CN202455714U - Power device radiator device - Google Patents
Power device radiator device Download PDFInfo
- Publication number
- CN202455714U CN202455714U CN2011205356974U CN201120535697U CN202455714U CN 202455714 U CN202455714 U CN 202455714U CN 2011205356974 U CN2011205356974 U CN 2011205356974U CN 201120535697 U CN201120535697 U CN 201120535697U CN 202455714 U CN202455714 U CN 202455714U
- Authority
- CN
- China
- Prior art keywords
- radiator
- circuit board
- power device
- power devices
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a power device radiator device, which comprises a radiator, power devices and a circuit board. The circuit board is fixedly arranged on the surface of the radiator through studs, the power devices are uniformly arranged on the upper side surface and the lower side surface of the radiator at intervals, and contacts of the power devices are welded on the circuit board. The power devices are directly fixedly arranged on the sides of the radiator, a bent plate is eliminated, the size of the radiator device is reduced, space is saved, assembly efficiency is improved, and processing cost is lowered. Besides, welded directions of the power devices on the circuit board are changed, the power devices are directly fixedly arranged on the sides of the radiator, the surface of the radiator is flush with the edges of the circuit board, and radiating efficiency is effectively improved.
Description
Technical field
The utility model belongs to the radiator field, especially a kind of power device heat sink arrangement.
Background technology
At present; Radiator is adopted in the heat radiation of power device usually; Circuit board is packed on the radiator through double-screw bolt, and the circuit board side is installed bent plate on radiator, and the power device that is welded on the circuit board is packed on the bent plate; Power device conducts to radiator through bent plate with heat, thereby realizes the purpose of heat radiation.There are many defectives in this form: 1, owing at the circuit board side bent plate has been installed, the surface that makes radiator thus is greater than circuit board, and power device needs through bent plate heat to be conducted to radiator and realizes heat radiation, and radiating effect is relatively poor; 2, because the existence of bent plate causes the entire radiator device volume bigger, it is bigger to take up room; 3, mounting screw is more, and dismounting is comparatively complicated; 4, power device is welded in the circuit board front, has increased the height of circuit board.
The utility model content
The purpose of the utility model is to overcome the weak point of prior art, and a kind of simple in structure, good heat dissipation effect, power device heat sink arrangement with low cost are provided.
The utility model solves its technical problem and takes following technical scheme to realize:
A kind of power device heat sink arrangement; Comprise radiator, power device, circuit board; Surface at radiator installs circuit board through double-screw bolt; The welding of power device and circuit board is characterized in that: be uniformly distributed with at interval at the upper and lower dual-side of radiator and be fixed with power device, the contact welded and installed of each power device is on circuit board.
And the surface area of said radiator is suitable with the area of circuit board.
The advantage and the beneficial effect of the utility model are:
1, this heat sink arrangement directly is packed in the radiator side with power device, has omitted bent plate, has not only reduced the volume of device, has saved the space, has also improved efficiency of assembling simultaneously, has reduced processing cost.
2, this heat sink arrangement has changed the direction of power device and circuit board welding, and power device directly is packed in the radiator side, has realized that spreader surface flushes with the edge of circuit board, has effectively improved radiating efficiency.
Description of drawings
Fig. 1 is the perspective view of the utility model.
Embodiment
Below in conjunction with accompanying drawing and through specific embodiment the utility model is done further to detail, following examples are descriptive, are not determinate, can not limit the protection range of the utility model with this.
A kind of power device heat sink arrangement comprises radiator 1, power device 3, circuit board 5, installs circuit board on the surface of radiator through double-screw bolt 6 and screw 7.
Be uniformly distributed with at interval at the upper and lower dual-side of radiator and be fixed with power device through trip bolt 2, the contact 4 direct welded and installed of each power device are on circuit board.
The surface area of radiator and the area of circuit board are basic identical, and the model of radiator (profile and size) is chosen or processed according to the size of circuit board and the size that needs to fix the power device that dispels the heat, and can improve the radiating effect of radiator thus.
Claims (2)
1. power device heat sink arrangement; Comprise radiator, power device, circuit board; Surface at radiator installs circuit board through double-screw bolt; Power device and circuit board welding, it is characterized in that: be uniformly distributed with in the upper and lower two sides of radiator at interval and be fixed with power device, the contact welded and installed of each power device is on circuit board.
2. power device heat sink arrangement according to claim 1 is characterized in that: the surface area of said radiator is suitable with the area of circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205356974U CN202455714U (en) | 2011-12-20 | 2011-12-20 | Power device radiator device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205356974U CN202455714U (en) | 2011-12-20 | 2011-12-20 | Power device radiator device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202455714U true CN202455714U (en) | 2012-09-26 |
Family
ID=46871532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205356974U Expired - Fee Related CN202455714U (en) | 2011-12-20 | 2011-12-20 | Power device radiator device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202455714U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11083107B2 (en) | 2018-12-29 | 2021-08-03 | Delta Electronics (Shanghai) Co., Ltd. | Electronic device and power module thereof |
-
2011
- 2011-12-20 CN CN2011205356974U patent/CN202455714U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11083107B2 (en) | 2018-12-29 | 2021-08-03 | Delta Electronics (Shanghai) Co., Ltd. | Electronic device and power module thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 300180 Hedong District, Tianjin Jintang Road, No. 174 Patentee after: TIANJIN RESEARCH INSTITUTE OF ELECTRIC SCIENCE Co.,Ltd. Patentee after: TIANJIN TIANCHUAN ENERGY EQUIPMENT Co.,Ltd. Address before: 300180 Hedong District, Tianjin Jintang Road, No. 174 Patentee before: TIANJIN DESIGN & RESEARCH INSTITUTE OF ELECTRIC DRIVE Co.,Ltd. Patentee before: TIANJIN TIANCHUAN ENERGY EQUIPMENT Co.,Ltd. Address after: 300180 Hedong District, Tianjin Jintang Road, No. 174 Patentee after: TIANJIN DESIGN & RESEARCH INSTITUTE OF ELECTRIC DRIVE Co.,Ltd. Patentee after: TIANJIN TIANCHUAN ENERGY EQUIPMENT Co.,Ltd. Address before: 300180 Hedong District, Tianjin Jintang Road, No. 174 Patentee before: Tianjin Design and Research Institute of Electric Drive Patentee before: TIANJIN TIANCHUAN ENERGY EQUIPMENT Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120926 Termination date: 20191220 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |