CN218634381U

CN218634381U - High temperature resistant thing allies oneself with intercommunication and uses multilayer circuit board

Info

Publication number: CN218634381U
Application number: CN202222175264.3U
Authority: CN
Inventors: 温群霞
Original assignee: Meizhou Shiya Electronic Co ltd
Current assignee: Meizhou Shiya Electronic Co ltd
Priority date: 2022-08-18
Filing date: 2022-08-18
Publication date: 2023-03-14
Anticipated expiration: 2032-08-18

Abstract

The utility model discloses a high temperature resistant thing allies oneself with intercommunication and uses multilayer circuit board, including circuit board main part, first chip and second chip, the front of first chip is provided with first fin, the front of second chip is provided with the second fin, be provided with coupling mechanism between first fin and the second chip, coupling mechanism includes heat conduction strip and two sets of heat-conducting plates; the utility model discloses a coupling mechanism of design, be convenient for in use can be with the heat transfer of the first chip of operation or second chip for not in the second fin in the first chip of operation in only a set of operation in first chip and the second chip through coupling mechanism, the heat transfer on the radiating fin will be carried out and dispel the heat on not carrying out the radiating fin, the radiating effect that makes the first chip of operation or second chip is better, and the heat dissipation efficiency is promoted, and convenient to use.

Description

High temperature resistant thing allies oneself with intercommunication and uses multilayer circuit board

Technical Field

The utility model belongs to the technical field of the circuit board, concretely relates to high temperature resistant thing allies oneself with intercommunication and uses multilayer circuit board.

Background

The internet is characterized in that the internet is connected with objects, the internet can interconnect various objects together through a network through the gateway when in use, the gateway realizes network interconnection and is complex network interconnection equipment, the gateway can be used for interconnection of a wide area network and a local area network, a multilayer circuit board is internally installed on the gateway, the multilayer circuit board is characterized in that the circuit board internally comprises a multilayer wiring layer, a dielectric layer is arranged between every two layers to form the multilayer circuit board, the dielectric layer is made of glass fiber epoxy resin, the glass fiber epoxy resin has the effect of bearing a certain height and has the function of high temperature resistance, and the multilayer circuit board has a long service life.

When the existing multi-layer circuit board for the internet of things mutual communication is used, a first chip and a second chip on the circuit board generate heat in the process of operation, the heat can be radiated through a first radiating fin and a second radiating fin respectively to radiate the heat, and when the first chip or the second chip does not operate simultaneously in the process of use, the second radiating fin on the first radiating fin or the second chip stops radiating, so that the radiating efficiency of the first chip or the second chip in operation can be reduced, the first radiating fin on the first chip or the second radiating fin on the second chip which is not in operation can also cause waste, the problem that the first chip or the second chip in operation can radiate heat quickly is reduced, and therefore, the multi-layer circuit board for the internet of things mutual communication with high temperature resistance is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high temperature resistant thing allies oneself with intercommunication and uses multilayer circuit board, in order to solve and to propose the mutual general multilayer circuit board of current thing allies oneself with in the above-mentioned background art when using, first chip and second chip on the circuit board can the heat production in service, the heat can dispel the heat through first fin and second fin respectively, distribute away the heat, and in the use when first chip or second chip do not move simultaneously, the second fin on first fin or the second chip just can stop the heat dissipation, at this moment can reduce the radiating efficiency of first chip or second chip in service, and the second fin on first fin on the first chip in service or the second chip in service also can cause the waste, the first chip in service or the second chip in service can carry out quick radiating problem have been reduced.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high temperature resistant thing allies oneself with intercommunication and uses multilayer circuit board, includes circuit board main part, first chip and second chip, the front of first chip is provided with first fin, and first fin can dispel the heat to first chip when using, the front of second chip is provided with the second fin, and the second fin can dispel the heat to the second chip when using, first fin with be provided with coupling mechanism between the second chip, coupling mechanism includes heat conduction strip and two sets of heat-conducting plates, and heat conduction strip and heat-conducting plate all have good heat conduction effect when using, the fixed aluminium heat conduction piece that is provided with in top of heat-conducting plate, the both ends of heat conduction strip with the surface contact of aluminium heat conduction piece.

Preferably, the end portion of the aluminum heat conduction block is fixedly provided with two groups of limiting blocks, when the heat conduction plate is used, the end portion of the heat conduction strip can be conveniently contacted and aligned with the surface of the aluminum heat conduction block through the limiting blocks, and the heat conduction plate is fixed on the surfaces of the first radiating fin and the second radiating fin.

Preferably, two groups of clamping blocks are fixedly arranged on the front side of the circuit board main body, the clamping blocks are fixed on the circuit board main body when the circuit board main body is used, a groove is formed in the clamping blocks, and the heat conducting strip is located in the groove.

Preferably, the thread groove has still been seted up to the inside of fixture block, there is the hob in the inside of thread groove through threaded connection, can carry out the chucking through the hob and fix the heat conduction strip when using.

Preferably, two groups of fixing blocks are fixedly arranged at the top of the heat conducting strip, and clamping grooves are formed in the fixing blocks.

Preferably, the working end of the screw rod penetrates into the clamping groove.

Preferably, the inside corner all around of circuit board main part has all seted up the mounting hole, can make the screw can install the circuit board main part on the shell of gateway through the mounting hole when using, the fixed rubber sleeve that is provided with of inner wall of mounting hole, the front and the back of rubber sleeve are all fixed and are provided with two sets of arc rubber slabs, and arc rubber slab can play the buffering and stop the effect when using.

Preferably, the front face of the circuit board main body is fixedly provided with a capacitor, and a plurality of groups of glass fiber epoxy resin are arranged in the circuit board main body.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) The utility model discloses a coupling mechanism of design, be convenient for in use can be with the heat transfer of the first chip of operation or second chip for not in the second fin in the first chip of operation in only a set of operation in first chip and the second chip through coupling mechanism, the heat transfer on the radiating fin will be carried out and dispel the heat on not carrying out the radiating fin, the radiating effect that makes the first chip of operation or second chip is better, and the heat dissipation efficiency is promoted, and convenient to use.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic view of the connection mechanism of the present invention;

FIG. 3 is a schematic view of the cross-sectional structure of the fastening block of the present invention;

fig. 4 is an enlarged schematic view of a portion a in fig. 1 according to the present invention;

in the figure: 1. a circuit board main body; 2. a first heat sink; 3. a first chip; 4. a second heat sink; 5. a second chip; 6. a heat conducting strip; 7. an arc-shaped rubber plate; 8. an aluminum heat conducting block; 9. a heat conducting plate; 10. a limiting block; 11. a clamping block; 12. a screw rod; 13. a card slot; 14. a fixed block; 15. a thread groove; 16. a groove; 17. mounting holes; 18. a rubber sleeve.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a high-temperature-resistant multilayer circuit board for Internet of things comprises a circuit board main body 1, a first chip 3 and a second chip 5, wherein the first chip 3 and the second chip 5 can complete the operation and processing of a gateway when in use, the front of the first chip 3 is provided with a first radiating fin 2, the front of the second chip 5 is provided with a second radiating fin 4, a connecting mechanism is arranged between the first radiating fin 2 and the second chip 5, the connecting mechanism can conveniently radiate heat when in use and improve the radiating efficiency, the connecting mechanism comprises a heat conducting strip 6 and two groups of heat conducting plates 9, the top of each heat conducting plate 9 is fixedly provided with an aluminum heat conducting block 8, two end parts of the heat conducting strip 6 are in contact with the surface of the aluminum heat conducting block 8, when in use, a part of heat on the first radiating fin 2 can be transmitted to the second radiating fin 4 through the heat conducting strip 6 for radiating, and two groups of limiting blocks 10 are fixedly arranged at the end parts of the aluminum heat conducting block 8, heat-conducting plate 9 is fixed at first fin 2, the surface of second fin 4, the fixed two sets of fixture blocks 11 that are provided with in front of circuit board main part 1, heat conduction strip 6 can be fixed in fixture block 11 when using, recess 16 has been seted up to fixture block 11's inside, heat conduction strip 6 is located recess 16's inside, thread groove 15 has still been seted up to fixture block 11's inside, hob 12 is located thread groove 15 when using, there is hob 12 inside through threaded connection in thread groove 15, the fixed two sets of fixed blocks 14 that are provided with in top of heat conduction strip 6, draw-in groove 13 has been seted up to fixed block 14's inside, the inside of draw-in groove 13 is penetrated to the work end of hob 12, coupling mechanism through the design, be convenient for in use can transmit the heat of first chip 3 or second chip 5 of operation for on the first chip 3 of not operating through coupling mechanism when only a set of operation in first chip 3 and second chip 5 In the second heat dissipation fin 4 in the first heat dissipation fin 2 or the second chip 5, the heat on the heat dissipation fin is transferred to the heat dissipation fin which does not dissipate heat, so that the heat dissipation effect of the first chip 3 or the second chip 5 in operation is better, the heat dissipation efficiency is improved, and the use is convenient.

In this embodiment, it is preferred, mounting hole 17 has all been seted up to inside corner all around of circuit board main part 1, rubber sleeve 18 fixes the inner wall at mounting hole 17 when using, the fixed rubber sleeve 18 that is provided with of inner wall of mounting hole 17, the front and the back of rubber sleeve 18 are all fixed and are provided with two sets of arc rubber slab 7, rubber sleeve 18 through the design, arc rubber slab 7 and mounting hole 17 combine together, be convenient for in use pass circuit board main part 1 through the screw and can protect circuit board main part 1 when the mounting hole 17 is installed on the shell of gateway, prevent to produce the indentation with the surface of screw and the surface of circuit board main part 1 and shell contact after screwing up and lead to cracked condition, conveniently use.

In this embodiment, preferably, the front surface of the circuit board main body 1 is fixedly provided with a capacitor, and a plurality of groups of glass fiber epoxy resins are arranged inside the circuit board main body 1, and when the circuit board main body 1 is used, the glass fiber epoxy resins have a function of bearing high temperature, so that the circuit board main body 1 can resist high temperature.

The utility model discloses a theory of operation and use flow:

the utility model discloses when using, when first chip 3 or second chip 5 do not move, put heat conduction strip 6 in recess 16 suitable position department, and let the both ends of heat conduction strip 6 contact with aluminium heat conduction piece 8, let the work end of hob 12 contact with draw-in groove 13, hold hob 12 at this moment and rotate to the direction that is close to heat conduction strip 6, the work end of hob 12 just penetrates the inside of draw-in groove 13, can fix heat conduction strip 6, at this moment in use when first chip 3 works second chip 5 out of work first chip 3's heat transfer for first fin 2 dispels the heat, at this moment partial heat transfer on first fin 2 is for heat conduction plate 9, heat conduction plate 9 transmits heat to aluminium heat conduction piece 8, aluminium heat conduction piece 8 transmits heat to heat conduction strip 6, heat conduction strip 6 transmits heat to aluminium heat conduction piece 8 on second fin 4, heat conduction plate 9 and transmits heat to the heat dissipation on second fin 4 and dispels the heat, if first chip 3 does not work second chip 5, according to the above-mentioned opposite, heat conduction strip 6 is transported to the principle of heat conduction on the second fin 4, dismantle heat conduction strip 6 according to the principle of carrying out of heat conduction and carrying out the operation, the heat conduction on the principle of the aforesaid heat conduction strip 6 is dismantled;

after the working end of the screw penetrates through the inside of the rubber sleeve 18 in the mounting hole 17 and penetrates into the shell of the gateway, the screw is screwed, the other end of the screw is in contact with the arc-shaped rubber plate 7 on the front side of the rubber sleeve 18, the back of the circuit board main body 1 is in contact with the surface of the shell through the arc-shaped rubber plate 7 on the back side of the rubber sleeve 18, the screw and the gateway shell can be prevented from being in direct contact with the circuit board main body 1, the arc-shaped rubber plate 7 can play a role in protection, and when the screw needs to be detached, the screw can be detached by operating according to the above opposite principle.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high temperature resistant thing allies oneself with intercommunication and uses multilayer circuit board, includes circuit board main part (1), first chip (3) and second chip (5), its characterized in that: the front of first chip (3) is provided with first fin (2), the front of second chip (5) is provided with second fin (4), first fin (2) with be provided with coupling mechanism between second chip (5), coupling mechanism includes heat conduction strip (6) and two sets of heat-conducting plate (9), the fixed aluminium heat conduction piece (8) that is provided with in top of heat-conducting plate (9), the both ends of heat conduction strip (6) with the surface contact of aluminium heat conduction piece (8), the fixed two sets of fixture block (11) that are provided with in front of circuit board main part (1), recess (16) have been seted up to the inside of fixture block (11), heat conduction strip (6) are located the inside of recess (16), thread groove (15) have still been seted up to the inside of fixture block (11), there is hob (12) through threaded connection in the inside of thread groove (15), the fixed top of heat conduction strip (6) is provided with two sets of fixed block (14), fixed block (13) have been seted up to the inside of draw-in groove (14).

2. The high temperature resistant inter-thing communication multilayer circuit board of claim 1, wherein: the end parts of the aluminum heat conducting blocks (8) are fixedly provided with two groups of limiting blocks (10), and the heat conducting plates (9) are fixed on the surfaces of the first radiating fins (2) and the second radiating fins (4).

3. The high temperature resistant inter-thing communication multilayer circuit board of claim 1, wherein: the working end of the screw rod (12) penetrates into the clamping groove (13).

4. The high temperature resistant inter-thing communication multilayer circuit board of claim 3, wherein: mounting hole (17) have all been seted up to the inside corner all around of circuit board main part (1), the inner wall of mounting hole (17) is fixed and is provided with rubber sleeve (18), the front and the back of rubber sleeve (18) are all fixed and are provided with two sets of arc rubber slab (7).

5. The high temperature resistant inter-thing communication multilayer circuit board of claim 4, wherein: the front face of the circuit board main body (1) is fixedly provided with a capacitor, and a plurality of groups of glass fiber epoxy resins are arranged inside the circuit board main body (1).