CN101150944B - Heat radiator - Google Patents
Heat radiator Download PDFInfo
- Publication number
- CN101150944B CN101150944B CN2006100627329A CN200610062732A CN101150944B CN 101150944 B CN101150944 B CN 101150944B CN 2006100627329 A CN2006100627329 A CN 2006100627329A CN 200610062732 A CN200610062732 A CN 200610062732A CN 101150944 B CN101150944 B CN 101150944B
- Authority
- CN
- China
- Prior art keywords
- heat
- sleeve pipe
- radiating fin
- pipe
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A radiating device comprises a radiator provided with a plurality of radiating fins and at least one heat pipe. The radiator also comprises a cannula perforating radiating fins, the heat pipe and the radiating fins of the radiator utilize the cannula with good heat-conducting property as medium to transfer heat fully between the heat pipe and the radiating fins.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor that is used on the electronic component.
Background technology
Along with electronic industry constantly develops, electronic component (particularly central processing unit) speed of service and overall performance are in continuous lifting.Yet its caloric value also increases thereupon, and volume is more and more littler on the other hand, and heating is also just more concentrated, makes industry use the heat abstractor of metal solid heat transfer can't satisfy the radiating requirements of high-end electronic component merely.
For this reason, industry is brought into use the heat abstractor that has heat pipe.Heat pipe is mainly to be made up of capillary structure that is provided with on vacuum-packed tubular shell, its inwall (as powder sintered thing, groove structure, screen net structure etc.) and interior hydraulic fluid of packing in right amount (as water, alcohol, fluorine Lyons, acetone etc.) thereof.Heat pipe be carry out after being heated by hydraulic fluid that liquid vapour two phase change absorb, release heat to be to reach the heat transfer purpose, owing to the Heat Transfer of Heat Pipe on Heat Pipe non-directional and heat transfer distances is long is used widely.
Chinese patent bulletin CN has disclosed a kind of heat abstractor 2634525Y number, it comprises that the radiator and that is sticked on a base plate, this base plate connects the heat pipe of this base plate and radiator, this radiator is formed by some radiating fin permutation and combination, and this radiating fin is provided with the through hole that heating tube wears.But heat pipe is directly to be welded in the through hole of radiating fin by scolder, when heat pipe penetrates radiating fin, cause easily to combine inhomogeneously between heat pipe and the radiating fin, influence the efficient that heat is transmitted to radiating fin by heat pipe, thereby the performance boost of heat abstractor is restricted.
Summary of the invention
In view of this, be necessary the heat abstractor that provides a kind of heat dispersion preferable.
A kind of heat abstractor, comprise the radiator and at least one heat pipe that are provided with some radiating fins, described heat abstractor also comprises the sleeve pipe that passes radiating fin, described radiator comprises that one places the pedestal of radiating fin bottom, described radiating fin is provided with the through hole that wears for described sleeve pipe, the internal diameter of described through hole is slightly larger than the external diameter of described sleeve pipe, external diameter enlarges the closely described through-hole inner surface of contact of bushing outer surface in it thereby described sleeve pipe makes by external tool, described heat pipe comprises that an endotherm section and that is connected with this pedestal is placed on the heat release section in the sleeve pipe, and the heat release section of described heat pipe is arranged in the described sleeve pipe and with internal surface of sleeve pipe and welds.
Heat abstractor of the present invention compared with prior art has following advantage: because in the heat abstractor of the present invention, the radiating fin of heat pipe and radiator passes through the good sleeve pipe of a heat conductivility as intermediary, be that heat pipe fully contacts with sleeve pipe, sleeve pipe also fully contacts with radiating fin simultaneously, make heat evenly be passed to radiating fin, thereby the integral heat sink performance is promoted by heat pipe.
Description of drawings
Be further described in conjunction with the embodiments with reference to the accompanying drawings:
Fig. 1 is the stereogram of heat abstractor one embodiment of the present invention.
Fig. 2 is the three-dimensional exploded view of another angle of heat abstractor shown in Figure 1.
Fig. 3 is the three-dimensional exploded view of heat abstractor shown in Figure 1.
Embodiment
Figure 1 shows that heat abstractor one preferred embodiment of the present invention, this heat abstractor comprises a radiator 10, a heat-conducting plate 20, two heat pipes 30 and connects two sleeve pipes 40 of heat pipe 30 and radiator 10.In the present embodiment, described radiator 10 is the aluminium extruded type radiator, promptly extrudes machine-shaping by the metal aluminium.
Please consult Fig. 2 and Fig. 3 in conjunction with Fig. 1, described radiator 10 comprises a pedestal 12, these pedestal 12 end faces form a protuberance 120, and some first radiating fins 14 that are parallel to each other extend upward setting from this protuberance 120, and these first radiating fin, 14 horizontal expansion directions exceed pedestal 12 two ends.Some second radiating fins 15 that are parallel to each other extend upward setting and are positioned at first radiating fin, 14 relative both sides from protuberance 120 both sides, the top of described second radiating fin 15 and first radiating fin 14 flushes, the length of second radiating fin, 15 horizontal expansions is less than the horizontal expansion length of first radiating fin 14, and second radiating fin 15 extends beyond the terminal edge of pedestal 12 along the longitudinal direction.First and second radiating fin 14,15 middle parts are provided with the slit 18 that a lengthwise runs through this first and second radiating fin 14,15, and this slit 18 extends to pedestal 12 upper surfaces.Be arranged with two through holes 16 that run through all first and second radiating fins 14,15 on first, second radiating fin 14,15 of described slit 18 both sides, the end face of described two through holes, 16 parallel slot 18 and close first, second radiating fin 14,15 is with ccontaining two sleeve pipes 40 and heat pipe 30.Four jiaos of pedestal 12 are provided with installing hole 130, by screw (figure does not show) this radiator 10 is fixed on the circuit board (figure does not show).Middle part, described pedestal 12 bottom surfaces protrudes out a projection 11 downwards, and these projection 11 lower surfaces are provided with two parallel grooves 17 of two longitudinal extensions and adjacency setting, in order to accommodate heat pipe 30.
Described heat-conducting plate 20 is a square tabular body, and its shape is consistent with the projection 11 of radiator 10.These heat-conducting plate 20 upper surfaces are provided with two grooves 27, to cooperate the passage of the groove 17 compositions one ccontaining heat pipe 30 on the projection 11.
Described each heat pipe 30 comprises the heat release section 32 of an endotherm section 31, one parallel endotherm section 31 and connects the adiabatic section 33 of endotherm section 31 and heat release section 32, the endotherm section 31 of described heat pipe 30 places groove 17 to cooperate with groove 27 in the passage that forms, and described heat release section 32 wears in the through hole of putting on first, second radiating fin 14,15 16.
Described sleeve pipe 40 is formed by the good metal material manufacturing of heat conductivility, and the material of sleeve pipe 140 is a copper in the present embodiment.The external diameter of this sleeve pipe 40 is slightly less than the internal diameter of through hole 16 and the external diameter of heat pipe 30 heat release section 32, and its length slightly is shorter than the heat release section 32 of heat pipe 30 than through hole 16 length.
When assembling this heat abstractor, earlier sleeve pipe 40 is worn in the through hole 16 to first, second radiating fin 14,15, stretched into by external tool the interior external diameter of sleeve pipe 40 is enlarged, thereby the outer wall of sleeve pipe 40 is fitted tightly in the inwall of through hole 16; Then the heat release section 32 of heat pipe 30 is inserted in the sleeve pipe 40 and with sleeve pipe 40 inwalls and welds; Simultaneously, in the passage that the groove 17 of the projection 11 of the endotherm section 31 plant radiators 10 of heat pipe 30 and heat-conducting plate 20 grooves 27 are formed, thereby radiator 10, heat-conducting plate 20 and heat pipe 30 are welded together.
During work, the heat transferred that electronic component produces is to heat-conducting plate 20, part heat reaches entire radiator 10 by pedestal 12, another part heat reaches the heat release section 32 of heat pipe 30 by the endotherm section 31 of heat pipe 30, because sleeve pipe 40 and the heat release section 32 of heat pipe 30 and fully contacting of first and second radiating fin 14,15, the heat of the heat release section 32 of heat pipe 30 evenly is passed on first, second radiating fin 14,15 by sleeve pipe 40, and the entire heat dissipation device is fully utilized.
Because the effect of sleeve pipe 40, sleeve pipe 40 is combined closely with radiating fin 14,15 earlier, contact combination with heat pipe 30 realization faces again, the bad phenomenon of heat conduction of having avoided heat pipe 30 directly to combine and having occurred with radiating fin 14,15, heat evenly is passed on the radiating fin 14,15 by heat pipe 30, has strengthened radiating effect.
Claims (6)
1. heat abstractor, comprise the radiator and at least one heat pipe that are provided with some radiating fins, it is characterized in that: described heat abstractor also comprises the sleeve pipe that passes radiating fin, described radiator comprises that one places the pedestal of radiating fin bottom, described radiating fin is provided with the through hole that wears for described sleeve pipe, the internal diameter of described through hole is slightly larger than the external diameter of described sleeve pipe, external diameter enlarges the closely described through-hole inner surface of contact of bushing outer surface in it thereby described sleeve pipe makes by external tool, described heat pipe comprises that an endotherm section and that is connected with this pedestal is placed on the heat release section in the sleeve pipe, and the heat release section of described heat pipe is arranged in the described sleeve pipe and with internal surface of sleeve pipe and welds.
2. heat abstractor as claimed in claim 1 is characterized in that: described base top surface forms a protuberance, and described radiating fin is provided with from protuberance end face one vertical extent.
3. heat abstractor as claimed in claim 1 is characterized in that: described base bottom surface middle part protrudes out a projection downwards, and a heat-conducting plate and described projection insert and put the endotherm section of heat pipe jointly.
4. heat abstractor as claimed in claim 1 is characterized in that: described radiating fin middle part is provided with the slit that a lengthwise runs through each radiating fin, and two through holes are respectively at the slit both sides.
5. heat abstractor as claimed in claim 1 is characterized in that: described radiator is the aluminium extruded type radiator.
6. heat abstractor as claimed in claim 1 is characterized in that: described sleeve pipe is made of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100627329A CN101150944B (en) | 2006-09-22 | 2006-09-22 | Heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100627329A CN101150944B (en) | 2006-09-22 | 2006-09-22 | Heat radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101150944A CN101150944A (en) | 2008-03-26 |
| CN101150944B true CN101150944B (en) | 2010-09-29 |
Family
ID=39251191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006100627329A Expired - Fee Related CN101150944B (en) | 2006-09-22 | 2006-09-22 | Heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101150944B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2503607Y (en) * | 2001-08-29 | 2002-07-31 | 庄金发 | Cooling fin with heat conduction pipe |
| US6450250B2 (en) * | 1999-06-11 | 2002-09-17 | Psc Computer Products, Inc. | Stackable heat sink for electronic components |
| CN2664189Y (en) * | 2003-09-20 | 2004-12-15 | 鸿富锦精密工业（深圳）有限公司 | Heat sink for heat pipe |
| CN2678136Y (en) * | 2004-02-05 | 2005-02-09 | 珍通科技股份有限公司 | Curved heat pipe radiator |
| CN2699476Y (en) * | 2003-07-17 | 2005-05-11 | 鸿富锦精密工业（深圳）有限公司 | Heat sink for heat pipe |
-
2006
- 2006-09-22 CN CN2006100627329A patent/CN101150944B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6450250B2 (en) * | 1999-06-11 | 2002-09-17 | Psc Computer Products, Inc. | Stackable heat sink for electronic components |
| CN2503607Y (en) * | 2001-08-29 | 2002-07-31 | 庄金发 | Cooling fin with heat conduction pipe |
| CN2699476Y (en) * | 2003-07-17 | 2005-05-11 | 鸿富锦精密工业（深圳）有限公司 | Heat sink for heat pipe |
| CN2664189Y (en) * | 2003-09-20 | 2004-12-15 | 鸿富锦精密工业（深圳）有限公司 | Heat sink for heat pipe |
| CN2678136Y (en) * | 2004-02-05 | 2005-02-09 | 珍通科技股份有限公司 | Curved heat pipe radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101150944A (en) | 2008-03-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100456461C (en) | Heat sink of heat pipe | |
| JP3119117U (en) | Heat tube heatsink structure | |
| CN100470773C (en) | Heat pipe radiating device | |
| US9506699B2 (en) | Heat pipe structure | |
| CN100444364C (en) | Heat pipe radiator | |
| TWI426859B (en) | Heat dissipation module, flat heat column thereof and manufacturing method for flat heat column | |
| JP2005114341A (en) | Heat sink having heat pipe, and method for manufacturing the same | |
| US20120180994A1 (en) | Heat pipe structure | |
| US20130213612A1 (en) | Heat pipe heat dissipation structure | |
| US11013146B2 (en) | Asymmetric heat pipe coupled to a heat sink | |
| CN100543640C (en) | Heating radiator | |
| US20090314471A1 (en) | Heat pipe type heat sink and method of manufacturing the same | |
| US11653471B2 (en) | Heat dissipation device | |
| CN101598512A (en) | Has heat pipe of double capillary structure and preparation method thereof | |
| CN103474404A (en) | Loop parallel type heat pipe radiator | |
| CN219202287U (en) | Heat dissipation device | |
| CN101749975B (en) | Radiating device | |
| CN100471374C (en) | Heat pipe radiator | |
| CN212183960U (en) | Heat dissipation pipe, heat dissipation module and liquid cooling system | |
| CN201750660U (en) | Heat pipe radiator | |
| CN101150944B (en) | Heat radiator | |
| CN203534296U (en) | Novel LED sunflower radiator | |
| US20130213609A1 (en) | Heat pipe structure | |
| CN201306960Y (en) | High-power loop type heat pipe radiating device | |
| CN100498125C (en) | Evaporation box of hot end heat sink for semiconductor electronic refrigerator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100929 Termination date: 20140922 |
|
| EXPY | Termination of patent right or utility model |