CN215869345U - Semiconductor heterostructure diode - Google Patents
Semiconductor heterostructure diode Download PDFInfo
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- CN215869345U CN215869345U CN202122514020.9U CN202122514020U CN215869345U CN 215869345 U CN215869345 U CN 215869345U CN 202122514020 U CN202122514020 U CN 202122514020U CN 215869345 U CN215869345 U CN 215869345U
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Abstract
The utility model discloses a semiconductor heterostructure diode which comprises an upper shell and a lower shell, wherein an installation cover is slidably installed on one side of the top of the upper shell, installation grooves are formed in two sides inside the upper shell, insertion rods are installed on two sides of the installation cover, limiting rods are connected to two sides of each insertion rod through a rotating shaft, clamping grooves are formed in the positions, close to the two sides of each limiting rod, of the inner wall of each installation groove, a first spring is arranged on one side of each limiting rod, one end of each first spring is connected with each insertion rod, one end of each insertion rod is provided with a second spring, one end of each second spring is connected with the installation grooves, a plurality of heat dissipation holes are formed in the bottom of the lower shell at equal intervals, and the heat dissipation holes are communicated with the lower shell. The LED lamp has the advantages of simple and reasonable structure, novel design, simple and convenient operation, convenience for workers to observe the service condition of the diode, capability of replacing and maintaining the diode, and high practical value.
Description
Technical Field
The utility model relates to the technical field of electronic elements, in particular to a semiconductor heterostructure diode.
Background
The diode is a commonly used electrical component, and the diode in the current market is generally a shaft type diode, and the packaging process of the diode adopts the traditional welding process.
The Chinese patent application No. CN202022651786.7 discloses a diode, which comprises a base, a body and a fixing piece, wherein the base is provided with a mounting groove and a first pin, the first pin is arranged in the middle of the bottom end of the base, a gasket covers the bottom surface of the mounting groove, the body is arranged on the mounting groove, a second pin and a third pin are arranged on two sides of the bottom end of the body, the front end surface of the body is also provided with a chip groove, a chip is arranged in the chip groove, the fixing piece is arranged on the front end surface of the body, and the rear end surface of the fixing piece is connected with the front end surface of the gasket; through the joint of body and base, the fixed body of slot grafting on inserted block through the mounting and the backing plate simultaneously when not influencing the electrical conductivity, has saved traditional welding process, effectively increases production efficiency, and mounting and backing plate all have insulating material injection moulding in addition, improve the security of using. However, this method is inconvenient for the base to be detached, and is difficult to repair and replace the diode body inside. We have therefore developed this and propose a semiconductor heterostructure diode.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problems, the utility model provides the following technical scheme:
the utility model discloses a semiconductor heterostructure diode which comprises an upper shell and a lower shell, wherein an installation cover is slidably installed on one side of the top of the upper shell, installation grooves are formed in two sides inside the upper shell, insertion rods are installed on two sides of the installation cover, limiting rods are connected to two sides of each insertion rod through rotating shafts, clamping grooves are formed in the positions, close to the two sides of each limiting rod, of the inner wall of each installation groove, a first spring is arranged on one side of each limiting rod, one end of each first spring is connected with each insertion rod, one end of each insertion rod is provided with a second spring, one end of each second spring is connected with the installation grooves, a plurality of heat dissipation holes are formed in the bottom of the lower shell at equal intervals, and the heat dissipation holes are communicated with the lower shell.
As a preferable technical scheme of the utility model, a convex block is arranged on one side of the clamping groove close to the limiting rod, and the convex block is hemispherical.
As a preferable technical scheme of the utility model, the inserted bar and the mounting groove can be mutually clamped, and the limiting bar and the clamping groove can be mutually clamped.
As a preferable technical solution of the present invention, a sliding groove is provided inside the upper housing, and the mounting cover is slidably mounted in the sliding groove.
As a preferred technical solution of the present invention, a diode body is disposed between the upper casing and the lower casing, and a chip slot is disposed at the top of the diode body, and a chip is disposed in the chip slot.
As a preferred technical solution of the present invention, one end of the diode body is respectively provided with a first pin and a second pin, and a center of one side of the lower case is provided with a third pin.
The utility model has the beneficial effects that:
1. according to the semiconductor heterostructure diode, the mounting cover can be conveniently opened and closed by workers through the matching use of the sliding groove and the mounting cover, the using condition of the diode body can be quickly observed, the diode body is convenient to replace or maintain, heat generated by the diode can be dissipated through the heat dissipation holes, and the service life of the diode is prolonged;
2. according to the semiconductor heterostructure diode, the mounting cover and the upper shell can be fixed with each other through the matching use of the inserted link, the limiting rod and the clamping groove, the limiting rod can be separated from the clamping groove through the extrusion of the second spring through the matching use of the first spring, the lug and the second spring, the mounting cover is taken out, and the diode can be conveniently replaced and maintained by workers; the LED lamp has the advantages of simple and reasonable structure, novel design, simple and convenient operation, convenience for workers to observe the service condition of the diode, capability of replacing and maintaining the diode, and high practical value.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:
FIG. 1 is a schematic perspective view of a semiconductor heterostructure diode of the present invention;
FIG. 2 is a schematic partial plan cross-sectional view of a semiconductor heterostructure diode of the present invention;
FIG. 3 is a schematic perspective view of a diode of a semiconductor heterostructure diode of the present invention;
fig. 4 is an enlarged schematic view of the structure a of fig. 2 of a semiconductor heterostructure diode of the present invention.
In the figure: 1. an upper housing; 2. a lower housing; 3. installing a cover; 4. mounting grooves; 5. inserting a rod; 6. a limiting rod; 7. a card slot; 8. a first spring; 9. a bump; 10. a second spring; 11. a chute; 12. heat dissipation holes; 13. a diode body; 14. a chip slot; 15. a chip; 16. A first pin; 17. a second pin; 18. and a third pin.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Example (b): as shown in fig. 1-4, a semiconductor heterostructure diode of the present invention, includes an upper case 1 and a lower case 2, an installation cover 3 is slidably installed on one side of the top of the upper shell 1, installation grooves 4 are respectively arranged on two sides of the interior of the upper shell 1, insertion rods 5 are respectively installed on two sides of the installation cover 3, and both sides of the inserted bar 5 are connected with a limiting bar 6 through a rotating shaft, both sides of the inner wall of the mounting groove 4, which are close to the limiting bar 6, are provided with clamping grooves 7, one side of the limiting bar 6 is provided with a first spring 8, and one end of the first spring 8 is connected with the inserted link 5, one end of the inserted link 5 is provided with a second spring 10, and one end of the second spring 10 is connected with the mounting groove 4, a plurality of heat dissipation holes 12 are equidistantly formed in the bottom of the lower shell 2, and the heat dissipation holes 12 are communicated with the lower shell 2.
Wherein, draw-in groove 7 installs lug 9 in the one side that is close to gag lever post 6, just lug 9 is the hemisphere, through being equipped with lug 9, can make things convenient for gag lever post 6 and draw-in groove 7 separation.
Wherein, inserted bar 5 and mounting groove 4 can block each other, gag lever post 6 can block each other with draw-in groove 7, through being equipped with gag lever post 6, can make installation lid 3 and upper housing 1 reciprocal anchorage together.
Wherein, the inside of going up casing 1 is equipped with spout 11, just installation lid 3 slidable mounting is in spout 11, through being equipped with installation lid 3, can make things convenient for the staff to change and maintain the diode.
A diode body 13 is arranged between the upper shell 1 and the lower shell 2, a chip groove 14 is formed in the top of the diode body 13, and a chip 15 is arranged in the chip groove 14.
Wherein, one end of the diode body 13 is respectively provided with a first pin 16 and a second pin 17, and the center of one side of the lower shell 2 is provided with a third pin 18.
The working principle is as follows: when the diode body 13 needs to be replaced and maintained, the installation cover 3 is arranged, so that a worker can conveniently replace the diode body, the installation cover 3 is firstly pushed, the inserting rod 5 is pushed by the installation cover 3 to extrude the inserting rod 3 to the second spring 10, the second spring 10 is compressed under force, the limiting rod 6 is separated from the clamping groove 7, the installation cover 3 is loosened, the limiting rod 6 can move rightwards across the clamping groove 7 by installing the lug 9, the installation cover 3 moves rightwards, the installation cover 3 slides in the upper shell 1, the worker can conveniently and directly observe the use condition of the diode body 13, the diode body 13 is conveniently replaced or maintained by the worker, after replacement is completed, the installation cover 3 only needs to be pushed into the upper shell 1, the limiting rod 6 and the clamping groove 7 are clamped with each other, and the operation is simple, labour saving and time saving, the installation and the dismantlement of being convenient for, the phenomenon that the installation lid 3 can not take place to drop simultaneously avoids influencing diode body 13's use.
Finally, it should be noted that: in the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A semiconductor heterostructure diode comprises an upper shell (1) and a lower shell (2), and is characterized in that an installation cover (3) is slidably installed on one side of the top of the upper shell (1), installation grooves (4) are formed in two sides of the interior of the upper shell (1), insertion rods (5) are installed on two sides of the installation cover (3), limiting rods (6) are connected to two sides of the insertion rods (5) through rotating shafts, clamping grooves (7) are formed in two sides, close to the limiting rods (6), of the inner wall of each installation groove (4), first springs (8) are arranged on one sides of the limiting rods (6), one ends of the first springs (8) are connected with the insertion rods (5), second springs (10) are arranged at one ends of the insertion rods (5), one ends of the second springs (10) are connected with the installation grooves (4), a plurality of heat dissipation holes (12) are formed in the bottom of the lower shell (2) at equal intervals, and the heat dissipation holes (12) are communicated with the lower shell (2).
2. A semiconductor heterostructure diode according to claim 1, characterized in that the clamping groove (7) is provided with a bump (9) at a side close to the limiting rod (6), and the bump (9) is hemispherical.
3. A semiconductor heterostructure diode according to claim 1, wherein the insert rod (5) and the mounting groove (4) are capable of engaging with each other, and the stopper rod (6) and the engaging groove (7) are capable of engaging with each other.
4. A semiconductor heterostructure diode according to claim 1, characterized in that the upper case (1) is internally provided with a slide groove (11) and the mounting cap (3) is slidably mounted in the slide groove (11).
5. A semiconductor heterostructure diode according to claim 1, characterized in that a diode body (13) is provided between the upper case (1) and the lower case (2), and a chip slot (14) is provided on top of the diode body (13), and a chip (15) is provided in the chip slot (14).
6. A semiconductor heterostructure diode according to claim 5, characterized in that the diode body (13) is provided with a first pin (16) and a second pin (17) at one end, respectively, and a third pin (18) at the center of one side of the lower case (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122514020.9U CN215869345U (en) | 2021-10-19 | 2021-10-19 | Semiconductor heterostructure diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122514020.9U CN215869345U (en) | 2021-10-19 | 2021-10-19 | Semiconductor heterostructure diode |
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| Publication Number | Publication Date |
|---|---|
| CN215869345U true CN215869345U (en) | 2022-02-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122514020.9U Active CN215869345U (en) | 2021-10-19 | 2021-10-19 | Semiconductor heterostructure diode |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116387258A (en) * | 2023-06-05 | 2023-07-04 | 深圳辰达行电子有限公司 | Multi-chip MOS integrated packaging structure and packaging method thereof |
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2021
- 2021-10-19 CN CN202122514020.9U patent/CN215869345U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116387258A (en) * | 2023-06-05 | 2023-07-04 | 深圳辰达行电子有限公司 | Multi-chip MOS integrated packaging structure and packaging method thereof |
| CN116387258B (en) * | 2023-06-05 | 2023-08-11 | 深圳辰达行电子有限公司 | Multi-chip MOS integrated packaging structure and packaging method thereof |
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