CN100562233C

CN100562233C - The heat radiation module

Info

Publication number: CN100562233C
Application number: CNB2006100337307A
Authority: CN
Inventors: 赖振田; 周志勇; 刘宜三
Original assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2006-02-16
Filing date: 2006-02-16
Publication date: 2009-11-18
Anticipated expiration: 2026-02-16
Also published as: CN101022714A

Abstract

A kind of heat radiation module, comprise a heat transfer plate, radiator and at least one heat pipe, this radiator comprises with the heat transfer plate substrate contacted and is located at some fin on the pedestal, the contacted side of this heat transfer plate and radiator is provided with at least one groove, has a groove on the pedestal of this radiator, and the corresponding passage that is combined into groove of this groove is to hold heat pipe, this heat pipe comprises first heat transfer segment between the pedestal of being located at heat transfer plate and radiator and second heat transfer segment that contacts with radiator away from heat transfer plate, the area of pedestal is greater than the area of heat transfer plate, first heat transfer segment of heat pipe comprises an arc section and a flat part, arc section is contained in the passage that the groove of groove on the heat transfer plate and radiator forms, its flat part is embedded in the groove of radiator base, stretch out outside the passage that the groove of the pedestal of the groove of heat transfer plate and radiator forms and have a flat bottom surface, the bottom surface coplane of the bottom surface of this flat part and pedestal.

Description

The heat radiation module

[technical field]

The present invention relates to a kind of heat radiation module, be meant a kind of heat radiation module that is used for heat radiation such as electronic component especially.

[background technology]

At present electronic component such as central processing unit all will produce a large amount of heats in normal running, and if the heat of untimely its generation of discharge will cause accumulation of heat to cause the temperature rising, and have a strong impact on the normal operation of electronic component.For this reason, industry is installed a heat abstractor usually and is carried out auxiliary heat dissipation on these electronic components.

A kind of typical heat abstractor such as Chinese patent announce No. 03223425.2 exposure, this heat abstractor comprises a radiator and the heat pipe that contacts with this radiator.Wherein this radiator comprises and is cooled substrate contacted such as electronic component such as central processing unit and be vertically installed in some fin on the pedestal.This heat pipe comprises the evaporation section that contacts with the pedestal of radiator, and from this evaporation section one end extend and with fin on the condensation segment that contacts away from the part of pedestal.During use, the heat that central processing unit produces is at first absorbed by pedestal, conducts on the fin again and then is dispersed in the surrounding environment to reach the purpose of cooling central processing unit.Heat pipe has good heat conductivity, distributes than the distant place accelerated heat so heat directly can be delivered on the fin fast from pedestal.For improving the heat-sinking capability of heat abstractor, usually fansink designs is become bigger volume to have bigger area of dissipation to promote whole performance.Yet, being subjected to the restriction of conditions such as space in actual applications, the volume of radiator can not be excessive.For example, other electronic components such as electric capacity etc. be arranged on central processing unit near, and this electric capacity is when being higher than central processing unit, electric capacity easily and radiator interfere.For avoiding this kind situation, generally avoid interfering with other elements by the volume that reduces radiator.Yet the area of dissipation that the volume that reduces radiator promptly reduces radiator will make the radiating effect of heat abstractor integral body reduce, and not satisfy radiating requirements.

[summary of the invention]

In view of this, be necessary the heat radiation module that provides a kind of heat dispersion preferable.

A kind of heat radiation module, comprise a heat transfer plate, be located at radiator and at least one heat pipe on the heat transfer plate, this radiator comprises with the heat transfer plate substrate contacted and is located at some fin on the pedestal, the contacted side of this heat transfer plate and radiator is provided with at least one groove, have a groove on the pedestal of this radiator, and

This groove and the corresponding passage that is combined into of groove on the heat transfer plate are to hold heat pipe, this heat pipe comprises first heat transfer segment between the pedestal of being located at heat transfer plate and radiator and second heat transfer segment that contacts with radiator away from heat transfer plate, the area of pedestal is greater than the area of heat transfer plate, wherein first heat transfer segment of this heat pipe comprises that one has the arc section and a flat part of circular cross-section, wherein the arc section of first heat transfer segment of heat pipe is contained in the passage that the groove of the pedestal of groove on the heat transfer plate and radiator forms, its flat part is embedded in the groove of radiator base, stretch out outside the passage that the groove of the pedestal of the groove of heat transfer plate and radiator forms and have a flat bottom surface, the bottom surface coplane of the bottom surface of this flat part and pedestal.

Compared to prior art, the heat transfer plate in the described heat radiation module can increase radiator to the distance between the electronic component, can avoid radiator and other elements to interfere, and makes radiator have relatively large volume; Simultaneously, the part of first heat transfer segment of heat pipe is flattened, can be avoided heat pipe and other elements to interfere.

With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.

[description of drawings]

Fig. 1 is the dispel the heat stereogram of module one embodiment of the present invention.

Fig. 2 is the profile along II-II line among Fig. 1.

Fig. 3 is the exploded view of Fig. 1.

Stereogram when Fig. 4 is heat radiation module bottom-up among Fig. 1.

Fig. 5 is the exploded view of Fig. 4.

Fig. 6 and Fig. 4 are close, the enlarged drawing when being heat radiation module bottom-up among Fig. 1.

[embodiment]

Please together consult Fig. 1 to 5, the present invention's two heat pipes 300 that an embodiment of module comprises a heat transfer plate 100, is located at the radiator 200 on the heat transfer plate 100 and contacts with radiator 200 with heat transfer plate 100 simultaneously that dispel the heat.

Heat transfer plate 100 is to be made by heat conductivility good metal material such as copper, aluminium etc., and it contacts and absorb the heat that central processing unit 400 produces with electronic component such as central processing unit 400 etc. on being located at circuit board 500.The top of heat transfer plate 100 is provided with a pair of groove that is parallel to each other 110 in order to ccontaining heat pipe 300, and with the heat transferred heat pipe 300 that absorbs.

What contact with the top of above-mentioned heat transfer plate 100 is radiator 200, the top board 220 that it comprises a pedestal 210, is provided with this pedestal 210 spaced and parallel, and be located at groups of fins 230 between pedestal 210 and the top board 220.

Wherein, pedestal 210 is to be made by heat conductivility good metal material such as copper, aluminium etc., and its area is greater than the area of heat transfer plate 100.Pedestal 210 comprises the bottom 2104 that contacts with heat transfer plate 100, and the top 2102 that contacts with groups of fins 230 bottoms 2304.The groove 2106 that has pair of parallel in the bottom 2104 of pedestal 210, these grooves 2106 respectively with heat transfer plate 100 on respective grooves 110 be combined into two passages in order to hold heat pipe 300.

The bottom side of top board 220 has a pair of groove that is parallel to each other 2202.

Groups of fins 230 uprightly is located on the pedestal 210, and its relative top flap 2302, bottom flap 2304 are connected with top board 220, pedestal 210 respectively.Be provided with the groove 2306 of pair of parallel in the top flap 2302 of groups of fins 230, and the groove on this groove 2306 and the top board 210 2106 is corresponding is combined into a pair of through hole with ccontaining heat pipe 300.

Each heat pipe 300 is the U type, is provided with capillary structure in it and is loaded with an amount of working media such as water, ethanol etc.Each heat pipe 300 comprises space and first heat transfer segment 310 that be arranged in parallel substantially and second heat transfer segment 320, and the 3rd heat transfer segment 330 that first heat transfer segment 310 and second heat transfer segment 320 are linked into an integrated entity, and first heat transfer segment 310 of heat pipe 300 and second heat transfer segment 320 are contained in respectively in the

groove

2106,2202 on pedestal 210, the top board 220.Wherein, first heat transfer segment 310 of heat pipe 300 can be divided into three parts, promptly has the middle part arc section 3104 of circular cross-section and is located at two flat parts 3102 at these middle part arc section 3104 two ends.Each flat part 3102 has a flat bottom surface and the end face of evagination, and promptly each flat part 3102 has semicircular cross-section, and the bottom surface of the bottom surface of flat part 3102 and pedestal 210 is in the same plane.And the middle part arc section 3104 of first heat transfer segment 310 of each heat pipe 300 is positioned at heat transfer plate 100 and pedestal 210 formed passages, and promptly the arc section 3104 of first heat transfer segment 310 is located between heat transfer plate 100 and the radiator 200.So, the heat that heat transfer plate 100 is absorbed, can pass to first heat transfer segment 310 of the pedestal 210 and the heat pipe 300 of radiator 200 simultaneously, pass through top flap 2302 and the top board 220 of second heat transfer segment 320 of heat pipe 300 again, be dispersed into the purpose that reaches cooling central processing unit 400 in the surrounding environment at last heat transferred groups of fins 230.In addition, the distance between 2 second heat transfer segment 320 of adjustable heat pipe 300 is so that make heat be evenly distributed in the top flap 2302 of groups of fins 230 more.

As mentioned above, first heat transfer segment 310 of heat pipe 300 contacts with heat transfer plate 100 and absorbs heat on the heat transfer plate 100, is the evaporation section of heat pipe 300; The heat that second heat transfer segment 320 of heat pipe 300 absorbs first heat transfer segment 310 is passed to the top board 220 that is in contact with it and the top of groups of fins 230, is the condensation segment of heat pipe 300.

Find out that obviously heat transfer plate 100 is positioned at the below of radiator 200, bed hedgehopping radiator 200, to avoid interference thereby can make to maintain a certain distance between the upper surface of the bottom surface of pedestal 210 of radiator 200 and the electric capacity 600 around the central processing unit 400; And the part that is positioned at heat transfer plate 100 outsides on first heat transfer segment 310 of heat pipe 300 is also tied formation flat part 3102, so also can avoid interfering with some elements.So the volume of the radiator 200 in the module is dispelled the heat in the present invention can be relatively large, has bigger area of dissipation to promote whole performance.

In the above-described embodiments, the flat part 3102 of first heat transfer segment 310 of heat pipe 300 can be made by methods such as the circular heat pipes 300 of punching press.We know, when by process for stamping the end of first heat transfer segment 310 of heat pipe 300 being tied, the capillary structures in the heat pipe 300 will be damaged and reduce the performance of heat pipe 300.As shown in Figure 6, for reducing the damage of capillary structure in the punching press opposite heat tube 300, some transition breach 2108 can be set in the both sides of the groove on the pedestal 210 2106, when punching press heat pipe 300, can form some changeover portions 3106 at the correspondence position on the heat pipe 300 and be placed in the described transition breach 2108, thereby can alleviate the damage of capillary structures in the punching press opposite heat tube 300.

Between above-mentioned each interconnective element, as being connected by methods such as welding between heat pipe 300 and the pedestal 210, between heat pipe 300 and the top board 220 and between heat pipe 300 and the groups of fins 230.

Claims

One kind the heat radiation module, comprise a heat transfer plate, be located at radiator and at least one heat pipe on the heat transfer plate, this radiator comprises with the heat transfer plate substrate contacted and is located at some fin on the pedestal, the contacted side of this heat transfer plate and radiator is provided with at least one groove, has a groove on the pedestal of this radiator, and this groove and the corresponding passage that is combined into of groove on the heat transfer plate are to hold heat pipe, this heat pipe comprises first heat transfer segment between the pedestal of being located at heat transfer plate and radiator and second heat transfer segment that contacts with radiator away from heat transfer plate, it is characterized in that: the area of pedestal is greater than the area of heat transfer plate, first heat transfer segment of this heat pipe comprises that one has the arc section and a flat part of circular cross-section, wherein the arc section of first heat transfer segment of heat pipe is contained in the passage that the groove of the pedestal of the groove of heat transfer plate and radiator forms, its flat part is embedded in the groove of radiator base, stretch out outside the passage that the groove of the pedestal of the groove of heat transfer plate and radiator forms and have a flat bottom surface, the bottom surface coplane of the bottom surface of this flat part and pedestal.
2. heat radiation module as claimed in claim 1 is characterized in that: described radiator also comprises a top board that is provided with at interval with pedestal, and described some fin are between pedestal and top board, and second heat transfer segment of described heat pipe contacts with this top board.
3. heat radiation module as claimed in claim 1 is characterized in that: the groove on the described pedestal is than the ditch flute length on the heat transfer plate.
4. heat radiation module as claimed in claim 1 is characterized in that: at least one side of the groove on the described pedestal is provided with at least one transition breach, is formed with at least one changeover portion on the described heat pipe, and this changeover portion is contained in the transition breach on the pedestal.
5. heat radiation module as claimed in claim 1 is characterized in that: the flat part of first heat transfer segment of described heat pipe has the circular arc end face of an evagination, and described end face is contained in the groove of radiator base.
6. heat radiation module as claimed in claim 1 is characterized in that: first heat transfer segment of described heat pipe has two flat parts and an arc section, and described arc section is located between two flat parts.
7. heat radiation module as claimed in claim 1 is characterized in that: described heat pipe further comprises one the 3rd heat transfer segment that connects first heat transfer segment and second heat transfer segment, and described the 3rd heat transfer segment is positioned at the radiator outside.
8. heat radiation module as claimed in claim 7 is characterized in that: described heat pipe takes the shape of the letter U.
9. heat radiation module as claimed in claim 2 is characterized in that: described fin parallel interval and uprightly being located on the pedestal, the top of each fin and bottom are formed with the flanging that is connected with top board and pedestal respectively.
10. heat radiation module as claimed in claim 1 is characterized in that: described pedestal is a lengthwise plate body, and it comprises the bottom that contacts with heat transfer plate, and the top that contacts with the groups of fins bottom.
11. heat radiation module as claimed in claim 1 is characterized in that: the pedestal of described heat transfer plate and radiator is made by copper or aluminium.