CN202421983U - Heat radiator of central processing unit (CPU) - Google Patents

Heat radiator of central processing unit (CPU) Download PDF

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Publication number
CN202421983U
CN202421983U CN201120471117XU CN201120471117U CN202421983U CN 202421983 U CN202421983 U CN 202421983U CN 201120471117X U CN201120471117X U CN 201120471117XU CN 201120471117 U CN201120471117 U CN 201120471117U CN 202421983 U CN202421983 U CN 202421983U
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CN
China
Prior art keywords
heat
cpu
copper
buckled
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201120471117XU
Other languages
Chinese (zh)
Inventor
尹建军
Original Assignee
DONGGUAN JIDU ELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DONGGUAN JIDU ELECTRONIC TECHNOLOGY Co Ltd filed Critical DONGGUAN JIDU ELECTRONIC TECHNOLOGY Co Ltd
Priority to CN201120471117XU priority Critical patent/CN202421983U/en
Application granted granted Critical
Publication of CN202421983U publication Critical patent/CN202421983U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model provides a heat radiator of a central processing unit (CPU). The heat radiator comprises heat pipes, a copper bottom and a heat radiation base, wherein the heat pipes are buckled on the copper bottom; the copper bottom is buckled on the heat radiation base; and the heat pipes are positioned between the copper bottom and the heat radiation base. According to the heat radiator of the CPU, the heat pipes are buckled on the copper bottom so as to be protected and convenient to mount and high in mounting efficiency; and moreover, the copper bottom can be relatively thin, heat radiation is facilitated, and a production process is relatively simple.

Description

A kind of cpu heat
Technical field
The utility model relates to electronic technology field, particularly a kind of cpu heat.
Background technology
On the mode of the heat pipe that cpu heat is provided in the prior art through welding was welded at the bottom of the copper, that need do at the bottom of this copper was thicker, because mounting process is complicated, inconvenience is installed, and radiating effect is bad.
The utility model content
The utility model provides a kind of cpu heat, its good heat dissipation effect, can play a protective role by opposite heat tube.
To achieve these goals, the utility model provides following technical scheme:
A kind of cpu heat, it comprises: at the bottom of heat pipe, the copper and heat dissipation base, wherein: said heat pipe is buckled on the said heat dissipation base at the bottom of the said copper on being buckled at the bottom of the said copper, and said heat pipe is at the bottom of the said copper and between the said heat dissipation base.
Preferably, have corresponding each bar heat pipe at the bottom of the said copper and be the groove of independent strip, said heat pipe is U-shaped and is many that the U-shaped bottom of said heat pipe is buckled in the said groove.
Through implementing above technical scheme; Have following technique effect: the cpu heat that the utility model provides on heat pipe being installed at the bottom of the copper, both can play a protective role by opposite heat tube; And easy for installation, installation effectiveness is high; Also can make do at the bottom of the copper thinner, be convenient to heat radiation, also make production technology simpler.
Description of drawings
The STRUCTURE DECOMPOSITION figure (front view) of the cpu heat that Fig. 1 provides for the utility model embodiment;
The STRUCTURE DECOMPOSITION figure (vertical view) of the cpu heat that Fig. 2 provides for the utility model embodiment;
The wiring layout (vertical view) of the cpu heat that Fig. 3 provides for the utility model embodiment;
The wiring layout (stereographic map) of the cpu heat that Fig. 4 provides for the utility model embodiment;
The application drawing (exploded view) of the cpu heat that Fig. 5 provides for the utility model embodiment;
The application drawing (wiring layout) of the cpu heat that Fig. 6 provides for the utility model embodiment.
Embodiment
In order better to understand the technical scheme of the utility model, describe the embodiment that the utility model provides in detail below in conjunction with accompanying drawing.
The utility model embodiment provides a kind of cpu heat; Like Fig. 1, Fig. 2, Fig. 3 and shown in Figure 4; This cpu heat comprises: at the bottom of heat pipe 120, the copper 130 and heat dissipation base 110; Wherein: said heat pipe 120 is buckled at the bottom of the said copper on 130, and 130 are buckled on the said heat dissipation base 110 at the bottom of the said copper, and said heat pipe 120 at the bottom of the said copper 130 and said heat dissipation base 110 between.Among this embodiment, this heat pipe 120 is used for heat radiation, has many, is in juxtaposition.Through heat pipe 120 being installed at the bottom of the copper on 130, both can play a protective role by opposite heat tube 120, and easy for installation, installation effectiveness is high, also can make at the bottom of the copper 130 do thinner, be convenient to heat radiation, also make production technology simpler.
In the present embodiment, more concrete, 130 have the independently groove of strip at the bottom of the said copper, and the quantity of this groove and heat pipe 120 is identical and the position is corresponding, and said heat pipe 120 is U-shaped and is many that the U-shaped bottom of said heat pipe 120 is buckled in the said groove.
In Fig. 5 and Fig. 6, the U-shaped end of the heat pipe 120 of this cpu heat is inserted in the radiating block 130, so that this CPU better dispels the heat.
More than a kind of cpu heat that the utility model embodiment is provided carried out detailed introduction; For one of ordinary skill in the art; Thought according to the utility model embodiment; The part that on embodiment and range of application, all can change, in sum, this description should not be construed as the restriction to the utility model.

Claims (2)

1. a cpu heat is characterized in that, comprising: at the bottom of heat pipe, the copper and heat dissipation base, wherein: said heat pipe is buckled on the said heat dissipation base at the bottom of the said copper on being buckled at the bottom of the said copper, and said heat pipe is at the bottom of the said copper and between the said heat dissipation base.
2. cpu heat according to claim 1 is characterized in that, has corresponding each bar heat pipe at the bottom of the said copper and be the groove of independent strip, and said heat pipe is U-shaped and is many, is buckled in the said groove bottom the U-shaped of said heat pipe.
CN201120471117XU 2011-11-23 2011-11-23 Heat radiator of central processing unit (CPU) Expired - Fee Related CN202421983U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201120471117XU CN202421983U (en) 2011-11-23 2011-11-23 Heat radiator of central processing unit (CPU)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201120471117XU CN202421983U (en) 2011-11-23 2011-11-23 Heat radiator of central processing unit (CPU)

Publications (1)

Publication Number Publication Date
CN202421983U true CN202421983U (en) 2012-09-05

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201120471117XU Expired - Fee Related CN202421983U (en) 2011-11-23 2011-11-23 Heat radiator of central processing unit (CPU)

Country Status (1)

Country Link
CN (1) CN202421983U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102520775A (en) * 2011-11-23 2012-06-27 东莞市几度电子科技有限公司 CPU (central processing unit) radiator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102520775A (en) * 2011-11-23 2012-06-27 东莞市几度电子科技有限公司 CPU (central processing unit) radiator

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: YIN JIANJUN

Free format text: FORMER OWNER: DONGGUAN JIDU ELECTRONIC TECHNOLOGY CO., LTD.

Effective date: 20140317

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 523000 DONGGUAN, GUANGDONG PROVINCE TO: 638400 GUANG AN, SICHUAN PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20140317

Address after: Gao Shi Xiang Village 638400 wusheng County in Sichuan Province Huaqiang Group No. 26 7

Patentee after: Yin Jianjun

Address before: 523000 Guangdong Province, Dongguan city Fenggang town Yan Tian AON industrial city sixty-third

Patentee before: Dongguan Jidu Electronic Technology Co., Ltd.

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120905

Termination date: 20131123