CN210778667U - Diode packaging support structure - Google Patents
Diode packaging support structure Download PDFInfo
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- CN210778667U CN210778667U CN201922123747.7U CN201922123747U CN210778667U CN 210778667 U CN210778667 U CN 210778667U CN 201922123747 U CN201922123747 U CN 201922123747U CN 210778667 U CN210778667 U CN 210778667U
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- heat dissipation
- fixedly connected
- support
- plate
- rectangular
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Abstract
The utility model discloses a diode packaging support structure, including joint sealing and encapsulation support plate, the symmetrical welding of encapsulation support plate upper end has the circuit hole, the heat dissipation support is installed to encapsulation support plate upper end, the fin is installed to heat dissipation support upper end, heat dissipation support upper end both sides fixedly connected with rectangle fixture block. The utility model discloses a heat dissipation support, the circuit hole, the joint sealing, the closing cap, the push rod, first bayonet lock, first spring beam, the second bayonet lock, the second spring beam, the mating reaction of bolt, through with heat dissipation support and circuit hole lug connection on the encapsulation support plate, the bolt of joint sealing bottom both sides is through pressing down, direct joint is on heat dissipation support under the effect of second bayonet lock and second spring beam, the electrode pin that makes the joint sealing both sides directly inserts and establishes in the circuit hole, the closing cap passes through first bayonet lock joint in the joint sealing upper end, push away in the push rod, compress first spring beam, make first bayonet lock break away from the rectangle sliding chamber, thereby open the closing cap, directly dismantle the chip, make things convenient for the maintenance to change.
Description
Technical Field
The utility model relates to a diode technical field especially relates to a diode encapsulation supporting structure.
Background
The light emitting diode is called LED for short, when electrons and holes are combined, visible light can be radiated, so that the light emitting diode can be manufactured to be used as an indicator lamp in circuits and instruments or to form character or digital display.
Traditional diode encapsulation is direct with electrode pin welding repackage on the support plate to encapsulating encapsulation chip and lead wire in support encapsulating district, this kind of packaging form makes diode chip can't dismantle when damaging, can only change whole encapsulation support simultaneously, thereby electrode pin can appear welding insecure when the welding simultaneously makes the unable normal use of chip.
SUMMERY OF THE UTILITY MODEL
The purpose of the utility model is to solve the following shortcoming among the prior art: traditional diode encapsulation is direct with electrode pin welding repackage on the support plate to encapsulating encapsulation chip and lead wire in support encapsulating district, this kind of packaging form makes diode chip can't dismantle when damaging, can only change whole encapsulation support simultaneously, thereby electrode pin can appear welding insecure when the welding simultaneously makes the unable normal use of chip. In order to achieve the above purpose, the utility model adopts the following technical scheme:
a diode packaging support structure comprises a sealing box and a packaging support plate, and is characterized in that circuit holes are symmetrically welded at the upper end of the packaging support plate, a heat dissipation support is mounted at the upper end of the packaging support plate, a heat dissipation sheet is mounted at the upper end of the heat dissipation support, rectangular fixture blocks are fixedly connected to two sides of the upper end of the heat dissipation support, a cavity is formed in each rectangular fixture block, second spring rods are symmetrically mounted on the inner wall of the cavity, a second clamping pin is fixedly connected to the other end of each second spring rod, a heat sink is mounted at the bottom end of the sealing box, the bottom of the heat sink penetrates through the sealing box and extends to the lower end of the sealing box, a diode chip is mounted above the heat sink, gold wires are electrically connected to two sides of the diode chip, electrode pins are electrically connected to the other ends of the gold wires, the electrode, the plug pin both sides are seted up with second bayonet lock assorted triangle-shaped draw-in groove, the smooth chamber of rectangle has been seted up to joint sealing upper end both sides, the smooth intracavity wall of rectangle runs through and sliding connection has the push rod, the joint sealing upper end is connected with the closing cap through closing device, install printing opacity device between joint sealing and the closing cap.
Preferably, the heat dissipation support comprises a bearing plate and a support column, the support column is fixedly connected to the packaging support plate, the other end of the support column is fixedly connected to the bearing plate, and the upper end of the bearing plate is provided with a heat dissipation fin.
Preferably, the radiating fins are square metal sheets, and four small rectangular metal sheets are fixedly connected to the periphery of the radiating fins.
Preferably, the sealing device comprises rectangular fixing blocks extending from the bottom ends of the two sides of the sealing cover, a first spring rod is fixedly connected to one end, close to the sealing box, of each rectangular fixing block, and a first clamping pin is fixedly connected to the other end of each first spring rod.
Preferably, the light transmission device comprises a lens, the lens comprises a convex mirror and a rectangular plate, the convex mirror is fixedly connected to the rectangular plate, and the rectangular plate is clamped at the upper end of the sealing box.
Preferably, the push rod comprises a handle and a push plate, the handle penetrates through the rectangular sliding cavity and is connected with the rectangular sliding cavity in a sliding mode, and one end, close to the first clamping pin, of the handle is fixedly connected with the push plate.
Compared with the prior art, the beneficial effects of the utility model are that:
through the heat dissipation support, the circuit hole, the joint sealing, the closing cap, the push rod, first bayonet lock, first spring pole, the second bayonet lock, the second spring pole, the mating reaction of bolt, through with heat dissipation support and circuit hole lug connection on the encapsulation support plate, the bolt of joint sealing bottom both sides is through pressing down, direct joint is on heat dissipation support under the effect of second bayonet lock and second spring pole, the electrode pin that makes the joint sealing both sides is inserted and is established in the circuit hole, because the joint sealing is on heat dissipation support, it is more stable to make to be connected between electrode pin and the circuit hole, increase diode chip life, the closing cap passes through first bayonet lock joint in the joint sealing, push away in the push rod, compress first spring pole, make first bayonet lock break away from the rectangle sliding chamber, thereby open the closing cap, the chip is directly dismantled, make things convenient for the maintenance to change.
Drawings
Fig. 1 is a schematic front structural view of a diode package support structure according to the present invention;
fig. 2 is a schematic top view of a diode package support structure according to the present invention;
fig. 3 is a partially enlarged schematic view of a structure of the diode packaging support structure enclosing device provided by the present invention;
fig. 4 is a schematic diagram of a partial enlarged view of a clamping structure of a diode package support structure according to the present invention.
In the figure: the packaging structure comprises a packaging carrier plate 1, a circuit hole 2, an electrode pin 3, a heat sink 4, a heat sink 5, a sealing box 6, a diode chip 7, a gold wire 8, a lens 9, a sealing cover 10, a rectangular sliding cavity 11, a push rod 12, a first clamping pin 13, a first spring rod 14, a heat dissipation support 15, a second clamping pin 16, a second spring rod 17, a bolt 18 and a rectangular clamping block 19.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Referring to fig. 1-4, a diode package support structure comprises a package 6 and a package support plate 1, wherein circuit holes 2 are symmetrically welded at the upper end of the package support plate 1, a heat dissipation support 15 is mounted at the upper end of the package support plate 1, the heat dissipation support 15 comprises a support plate and a support pillar, the support pillar is fixedly connected to the package support plate 1, the other end of the support pillar is fixedly connected to the support plate, a heat sink 4 is mounted at the upper end of the heat dissipation support 15, the heat sink 4 is a square metal sheet, four small rectangular metal sheets are fixedly connected to the periphery of the heat sink 4, the heat sink and the support plate are both made of aluminum alloy, the aluminum alloy is light in weight and fast in heat dissipation, so that the heat dissipation effect of the heat sink is good, the heat sink 4 directly contacts the support, the two sides of the upper end of the heat dissipation bracket 15 are fixedly connected with rectangular fixture blocks 19, the rectangular fixture blocks 19 are provided with cavities, the cavities are cross-shaped, the middle is wide, the upper end and the lower end are narrow, the inner wall of the cavities are symmetrically provided with second spring rods 17, the other end of each second spring rod 17 is fixedly connected with a second clamp pin 16, each second clamp pin is in a right-angled triangle shape, the bottom end of the sealing box 6 is provided with a heat sink 5, the bottom of the heat sink 5 penetrates through the sealing box 6 and extends to the lower end, the heat sink 5 is in a cylindrical shape, the upper end of each heat sink 4 is provided with a cylindrical groove matched with the heat sink 5, so that the heat sink 5 is closely attached to the heat sink 4, the heat dissipation is improved, a diode chip 7 is arranged above the heat sink 5, the two sides of the diode chip 7 are electrically connected with gold wires 8, the other ends, the two sides of the bolt 18 are provided with triangular clamping grooves matched with the second clamping pin 16, the bolt 18 is pressed against the second clamping pin 16, the second spring rod 17 is compressed, the spring rod 17 rebounds through the triangular clamping groove to enable the second clamping pin 16 to be clamped in the triangular clamping groove, so that the sealing box is fixedly connected with the heat dissipation support 15, the electrode pin 3 is inserted in the circuit hole 2 to complete electrical connection, the clamping structure is stable, the electrode pin 3 cannot be separated from the circuit hole 2, the service life of the diode chip 7 is prolonged, two sides of the upper end of the sealing box 6 are provided with rectangular sliding cavities 11, the inner walls of the rectangular sliding cavities 11 are penetrated and slidably connected with push rods 12, each push rod 12 comprises a handle and a push plate, the handles are penetrated and slidably connected in the rectangular sliding cavities, the push plates are fixedly connected at one ends of the handles close to the first clamping pins 13, the upper end of the sealing, the sealing device comprises rectangular fixing blocks extending from the bottom ends of two sides of a sealing cover 10, one end of each rectangular fixing block, which is close to a sealing box 6, is fixedly connected with a first spring rod 14, the other end of each first spring rod 14 is fixedly connected with a first clamping pin 13, the sealing cover 6 is tightly pressed and is clamped with the sealing box 6 under the action of the sealing device, so that the diode chip 7 is not in contact with the outside, the service life of the diode chip 7 is prolonged, under the condition that the diode chip 7 needs to be replaced, a push rod 12 is pushed to extrude the first clamping pin 13, under the compression action of the first spring rods 14, the first clamping pin 13 is separated from a rectangular sliding cavity 11, so that the sealing cover 10 is opened, the diode chip 7 is directly replaced, the whole packaging support does not need to be replaced, so that the replacement is convenient, a light transmission device is installed between the sealing box 6 and the sealing cover 10, the light transmission device, convex mirror fixed connection is on the rectangular plate, and the rectangular plate joint is in 6 upper ends of joint box, and lens are glass lens, can not change by oxidation in long-time use to reduce diode chip 7's light efficiency, offer the rectangular plate assorted rectangle recess with lens 9 in 6 upper ends of joint box, make rectangular plate and rectangle recess closely laminate, thereby increase the seal of encapsulation support. (the connection mode of the electrode pin 3 and the circuit hole 2 belongs to the prior art, and the working principle is not described in detail)
The utility model discloses in, the user is when using the device, press the joint sealing 6, make the bolt 18 of 6 bottoms of joint sealing under the effect of second bayonet lock 16 and second spring beam 17, make the 16 joints of second bayonet lock in the triangle-shaped draw-in groove of 18 both sides of bolt, thereby make joint sealing 6 through heat dissipation support 15 and 1 fixed connection of encapsulation support plate, make electrode pin 3 stably insert and establish in the circuit hole, press closing cap 10 again, first bayonet lock 13 joint through closing cap 10 bottom is in rectangle sliding chamber 11, accomplish the closure effect between closing cap 10 and the joint sealing 6, when needing to change diode chip 7, push rod 12 interpolation, compress first spring beam 14, make first bayonet lock 13 break away from in the rectangle sliding chamber 11, thereby make closing cap 10 tear open from 6 upper ends of joint sealing, thereby comparatively simple and convenient dismantlement diode chip 7 accomplishes the change.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. A diode packaging support structure comprises a sealing box (6) and a packaging support plate (1), and is characterized in that circuit holes (2) are symmetrically welded at the upper end of the packaging support plate (1), a heat dissipation support (15) is installed at the upper end of the packaging support plate (1), a heat dissipation sheet (4) is installed at the upper end of the heat dissipation support (15), rectangular fixture blocks (19) are fixedly connected to two sides of the upper end of the heat dissipation support (15), a cavity is formed in each rectangular fixture block (19), second spring rods (17) are symmetrically installed on the inner wall of the cavity, second clamp pins (16) are fixedly connected to the other ends of the second spring rods (17), a heat sink (5) is installed at the bottom end of the sealing box (6), the bottom of the heat sink (5) penetrates through the sealing box (6) and extends to the lower end, a diode chip (7) is installed above the heat sink (5), and gold, gold thread (8) other end electric connection has electrode pin (3), electrode pin (3) run through and fixed connection joint sealing (6) bottom, the rectangle cavity has been seted up to joint sealing (6) lower extreme symmetry, rectangle cavity inner wall fixedly connected with bolt (18), bolt (18) both sides seted up with second bayonet lock (16) assorted triangle-shaped draw-in groove, smooth chamber (11) of rectangle have been seted up to joint sealing (6) upper end both sides, smooth chamber (11) inner wall of rectangle runs through and sliding connection has push rod (12), joint sealing (6) upper end is connected with closing cap (10) through closing device, install printing opacity device between joint sealing (6) and closing cap (10).
2. The diode package support structure according to claim 1, wherein the heat dissipation bracket (15) comprises a carrier plate and a support pillar, the support pillar is fixedly connected to the package carrier plate (1), the other end of the support pillar is fixedly connected to the carrier plate, and a heat sink (4) is mounted on the carrier plate.
3. The diode packaging support structure according to claim 1, wherein the heat sink (4) is a square metal plate, and four small rectangular metal plates are fixedly connected to the periphery of the heat sink (4).
4. The diode encapsulating bracket structure according to claim 1, wherein the sealing device comprises a rectangular fixing block extending from the bottom ends of two sides of the sealing cover (10), a first spring rod (14) is fixedly connected to one end of the rectangular fixing block close to the sealing box (6), and a first clamping pin (13) is fixedly connected to the other end of the first spring rod (14).
5. A diode package support structure according to claim 1, wherein said light transmission means comprises a lens (9), said lens (9) comprises a convex mirror and a rectangular plate, said convex mirror is fixedly connected to said rectangular plate, and said rectangular plate is clamped to the upper end of the enclosure (6).
6. A diode package support structure according to claim 1, wherein the push rod (12) comprises a handle and a push plate, the handle is penetrated and slidably connected in the rectangular sliding cavity, and the handle is fixedly connected with the push plate near one end of the first pin (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922123747.7U CN210778667U (en) | 2019-12-02 | 2019-12-02 | Diode packaging support structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922123747.7U CN210778667U (en) | 2019-12-02 | 2019-12-02 | Diode packaging support structure |
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| Publication Number | Publication Date |
|---|---|
| CN210778667U true CN210778667U (en) | 2020-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922123747.7U Expired - Fee Related CN210778667U (en) | 2019-12-02 | 2019-12-02 | Diode packaging support structure |
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| Country | Link |
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| CN (1) | CN210778667U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111969090A (en) * | 2020-08-27 | 2020-11-20 | 宁波昇特微电子科技有限公司 | Deep ultraviolet chip epitaxial chip packaging structure device |
| CN112216776A (en) * | 2020-10-28 | 2021-01-12 | 江西舜曙照明电器有限公司 | Increase LED supporting structure of gas tightness |
| CN113066765A (en) * | 2021-03-22 | 2021-07-02 | 合肥鑫晟光电科技有限公司 | Semiconductor packaging structure |
-
2019
- 2019-12-02 CN CN201922123747.7U patent/CN210778667U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111969090A (en) * | 2020-08-27 | 2020-11-20 | 宁波昇特微电子科技有限公司 | Deep ultraviolet chip epitaxial chip packaging structure device |
| CN112216776A (en) * | 2020-10-28 | 2021-01-12 | 江西舜曙照明电器有限公司 | Increase LED supporting structure of gas tightness |
| CN112216776B (en) * | 2020-10-28 | 2021-11-23 | 江西舜曙照明电器有限公司 | Increase LED supporting structure of gas tightness |
| CN113066765A (en) * | 2021-03-22 | 2021-07-02 | 合肥鑫晟光电科技有限公司 | Semiconductor packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200616 Termination date: 20201202 |
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| CF01 | Termination of patent right due to non-payment of annual fee |