CN102520775A - CPU (central processing unit) radiator - Google Patents
CPU (central processing unit) radiator Download PDFInfo
- Publication number
- CN102520775A CN102520775A CN2011103769623A CN201110376962A CN102520775A CN 102520775 A CN102520775 A CN 102520775A CN 2011103769623 A CN2011103769623 A CN 2011103769623A CN 201110376962 A CN201110376962 A CN 201110376962A CN 102520775 A CN102520775 A CN 102520775A
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- Prior art keywords
- heat
- heat pipe
- cpu
- copper
- radiator
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a CPU (central processing unit) radiator. The CPU radiator comprises a heat pipe, a copper bottom and a radiating base, wherein the heat pipe is fastened on the copper bottom which is fastened on the radiating base; and the heat pipe is positioned between the copper bottom and the radiating base. The CPU radiator provided by the invention has the advantages that since the heat pipe is fastened on the copper bottom, not only can the protective action be performed for the heat pipe, but also the installation of the heat pipe is convenient, the installation efficiency is high, and the copper bottom also can be made to be thinner so as to be convenient for radiation and also lead the production process to be simpler.
Description
Technical field
The present invention relates to electronic technology field, particularly a kind of cpu heat.
Background technology
On the mode of the heat pipe that cpu heat is provided in the prior art through welding was welded at the bottom of the copper, that need do at the bottom of this copper was thicker, because mounting process is complicated, inconvenience is installed, and radiating effect is bad.
Summary of the invention
The present invention provides a kind of cpu heat, its good heat dissipation effect, can play a protective role by opposite heat tube.
To achieve these goals, the present invention provides following technical scheme:
A kind of cpu heat, it comprises: at the bottom of heat pipe, the copper and heat dissipation base, wherein: said heat pipe is buckled on the said heat dissipation base at the bottom of the said copper on being buckled at the bottom of the said copper, and said heat pipe is at the bottom of the said copper and between the said heat dissipation base.
Preferably, have corresponding each bar heat pipe at the bottom of the said copper and be the groove of independent strip, said heat pipe is U-shaped and is many that the U-shaped bottom of said heat pipe is buckled in the said groove.
Through implementing above technical scheme; Have following technique effect: cpu heat provided by the invention on heat pipe being installed at the bottom of the copper, both can play a protective role by opposite heat tube; And easy for installation, installation effectiveness is high; Also can make do at the bottom of the copper thinner, be convenient to heat radiation, also make production technology simpler.
Description of drawings
The STRUCTURE DECOMPOSITION figure (front view) of the cpu heat that Fig. 1 provides for the embodiment of the invention;
The STRUCTURE DECOMPOSITION figure (vertical view) of the cpu heat that Fig. 2 provides for the embodiment of the invention;
The wiring layout (vertical view) of the cpu heat that Fig. 3 provides for the embodiment of the invention;
The wiring layout (stereographic map) of the cpu heat that Fig. 4 provides for the embodiment of the invention;
The application drawing (exploded view) of the cpu heat that Fig. 5 provides for the embodiment of the invention;
The application drawing (wiring layout) of the cpu heat that Fig. 6 provides for the embodiment of the invention.
Embodiment
Technical scheme is for a better understanding of the present invention described embodiment provided by the invention in detail below in conjunction with accompanying drawing.
The embodiment of the invention provides a kind of cpu heat; Like Fig. 1, Fig. 2, Fig. 3 and shown in Figure 4; This cpu heat comprises: at the bottom of heat pipe 120, the copper 130 and heat dissipation base 110; Wherein: said heat pipe 120 is buckled at the bottom of the said copper on 130, and 130 are buckled on the said heat dissipation base 110 at the bottom of the said copper, and said heat pipe 120 at the bottom of the said copper 130 and said heat dissipation base 110 between.Among this embodiment, this heat pipe 120 is used for heat radiation, has many, is in juxtaposition.Through heat pipe 120 being installed at the bottom of the copper on 130, both can play a protective role by opposite heat tube 120, and easy for installation, installation effectiveness is high, also can make at the bottom of the copper 130 do thinner, be convenient to heat radiation, also make production technology simpler.
In the present embodiment, more concrete, 130 have the independently groove of strip at the bottom of the said copper, and the quantity of this groove and heat pipe 120 is identical and the position is corresponding, and said heat pipe 120 is U-shaped and is many that the U-shaped bottom of said heat pipe 120 is buckled in the said groove.
In Fig. 5 and Fig. 6, the U-shaped end of the heat pipe 120 of this cpu heat is inserted in the radiating block 130, so that this CPU better dispels the heat.
More than a kind of cpu heat that the embodiment of the invention provided has been carried out detailed introduction; For one of ordinary skill in the art; Thought according to the embodiment of the invention; The part that on embodiment and range of application, all can change, in sum, this description should not be construed as limitation of the present invention.
Claims (2)
1. a cpu heat is characterized in that, comprising: at the bottom of heat pipe, the copper and heat dissipation base, wherein: said heat pipe is buckled on the said heat dissipation base at the bottom of the said copper on being buckled at the bottom of the said copper, and said heat pipe is at the bottom of the said copper and between the said heat dissipation base.
2. cpu heat according to claim 1 is characterized in that, has corresponding each bar heat pipe at the bottom of the said copper and be the groove of independent strip, and said heat pipe is U-shaped and is many, is buckled in the said groove bottom the U-shaped of said heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103769623A CN102520775A (en) | 2011-11-23 | 2011-11-23 | CPU (central processing unit) radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103769623A CN102520775A (en) | 2011-11-23 | 2011-11-23 | CPU (central processing unit) radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102520775A true CN102520775A (en) | 2012-06-27 |
Family
ID=46291727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103769623A Pending CN102520775A (en) | 2011-11-23 | 2011-11-23 | CPU (central processing unit) radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102520775A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2618300Y (en) * | 2003-04-17 | 2004-05-26 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe radiator |
| CN201039636Y (en) * | 2006-08-02 | 2008-03-19 | 深圳市七彩虹科技发展有限公司 | Radiator |
| CN101749975A (en) * | 2008-12-16 | 2010-06-23 | 富准精密工业(深圳)有限公司 | Radiating device |
| JP3171782U (en) * | 2011-08-09 | 2011-11-17 | 林俊宏 | Fin-type heatsink to enhance heat dissipation |
| CN202421983U (en) * | 2011-11-23 | 2012-09-05 | 东莞市几度电子科技有限公司 | Heat radiator of central processing unit (CPU) |
-
2011
- 2011-11-23 CN CN2011103769623A patent/CN102520775A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2618300Y (en) * | 2003-04-17 | 2004-05-26 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe radiator |
| CN201039636Y (en) * | 2006-08-02 | 2008-03-19 | 深圳市七彩虹科技发展有限公司 | Radiator |
| CN101749975A (en) * | 2008-12-16 | 2010-06-23 | 富准精密工业(深圳)有限公司 | Radiating device |
| JP3171782U (en) * | 2011-08-09 | 2011-11-17 | 林俊宏 | Fin-type heatsink to enhance heat dissipation |
| CN202421983U (en) * | 2011-11-23 | 2012-09-05 | 东莞市几度电子科技有限公司 | Heat radiator of central processing unit (CPU) |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: YIN JIANJUN Free format text: FORMER OWNER: DONGGUAN JIDU ELECTRONIC TECHNOLOGY CO., LTD. Effective date: 20140317 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 523000 DONGGUAN, GUANGDONG PROVINCE TO: 638400 GUANG'AN, SICHUAN PROVINCE |
|
| TA01 | Transfer of patent application right |
Effective date of registration: 20140317 Address after: Gao Shi Xiang Village 638400 wusheng County in Sichuan Province Huaqiang Group No. 26 7 Applicant after: Yin Jianjun Address before: 523000 Guangdong Province, Dongguan city Fenggang town Yan Tian AON industrial city sixty-third Applicant before: Dongguan Jidu Electronic Technology Co., Ltd. |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120627 |