CN117423662B - SiC power device heat dissipation packaging structure and packaging method - Google Patents
SiC power device heat dissipation packaging structure and packaging method Download PDFInfo
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- CN117423662B CN117423662B CN202311738453.XA CN202311738453A CN117423662B CN 117423662 B CN117423662 B CN 117423662B CN 202311738453 A CN202311738453 A CN 202311738453A CN 117423662 B CN117423662 B CN 117423662B
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 86
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000011521 glass Substances 0.000 claims abstract description 37
- 238000001179 sorption measurement Methods 0.000 claims abstract description 25
- 238000001125 extrusion Methods 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000741 silica gel Substances 0.000 claims description 10
- 229910002027 silica gel Inorganic materials 0.000 claims description 10
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 11
- 230000029058 respiratory gaseous exchange Effects 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract description 2
- 239000003292 glue Substances 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 16
- 239000010949 copper Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
Abstract
The invention relates to the technical field of heat dissipation and packaging of power electronic devices, in particular to a heat dissipation packaging structure and a heat dissipation packaging method of a SiC power device. Including the heat dissipation casing, the both sides wall of heat dissipation casing all is provided with a plurality of groups of pins, through placing the chip in the slide glass box, drive the push pedal and extrude the piston when making slide glass box remove, slide glass box continues to remove, make the tip of second slide bar get into the second spacing inslot portion, the surface that the while spacing bolt breaks away from the push pedal, the conflict effort of first spring drives the push pedal and removes and stimulate the piston this moment, make the piston cylinder be in the state of breathing in, the adsorption tap produces adsorption effort to the chip bottom this moment, make the chip adsorbed and fix in the inside of slide glass box, make this packaging structure need not glue seal or welding and can realize the encapsulation to the chip, lower damage to the chip when making things convenient for the dismantlement of chip, make chip and packaging structure can reuse, and then be favorable to realizing environmental protection and sustainable development.
Description
Technical Field
The invention belongs to the technical field of heat dissipation and packaging of power electronic devices, and particularly relates to a heat dissipation packaging structure and a heat dissipation packaging method of a SiC power device.
Background
SiC is a novel wide band gap semiconductor material that is currently developed and mature, and can be used for manufacturing high-power electronic devices, such as SiC MOSFETs, siC JFETs, siC IGBTs, and the like. Compared with Si power devices, the SiC power device has the advantages of low on-resistance, high switching frequency, high temperature resistance, high pressure resistance and the like, has great application prospect and industrial value in the field of high frequency and high pressure, and the traditional SiC power device packaging technology is characterized in that the lower surface of a SiC chip is welded at a copper layer on a DBC, the upper surface of the SiC chip is connected with other independent upper copper layers by using a bonding aluminum wire, the copper layer under the DBC is welded on a substrate, the substrate is directly connected with a shell for heat dissipation, and different layers are connected through solder layers.
Through searching, in the prior art, the bulletin number: CN213816137U, publication date: 2021-07-27 discloses a packaging structure for improving the packaging thermal uniformity of a SiC power device, which comprises a SiC chip I, a SiC chip II, a DBC upper copper layer I, a DBC upper copper layer II, a DBC upper copper layer III, a DBC ceramic layer, a DBC lower copper layer and a substrate; the surface of the DBC upper copper layer I, the DBC upper copper layer II, the DBC upper copper layer III and the DBC lower copper layer are etched with a hollowed-out structure solder layer; the upper surface of the SiC chip I is connected with the hollowed-out structure solder layer on the copper layer II on the DBC through a bonding aluminum clad copper strip; the upper surface of the second SiC chip is connected with the hollowed-out structure solder layer on the third copper layer on the DBC through a bonding aluminum clad copper strip. The packaging structure has the advantages of uniform heat dissipation, high reliability, good conductive performance of the bonding aluminum-clad copper strip and small parasitic inductance, can effectively strengthen the connection of bonding wires, and prolongs the service life of the SiC power device.
The device still has the following drawbacks: although the connection of the bonding wires can be effectively reinforced, the service life of the SiC power device is prolonged. However, after the device completes the encapsulation of the chip, the chip is inconvenient to detach, and the detached chip is easy to damage and cannot be reused.
Disclosure of Invention
The invention provides a radiating packaging structure and a packaging method for a SiC power device, wherein the radiating packaging structure comprises a radiating shell, a plurality of groups of pins are arranged on two side walls of the radiating shell, a radiating cover is movably clamped on the radiating shell, a plurality of groups of heat-conducting clapboards are fixedly connected inside the radiating shell, a slide part is arranged between every two groups of heat-conducting clapboards, and a chip is movably clamped inside the slide part;
the slide glass portion includes the box, the inner wall fixedly connected with piston cylinder of box, sliding connection has the piston rod on the piston cylinder, the one end fixedly connected with push pedal of piston rod, be provided with first spring between push pedal and the piston cylinder, the inner wall sliding connection of piston cylinder has the piston, the inner wall sliding connection of box has the slide glass box, a plurality of groups of absorption holes have been seted up to the inner wall bottom of slide glass box, a plurality of groups absorption hole is laminated mutually with the bottom of chip.
Further, a plurality of first screw holes are formed in the heat dissipation shell, a heat dissipation silica gel plate is fixedly connected to the heat dissipation cover, the heat dissipation silica gel plate is movably abutted to the slide part, a sealing strip is paved on the heat dissipation cover, a plurality of second screw holes are formed in the sealing strip and the heat dissipation cover, and bolts are connected between the second screw holes and the first screw holes in a threaded mode.
Further, a plurality of first conducting strips are embedded in the heat dissipation shell, the first conducting strips are respectively electrically connected with one group of pins, a plurality of second conducting strips are embedded in the heat conduction partition plate, the two ends of the second conducting strips are respectively electrically connected with one group of first conducting strips, a plurality of first conducting strips are embedded in the heat conduction partition plate, one ends of the first conducting strips are electrically connected with one group of second conducting strips, and the other ends of the first conducting strips extend to the top end of the outer wall of the heat conduction partition plate.
Further, the box uses the heat conduction material, the slide glass box uses the heat conduction material, slide glass box's inner wall bottom embedded mounting has a plurality of groups second conducting strip, and a plurality of groups the second conducting strip all with chip electric connection, the inner wall bottom embedded mounting of box has a plurality of groups third conducting strip, a plurality of groups the one end of third conducting strip respectively with a set of second conducting strip electric connection, a plurality of groups the other end of third conducting strip respectively with a set of first conducting strip electric connection.
Further, the inner wall embedded elbow that installs of box, the one end intercommunication of return bend has flexible hose, flexible hose's the other end intercommunication has the air duct, the air duct is embedded installs in the inner wall bottom of slide cassette, the intercommunication has a plurality of groups to adsorb the air cock on the air duct, and a plurality of groups adsorb the air cock and set up respectively in a set of absorption hole, a plurality of groups adsorb the top of air cock and laminating each other with the chip bottom.
Further, one end of the piston cylinder is provided with a piston tube, the other end of the piston tube is communicated with the bent tube, the piston is movably attached to the inner wall of the piston cylinder, a sealing ring is sleeved on the piston, and the center of the piston is fixedly connected with one end of the piston rod.
Further, a first chute is formed in the chip box, a first sliding rod is connected to the inner wall of the first chute in a sliding mode, an extrusion block is fixedly connected to one end of the first sliding rod, the extrusion block is movably abutted to the inner wall of the box body, a first limit groove is formed in the chip box, the first limit groove is movably clamped with the extrusion block, a second spring is arranged between the inner wall of the first limit groove and the extrusion block, and the second spring is sleeved on the first sliding rod.
Further, a second limiting groove is formed in the first sliding rod, a second sliding groove is formed in the chip box, the inner wall of the second sliding groove is connected with a second sliding rod in a sliding mode, and one end of the second sliding rod is movably clamped with the second limiting groove.
Further, the other end fixedly connected with spacing bolt of second slide bar, spacing bolt and push pedal activity joint, be provided with the third spring between spacing bolt and the outer wall of slide glass box, the third spring cover is established on the second slide bar.
A packaging method of a heat dissipation packaging structure of a SiC power device, the packaging method comprising:
extracting a group of chip boxes, and placing chips into the chip boxes;
pushing the slide box into the box body according to the slide box, simultaneously extruding the push plate, and discharging the gas in the piston cylinder;
after the slide glass box contacts the inner wall of the box body, the first spring drives the push plate to spring open, pulls the piston and sucks air into the piston cylinder;
air is sucked into the piston cylinder through the adsorption hole;
at this time, the adsorption hole generates adsorption force to the bottom end of the chip, so that the chip is adsorbed and fixed in the chip box;
the heat dissipation cover is clamped on the heat dissipation shell to prevent the slide box from being ejected, and the packaging of the chip is completed.
The beneficial effects of the invention are as follows:
1. through placing the chip in the slide glass box, promote slide glass box and get into the box, drive the push pedal and extrude the piston when making slide glass box remove, with the inside air discharge of piston cylinder, slide glass box continues to remove, make the one end of second slide bar get into the second spacing inslot portion, the while spacing bolt breaks away from the surface of push pedal, the conflict effort of first spring drives the push pedal and removes and stimulate the piston this moment, make the piston cylinder be in the state of breathing in, adsorption nozzle produces adsorption effort to the chip bottom this moment, make the chip be adsorbed and fix in the inside of slide glass box, make this packaging structure need not glue seal or welding and can realize the encapsulation to the chip, lower damage to the chip when making things convenient for the dismantlement of chip, make chip and packaging structure can reuse, and then be favorable to realizing environmental protection and sustainable development.
2. Through setting up multilayer heat conduction baffle, with the chip package in the box between two sets of heat conduction baffles, can realize the three-dimensional encapsulation to multiunit chip, and can adjust the chip's of the number according to the demand, satisfy the chip encapsulation of different conditions, promote this packaging structure's universality.
3. Install the heat dissipation lid through the bolt on the heat dissipation casing, make heat dissipation silica gel plate and slide glass portion conflict joint, carry out spacing fixedly to slide glass portion, seal the heat dissipation casing through the sealing strip, accomplish the encapsulation of chip, protect the chip, prevent that outside dust from getting into, the heat that produces in the chip course of working is led into the box through the carrier case, absorb the heat through the heat conduction baffle again, in leading-in heat dissipation casing and the heat dissipation lid at last, give off the heat to the outside of this packaging structure, realize the heat dissipation to the chip, can dispel the heat to the chip when making this packaging structure accomplish the encapsulation to the chip, promote this packaging structure's security.
4. Through making the chip laminating in the inside of slide glass box, make the chip pass through second conducting strip and first conducting strip electric connection, rethread second conducting strip and first conducting strip electric connection, finally through pin and external circuit electric connection, make this packaging structure need not to carry out electric connection to the chip through the bonding wire, promoted the efficiency of chip encapsulation in the time of having promoted current density.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 shows a schematic diagram of a main body structure according to an embodiment of the present invention;
FIG. 2 illustrates a side cross-sectional view of a body structure according to an embodiment of the present invention;
FIG. 3 illustrates a front view cross-section of a body structure according to an embodiment of the present invention;
FIG. 4 illustrates an exploded view of a slide construction according to an embodiment of the invention;
FIG. 5 illustrates a cross-sectional view of a slide front view structure in accordance with an embodiment of the invention;
FIG. 6 illustrates a side cross-sectional view of a slide according to an embodiment of the invention;
FIG. 7 illustrates a top cross-sectional view of a slide according to an embodiment of the invention;
FIG. 8 shows an enlarged view at A in FIG. 7 in accordance with an embodiment of the present invention;
fig. 9 shows an enlarged view at B in fig. 7 according to an embodiment of the present invention.
In the figure: 1. a heat dissipation housing; 2. pins; 3. a thermally conductive separator plate; 301. a second conductive strip; 302. a first conductive sheet; 4. a slide part; 401. a case; 402. a piston cylinder; 403. a piston rod; 404. a push plate; 405. a first spring; 406. a card case; 4061. adsorption holes; 4062. a second conductive sheet; 4063. an air duct; 4064. adsorbing the air tap; 4065. a first chute; 4066. a first slide bar; 4067. extruding a block; 4068. a first limit groove; 4069. a second spring; 40610. the second limit groove; 40611. a second chute; 40612. a second slide bar; 40613. a limit bolt; 40614. a third spring; 407. a third conductive sheet; 408. bending the pipe; 409. a flexible hose; 410. a piston tube; 411. a piston; 5. a first threaded hole; 6. a heat-dissipating cover; 601. a heat dissipating silicone plate; 602. a sealing strip; 603. a second threaded hole; 604. a bolt; 7. a first conductive strip.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The embodiment of the invention provides a radiating packaging structure of a SiC power device, which comprises a radiating shell 1; as illustrated in fig. 1-3.
The heat dissipation device comprises a heat dissipation shell 1, and is characterized in that a plurality of groups of pins 2 are arranged on two side walls of the heat dissipation shell 1, a plurality of groups of heat conduction clapboards 3 are fixedly connected inside the heat dissipation shell 1, a slide part 4 is arranged between every two groups of heat conduction clapboards 3, a chip is movably clamped inside the slide part 4, a plurality of groups of first threaded holes 5 are formed in the heat dissipation shell 1, a heat dissipation cover 6 is movably clamped on the heat dissipation shell 1, a heat dissipation silica gel plate 601 is fixedly connected on the heat dissipation cover 6, the heat dissipation silica gel plate 601 movably abuts against the slide part 4, a sealing strip 602 is paved on the heat dissipation cover 6, a plurality of groups of second threaded holes 603 are formed in the sealing strip 602 and the heat dissipation cover 6, and bolts 604 are respectively connected between the second threaded holes 603 and the first threaded holes 5;
specifically, the pin 2 is used for the electric connection between this power device and external circuit, heat dissipation casing 1 and heat dissipation lid 6 all use the heat conduction material, place the chip in the inside of slide glass portion 4, install heat dissipation lid 6 on heat dissipation casing 1 through bolt 604, make heat dissipation silica gel plate 601 and slide glass portion 4 conflict joint, spacing fixed to slide glass portion 4, seal heat dissipation casing 1 through sealing strip 602, accomplish the encapsulation of chip, protect the chip, prevent that outside dust from getting into, the chip of accessible heat dissipation casing 1 and heat dissipation lid 6 in the while is dispelled the heat to the chip in the work.
The inside embedded first conducting strip 7 of a plurality of groups of installation of heat dissipation casing 1, a plurality of groups first conducting strip 7 respectively with a set of pin 2 electric connection, the inside embedded second conducting strip 301 of a plurality of groups of installation of heat conduction baffle 3, a plurality of groups the both ends of second conducting strip 301 respectively with a set of first conducting strip 7 electric connection, the embedded first conducting strip 302 of a plurality of groups of installation on the heat conduction baffle 3, a plurality of groups the one end and the second conducting strip 301 electric connection of first conducting strip 302, a plurality of groups the other end of first conducting strip 302 extends to the outer wall top of heat conduction baffle 3.
The slide 4 includes a case 401; as illustrated in fig. 3-9.
The box 401 is made of a heat conducting material, a piston cylinder 402 is fixedly connected to the inner wall of the box 401, a piston rod 403 is connected to the piston cylinder 402 in a sliding manner, a push plate 404 is fixedly connected to one end of the piston rod 403, a first spring 405 is arranged between the push plate 404 and the piston cylinder 402, the first spring 405 is sleeved on the piston rod 403, a slide box 406 is connected to the inner wall of the box 401 in a sliding manner, the slide box 406 is made of a heat conducting material, the bottom end of the inner wall of the slide box 406 is movably clamped with a chip, a plurality of groups of adsorption holes 4061 are formed in the bottom end of the inner wall of the slide box 406, and a plurality of groups of adsorption holes 4061 are mutually attached to the bottom end of the chip;
a plurality of groups of second conductive plates 4062 are embedded in the bottom end of the inner wall of the slide box 406, the plurality of groups of second conductive plates 4062 are electrically connected with the chip, a plurality of groups of third conductive plates 407 are embedded in the bottom end of the inner wall of the box 401, one ends of the plurality of groups of third conductive plates 407 are respectively electrically connected with one group of second conductive plates 4062, and the other ends of the plurality of groups of third conductive plates 407 are respectively electrically connected with one group of first conductive plates 302;
specifically, the chip is attached to the inside of the carrier box 406, so that the chip is electrically connected to the first conductive sheet 302 through the second conductive sheet 4062, then electrically connected to the first conductive strip 7 through the second conductive strip 301, and finally electrically connected to an external circuit through the pin 2.
The inner wall of the box 401 is provided with an elbow 408 in an embedded manner, the other end of the elbow 408 is communicated with a telescopic hose 409, one end of the telescopic hose 409 is communicated with an air duct 4063, the air duct 4063 is arranged at the bottom end of the inner wall of the chip box 406 in an embedded manner, the air duct 4063 is communicated with a plurality of groups of adsorption air nozzles 4064, the adsorption air nozzles 4064 are respectively arranged in a group of adsorption holes 4061, and the top ends of the adsorption air nozzles 4064 are mutually attached to the bottom end of the chip;
one end of the piston cylinder 402 is provided with a piston tube 410, the other end of the piston tube 410 is communicated with the bent tube 408, the inner wall of the piston cylinder 402 is slidably connected with a piston 411, the piston 411 is movably attached to the inner wall of the piston cylinder 402, a sealing ring is sleeved on the piston 411, and the center of the piston 411 is fixedly connected with one end of the piston rod 403;
specifically, by extruding the push plate 404, the piston rod 403 is driven to push the piston 411, air in the piston cylinder 402 is discharged, after the push plate 404 loses extrusion force, the push plate 404 drives the piston 411 to pop out in a direction away from the piston cylinder 402 through the abutting force of the first spring 405, air enters the air duct 4063 through the adsorption air tap 4064, enters the elbow 408 through the telescopic hose 409 and is finally sucked into the piston cylinder 402 through the piston tube 410, and at the moment, the adsorption air tap 4064 generates adsorption force on the bottom end of the chip, so that the chip is adsorbed and fixed in the chip box 406.
The slide box 406 is provided with a first chute 4065, the inner wall of the first chute 4065 is slidably connected with a first slide bar 4066, one end of the first slide bar 4066 is fixedly connected with an extrusion block 4067, the extrusion block 4067 is movably abutted against the inner wall of the box 401, the slide box 406 is provided with a first limit groove 4068, the first limit groove 4068 is movably clamped with the extrusion block 4067, a second spring 4069 is arranged between the inner wall of the first limit groove 4068 and the extrusion block 4067, and the second spring 4069 is sleeved on the first slide bar 4066;
the first slide bar 4066 is provided with a second limit groove 40610, the slide box 406 is provided with a second slide groove 40611, the inner wall of the second slide groove 40611 is slidably connected with a second slide bar 40612, one end of the second slide bar 40612 is movably clamped with the second limit groove 40610, the other end of the second slide bar 40612 is fixedly connected with a limit bolt 40613, the limit bolt 40613 is movably clamped with the push plate 404, a third spring 40614 is arranged between the limit bolt 40613 and the outer wall of the slide box 406, and the third spring 40614 is sleeved on the second slide bar 40612;
specifically, the chip is placed in the slide box 406, the slide box 406 is pushed into the box 401, at this time, the second slide bar 40612 is attached to the surface of the first slide bar 4066, the limit bolt 40613 is pushed out and clamped on the surface of the push plate 404, the push plate 404 is driven to squeeze the piston 411 while the slide box 406 moves, air in the piston cylinder 402 is discharged, the slide box 406 continues to move, the squeeze block 4067 contacts the inner wall of the box 401, the squeeze block 4067 continues to move into the first limit groove 4068, at this time, the first slide bar 4066 slides into the first slide groove 4065, the second limit groove 40610 moves to one end of the second slide bar 40612, at this time, due to the tension of the third spring 40614, the limit bolt 40613 is pulled to move inwards, one end of the second slide bar 40612 enters the second limit groove 40610, at this time, the limit bolt 40613 is separated from the surface of the push plate 404, at this time, the acting force of the first spring 405 drives the push plate 404 to move and pull the piston 411, and the piston cylinder 402 is in an air suction state.
The working principle of the radiating packaging structure of the SiC power device provided by the invention is as follows:
through placing the chip in slide box 406, promote slide box 406 and get into box 401 in, this moment second slide bar 40612 laminating is at the surface of first slide bar 4066, release stop bolt 40613 and joint are at the surface of push pedal 404, make slide box 406 remove and drive push pedal 404 to extrude piston 411 simultaneously, discharge the inside air of piston cylinder 402, slide box 406 continues to remove, make extrusion piece 4067 contact the inner wall of box 401, continue to remove and make extrusion piece 4067 get into first spacing groove 4068, slide bar first slide bar 4066 slides to the inside of first spout 4065 at this moment, make second spacing groove 40610 remove to the one end of second slide bar 40612, this moment because the tensile effect of third spring 40614, pull stop bolt 40613 inwards, make the one end of second slide bar 40612 get into the inside of second spacing groove 40610, simultaneously stop bolt 40613 breaks away from the surface of push pedal 404, the inside the effort of first spring 405 drives push pedal 404 and pulls piston 411, make piston cylinder 402 be in the state of breathing in, air inlet air cock 4064 gets into air duct 4065 through the inside of air cock 4064, and then get into the inside of air cock 4065, make the inside of chip 4064 is adsorbed by the inside of hose 4064 through the flexible pipe 40408 at this moment, and then the inside of chip is adsorbed by the inside of flexible hose 406.
Install heat dissipation lid 6 to heat dissipation casing 1 through bolt 604, make heat dissipation silica gel plate 601 and slide glass portion 4 conflict joint, carry out spacing fixedly to slide glass portion 4, seal heat dissipation casing 1 through sealing strip 602, accomplish the encapsulation of chip, protect the chip, prevent outside dust entering, accessible heat dissipation casing 1 and heat dissipation lid 6 dispel the heat to the chip in the work simultaneously.
The chip is attached to the inside of the carrier box 406, so that the chip is electrically connected with the first conductive sheet 302 through the second conductive sheet 4062, then electrically connected with the first conductive strip 7 through the second conductive strip 301, and finally electrically connected with an external circuit through the pin 2.
The heat generated in the working process of the chip is led into the box 401 through the carrier box 406, is absorbed through the heat conducting partition plate 3, and finally is led into the heat radiating shell 1 and the heat radiating cover 6, and the heat is radiated to the outside of the packaging structure, so that the heat radiation of the chip is realized.
On the basis of the above-mentioned heat dissipation packaging structure of the SiC power device, the embodiment of the present invention further provides a packaging method for the packaging structure, and the packaging method includes:
extracting a group of chip boxes, and placing chips into the chip boxes;
pushing the slide box into the box body according to the slide box, simultaneously extruding the push plate by the limit bolt, and discharging the gas in the piston cylinder;
after the extrusion block contacts the inner wall of the box body, the slide card box is continuously pushed, so that the extrusion block enters the first limit groove;
at the moment, one end of the second sliding rod enters the second limit groove to drive the limit bolt to move and separate from the surface of the push plate;
the first spring drives the push plate to spring open, pulls the piston and sucks air into the piston cylinder;
air enters the air duct through the adsorption air tap, then enters the bent pipe through the telescopic hose, and finally is sucked into the piston cylinder through the piston pipe;
at the moment, the adsorption air tap generates adsorption acting force on the bottom end of the chip, so that the chip is adsorbed and fixed in the chip box;
the heat dissipation cover is clamped on the heat dissipation shell, and the slide glass box is extruded by the heat dissipation silica gel plate to prevent the slide glass box from being ejected;
and (3) rotationally fixing the bolts to the first threaded holes and the second threaded holes to finish the encapsulation of the chip.
Although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. The utility model provides a SiC power device heat dissipation packaging structure, includes heat dissipation casing (1), its characterized in that: a plurality of groups of pins (2) are arranged on two side walls of the heat dissipation shell (1), a heat dissipation cover (6) is movably clamped on the heat dissipation shell (1), a plurality of groups of heat conduction clapboards (3) are fixedly connected inside the heat dissipation shell (1), a slide part (4) is arranged between every two groups of heat conduction clapboards (3), and a chip is movably clamped inside the slide part (4);
the slide glass part (4) comprises a box body (401), a piston cylinder (402) is fixedly connected to the inner wall of the box body (401), a piston rod (403) is connected to the piston cylinder (402) in a sliding mode, a push plate (404) is fixedly connected to the end portion of the piston rod (403), a first spring (405) is arranged between the push plate (404) and the piston cylinder (402), a piston (411) is connected to the inner wall of the piston cylinder (402) in a sliding mode, a slide glass box (406) is connected to the inner wall of the box body (401) in a sliding mode, a plurality of groups of adsorption holes (4061) are formed in the bottom end of the inner wall of the slide glass box (406), and the adsorption holes (4061) are mutually attached to the bottom end of a chip;
the embedded return bend (408) of installing of inner wall of box (401), the tip intercommunication of return bend (408) has flexible hose (409), the tip intercommunication of flexible hose (409) has air duct (4063), the inner wall bottom at slide cassette (406) is installed to air duct (4063) is embedded, the last intercommunication of air duct (4063) has a plurality of groups to adsorb air cock (4064), a plurality of groups adsorb air cock (4064) and set up respectively in a set of absorption hole (4061), a plurality of groups adsorb air cock (4064) tip and chip bottom laminating mutually.
2. The SiC power device heat dissipation package structure of claim 1, wherein: a plurality of first screw holes (5) of group have been seted up on heat dissipation casing (1), fixedly connected with heat dissipation silica gel plate (601) on heat dissipation lid (6), heat dissipation silica gel plate (601) are contradicted with slide glass portion (4) activity, sealing strip (602) have been laid on heat dissipation lid (6), a plurality of second screw holes (603) of group have all been seted up on sealing strip (602) and heat dissipation lid (6), threaded connection has bolt (604) between second screw hole (603) and a set of first screw holes (5) respectively.
3. The SiC power device heat dissipation package structure of claim 2, wherein: the heat dissipation shell comprises a heat dissipation shell body (1), a plurality of groups of first conducting strips (7) are embedded in the heat dissipation shell body (1), the first conducting strips (7) are electrically connected with a group of pins (2) respectively, a plurality of groups of second conducting strips (301) are embedded in the heat conduction shell body (3), two ends of the second conducting strips (301) are electrically connected with a group of first conducting strips (7) respectively, a plurality of groups of first conducting strips (302) are embedded in the heat conduction shell body (3), one ends of the first conducting strips (302) are electrically connected with a group of second conducting strips (301), and the other ends of the first conducting strips (302) extend to the top end of the outer wall of the heat conduction shell body (3).
4. The SiC power device heat dissipation package structure of claim 1, wherein: the novel glass slide box comprises a box body (401) and a slide box (406), wherein heat conducting materials are used for the box body (401) and the slide box (406), a plurality of groups of second conducting strips (4062) are embedded in the bottom end of the inner wall of the slide box (406), a plurality of groups of second conducting strips (4062) are electrically connected with a chip, a plurality of groups of third conducting strips (407) are embedded in the bottom end of the inner wall of the box body (401), one ends of the third conducting strips (407) are electrically connected with a group of second conducting strips (4062) respectively, and the other ends of the third conducting strips (407) are electrically connected with a group of first conducting strips (302) respectively.
5. The SiC power device heat dissipation package structure of claim 1, wherein: the end of the piston cylinder (402) is provided with a piston tube (410), the end of the piston tube (410) is communicated with the bent tube (408), the piston (411) is movably attached to the inner wall of the piston cylinder (402), the piston (411) is sleeved with a sealing ring, and the center of the piston (411) is fixedly connected with the end of the piston rod (403).
6. The SiC power device heat dissipation package structure of claim 1, wherein: the slide glass box is characterized in that a first sliding groove (4065) is formed in the slide glass box (406), a first sliding rod (4066) is connected to the inner wall of the first sliding groove (4065) in a sliding mode, an extrusion block (4067) is fixedly connected to the end portion of the first sliding rod (4066), the extrusion block (4067) is in movable contact with the inner wall of the box body (401), a first limit groove (4068) is formed in the slide glass box (406), the first limit groove (4068) is movably connected with the extrusion block (4067) in a clamping mode, a second spring (4069) is arranged between the inner wall of the first limit groove (4068) and the extrusion block (4067), and the second spring (4069) is sleeved on the first sliding rod (4066).
7. The SiC power device heat dissipation package of claim 6, wherein: the slide glass box is characterized in that a second limiting groove (40610) is formed in the first sliding rod (4066), a second sliding groove (40611) is formed in the slide glass box (406), a second sliding rod (40612) is connected to the inner wall of the second sliding groove (40611) in a sliding mode, and the end portion of the second sliding rod (40612) is movably clamped with the second limiting groove (40610).
8. The SiC power device heat dissipation package of claim 7, wherein: the end part of the second slide rod (40612) is fixedly connected with a limit bolt (40613), the limit bolt (40613) is movably clamped with the push plate (404), a third spring (40614) is arranged between the limit bolt (40613) and the outer wall of the slide box (406), and the third spring (40614) is sleeved on the second slide rod (40612).
9. A packaging method applied to the SiC power device heat dissipation packaging structure of any one of claims 1 to 8, characterized in that: the packaging method comprises the following steps:
extracting a group of chip boxes, and placing chips into the chip boxes;
pushing the slide box into the box body according to the slide box, simultaneously extruding the push plate, and discharging the gas in the piston cylinder;
after the slide glass box contacts the inner wall of the box body, the first spring drives the push plate to spring open, pulls the piston and sucks air into the piston cylinder;
air is sucked into the piston cylinder through the adsorption hole;
at this time, the adsorption hole generates adsorption force to the bottom end of the chip, so that the chip is adsorbed and fixed in the chip box;
the heat dissipation cover is clamped on the heat dissipation shell to prevent the slide box from being ejected, and the packaging of the chip is completed.
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