CN216491257U - Aluminum-based copper-clad plate with multiple layers, added structure and strong heat dissipation - Google Patents

Aluminum-based copper-clad plate with multiple layers, added structure and strong heat dissipation Download PDF

Info

Publication number
CN216491257U
CN216491257U CN202122866761.3U CN202122866761U CN216491257U CN 216491257 U CN216491257 U CN 216491257U CN 202122866761 U CN202122866761 U CN 202122866761U CN 216491257 U CN216491257 U CN 216491257U
Authority
CN
China
Prior art keywords
copper
clad plate
plate
aluminum
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202122866761.3U
Other languages
Chinese (zh)
Inventor
季荣梅
曹小进
陈佳伟
何亚祥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Xinrongjin Insulation Materials Co ltd
Original Assignee
Shenzhen Xinrongjin Insulation Materials Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Xinrongjin Insulation Materials Co ltd filed Critical Shenzhen Xinrongjin Insulation Materials Co ltd
Priority to CN202122866761.3U priority Critical patent/CN216491257U/en
Application granted granted Critical
Publication of CN216491257U publication Critical patent/CN216491257U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The utility model provides an aluminum-based copper-clad plate with multiple layers, increased structure and strong heat dissipation, which relates to the technical field of copper-clad plates and comprises a copper-clad plate body, the lower surface of the copper-clad plate body is provided with an aluminum substrate body, the lower surface of the aluminum substrate body is provided with an insulating plate, the lower surface of the insulating plate is provided with a silica gel heat conducting plate, the lower surface of the silica gel heat conducting plate is provided with a plurality of U-shaped heat conducting blocks, the lower surface of the U-shaped heat conducting block is provided with the dustproof net, the heat generated by the copper-clad plate body and the aluminum substrate body can be conducted to the silica gel heat conducting plate through the insulating plate, the silica gel heat conducting plate can conduct the conducted heat to the U-shaped heat conducting block for dissipation, and the heat dissipating holes of the heat conducting block arranged in the U-shaped heat conducting block can further dissipate the heat, the copper-clad plate body and the aluminum substrate body are enabled to be in a normal temperature, and damage caused by overhigh heat is effectively prevented.

Description

Aluminum-based copper-clad plate with multiple layers, added structure and strong heat dissipation
Technical Field
The utility model relates to the technical field of copper-clad plates, in particular to an aluminum-based copper-clad plate with multiple layers, an added structure and high heat dissipation.
Background
The copper clad laminate is a plate material prepared by soaking electronic glass fiber cloth or other reinforcing materials with resin, covering one side or two sides with copper foil and hot-pressing, for example, a high heat dissipation flexible polyimide copper clad laminate with application number CN202021541633.0, and relates to the technical field of copper clad laminates. The scheme comprises a copper-clad plate body; one side fixedly connected with mounting of copper-clad plate body, one side fixedly connected with guide rail of mounting, one side sliding fit of guide rail has the locating lever, and the inside of locating lever is seted up flutedly, and the inside elastic fit of recess has the stopper. This scheme has seted up the channel through the inside at the copper-clad plate body, conducting material can be installed to the inside of channel, thereby make the copper-clad plate probably carry out two-way electrically conductive or one-way electrically conductive according to the demand, thereby promoted the variety of copper-clad plate, be provided with the guide rail in one side of copper-clad plate body, when needs promote the mounting, the guide rail has played the effect of helping hand, thereby it is more convenient when the operation to make, this internal heat dissipation layer that is provided with of copper-clad plate, the temperature of copper-clad plate body during operation has been reduced, thereby the life-span of copper-clad plate body has been promoted.
However, according to the technical scheme, the copper-clad plate is provided with a large number of electronic elements, a large number of heat energy is generated in the working state, the copper-clad plate is poor in heat dissipation performance, and the copper-clad plate is easy to damage due to untimely heat dissipation after being used for a long time, so that the improvement is made, and the aluminum-based copper-clad plate with the multiple layers and the strong structure heat dissipation performance is provided.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide an aluminum-based copper-clad plate with a composite layer, a structure and high heat dissipation, which can effectively solve the problems in the background technology.
In order to achieve the purpose, the utility model adopts the technical scheme that:
the aluminum-based copper-clad plate with the composite layer added and the structure having strong heat dissipation performance comprises a copper-clad plate body, wherein the lower surface of the copper-clad plate body is provided with an aluminum substrate body, the lower surface of the aluminum substrate body is provided with an insulation plate, the lower surface of the insulation plate is provided with a silica gel heat-conducting plate, the lower surface of the silica gel heat-conducting plate is provided with a plurality of U-shaped heat-conducting blocks, the lower surface of the U-shaped heat-conducting block is provided with a dust screen, the copper-clad plate body, the aluminum substrate body, the insulation plate, the silica gel heat-conducting plate and the U-shaped heat-conducting blocks are fixedly installed in the inner part of the surrounding shell, and the two ends of the dust screen are fixedly installed on the outer surface of the lower end of the surrounding shell through two clamping mechanisms.
Preferably, a second rectangular heat dissipation groove is formed between every two insulation plates, and each insulation plate is internally provided with a transverse heat dissipation hole and a vertical heat dissipation hole which are formed in a transverse-vertical crossing mode.
Preferably, a first rectangular heat dissipation groove is formed between every two U-shaped heat conduction blocks, and a plurality of heat conduction block heat dissipation holes are formed in the U-shaped heat conduction blocks.
Preferably, the clamping mechanism comprises a clamping block, and one end surface of the clamping block is fixedly installed at one end of the dust screen.
Preferably, the other end of the clamping block is movably clamped in the clamping groove, the clamping groove is formed in the L-shaped fixing plate, and the L-shaped fixing plate is fixedly installed on the lower surface of the surrounding shell.
Preferably, a fixing bolt penetrates through the center of the fixture block and one end of the L-shaped fixing plate movably, and one end of the fixing bolt is clamped on the lower surface of the surrounding shell movably.
Preferably, the outer surfaces of two sides of the upper end of the surrounding shell are fixedly provided with two fixed protruding blocks, and each fixed protruding block is internally provided with a fixed hole.
Compared with the prior art, the utility model has the following beneficial effects:
(1) according to the utility model, the copper-clad plate body and the aluminum substrate body are placed in the surrounding shell to prevent shaking in use, heat generated by the copper-clad plate body and the aluminum substrate body can be conducted to the silica gel heat-conducting plate by the insulating plate, the silica gel heat-conducting plate can conduct the conducted heat to the U-shaped heat-conducting block to be dissipated, the second rectangular heat-dissipating groove formed in the insulating plate can dissipate a part of overhigh heat in advance by matching with the transverse heat-dissipating holes and the vertical heat-dissipating holes, so that the insulating plate can be prevented from being damaged, the heat can be further dissipated by the heat-conducting block heat-dissipating holes formed in the U-shaped heat-conducting block, the copper-clad plate body and the aluminum substrate body are in a normal temperature, and damage caused by overhigh heat can be effectively prevented.
(2) According to the utility model, dust can be isolated from the outside through the dustproof net, the U-shaped heat conducting block in the dustproof net is prevented from accumulating dust, so that the heat dissipation effect is reduced, the clamping mechanisms arranged at two ends of the dustproof net can clamp the heat conducting block, the dust conducting block is prevented from falling off after being used for a long time, and meanwhile, the dust conducting block can be conveniently replaced.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the front side of an aluminum-based copper-clad plate with a composite layer added and strong structural heat dissipation;
FIG. 2 is a schematic structural view of an aluminum-based copper-clad plate with a composite layer added and strong structural heat dissipation performance;
FIG. 3 is a schematic structural diagram of the side of the aluminum-based copper-clad plate with the multiple layers added and the structure having strong heat dissipation;
FIG. 4 is a schematic structural diagram of a section A-A in FIG. 3 of the aluminum-based copper-clad plate with multiple layers and strong structural heat dissipation;
FIG. 5 is an enlarged schematic structural diagram of a part a in FIG. 2 of the aluminum-based copper-clad plate with a composite layer added and strong structural heat dissipation.
In the figure: 1. a copper-clad plate body; 2. an enclosure; 3. a fixing hole; 4. fixing the protruding block; 5. a dust screen; 6. an aluminum substrate body; 7. an insulating plate; 8. a silica gel heat-conducting plate; 9. a U-shaped heat conducting block; 10. transverse heat dissipation holes; 11. vertical heat dissipation holes; 12. a first rectangular heat sink; 13. heat dissipation holes of the heat conduction block; 14. a chucking mechanism; 1401. fixing the bolt; 1402. an L-shaped fixing plate; 1403. a card slot; 1404. a clamping block; 15. a second rectangular heat sink.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
As shown in fig. 1-5, the aluminum-based copper-clad plate with the composite layer having the strong heat dissipation performance is provided, including the copper-clad plate body 1, the lower surface of the copper-clad plate body 1 is provided with the aluminum-clad plate body 6, the lower surface of the aluminum-clad plate body 6 is provided with the insulation plate 7, the lower surface of the insulation plate 7 is provided with the silica gel heat-conducting plate 8, the lower surface of the silica gel heat-conducting plate 8 is provided with the plurality of U-shaped heat-conducting blocks 9, the lower surface of the U-shaped heat-conducting blocks 9 is provided with the dust screen 5, the copper-clad plate body 1, the aluminum-clad plate body 6, the insulation plate 7, the silica gel heat-conducting plate 8 and the U-shaped heat-conducting blocks 9 are fixedly installed in the inner part surrounding the shell 2, and both ends of the dust screen 5 are fixedly installed on the outer surface of the lower end surrounding the shell 2 through two chucking mechanisms 14.
It can be understood that in this application, per two a second rectangle radiating groove 15 has all been seted up between the insulation board 7, and every the inside of insulation board 7 all is equipped with horizontal louvre 10 and the vertical louvre 11 that the cross was seted up anyhow, can be with partly in advance effluvium of the heat of overhigh through the horizontal louvre 10 of second rectangle radiating groove 15 cooperation and the vertical louvre 11 of seting up on the insulation board 7.
It can be understood that, in this application, per two all be equipped with a first rectangle radiating groove 12 between the U-shaped heat conduction piece 9, and every a plurality of heat conduction piece louvre 13 has all been seted up to the inside of U-shaped heat conduction piece 9, and heat dissipation that can step forward through the inside heat conduction piece louvre 13 of seting up of U-shaped heat conduction piece 9 is in a normal temperature for copper-clad plate body 1 and aluminium base board body 6 are in, and the effectual heat that prevents leads to the damage excessively high.
It can be understood that, in the present application, the clamping mechanism 14 includes the clamping block 1404, and one end surface of the clamping block 1404 is fixedly installed at one end of the dust screen 5, so that the dust can be isolated from the outside through the dust screen 5, and the dust can be prevented from being accumulated on the inner U-shaped heat-conducting block 9, which results in the reduction of the heat dissipation effect thereof.
It can be understood that, in this application, the other end activity chucking of fixture block 1404 is in the inside of draw-in groove 1403, draw-in groove 1403 is seted up in the inside of L shape fixed plate 1402, L shape fixed plate 1402 fixed mounting is at the lower surface that surrounds shell 2, can carry out preliminary fixed when using in the inside of draw-in groove 1403 through the other end activity chucking of fixture block 1404.
It can be understood that in the present application, the fixing bolt 1401 movably passes through the center of the fixture block 1404 and one end of the L-shaped fixing plate 1402, one end of the fixing bolt 1401 is movably fastened to the lower surface of the surrounding casing 2, and the fixture block 1404 and the L-shaped fixing plate 1402 are fastened by the fixing bolt 1401, so that the fixture block can be rapidly replaced when in use.
It can be understood that in this application, surround the equal fixed mounting in upper end both sides surface of shell 2 has two fixed outstanding pieces 4, every fixed orifices 3 has all been seted up to fixed outstanding piece 4's inside, has all seted up a fixed orifices 3 through fixed outstanding piece 4's inside and can fix equipment using the messenger.
The working principle of the aluminum-based copper-clad plate with the composite layer added structure and strong heat dissipation performance is as follows:
during the use, at first copper-clad plate body 1 and aluminium base board body 6 are put into the inside that surrounds shell 2 and can prevent when using and shake, and the heat that copper-clad plate body 1 and aluminium base board body 6 produced can be conducted to silica gel heat-conducting plate 8 by insulation board 7 on, and silica gel heat-conducting plate 8 can be with the heat conduction of conducting coming to give off on U-shaped heat conduction piece 9, wherein the second rectangle radiating groove 15 of seting up on the insulation board 7 cooperates horizontal louvre 10 and vertical louvre 11 can be with partly in advance effluvium of too high heat, can prevent that insulation board 7 from damaging, and the inside heat conduction piece louvre 13 of seting up of U-shaped heat conduction piece 9 can further effluvium the heat, make copper-clad plate body 1 and aluminium base board body 6 be in a normal temperature, effectually prevent that the heat from too high and leading to the damage.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (7)

1. The aluminum-based copper-clad plate with the composite layer added and strong structure heat dissipation performance comprises a copper-clad plate body (1) and is characterized in that: the copper-clad plate comprises a copper-clad plate body (1), wherein an aluminum substrate body (6) is arranged on the lower surface of the copper-clad plate body (1), an insulation plate (7) is arranged on the lower surface of the aluminum substrate body (6), a silica gel heat-conducting plate (8) is arranged on the lower surface of the insulation plate (7), a plurality of U-shaped heat-conducting blocks (9) are arranged on the lower surface of the U-shaped heat-conducting blocks (9), a dustproof net (5) is arranged on the lower surface of the surrounding shell (2), the copper-clad plate body (1), the aluminum substrate body (6), the insulation plate (7), the silica gel heat-conducting plate (8) and the U-shaped heat-conducting blocks (9) are fixedly arranged in the surrounding shell (2), and two ends of the dustproof net (5) are fixedly arranged on the outer surface of the lower end of the surrounding shell (2) through two clamping mechanisms (14).
2. The aluminum-based copper-clad plate with the composite layer added and strong structural heat dissipation performance according to claim 1, characterized in that: every two all seted up a second rectangle radiating groove (15) between insulation board (7), and every the inside of insulation board (7) all is equipped with horizontal louvre (10) and vertical louvre (11) that the cross was seted up anyhow.
3. The aluminum-based copper-clad plate with the composite layer added and strong structural heat dissipation performance according to claim 1, characterized in that: every two all be equipped with one first rectangle radiating groove (12) between U-shaped heat conduction piece (9), and every a plurality of heat conduction piece louvre (13) have all been seted up to the inside of U-shaped heat conduction piece (9).
4. The aluminum-based copper-clad plate with the composite layer added and strong structural heat dissipation performance according to claim 1, characterized in that: the clamping mechanism (14) comprises a fixture block (1404), and one end surface of the fixture block (1404) is fixedly arranged at one end of the dust screen (5).
5. The aluminum-based copper-clad plate with the composite layer added and strong structural heat dissipation performance according to claim 4, characterized in that: the other end of the clamping block (1404) is movably clamped in the clamping groove (1403), the clamping groove (1403) is formed in the L-shaped fixing plate (1402), and the L-shaped fixing plate (1402) is fixedly installed on the lower surface of the surrounding shell (2).
6. The aluminum-based copper-clad plate with the composite layer added and strong structural heat dissipation performance according to claim 4, characterized in that: a fixing bolt (1401) movably penetrates through the center of the clamping block (1404) and one end of the L-shaped fixing plate (1402), and one end of the fixing bolt (1401) is movably clamped on the lower surface of the surrounding shell (2).
7. The aluminum-based copper-clad plate with the composite layer added and strong structural heat dissipation performance according to claim 1, characterized in that: the outer surface of the two sides of the upper end of the surrounding shell (2) is fixedly provided with two fixed protruding blocks (4), and each fixed protruding block (4) is internally provided with a fixed hole (3).
CN202122866761.3U 2021-11-22 2021-11-22 Aluminum-based copper-clad plate with multiple layers, added structure and strong heat dissipation Active CN216491257U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122866761.3U CN216491257U (en) 2021-11-22 2021-11-22 Aluminum-based copper-clad plate with multiple layers, added structure and strong heat dissipation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122866761.3U CN216491257U (en) 2021-11-22 2021-11-22 Aluminum-based copper-clad plate with multiple layers, added structure and strong heat dissipation

Publications (1)

Publication Number Publication Date
CN216491257U true CN216491257U (en) 2022-05-10

Family

ID=81399440

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122866761.3U Active CN216491257U (en) 2021-11-22 2021-11-22 Aluminum-based copper-clad plate with multiple layers, added structure and strong heat dissipation

Country Status (1)

Country Link
CN (1) CN216491257U (en)

Similar Documents

Publication Publication Date Title
CN216491257U (en) Aluminum-based copper-clad plate with multiple layers, added structure and strong heat dissipation
CN114401581A (en) Asymmetric copper-thick double-sided aluminum substrate and processing method thereof
CN109587940B (en) High-heat-dissipation aluminum-based copper-clad plate
CN219437215U (en) Intelligent heat dissipation multilayer circuit board
CN212463626U (en) Multilayer flexible circuit board
CN214046159U (en) PCB circuit board with penetrating type via hole bonding pad
CN210781515U (en) Circuit board with good anti-aging effect
CN220629654U (en) Single-sided gold-plated PCB circuit board
CN217214691U (en) Semiconductor device structure and electronic equipment
CN216414649U (en) Electronic circuit board with good heat resistance
CN214014795U (en) Circuit board with anticreep high thermal conductivity
CN215935156U (en) High-efficient mounting structure of high density blind hole 5G circuit board
CN219269377U (en) Circuit board with heat dissipation function
CN220755279U (en) Insulating multilayer aluminum-based circuit board
CN216531896U (en) Heat dissipation type circuit board
CN212544164U (en) Exhaust fan control circuit board convenient to heat dissipation
CN218103625U (en) Modular HDI high density laminated plate
CN218183597U (en) High multilayer blind hole electroplate HDI board
CN216930405U (en) Metal substrate capable of replacing ceramic substrate
CN216873457U (en) Circuit board with heat dissipation structure
CN219162623U (en) High-power-consumption quick-release electronic disc structure
CN212749832U (en) PCI password card convenient to heat dissipation is overhauld
CN216982313U (en) High-speed image processing board with protective structure
CN219802661U (en) Printed wiring board with bonding pad protection structure
CN216087096U (en) High-density interconnection set top box printed circuit board

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant