CN202535311U - Assembly structure of power amplifier - Google Patents

Assembly structure of power amplifier Download PDF

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Publication number
CN202535311U
CN202535311U CN2012200561534U CN201220056153U CN202535311U CN 202535311 U CN202535311 U CN 202535311U CN 2012200561534 U CN2012200561534 U CN 2012200561534U CN 201220056153 U CN201220056153 U CN 201220056153U CN 202535311 U CN202535311 U CN 202535311U
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CN
China
Prior art keywords
amplification module
heat
horizontal
power amplifier
conducting substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn - After Issue
Application number
CN2012200561534U
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Chinese (zh)
Inventor
孟庆南
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHENGWEI ELECTRONIC TECHNOLOGY Co Ltd WUHAN
Wuhan Gewei Electronic Technology Co Ltd
Original Assignee
ZHENGWEI ELECTRONIC TECHNOLOGY Co Ltd WUHAN
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHENGWEI ELECTRONIC TECHNOLOGY Co Ltd WUHAN filed Critical ZHENGWEI ELECTRONIC TECHNOLOGY Co Ltd WUHAN
Priority to CN2012200561534U priority Critical patent/CN202535311U/en
Application granted granted Critical
Publication of CN202535311U publication Critical patent/CN202535311U/en
Anticipated expiration legal-status Critical
Withdrawn - After Issue legal-status Critical Current

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Abstract

The utility model provides an assembly structure of a power amplifier. The assembly structure comprises at least two amplifier modules, wherein each amplifier module comprises a heat conducting base plate, and an amplifying tube matching circuit board is assembled on the heat conducting base plate; at least one radio-frequency power amplifying tube is assembled on each amplifying tube matching circuit board, and the assembly directions of all the radio-frequency power amplifying tubes are parallel to one another; the heat conducting base plates of any two adjacent amplifier modules are vertically assembled and connected with each other along the transmission direction of radio-frequency signals; one or more of a micro-strip line, a cable line and an electronic device are arranged on each amplifying tube matching circuit board; and the connection mode of alternating-current signals or direct-current signals between the amplifier modules is one or more of micro-strip line connection, cable line connection and connector component connection. Compared with the conventional plane assembly technology, the assembly structure of the power amplifier has the characteristic of small area occupied by a mounting plane, and is suitable for an assembly environment which has a certain height space and a small mounting plane.

Description

A kind of assembly structure of power amplifier
Technical field
The utility model belongs to base station power amplifier technical field, is specifically related to a kind of assembly structure of power amplifier, and is particularly little at the assembling area, and the fit of the power amplifier under the assembly environment in certain height space is arranged.
Background technology
Radio-frequency power amplifier is the critical component of wireless communication base station system, and the demands such as high-power, high efficiency of power amplifier in the market in order to satisfy system all is to close the road by a plurality of amplifier tubes to realize basically.The fit of traditional power amplifier is as depicted in figs. 1 and 2; Basically be the natural mode that comes from the plane assembling of radio-frequency power amplifier tube; Promptly all radio-frequency power amplifier tubes 1 and amplifier tube match circuit plate 2 horizontal are assemblied on the big heat-conducting substrate 3; Horizontal is installed on the heat abstractor plane again, can effectively dispel the heat thereby reach the radio-frequency power amplifier tube.
Though the assembly structure of above-mentioned power amplifier has better radiating effect; But also there is certain restriction under certain conditions; Such as enough height space are being arranged but having only in the assembly environment of less mounting plane; If still adopt the plane assembly structure of a plurality of radio-frequency power amplifier tubes do not assembled by spatial constraints, so just need to propose assembly structure better under this assembly environment.
The utility model content
The technical problem that the utility model will solve is: provide a kind of and be applicable to the certain height space but have only a kind of assembly structure of power amplifier of the assembly environment of less mounting plane.
The utility model is to solve the problems of the technologies described above the technical scheme of being taked to be: a kind of assembly structure of power amplifier; It is characterized in that: it comprises at least 2 amplification modules; Each amplification module comprises a heat-conducting substrate; Be equipped with amplifier tube match circuit plate on the heat-conducting substrate, be equipped with at least 1 radio-frequency power amplifier tube on the amplifier tube match circuit plate, the assembly direction of all radio-frequency power amplifier tubes is parallel to each other; The heat-conducting substrate of two adjacent amplification modules vertically assembles connection along the transmission direction of radiofrequency signal arbitrarily; Amplifier tube match circuit plate is provided with one or more in microstrip line, cable, the electronic device; The AC signal between the said amplification module or the connected mode of direct current signal are one or more in microstrip line connection, cable connection, the connector assembly connected mode.
Press such scheme, the connected mode between the heat-conducting substrate of described adjacent amplification module is lock screw, welding, in bonding one or more.
Press such scheme, described amplifier tube match circuit plate is lock screw, welding, in bonding one or more in the fit of heat-conducting substrate.
Press such scheme; Described amplification module is 2,1 amplification module horizontal wherein, and 1 amplification module is on the heat-conducting substrate of the vertical edge-on amplification module that is assemblied in horizontal of the transmission direction of radiofrequency signal in addition; Form L shaped structure, the bottom surface of the amplification module of horizontal is assemblied on the heat abstractor.
As another kind of optimal way; Described amplification module is 3; 1 amplification module horizontal wherein; In addition 2 amplification modules form the U-shaped structure on the heat-conducting substrate of the vertical edge-on amplification module that is assemblied in horizontal of the transmission direction of radiofrequency signal, and the bottom surface of the amplification module of horizontal is assemblied on the heat abstractor.
As another kind of optimal way; Described amplification module is 4; First amplification module horizontal wherein, second with the 3rd amplification module on the heat-conducting substrate of the vertical edge-on amplification module that is assemblied in horizontal of the transmission direction of radiofrequency signal, the 4th amplification module again horizontal second and the 3rd above the amplification module; Form the square shape structure, the bottom surface of the amplification module of first horizontal is assemblied on the heat abstractor.
The beneficial effect of the utility model is: with existing plane mounting technology contrast, the utlity model has the little characteristics of mounting plane area occupied, be applicable to the certain height space but have only the assembly environment of less mounting plane; Confirm that through overheated emulation and heat test this assembly structure also can satisfy the thermal design requirement simultaneously.
Description of drawings
Fig. 1 be traditional power amplifier assembly structure wait the shaft angle view.
Fig. 2 is the exploded perspective view of the assembly structure of traditional power amplifier.
Fig. 3 is the forward view of the utility model one embodiment.
Fig. 4 is the frontal view of the utility model one embodiment.
Fig. 5 is the view such as shaft angle such as grade of the utility model one embodiment.
Fig. 6 is the exploded perspective view of the utility model one embodiment.
Embodiment
Embodiment one:
Fig. 3 is the forward view of the utility model one embodiment; Fig. 4 is the frontal view of the utility model one embodiment, and Fig. 5 is the view such as shaft angle such as grade of the utility model one embodiment, and it comprises 3 amplification modules; 1 amplification module 101 horizontal wherein; In addition 2 amplification modules 102,103 are on the heat-conducting substrate of the vertical edge-on amplification module 101 that is assemblied in horizontal of the transmission direction of radiofrequency signal, and the bottom surface of the amplification module 101 of horizontal is assemblied on the heat abstractor, and 3 amplification modules form the U-shaped structures.
Fig. 6 is the exploded perspective view of the utility model one embodiment, and each amplification module comprises a heat-conducting substrate 3, is equipped with amplifier tube match circuit plate 2 on the heat-conducting substrate 3, is equipped with at least 1 radio-frequency power amplifier tube 1 on the amplifier tube match circuit plate 2; The plane of said amplification module is parallel with the radiofrequency signal direction, and the assembly direction of all radio-frequency power amplifier tubes 1 is parallel to each other; The heat-conducting substrate 3 of adjacent amplification module connects mutually; Amplifier tube match circuit plate 2 is provided with one or more in microstrip line, cable, the electronic device; The AC signal between the said amplification module or the connected mode of direct current signal are one or more in microstrip line connection, cable connection, the connector assembly connected mode.
Connected mode between the adjacent heat-conducting substrate is lock screw, welding, in bonding one or more, but will guarantee well to contact to help heat conduction, has taked lock screw mode to assemble in the present embodiment.
Connected mode is all taked the welding manner assembling in the present embodiment for lock screw, welding, in bonding one or more between amplifier tube match circuit plate and the heat-conducting substrate.
The material of heat-conducting substrate can be one or more in the heat-conductivity conducting materials such as copper material, aluminium, in the present embodiment, in order to guarantee heat conduction preferably, has all adopted copper material.
Embodiment two:
With reference to the implementation of embodiment one, also there is other implementation method in the utility model.
Amplification module is 2; 1 amplification module horizontal wherein; In addition 1 amplification module forms L shaped structure on the heat-conducting substrate of the vertical edge-on amplification module that is assemblied in horizontal of the transmission direction of radiofrequency signal, and the bottom surface of the amplification module of horizontal is assemblied on the heat abstractor.
Embodiment three:
Amplification module is 4; First amplification module horizontal wherein; Second with the 3rd amplification module on the heat-conducting substrate of the vertical edge-on amplification module that is assemblied in horizontal of the transmission direction of radiofrequency signal; The 4th amplification module horizontal again forms square shape at second and the 3rd above the amplification module, and the bottom surface of the amplification module of first horizontal is assemblied on the heat abstractor.
The length of the amplification module of horizontal with and the radio-frequency power amplifier tube number that go up to be provided with look and can assemble area and decide, the height of vertical edge-on amplification module with and the radio-frequency power amplifier tube number that goes up setting look assembling height space and decide.
Above-mentioned be merely the preferable concrete implementation of the utility model for example; The protection range of the utility model is not limited to described embodiment here; In the technical scope that any basic fundamental personnel that are familiar with this area disclose based on the utility model; The replacement that can expect easily or modification all should be included within the appended claims institute restricted portion.

Claims (6)

1. the assembly structure of a power amplifier; It is characterized in that: it comprises at least 2 amplification modules; Each amplification module comprises a heat-conducting substrate; Be equipped with amplifier tube match circuit plate on the heat-conducting substrate, be equipped with at least 1 radio-frequency power amplifier tube on the amplifier tube match circuit plate, the assembly direction of all radio-frequency power amplifier tubes is parallel to each other; The heat-conducting substrate of two adjacent amplification modules vertically assembles connection along the transmission direction of radiofrequency signal arbitrarily; Amplifier tube match circuit plate is provided with one or more in microstrip line, cable, the electronic device; The AC signal between the said amplification module or the connected mode of direct current signal are one or more in microstrip line connection, cable connection, the connector assembly connected mode.
2. the assembly structure of power amplifier according to claim 1 is characterized in that: the connected mode between the heat-conducting substrate of described adjacent amplification module is lock screw, welding, in bonding one or more.
3. the assembly structure of power amplifier according to claim 1 is characterized in that: described amplifier tube match circuit plate is lock screw, welding, in bonding one or more in the fit of heat-conducting substrate.
4. according to the assembly structure of any described power amplifier in the claim 1 to 3; It is characterized in that: described amplification module is 2; 1 amplification module horizontal wherein; In addition 1 amplification module forms L shaped structure on the heat-conducting substrate of the vertical edge-on amplification module that is assemblied in horizontal of the transmission direction of radiofrequency signal, and the bottom surface of the amplification module of horizontal is assemblied on the heat abstractor.
5. according to the assembly structure of any described power amplifier in the claim 1 to 3; It is characterized in that: described amplification module is 3; 1 amplification module horizontal wherein; In addition 2 amplification modules form the U-shaped structure on the heat-conducting substrate of the vertical edge-on amplification module that is assemblied in horizontal of the transmission direction of radiofrequency signal, and the bottom surface of the amplification module of horizontal is assemblied on the heat abstractor.
6. according to the assembly structure of any described power amplifier in the claim 1 to 3; It is characterized in that: described amplification module is 4; First amplification module horizontal wherein; Second with the 3rd amplification module on the heat-conducting substrate of the vertical edge-on amplification module that is assemblied in horizontal of the transmission direction of radiofrequency signal; The 4th amplification module horizontal again forms the square shape structure at second and the 3rd above the amplification module, and the bottom surface of the amplification module of first horizontal is assemblied on the heat abstractor.
CN2012200561534U 2012-02-21 2012-02-21 Assembly structure of power amplifier Withdrawn - After Issue CN202535311U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012200561534U CN202535311U (en) 2012-02-21 2012-02-21 Assembly structure of power amplifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012200561534U CN202535311U (en) 2012-02-21 2012-02-21 Assembly structure of power amplifier

Publications (1)

Publication Number Publication Date
CN202535311U true CN202535311U (en) 2012-11-14

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CN2012200561534U Withdrawn - After Issue CN202535311U (en) 2012-02-21 2012-02-21 Assembly structure of power amplifier

Country Status (1)

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CN (1) CN202535311U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102595838A (en) * 2012-02-21 2012-07-18 武汉正维电子技术有限公司 Assembly structure of power amplifier
WO2014161362A1 (en) * 2013-07-25 2014-10-09 中兴通讯股份有限公司 Doherty power amplifier
CN114980633A (en) * 2022-08-02 2022-08-30 成都汉芯国科集成技术有限公司 Power amplifier device of front side heat extraction structure

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102595838A (en) * 2012-02-21 2012-07-18 武汉正维电子技术有限公司 Assembly structure of power amplifier
WO2014161362A1 (en) * 2013-07-25 2014-10-09 中兴通讯股份有限公司 Doherty power amplifier
US9800209B2 (en) 2013-07-25 2017-10-24 Xi'an Zhongxing New Software Co. Ltd. Doherty power amplifier
CN114980633A (en) * 2022-08-02 2022-08-30 成都汉芯国科集成技术有限公司 Power amplifier device of front side heat extraction structure
CN114980633B (en) * 2022-08-02 2022-10-21 成都汉芯国科集成技术有限公司 Power amplifier device of front side heat extraction structure

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
AV01 Patent right actively abandoned

Granted publication date: 20121114

Effective date of abandoning: 20140716

RGAV Abandon patent right to avoid regrant