CN101749975B - Radiating device - Google Patents

Radiating device Download PDF

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Publication number
CN101749975B
CN101749975B CN2008103062822A CN200810306282A CN101749975B CN 101749975 B CN101749975 B CN 101749975B CN 2008103062822 A CN2008103062822 A CN 2008103062822A CN 200810306282 A CN200810306282 A CN 200810306282A CN 101749975 B CN101749975 B CN 101749975B
Authority
CN
China
Prior art keywords
heat
section
heat pipe
pipe
abstractor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008103062822A
Other languages
Chinese (zh)
Other versions
CN101749975A (en
Inventor
许寿标
周世文
陈俊吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Zhongke Globaltek Optoelectronics Light Energy Co ltd
Shenzhen Qichuangmei Tech Co Ltd
Original Assignee
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hong Jun Precision Industry Co ltd, Fuzhun Precision Industry Shenzhen Co Ltd filed Critical Hong Jun Precision Industry Co ltd
Priority to CN2008103062822A priority Critical patent/CN101749975B/en
Priority to US12/432,745 priority patent/US20100147502A1/en
Publication of CN101749975A publication Critical patent/CN101749975A/en
Application granted granted Critical
Publication of CN101749975B publication Critical patent/CN101749975B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/08—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The present invention relates to a radiating device comprising a hot pipe and other two hot pipes. The hot pipe and the other two hot pipes comprise a heat absorbing and a connecting section for connecting the heat absorbing section and a heat releasing section, and the diameter of the heat absorbing section of the hot pipe and the other hot pipes is smaller than that of the heat releasing section. The hot pipe is arranged between the other two hot pipes. The heat absorbing section and the heat releasing section of the hot pipe are coplane, and the absorbing section and the heat releasing section of the other two hot pipes are not coplane. A distance between the heat releasing section of the hot pipe and the heat releasing section of the other two hot pipe are larger than the distance between the heat absorbing section of the hot pipe and the heat absorbing section of the other two hot pipes. Compared with the prior art, the diameter of the heat absorbing section of the hot pipe in the radiating device is smaller than that of the heat releasing section, and the diameter of the hot pipe is unevenly distributed; when the radiating device in work, absorbed heat can be rapidly conducted to the heat releasing section by the heat absorbing section of the hot pipe; thus, metal material for making the hot pipe is saved on the premise that the performance of the hot pipe is not affected; and the production cost is reduced.

Description

Heat abstractor
Technical field
The present invention relates to a kind of heat abstractor, refer to a kind of heat abstractor of cooling electronic components especially.
Background technology
Along with electronic industry constantly develops, the speed of service of electronic components such as central processing unit and overall performance constantly promote, its caloric value increases thereupon, on the other hand, the integrated level of electronic component is deepened day by day, volume is more and more littler, so its heating problem is also just more outstanding, makes industry use the heat abstractor of metal solid heat radiation can't satisfy the radiating requirements of high-end electronic component merely.
For this reason, industry is brought into use the heat abstractor that has heat pipe.Heat pipe mainly is made up of an amount of hydraulic fluid (as water, alcohol, acetone etc.) in the capillary structure that arranges on vacuum-packed tubular shell, the inner walls (as powder sintered thing, groove structure, screen net structure etc.) and the housing of packing into thereof.Heat pipe is heated, cools off by hydraulic fluid and carries out that gas, liquid two phase change are inhaled, thermal discharge reaches the heat transfer purpose, and is fast and heat transfer distances is long is used widely owing to Heat Transfer of Heat Pipe on Heat Pipe speed.
Traditional heat pipe type heat abstractor comprises for a base of contact electronic component, is located at the some radiating fins on this base and connects a heat pipe of this base and radiating fin.When using this heat abstractor, base absorbs the heat that electronic component produces, and heat is passed to radiating fin and then is distributed to surrounding space from this base via heat pipe.Yet the diameter homogeneous of heat pipe and bigger usually in traditional heat pipe type heat abstractor makes the consumptive material of entire heat dissipation device more, and manufacturing cost is higher.
Summary of the invention
In view of this, be necessary to provide a kind of lower-cost heat abstractor.
A kind of heat abstractor, comprise first heat pipe, second heat pipe and the 3rd heat pipe, this first heat pipe and second, the 3rd heat pipe comprises an endotherm section, one linkage section of one heat release section and connection endotherm section and heat release section, described first heat pipe and second, the diameter of the endotherm section of the 3rd heat pipe is littler than the diameter of heat release section, described first heat pipe is positioned at second, between the 3rd heat pipe, endotherm section and the heat release section of described first heat pipe are coplanar, described second, the endotherm section of the 3rd heat pipe and heat release section antarafacial, the heat release section of described first heat pipe and described second, distance between the heat release section of the 3rd heat pipe is greater than the endotherm section and described second of described first heat pipe, distance between the endotherm section of the 3rd heat pipe.
Compared with prior art, the diameter of heat pipe heat-absorbing section is littler than the diameter of heat release section in the heat abstractor of the present invention, the diameter of heat pipe distributes and is inhomogeneous, during heat abstractor work, the endotherm section of heat pipe can conduct to the heat that absorbs rapidly the heat release section of heat pipe, make the used metal material of heat pipe thereby under the prerequisite that does not influence properties of hot pipe, saved, reduced production cost.
With reference to the accompanying drawings, the invention will be further described in conjunction with the embodiments.
Description of drawings
Fig. 1 is the three-dimensional assembly diagram of one embodiment of the invention heat abstractor.
Fig. 2 is the three-dimensional exploded view of heat abstractor among Fig. 1.
The specific embodiment
Please refer to Fig. 1 and Fig. 2, the heat abstractor of one embodiment of the invention is used for the electronic component (not shown) that is installed on the circuit board (not shown) is dispelled the heat.Three heat pipes 30 that this heat abstractor comprises a base 10, is arranged at a fins group 20 of these base 10 tops, heat conduction connects base 10 and fins group 20, be arranged at a fan 40 of fins group 20 front sides and in order to this fan 40 is fixed on two fan Fixtures 50 on the fins group 20.
Described base 10 is made by the heat conductivility good metal.This base 10 comprises a base plate 12 and a top board 14.The bottom surface of this base plate 12 is used for contacting with electronic component, and its top offers in order to three of the ccontaining heat pipe 30 first parallel grooves 122.This top board 14 comprises a rectangular body portion 142 and locates outward extending four button arms 144 from 142 4 jiaos of bodies.That the bottom of this body 142 offers is corresponding with first groove 122, in order to three of the ccontaining heat pipe 30 second parallel grooves 146.End of each button arm 144 offers a through hole 148, thereby use to pass for fastener 149 this heat abstractor is installed on the circuit board.
Described fins group 20 comprises some fins parallel to each other that are stacked, and wherein each fin is made by sheet metal, and a slot 22 is respectively offered in fins group 20 both sides, and fins group 20 offers three through holes 24 that heating tube 30 penetrates.
Described each heat pipe 30 comprises an endotherm section 32, a heat release section 34 and connects a linkage section 36 of endotherm section 32 and heat release section 34.The endotherm section 32 of heat pipe 30 is placed in first groove 122 and second groove, the 146 common passages that form of base 10, and the heat release section 34 of heat pipe 30 is inserted in the through hole 24 of fins group 20.The diameter of each heat pipe 30 distributes and is inhomogeneous, the diameter of the endotherm section 32 of each heat pipe 30 is littler than the diameter of heat release section 34, the diameter of the linkage section 36 of heat pipe 30 becomes big at an end that is connected with endotherm section 32 gradually to the other end that is connected with heat release section 34, in the present embodiment, the diameter of heat pipe 30 endotherm sections 32 is 6mm, the diameter of heat release section 34 is 8mm, when heat abstractor is worked, the endotherm section 32 of heat pipe 30 can conduct to the heat that absorbs from base 10 rapidly the heat release section 34 of heat pipe 30, make the used metal material of heat pipe 30 thereby under the prerequisite that does not influence heat pipe 30 performances, saved, also reduce simultaneously the size with the base 10 of endotherm section 32 combinations of heat pipe 30, reduced production cost.The heat release section 34 of each heat pipe 30 is angled with endotherm section 32, in the present embodiment, the heat release section 34 of each heat pipe 30 is perpendicular to endotherm section 32, and the endotherm section 32 and the heat release section 34 that are inserted in the heat pipe 30 in the middle of the fins group 20 are positioned at same plane, and are inserted in endotherm section 32 and heat release section 34 antarafacials of the heat pipe 30 of fins group 20 both sides.
Described fan 40 comprises a square framework 42 and is placed in a impeller 44 in the framework 42 that this framework offers through hole 420 for 42 4 jiaos.
Described each fan Fixture 50 comprises that an installation portion 52 reaches from the extended cramp 54 of installation portion 52 1 lateral bucklings.Form a circular arc otch 522 in the middle of these installation portion 52 opposite sides, with thinking that fan 40 provides gas channel, the two ends up and down of this installation portion 52 offer the screw 520 corresponding with the through hole 420 of fan 40.
When assembling this heat abstractor, top board 14 and the base plate 12 of base 10 fit, make second groove 146 of base 10 top boards 14 aim at first groove 122 of base plates 12, the endotherm section 32 of heat pipe 30 is contained in first groove 122 of base 10 and the passage that second groove 146 forms.The heat release section 34 of heat pipe 30 penetrates in the through hole 24 of fins group 20.The cramp 54 of each fan Fixture 50 is buckled in the slot 22 of fins group 20, at last fan 40 is fixed on the fan Fixture 50, thereby finishes the assembling of heat abstractor.
Compared with prior art, the diameter of each heat pipe 30 endotherm section 32 is littler than the diameter of heat release section 34 in the heat abstractor of the present invention, the diameter of each heat pipe 30 distributes and is inhomogeneous, during heat abstractor work, the endotherm section 32 of heat pipe 30 can conduct to the heat that absorbs from base 10 rapidly the heat release section 34 of heat pipe 30, make the used metal material of heat pipe 30 thereby under the prerequisite that does not influence heat pipe 30 performances, saved, also reduced the size of the base 10 that cooperates with heat pipe 30 simultaneously, reduced production cost.In addition, because endotherm section 32 diameters of heat pipe 30 are less, the volume of entire heat dissipation device also can correspondingly be reduced, meet the trend that the volume of electronic product day by day reduces, thereby improve the heat abstractor application flexibility.

Claims (9)

1. heat abstractor, comprise first heat pipe, second heat pipe and the 3rd heat pipe, this first heat pipe and second, the 3rd heat pipe includes an endotherm section, one linkage section of one heat release section and connection endotherm section and heat release section, it is characterized in that: described first heat pipe and second, the diameter of the endotherm section of the 3rd heat pipe is littler than the diameter of heat release section, described first heat pipe is positioned at described second, between the 3rd heat pipe, endotherm section and the heat release section of described first heat pipe are coplanar, described second, the endotherm section of the 3rd heat pipe and heat release section antarafacial, the heat release section of described first heat pipe and described second, distance between the heat release section of the 3rd heat pipe is greater than the endotherm section and described second of described first heat pipe, distance between the endotherm section of the 3rd heat pipe.
2. heat abstractor as claimed in claim 1, it is characterized in that: the endotherm section of described first heat pipe is vertical with heat release section.
3. heat abstractor as claimed in claim 1, it is characterized in that: the diameter of the linkage section of described first heat pipe becomes big at an end that is connected with endotherm section gradually to the other end that is connected with heat release section.
4. heat abstractor as claimed in claim 1, it is characterized in that: the diameter of the endotherm section of described first heat pipe is 6mm, the diameter of heat release section is 8mm.
5. heat abstractor as claimed in claim 1, it is characterized in that: described heat abstractor also comprises a base and a fins group, and the endotherm section of described first heat pipe connects this base, and the heat release section of first heat pipe connects this fins group.
6. heat abstractor as claimed in claim 5, it is characterized in that: described base comprises a base plate and is positioned at a top board on the base plate, the top of this base plate and the bottom of top board are offered first groove and second groove respectively, and the endotherm section of first heat pipe is folded between the base plate of base and the top board and is placed in this first groove and second groove.
7. heat abstractor as claimed in claim 6 is characterized in that: the top board of described base comprises a body and the some button arms that extend around body, and some fasteners wear the button arm and are used for heat abstractor is installed in a circuit board.
8. heat abstractor as claimed in claim 5, it is characterized in that: described heat abstractor also comprises a fan, this fan is installed in fins group one side.
9. heat abstractor as claimed in claim 8, it is characterized in that: described heat abstractor also comprises a fan Fixture, this fan Fixture comprises that an installation portion reaches from the extended cramp of installation portion one lateral buckling, this fan is fixed on the installation portion, and this cramp is buckled in the slot of offering on the fins group.
CN2008103062822A 2008-12-16 2008-12-16 Radiating device Expired - Fee Related CN101749975B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008103062822A CN101749975B (en) 2008-12-16 2008-12-16 Radiating device
US12/432,745 US20100147502A1 (en) 2008-12-16 2009-04-29 Heat dissipation device with heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2008103062822A CN101749975B (en) 2008-12-16 2008-12-16 Radiating device

Publications (2)

Publication Number Publication Date
CN101749975A CN101749975A (en) 2010-06-23
CN101749975B true CN101749975B (en) 2013-07-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008103062822A Expired - Fee Related CN101749975B (en) 2008-12-16 2008-12-16 Radiating device

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US (1) US20100147502A1 (en)
CN (1) CN101749975B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102520775A (en) * 2011-11-23 2012-06-27 东莞市几度电子科技有限公司 CPU (central processing unit) radiator
US9121645B2 (en) 2013-02-11 2015-09-01 Google Inc. Variable thickness heat pipe
US10048017B2 (en) * 2015-12-01 2018-08-14 Asia Vital Components Co., Ltd. Heat dissipation unit
CN106931815A (en) * 2017-04-27 2017-07-07 长沙理工大学 A kind of reducing series and parallel conduit plate type pulsating heat pipe
CN109916207B (en) * 2018-06-12 2020-05-26 山东大学 Loop heat pipe with diameter-variable ascending pipe
CN112153863B (en) * 2020-09-17 2023-03-21 南通大学 Heat radiation assembly

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101026943A (en) * 2006-02-17 2007-08-29 富准精密工业(深圳)有限公司 Guided radiating device
CN101072485A (en) * 2006-05-12 2007-11-14 富准精密工业(深圳)有限公司 Radiating device
CN101193535A (en) * 2006-12-01 2008-06-04 富准精密工业(深圳)有限公司 Heat pipe radiator

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3572426A (en) * 1967-10-05 1971-03-23 Gen Electric Underwater heat exchange system
AU2003298561A1 (en) * 2002-08-23 2004-05-13 Jonathan S. Dahm Method and apparatus for using light emitting diodes
TWM242770U (en) * 2003-10-03 2004-09-01 Molex Inc Heat sink module having dual fans
US7174951B1 (en) * 2005-08-30 2007-02-13 Asia Vital Component Co., Ltd. Radiator module structure
US7766074B2 (en) * 2006-05-12 2010-08-03 Cpumate Inc. Heat-dissipating device having air-guiding structure
US20080105406A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat pipe with variable grooved-wick structure and method for manufacturing the same
US7610950B2 (en) * 2006-11-08 2009-11-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
US7866375B2 (en) * 2006-12-01 2011-01-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
US7518861B2 (en) * 2007-04-20 2009-04-14 Hewlett-Packard Development Company, L.P. Device cooling system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101026943A (en) * 2006-02-17 2007-08-29 富准精密工业(深圳)有限公司 Guided radiating device
CN101072485A (en) * 2006-05-12 2007-11-14 富准精密工业(深圳)有限公司 Radiating device
CN101193535A (en) * 2006-12-01 2008-06-04 富准精密工业(深圳)有限公司 Heat pipe radiator

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Publication number Publication date
US20100147502A1 (en) 2010-06-17
CN101749975A (en) 2010-06-23

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Granted publication date: 20130703

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