so that the rigidity of the first through holes can be improved, and the use of materials is reduced.
Example 3
Referring to fig. 8 and 9, the present embodiment is different from embodiment 1 in that: the number of the microchannel plates 10 is multiple, the microchannel plates 10 are communicated end to end, wherein a switching collecting portion 70 is arranged between two adjacent microchannel plates, the switching collecting portion 70 is provided with a hollow accommodating cavity, the switching collecting portion 70 is provided with a first connector and a second connector which are respectively communicated with the hollow accommodating cavity, the first connector of the switching collecting portion 70 is communicated with a liquid inlet end or a liquid outlet end of one of the two adjacent microchannel plates, and the second connector of the switching collecting portion 70 is communicated with a liquid outlet end or a liquid inlet end of the other one of the two adjacent microchannel plates. When the heating device of semiconductor or electron type is dispelled the heat, because the intensification of equipment, the equipment inner space is all comparatively compact usually, therefore in this embodiment, can be respectively through adjusting the width and the length of a plurality of microchannel plates in order to adapt to the device that generates heat of different sizes, also be the width of a plurality of microchannel plates can be the same, also can be inequality for microchannel plate and the device that generates heat can improve the effective utilization in space in the condition of size assorted, also can improve the radiating efficiency simultaneously, avoid the energy waste.
In this embodiment, the liquid inlet end or the liquid outlet end of one of the two adjacent microchannel plates 10 is inserted into the first connection port of the adaptor collecting portion 70, and the liquid outlet end or the liquid inlet end of the other one of the two adjacent microchannel plates 10 is inserted into the second connection port of the adaptor collecting portion 70. The direct insertion mode can reduce the occupied space of equipment, and when two adjacent microchannel plates are inserted into the switching collecting part, the gaps between the microchannel plates and the switching collecting part are sealed in a sealant mode or a welding mode.
Specifically, referring to fig. 8 and 9, as a manner of this embodiment, the number of the microchannel plates 10 is two, wherein the two microchannel plates 10 are a first microchannel plate 10A and a second microchannel plate 10B, the first microchannel plate 10A and the second microchannel plate 10B are communicated end to end, a switching collecting part 70 is arranged between the first microchannel plate 10A and the second microchannel plate 10B, the switching collecting part 70 is provided with a hollow accommodating cavity, the switching collecting part 70 is provided with a first connecting port and a second connecting port which are respectively communicated with the hollow accommodating cavity, the first connection port of the adapting collecting part 70 is communicated with the liquid inlet end or the liquid outlet end of the first microchannel plate 10A, the second connection port of the adapting collecting part 70 is communicated with the liquid outlet end or the liquid inlet end of the second microchannel plate 10B. The widths of the plurality of microchannel plates may be the same or different, that is, in one mode of this embodiment, the mounting surface on the first microchannel plate may be used to mount a heat generating device with a larger length, and the mounting surface on the second microchannel plate may be used to mount a heat generating device with a smaller length. In practical use, heat dissipation may need to be performed on heat generating devices with different sizes, and in this embodiment, by adding a switching current collector to communicate the first microchannel plate with the second microchannel plate, heat generating devices with different sizes may be mounted on the first microchannel plate and the second microchannel plate, respectively.
In addition, the liquid inlet end or the liquid outlet end of the first microchannel plate 10A is inserted into the first connection port of the adaptor collecting portion 70, and the liquid outlet end or the liquid inlet end of the second microchannel plate 10B is inserted into the second connection port of the adaptor collecting portion 70. The direct plug-in mounting mode can reduce the occupied space of equipment, and when the first microchannel plate and the second microchannel plate are plugged in the transfer collecting part, the gaps between the first microchannel plate and the second microchannel plate and the transfer collecting part are sealed in a sealant mode or a welding mode.
In this embodiment, the first connection port and the second connection port are respectively located on two opposite surfaces of the adapting collecting portion, and when the two adjacent microchannel plates are inserted into the adapting collecting portion, the two adjacent microchannel plates are parallel to each other.
Similarly, the first connection port and the second connection port are respectively located on the surfaces of the switching and current collecting portion, which are perpendicular to each other, and when the two adjacent microchannel plates are inserted into the switching and current collecting portion, an included angle between the two adjacent microchannel plates is 90 degrees.
When the first connecting port and the second connecting port are respectively positioned on the surfaces of the switching collecting part which form an angle with each other, and the two adjacent microchannel plates are inserted into the switching collecting part, the two adjacent microchannel plates form an included angle with each other, so that the method can be suitable for different use environments, and is particularly suitable for the condition that heating devices with different sizes are positioned at the positions which form an angle with each other.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A microchannel radiator is characterized by comprising a microchannel plate, wherein a plurality of hollow microchannels which run through two ends of the microchannel plate are arranged in the microchannel plate, one end of each microchannel is a liquid inlet end, the other end of each microchannel is a liquid outlet end, one surface of the microchannel plate is a mounting surface of a heating device, solid parts are arranged on two sides of the microchannel plate, which are positioned on the hollow microchannels, and mounting parts for fixedly mounting the heating devices are arranged on the solid parts; the thickness h of the microchannel plate is less than 5 mm.
2. The microchannel heat sink of claim 1, wherein the solid portion has a width w1 of between 6 and 15mm, and the total width w of the solid portion and the microchannel plate is between 40 and 150 mm.
3. The microchannel heat sink of claim 1, wherein the solid portion is integrally formed with the microchannel plate or extends outwardly from sidewalls of the microchannel plate on both sides of the hollow microchannel.
4. The microchannel heat sink of claim 1, wherein a surface of the microchannel plate remote from the mounting surface is provided with a stiffening structure for stiffening the microchannel plate.
5. The microchannel heat sink of claim 4, wherein the reinforcing structure is a reinforcing block attached to a surface of the microchannel plate remote from the mounting surface, the reinforcing block having a connection to the microchannel plate.
6. The microchannel heat sink of claim 5, wherein the mounting portion is at least one pair of first through holes opened in the solid portion, the pair of first through holes being respectively located in the solid portions on both sides of the microchannel plate; the connecting part is a second through hole which is formed in the reinforcing pressing block and is overlapped with the at least one pair of first through holes; the heating device, the solid part and the reinforcing pressing block are fixedly connected through a bolt nut or a rivet nut.
7. The microchannel heat sink according to claim 1, further comprising a liquid inlet collecting portion and a liquid outlet collecting portion, wherein the liquid inlet collecting portion and the liquid outlet collecting portion are both provided with hollow accommodating cavities, the liquid inlet collecting portion is provided with a liquid inlet and a liquid inlet connector communicated with the hollow accommodating cavities, the liquid outlet collecting portion is provided with a liquid outlet and a liquid outlet connector communicated with the hollow accommodating cavities, the liquid inlet connector of the liquid inlet collecting portion is communicated with the liquid inlet end of the microchannel, and the liquid outlet connector of the liquid outlet collecting portion is communicated with the liquid outlet end of the microchannel.
8. The microchannel heat sink of claim 7, wherein the inlet end of the microchannel plate is inserted into the inlet connection port of the inlet manifold, and the outlet end of the microchannel plate is inserted into the outlet connection port of the outlet manifold.
9. The microchannel heat sink according to claim 1, wherein the number of the microchannel plates is plural, and the plural microchannel plates are connected end to end, wherein a switching manifold is disposed between two adjacent microchannel plates, the switching manifold has a hollow receiving cavity, the switching manifold has a first connection port and a second connection port, the first connection port of the switching manifold is connected to the liquid inlet end or the liquid outlet end of one of the two adjacent microchannel plates, and the second connection port of the switching manifold is connected to the liquid outlet end or the liquid inlet end of the other of the two adjacent microchannel plates.
10. The microchannel heat sink of claim 9, wherein the liquid inlet end or the liquid outlet end of one of the two adjacent microchannel plates is inserted into the first connection port of the connecting and collecting portion, and the liquid outlet end or the liquid inlet end of the other of the two adjacent microchannel plates is inserted into the second connection port of the connecting and collecting portion.
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| CN202110479141.6A CN113192911A (en) | 2021-04-29 | 2021-04-29 | Micro-channel radiator |
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| CN202110479141.6A CN113192911A (en) | 2021-04-29 | 2021-04-29 | Micro-channel radiator |
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|---|---|---|---|---|
| WO2023076093A1 (en) * | 2021-10-25 | 2023-05-04 | Lam Research Corporation | Microchannel assembly cooled power circuits for power boxes of substrate processing systems |
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