CN220324479U - Surface-mounted LED lamp bead with heat radiation structure - Google Patents

Surface-mounted LED lamp bead with heat radiation structure Download PDF

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Publication number
CN220324479U
CN220324479U CN202321653260.XU CN202321653260U CN220324479U CN 220324479 U CN220324479 U CN 220324479U CN 202321653260 U CN202321653260 U CN 202321653260U CN 220324479 U CN220324479 U CN 220324479U
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China
Prior art keywords
heat dissipation
heat
lamp bead
led lamp
heat conduction
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Active
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CN202321653260.XU
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Chinese (zh)
Inventor
蒋衡亮
彭德才
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Shenzhen Jirui Optoelectronic Co ltd
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Shenzhen Jirui Optoelectronic Co ltd
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Priority to CN202321653260.XU priority Critical patent/CN220324479U/en
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Abstract

The utility model relates to the technical field of LED lamp beads, and discloses a mounted LED lamp bead with a heat dissipation structure, which comprises a lamp bead, wherein the bottom of the lamp bead is connected with a heat dissipation mechanism, and the heat dissipation mechanism is connected with a fixing mechanism; the heat dissipation mechanism comprises heat conduction glue, the heat conduction glue is connected with heat conduction pins, the heat conduction pins are connected with heat dissipation cavities, and heat dissipation holes are formed in the side surfaces of the heat dissipation cavities; the fixing mechanism comprises a base plate, a fixing groove is formed in the top of the base plate, and a fixing rod is connected inside the fixing groove. This paste dress LED lamp pearl with heat radiation structure carries out heat conduction and heat convection to the heat that sends in the lamp pearl use through heat conduction pin and heat dissipation chamber, dispels the heat to the lamp pearl jointly, guarantees the lamp pearl normal use, inserts the fixed slot through dead lever and card strip in, utilizes the card strip card in the fixed slot, accomplishes the installation of lamp pearl, convenient to use.

Description

Surface-mounted LED lamp bead with heat radiation structure
Technical Field
The utility model relates to the technical field of LED lamp beads, in particular to a mounted LED lamp bead with a heat dissipation structure.
Background
The LED is a solid semiconductor device capable of converting electric energy into visible light, and can directly convert the electric energy into light, the heart of the LED is a semiconductor wafer, one end of the wafer is attached to a bracket, the other end of the wafer is a negative electrode, and the other end of the wafer is connected with the positive electrode of a power supply, so that the whole wafer is encapsulated by epoxy resin.
The heat dissipation efficiency of the mounting LED lamp bead on the current market is lower, and inconvenient when the mounting, as CN218153691U strong heat dissipation formula for street lamp disclosed by Chinese patent website is used, a plurality of heat conducting wires are fixedly arranged at the bottom of the core plate, heat is dissipated through the heat conduction mode, the periphery of the base is provided with an air flow cavity, the inner cavity wall and the bottom cavity wall of the air flow cavity are all penetrated and provided with air flow holes, the convection of the inside air and the outside air can be formed, the heat exchange efficiency is improved, the heat dissipation efficiency and the effect are improved, the service life of the lamp bead is prolonged, but the convection heat dissipation is carried out at the bottom of the air flow cavity through the air flow holes, the heat conduction efficiency is reduced, and the mounting is inconvenient when the mounting is carried out, so that the mounting LED lamp bead with a heat dissipation structure is provided for solving the problems mentioned in the background.
Disclosure of Invention
(one) solving the technical problems
The utility model aims to provide a mounting LED lamp bead with a heat dissipation structure, so as to solve the problems in the background technology.
(II) technical scheme
In order to solve the technical problems, the utility model provides the following technical scheme: a mounting LED lamp bead with a heat radiation structure comprises a lamp bead, wherein the bottom of the lamp bead is connected with a heat radiation mechanism, and the heat radiation mechanism is connected with a fixing mechanism;
the heat dissipation mechanism comprises heat conduction glue, the heat conduction glue is connected with heat conduction pins, the heat conduction pins are connected with heat dissipation cavities, and heat dissipation holes are formed in the side surfaces of the heat dissipation cavities;
the fixing mechanism comprises a substrate, a fixing groove is formed in the top of the substrate, a fixing rod is connected inside the fixing groove, and a clamping strip is connected to the bottom of the fixing rod.
Preferably, the lamp bead comprises an LED chip, the top of the LED chip is connected with transparent resin, the top of the transparent resin is connected with a transparent shell, and the bottom of the transparent shell is connected with a bottom plate.
The LED lamp bead device can meet the normal function requirement of the LED lamp bead through the lamp bead, and light emitted by the LED chip is uniformly dispersed through the convex surface formed by the transparent resin and the transparent shell.
Preferably, the heat conducting pins are inserted into the substrate through the bottom plate and the heat dissipation cavity.
The heat conduction pins can be fixed through the substrate by inserting the heat conduction pins into the substrate, and the lamp beads are communicated and controlled through the substrate.
Preferably, the fixing rod is connected to the bottom of the heat dissipation cavity.
The lamp beads and the heat dissipation mechanism are connected to the fixing mechanism through the fixing rods, so that the lamp beads can be conveniently fixed on the bottom plate.
Compared with the prior art, the utility model has the following beneficial effects:
1. this paste dress LED lamp pearl with heat radiation structure carries out heat conduction and heat convection to the heat that the lamp pearl sent in the use through heat conduction pin and heat dissipation chamber, dispels the heat to the lamp pearl jointly, guarantees the lamp pearl normal use.
2. This paste dress LED lamp pearl with heat radiation structure inserts in the fixed slot through dead lever and card strip, utilizes card strip card in the fixed slot, accomplishes the installation of lamp pearl, convenient to use.
Drawings
FIG. 1 is a schematic cross-sectional view of the present utility model;
fig. 2 is a schematic diagram of the front structure of the present utility model.
Wherein: 1. a lamp bead; 11. an LED chip; 12. a transparent resin; 13. a transparent housing; 14. a bottom plate; 2. a heat dissipation mechanism; 21. a heat-conducting adhesive; 22. a heat conducting pin; 23. a heat dissipation cavity; 24. a heat radiation hole; 3. a fixing mechanism; 31. a substrate; 32. a fixing groove; 33. a fixed rod; 34. and (5) clamping the strip.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-2, a mounted LED lamp bead with a heat dissipation structure includes a lamp bead 1, a heat dissipation mechanism 2 is connected to the bottom of the lamp bead 1, and a fixing mechanism 3 is connected to the heat dissipation mechanism 2;
the heat dissipation mechanism 2 comprises heat conduction glue 21, wherein the heat conduction glue 21 is connected with heat conduction pins 22, the heat conduction pins 22 are connected with heat dissipation cavities 23, and heat dissipation holes 24 are formed in the side surfaces of the heat dissipation cavities 23;
the fixing mechanism 3 comprises a base plate 31, a fixing groove 32 is formed in the top of the base plate 31, a fixing rod 33 is connected inside the fixing groove 32, and a clamping strip 34 is connected to the bottom of the fixing rod 33.
Specifically, the lamp bead 1 comprises an LED chip 11, the top of the LED chip 11 is connected with a transparent resin 12, the top of the transparent resin 12 is connected with a transparent shell 13, and the bottom of the transparent shell 13 is connected with a bottom plate 14.
Through above-mentioned technical scheme, lamp pearl 1 makes the device can satisfy normal LED lamp pearl functional requirement to evenly disperse the light that LED chip 11 sent through the convex surface that transparent resin 12 and transparent shell 13 formed.
Specifically, the heat conductive pins 22 are inserted into the substrate 31 through the bottom plate 14 and the heat dissipation chamber 23.
Through the above technical scheme, the heat conduction pins 22 are inserted into the substrate 31, so that the heat conduction pins 22 can be fixed through the substrate and the lamp beads 1 can be communicated and controlled through the substrate 31.
Specifically, the fixing rod 33 is connected to the bottom of the heat dissipation chamber 23.
Through the above technical scheme, the fixing rod 33 connects the lamp bead 1 and the heat dissipation mechanism 2 on the fixing mechanism 3, so that the lamp bead 1 can be conveniently fixed on the bottom plate 14.
When the LED lamp bead is used, the fixing rod 33 and the clamping strip 34 are inserted into the fixing groove 32 in an aligned mode, the clamping strip 34 is folded inwards under pressure at the opening of the fixing groove 32, after the clamping strip 34 is inserted into the fixing groove 32, the clamping strip 34 is not opened under pressure and is clamped into the fixing groove 32, the LED lamp bead is fixed on the substrate 31, when the lamp bead 1 is used for heating, the transparent resin 12 absorbs heat of the LED chip 11 and transfers the heat to the heat conducting pins 22, the heat absorbed by the heat conducting pins 22 is transferred into the heat dissipation cavity 23, and the heat dissipation is carried out on the heat conducting pins 22 in the heat dissipation cavity 23 through the heat dissipation holes 24.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (4)

1. The utility model provides a paste dress LED lamp pearl with heat radiation structure, includes lamp pearl (1), its characterized in that: the bottom of the lamp bead (1) is connected with a heat dissipation mechanism (2), and the heat dissipation mechanism (2) is connected with a fixing mechanism (3);
the heat dissipation mechanism (2) comprises heat conduction glue (21), the heat conduction glue (21) is connected with heat conduction pins (22), the heat conduction pins (22) are connected with heat dissipation cavities (23), and heat dissipation holes (24) are formed in the side surfaces of the heat dissipation cavities (23);
the fixing mechanism (3) comprises a base plate (31), a fixing groove (32) is formed in the top of the base plate (31), a fixing rod (33) is connected inside the fixing groove (32), and a clamping strip (34) is connected to the bottom of the fixing rod (33).
2. The mounted LED lamp bead with heat dissipation structure of claim 1, wherein: the lamp bead (1) comprises an LED chip (11), the top of the LED chip (11) is connected with a transparent resin (12), the top of the transparent resin (12) is connected with a transparent shell (13), and the bottom of the transparent shell (13) is connected with a bottom plate (14).
3. The mounted LED lamp bead with heat dissipation structure of claim 1, wherein: the heat conducting pins (22) penetrate through the bottom plate (14) and the heat dissipation cavity (23) and are inserted into the substrate (31).
4. The mounted LED lamp bead with heat dissipation structure of claim 1, wherein: the fixing rod (33) is connected to the bottom of the heat dissipation cavity (23).
CN202321653260.XU 2023-06-27 2023-06-27 Surface-mounted LED lamp bead with heat radiation structure Active CN220324479U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321653260.XU CN220324479U (en) 2023-06-27 2023-06-27 Surface-mounted LED lamp bead with heat radiation structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321653260.XU CN220324479U (en) 2023-06-27 2023-06-27 Surface-mounted LED lamp bead with heat radiation structure

Publications (1)

Publication Number Publication Date
CN220324479U true CN220324479U (en) 2024-01-09

Family

ID=89422303

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321653260.XU Active CN220324479U (en) 2023-06-27 2023-06-27 Surface-mounted LED lamp bead with heat radiation structure

Country Status (1)

Country Link
CN (1) CN220324479U (en)

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