CN214313232U - Full-view-angle LED chip packaging structure - Google Patents

Abstract

The utility model discloses a full visual angle LED chip packaging structure, include: packaging; the inner end of the package is provided with a heat dissipation seat; the top end of the package is provided with a transparent shell; the LED chip is arranged at the top end of the heat dissipation seat; the heat dissipation structure comprises pins, and two pins are symmetrically arranged at two ends of the middle of the heat dissipation seat. This full-view LED chip packaging structure through setting up transparent shell to reduce the height of encapsulation, make the luminous LED chip of inside full angle realize full angle's the luminous through the euphotic layer that transparent shell and radiating seat surface set up, draw the piece through the pulling, dismantlement encapsulation that can be convenient, the practicality is stronger.

Description

Full-view-angle LED chip packaging structure

Technical Field

The utility model relates to a LED chip technical field specifically is a full angle of view LED chip packaging structure.

Background

A solid semiconductor device, the heart of LED is a semiconductor wafer, one end of the wafer is attached to a support, one end is a cathode, the other end is connected with the anode of a power supply, so that the whole wafer is encapsulated by epoxy resin;

the existing LED chip package needs to be fixedly installed, so that the package needs to occupy larger volume, the package structure reflects and absorbs light, the LED chip package cannot achieve the condition of emitting light at a full view angle, and the installation and disassembly of the package are troublesome due to the fact that the LED chip package needs to be fixedly installed, and the practicability is poor.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a full visual angle LED chip packaging structure to solve the inconvenient problem of dismantling of prior art's LED chip packaging structure at least.

In order to achieve the above object, the utility model provides a following technical scheme: a full-view LED chip package structure, comprising:

packaging;

the inner end of the package is provided with a heat dissipation seat;

the top end of the package is provided with a transparent shell;

the LED chip is arranged at the top end of the heat dissipation seat;

the heat dissipation structure comprises pins, and two pins are symmetrically arranged at two ends of the middle of the heat dissipation seat.

Preferably, a light-transmitting layer is arranged on the surface of the heat sink.

Preferably, a bonding wire is arranged between the electrode of the LED chip and the corresponding end pin.

Preferably, the bottom both sides of transparent shell all are provided with the connecting block, the bottom of connecting block is provided with the inserted block, the trompil has been seted up at the middle part of inserted block.

Preferably, jacks are symmetrically formed in two sides of the top end of the package, and the jacks are the same as the connecting block and the inserting block in shape.

Preferably, the surface both ends of encapsulation have all been seted up the spout, sliding connection has the protecgulum in the spout, the surface of protecgulum is provided with the fixed block.

Preferably, the inner encapsulation outer wall of protecgulum is provided with draws the piece, the inner of drawing the piece is provided with the one end of connecting rod, the other end of connecting rod extends into the inner chamber of encapsulation to be provided with the fan piece, the bottom surface of fan piece is provided with the lug, the lug slides and sets up in the inner chamber fluting of encapsulation, the one end of lug is provided with the spring.

Compared with the prior art, the beneficial effects of the utility model are that: this full-view LED chip packaging structure through setting up transparent shell to reduce the height of encapsulation, make the luminous LED chip of inside full angle realize full angle's the luminous through the euphotic layer that transparent shell and radiating seat surface set up, draw the piece through the pulling, dismantlement encapsulation that can be convenient, the practicality is stronger.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic diagram of the exploded structure of FIG. 1;

fig. 3 is a partial sectional structural view of the package of fig. 1.

In the figure: 1. the LED packaging structure comprises a package, 2, a heat dissipation seat, 3, a transparent shell, 4, an LED chip, 5, a bonding wire, 6, a pin, 7, a connecting block, 8, an inserting block, 9, an opening, 10, a jack, 11, a sliding groove, 12, a front cover, 13, a fixing block, 14, a pulling block, 15, a connecting rod, 16, a fan block, 17, a bump, 18 and a spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a full-view LED chip package structure, comprising: the LED package comprises a package 1, a heat dissipation seat 2, a transparent shell 3, an LED chip 4 and pins 6, wherein the heat dissipation seat 2 is arranged at the inner end of the package 1; the top end of the package 1 is provided with a transparent shell 3; the top end of the heat radiation seat 2 is provided with an LED chip 4; two pins 6 are symmetrically arranged at two ends of the middle part of the heat radiation seat 2, and the chip can be connected with the outside through the pins 6.

Preferably, a light-transmitting layer is further disposed on the surface of the heat sink 2, so as to increase the emitting angle of the light.

Preferably, a bonding wire 5 is disposed between the electrode of the LED chip 4 and the corresponding terminal pin 6, so that the LED chip 4 is connected to the pin 6.

As preferred scheme, further, transparent shell 3's bottom both sides all are provided with connecting block 7, and connecting block 7's bottom is provided with inserted block 8, and trompil 9 has been seted up at inserted block 8's middle part, through setting up connecting block 7, is convenient for increase inserted block 8's steadiness.

Preferably, the package 1 is symmetrically provided with insertion holes 10 at both sides of the top end thereof, the insertion holes 10 are the same as the connection blocks 7 and the insertion blocks 8, and the insertion blocks 8 can conveniently enter the insertion holes 10.

As a preferred scheme, furthermore, the two ends of the surface of the package 1 are both provided with sliding grooves 11, the sliding grooves 11 are connected with a front cover 12 in a sliding manner, the surface of the front cover 12 is provided with fixing blocks 13, and the front cover 12 is convenient to pull open through the fixing blocks 13.

Preferably, a pulling block 14 is arranged on the outer wall of the package 1 at the inner end of the front cover 12, one end of a connecting rod 15 is arranged at the inner end of the pulling block 14, the other end of the connecting rod 15 extends into the inner cavity of the package 1 and is provided with a sector 16, a bump 17 is arranged on the bottom end surface of the sector 16, the bump 17 is slidably arranged in a groove of the inner cavity of the package 1, a spring 18 is arranged at one end of the bump 17, and the sector 16 is convenient to return through the spring 18.

The LED chip of the scheme is the prior art, and the LED chip can meet the requirements of the scheme.

All the electrical components in the present application are connected with the power supply adapted to the electrical components through the wires, and an appropriate controller should be selected according to actual conditions to meet the control requirements, and specific connection and control sequences should be obtained.

When the heat dissipation device is installed, the heat dissipation seat 2 is placed in the package 1, the jack 8 at the bottom end of the transparent shell 3 is inserted into the jack 10 in an alignment manner, the insertion block 8 enters the jack 10, the fan block 16 is extruded into an inner cavity of the package, along with the entry of the insertion block 8, when the opening hole 9 is located at one end of the fan block 16, the fan block 16 is clamped into the opening hole 9 under the action of the spring 18, and the insertion block 8 is clamped; when the transparent shell 3 needs to be detached, the front cover 12 is slid, the pull block 14 is pulled, the connecting rod 15 drives the fan block 16 to move towards one end, the fan block 16 is separated from the open hole 9, the transparent shell 3 can be taken out, and the practicability is high.

In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation; also, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," "fixedly mounted," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral to one another; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. A full-view LED chip packaging structure, comprising:

a package (1);

the heat dissipation device comprises a heat dissipation seat (2), wherein the heat dissipation seat (2) is arranged at the inner end of the package (1);

the top end of the package (1) is provided with the transparent shell (3);

the LED chip (4) is arranged at the top end of the heat dissipation seat (2);

the heat dissipation structure comprises pins (6), and two pins (6) are symmetrically arranged at two ends of the middle of the heat dissipation seat (2).

2. The full-view LED chip package structure according to claim 1, wherein a light-transmitting layer is disposed on the surface of the heat spreader (2).

3. The full-view LED chip packaging structure according to claim 1, wherein bonding wires (5) are arranged between the electrodes of the LED chips (4) and the corresponding end pins (6).

4. The full-view LED chip packaging structure according to claim 1, wherein two sides of the bottom end of the transparent housing (3) are respectively provided with a connecting block (7), the bottom end of the connecting block (7) is provided with an insert block (8), and the middle of the insert block (8) is provided with an opening (9).

5. The full-view LED chip packaging structure of claim 4, wherein the top end of the package (1) is symmetrically provided with jacks (10) at two sides, and the jacks (10) are the same as the connecting blocks (7) and the plug blocks (8) in shape.

6. The full-view LED chip packaging structure according to claim 5, wherein two ends of the surface of the package (1) are respectively provided with a sliding groove (11), the sliding grooves (11) are connected with a front cover (12) in a sliding manner, and a fixing block (13) is arranged on the surface of the front cover (12).

7. The full-view LED chip packaging structure of claim 6, wherein the outer wall of the inner end package (1) of the front cover (12) is provided with a pull block (14), the inner end of the pull block (14) is provided with one end of a connecting rod (15), the other end of the connecting rod (15) extends into the inner cavity of the package (1) and is provided with a fan block (16), the bottom end surface of the fan block (16) is provided with a bump (17), the bump (17) is slidably arranged in a groove of the inner cavity of the package (1), and one end of the bump (17) is provided with a spring (18).

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