CN214477406U

CN214477406U - Non-contact card chip packaging structure with good heat dissipation performance

Info

Publication number: CN214477406U
Application number: CN202120811470.1U
Authority: CN
Inventors: 赵伟锋
Original assignee: Shenzhen Nanxin International Electronics Co ltd
Current assignee: Shenzhen Nanxin International Electronics Co ltd
Priority date: 2021-04-20
Filing date: 2021-04-20
Publication date: 2021-10-22
Anticipated expiration: 2031-04-20

Abstract

The utility model discloses a non-contact card chip package structure that thermal diffusivity is good belongs to chip package technical field, and it includes the encapsulation box, the last fixed surface of encapsulation box is connected with the lid, the lower fixed surface of encapsulation box inner wall is connected with the backing plate, the top of backing plate is provided with the chip, the surface of chip is provided with the heat conduction coating, the top overlap joint of chip has the heat conduction to fill. This non-contact card chip packaging structure that thermal diffusivity is good, through setting up the connecting piece, the jack, the pin, the plug, the notch, the slider, the kelly, a spring, the shell fragment, draw piece and fixture block, these settings make this device in the pin can change at any time, can normal use after the chip of breaking the pin in accident in the use installation updates the pin, avoid the direct abandonment of a large amount of available chips to cause the waste, pin dismouting is quick simple simultaneously, can effectively fix after the installation is accomplished, guarantee chip normal use, and is very practical.

Description

Non-contact card chip packaging structure with good heat dissipation performance

Technical Field

The utility model belongs to the technical field of the chip package, specifically be a good non-contact card chip packaging structure of thermal diffusivity.

Background

The package is a shell for mounting semiconductor integrated circuit chip, which not only plays the roles of mounting, fixing, sealing, protecting chip and enhancing electrothermal performance, but also is connected to the pins of the package shell by wires through the connection points on the chip, and the pins are connected with other devices by wires on the printed circuit board, thereby realizing the connection of internal chip and external circuit. The pin is usually fixed among traditional chip package structure, if the unexpected pin of buckling in the use, leads to the fracture of pin very easily, because package structure is airtight again, the pin is difficult to splice, leads to the direct abandonment of chip that the pin damaged, leads to the waste of a large amount of chips.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

In order to overcome the above-mentioned defect of prior art, the utility model provides a non-contact card chip packaging structure that thermal diffusivity is good has solved traditional chip packaging structure in the pin usually for fixing, if the pin is buckled to the accident in the use, leads to the fracture of pin very easily, because packaging structure is airtight again, the pin is difficult to splice, leads to the direct abandonment of chip that the pin damaged, leads to the problem of the waste of a large amount of chips.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a non-contact card chip packaging structure that thermal diffusivity is good, includes the packaging box, the last fixed surface of packaging box is connected with the lid, the lower fixed surface of packaging box inner wall is connected with the backing plate, the top of backing plate is provided with the chip, the surface of chip is provided with the heat conduction coating, the top overlap joint of chip has the heat conduction to fill, two fin of last fixed surface of lid is connected with, the equal fixedly connected with a plurality of connecting piece of the left and right sides face of chip, a plurality of jack has all been seted up to the left and right sides face of packaging box, the joint has the pin in the jack.

The one end fixedly connected with plug of pin, the plug is located corresponding the connecting piece, the notch has all been seted up to the left and right sides face of encapsulation box, the joint has the slider in the notch, the lower fixed surface of slider is connected with a plurality of kelly, the last fixed surface of slider is connected with a plurality of spring, the top fixed connection of spring is at the upper surface of notch inner wall, and the equal fixedly connected with in the face that keeps away from each other of two sliders draws the piece, and the equal fixedly connected with in face that is close to each other of two sliders is a plurality of fixture block.

As a further aspect of the present invention: the front and the back of the packaging box are fixedly connected with fixing plates, and threaded holes are formed in the upper surfaces of the fixing plates.

As a further aspect of the present invention: the backing plate is made of rubber, and the radiating fins are made of copper alloy.

As a further aspect of the present invention: the upper surface and the lower surface of the plug are fixedly connected with elastic pieces which are made of conductive materials.

As a further aspect of the present invention: a convex block is arranged on one side of the pull block, and a groove is formed in the upper surface of the box cover.

As a further aspect of the present invention: the clamping rods and the pins are arranged in a crossed mode, the distance between the two corresponding clamping rods is smaller than the width of the plug, and the packaging box is connected with the box cover in a hot melting mode.

(III) advantageous effects

Compared with the prior art, the beneficial effects of the utility model reside in that:

1. the non-contact card chip packaging structure with good heat dissipation performance is characterized in that a connecting piece, a jack, pins, a plug, a notch, a sliding block, a clamping rod, a spring sheet, a pulling block and a clamping block are arranged, the connecting piece and the plug are arranged in a matched mode, so that the pins can be inserted into and pulled out of the connecting piece through the plug, when part of the pins are broken, the broken pins can be pulled out of the connecting piece and replaced by new pins, the pulling block and the sliding block are arranged in a matched mode, when the pulling block is pulled upwards, the sliding block moves upwards along the notch and extrudes the spring to drive the clamping rod to move upwards, when the clamping rod moves to a certain height, the clamping rod does not block the plug any more, so that the plug can be pulled out of the connecting piece through pulling the pins, damaged pins can be taken out and replaced, after the new pins are inserted into the corresponding connecting pieces again, the pulling block is released, the sliding block automatically moves downwards due to drive the clamping rod to limit the clamped pins again, avoid the pin to produce when using not hard up, these settings make this device in the pin can change at any time, can normally use after the chip of breaking the pin in accident in the use installation updates the pin, avoid the direct abandonment of a large amount of available chips to cause the waste, pin dismouting is simple fast simultaneously, can effectively fix after the installation is accomplished, guarantee chip normal use, very practicality.

2. This non-contact card chip packaging structure that thermal diffusivity is good, through setting up the lid, the chip, the heat conduction coating, heat conduction is filled and the fin, the setting of lid, be in airtight state in making the encapsulation box, avoid the air to cause the corruption to the chip in getting into the encapsulation box, guarantee the life of chip, because adopt the hot melt to be connected between lid and the encapsulation box, the gas tightness in the encapsulation box has further been strengthened, effectively avoid the chip to receive the damage, and the setting of heat conduction is filled and the fin, the heat that makes the chip produce when using can be filled and the fin is effectual dispels fast through the heat conduction, it is overheated when avoiding the chip to use, also can ensure the normal work of chip when further ensuring chip life.

3. This non-contact card chip packaging structure that thermal diffusivity is good, through setting up the fixed plate, recess and shell fragment, the setting of shell fragment, make the plug and with the connecting piece between the joint more firm, simultaneously because the shell fragment adopts conducting material, can ensure the normal use of circuit when the joint is firm, and the setting of fixed plate, if need long-term fixed use after this device installation is accomplished, can use the screw to pass through the fixed plate and fix this device in suitable position, produce the offset when avoiding this device to use, avoid the outage, and the setting of recess, be convenient for distinguish the tow sides of this device, can distinguish fast and correctly install when using.

Drawings

Fig. 1 is a schematic front view of a cross-sectional structure of the present invention;

FIG. 2 is a schematic three-dimensional structure of the present invention;

FIG. 3 is a schematic three-dimensional structure of the slider of the present invention;

fig. 4 is a schematic top view of the present invention;

fig. 5 is a schematic view of a front cross-sectional structure of the connecting member of the present invention;

in the figure: the packaging box comprises a packaging box 1, a box cover 2, a backing plate 3, a chip 4, a heat conduction coating 5, heat conduction filling 6, a heat radiating fin 7, a connecting piece 8, a jack 9, a pin 10, a plug 11, a notch 12, a sliding block 13, a clamping rod 14, a spring 15, a spring piece 16, a pulling block 17, a clamping block 18, a fixing plate 19 and a groove 20.

Detailed Description

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

As shown in fig. 1-5, the utility model provides a technical solution: a non-contact card chip packaging structure with good heat dissipation performance comprises a packaging box 1, a box cover 2 is fixedly connected to the upper surface of the packaging box 1, the box cover 2 is arranged to enable the interior of the packaging box 1 to be in a closed state, air is prevented from entering the packaging box 1 to corrode a chip 4, the service life of the chip 4 is guaranteed, a base plate 3 is fixedly connected to the lower surface of the inner wall of the packaging box 1, the chip 4 is arranged above the base plate 3, a heat conduction coating 5 is arranged on the outer surface of the chip 4, a heat conduction filling 6 is lapped above the chip 4, two radiating fins 7 are fixedly connected to the upper surface of the box cover 2, the heat conduction filling 6 and the radiating fins 7 are arranged, heat generated by the chip 4 in use can be rapidly and effectively dissipated through the heat conduction filling 6 and the radiating fins 7, overheating of the chip 4 in use is avoided, the service life of the chip 4 is further guaranteed, and normal operation of the chip 4 can also be guaranteed, the left side surface and the right side surface of the chip 4 are fixedly connected with a plurality of connecting pieces 8, the connecting pieces 8 are matched with the plugs 11, so that the pins 10 can be inserted into and pulled out of the connecting pieces 8 through the plugs 11, when part of the pins 10 are broken, the broken pins 10 can be pulled out of the connecting pieces 8 and replaced with new pins 10, a plurality of jacks 9 are formed in the left side surface and the right side surface of the packaging box 1, and the pins 10 are clamped in the jacks 9.

One end of the pin 10 is fixedly connected with a plug 11, the plug 11 is positioned in the corresponding connecting piece 8, the left side and the right side of the packaging box 1 are both provided with notches 12, sliders 13 are clamped in the notches 12, the lower surfaces of the sliders 13 are fixedly connected with a plurality of clamping rods 14, the upper surfaces of the sliders 13 are fixedly connected with a plurality of springs 15, the top ends of the springs 15 are fixedly connected with the upper surface of the inner wall of the notches 12, the mutually far surfaces of the two sliders 13 are both fixedly connected with a pulling block 17, the pulling block 17 is matched with the sliders 13, when the pulling block 17 is pulled upwards, the sliders 13 move upwards along the notches 12 and extrude the springs 15 to drive the clamping rods 14 to move upwards, when the clamping rods 14 move to a certain height, the clamping rods 14 do not block the plug 11 any more, so that the plug 11 can pull the pin 10 to pull out of the connecting piece 8, thereby taking out and replacing the damaged pin 10, after a new pin 10 is inserted into the corresponding connecting piece 8 again, the pulling block 17 is loosened, the sliding blocks 13 automatically move downwards due to the elasticity of the spring 15, the clamping rods 14 are driven to limit the clamped pins 10 again, the pins 10 are prevented from loosening in use, and the surfaces, close to each other, of the two sliding blocks 13 are fixedly connected with a plurality of clamping blocks 18.

Specifically, as shown in fig. 2, the front surface and the back surface of the packaging box 1 are fixedly connected with a fixing plate 19, a threaded hole is formed in the upper surface of the fixing plate 19, the backing plate 3 is made of rubber, the radiating fins 7 are made of copper or copper alloy, and the radiating fins 7 are made of copper alloy, so that the heat conducting performance of the radiating fins 7 is enhanced, heat generated by the chip 4 can be quickly dissipated, and the chip 4 can be ensured to normally work for a long time.

Specifically, as shown in fig. 4 and 5, the upper surface and the equal fixedly connected with shell fragment 16 of lower surface of plug 11, the setting of shell fragment 16, make 11 card of plug in this device go into behind the connecting piece 8,

shell fragment

16 and 8 inner wall in close contact with of connecting piece, make kelly 14 can not break away from automatically plug 11 behind breaking away from jack 9, the removal and the change of the pin 10 of being convenient for, shell fragment 16 is electrically conductive material, one side of drawing piece 17 is provided with the lug, the setting of lug, be convenient for will draw piece 17 to upwards stimulate, thereby change pin 10 that can be quick, recess 20 is seted up to the upper surface of lid 2.

Specifically, as shown in fig. 1 and 3, the clamping rods 14 are arranged in a crossed manner with the pins 10, the distance between the two corresponding clamping rods 14 is smaller than the width of the plug 11, the clamping rods 14 are arranged in a crossed manner with the pins 10, so that the approaching ends of the two corresponding plugs 11 can be limited by one clamping rod 14, the structure of the device is simplified, the expected work can be completed, the device is very practical, and the packaging box 1 is connected with the box cover 2 through hot melting.

The utility model discloses a theory of operation does:

s1, when the device needs to be used, the directions of the chip 4 are distinguished through the groove 20, the chip 4 is correctly connected into a circuit through the pins 10 and then can be normally used, and heat generated by the chip 4 is conducted to the radiating fin 7 through the heat conducting coating 5 and the heat conducting filling 6 to be radiated;

s2, after the chip 4 is repeatedly disassembled and assembled when in use, if the pin 10 is broken, the pull block 17 on the corresponding side can be pulled upwards, so that the pull block 17 drives the slide block 13 to move upwards along the notch 12, at the moment, the slide block 13 upwards compresses the spring 15 and drives the bottom end of the clamping rod 14 to be separated from the jack 9, and at the moment, the broken pin 10 can be pulled out from the connecting piece 8;

s3, the plug 11 on one side of the new pin 10 is inserted into the corresponding connector 8 again through the jack 9, the pulling block 17 can be loosened after the pin 10 is clamped firmly, the sliding block 13 automatically moves downwards due to the elasticity of the spring 15 and drives the bottom end of the clamping rod 14 to be clamped into the jack 9 again, the plug 11 is blocked in the connector 8 and cannot be pulled out at the moment, and the pin 10 can be normally used after being replaced.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.

Claims

1. The utility model provides a good non-contact card chip packaging structure of thermal diffusivity, includes packaging box (1), its characterized in that: the packaging box comprises a packaging box body (1), a box cover (2) and a base plate (3), wherein the upper surface of the packaging box body (1) is fixedly connected with the lower surface of the inner wall of the packaging box body (1), a chip (4) is arranged above the base plate (3), a heat-conducting coating (5) is arranged on the outer surface of the chip (4), heat-conducting filling (6) is lapped above the chip (4), two radiating fins (7) are fixedly connected with the upper surface of the box cover (2), a plurality of connecting pieces (8) are fixedly connected with the left side surface and the right side surface of the chip (4), a plurality of jacks (9) are respectively formed in the left side surface and the right side surface of the packaging box body (1), and pins (10) are clamped in the jacks (9);

the one end fixedly connected with plug (11) of pin (10), plug (11) are located and correspond connecting piece (8), notch (12) have all been seted up to the left and right sides face of encapsulation box (1), the joint has slider (13) in notch (12), the lower fixed surface of slider (13) is connected with a plurality of kelly (14), the last fixed surface of slider (13) is connected with a plurality of spring (15), the top fixed connection of spring (15) is at the upper surface of notch (12) inner wall, and the equal fixedly connected with in face of keeping away from each other of two sliders (13) draws piece (17), and the equal fixedly connected with in face of being close to each other of two sliders (13) is a plurality of fixture block (18).

2. The package structure of claim 1, wherein the package structure comprises: the packaging box is characterized in that fixing plates (19) are fixedly connected to the front face and the back face of the packaging box (1), and threaded holes are formed in the upper surfaces of the fixing plates (19).

3. The package structure of claim 1, wherein the package structure comprises: the backing plate (3) is made of rubber, and the radiating fins (7) are made of copper alloy.

4. The package structure of claim 1, wherein the package structure comprises: the upper surface and the lower surface of the plug (11) are both fixedly connected with elastic pieces (16), and the elastic pieces (16) are made of conductive materials.

5. The package structure of claim 1, wherein the package structure comprises: a convex block is arranged on one side of the pulling block (17), and a groove (20) is formed in the upper surface of the box cover (2).

6. The package structure of claim 1, wherein the package structure comprises: the clamping rods (14) and the pins (10) are arranged in a crossed mode, the distance between the two corresponding clamping rods (14) is smaller than the width of the plug (11), and the packaging box (1) is connected with the box cover (2) in a hot melting mode.