CN216930405U

CN216930405U - Metal substrate capable of replacing ceramic substrate

Info

Publication number: CN216930405U
Application number: CN202123205758.3U
Authority: CN
Inventors: 杨永平
Original assignee: Guangdong Daoshengyi Laser Technology Co ltd
Current assignee: Guangdong Daoshengyi Laser Technology Co ltd
Priority date: 2021-12-20
Filing date: 2021-12-20
Publication date: 2022-07-08
Anticipated expiration: 2031-12-20

Abstract

The utility model discloses a metal substrate capable of replacing a ceramic substrate, which comprises a metal base layer, wherein an insulating layer is fixedly connected to the upper end of the metal base layer, a circuit layer is fixedly connected to the upper end of the insulating layer, assembling holes penetrating up and down are formed in four corners of the upper ends of the circuit layer, the insulating layer and the metal base layer, heat dissipation devices are clamped on the left portion and the right portion of the upper end of the metal base layer, LED lamp posts are arranged at the upper ends of the two heat dissipation devices, a protection device is movably inserted into the circuit layer, the insulating layer and the metal base layer, two penetrating grooves penetrating up and down are formed in the upper ends of the circuit layer and the insulating layer, two grooves are formed in the upper end of the metal base layer, two first circular grooves are formed in the left portion and the right portion of the inner wall of the two grooves, and the four penetrating grooves correspond to the two grooves in position. The metal substrate capable of replacing the ceramic substrate has the advantages of high heat conduction efficiency, good protection effect and high stability, and is suitable for replacing the ceramic substrate.

Description

Metal substrate capable of replacing ceramic substrate

Technical Field

The utility model relates to the technical field of metal substrates, in particular to a metal substrate capable of replacing a ceramic substrate.

Background

The ceramic substrate refers to a special process plate in which copper foil is directly bonded to the surface of an alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at a high temperature. The manufactured ultrathin composite substrate has excellent electrical insulation performance, high heat conduction characteristic, excellent soft weldability and high adhesion strength, can be etched into various patterns like a PCB (printed Circuit Board), and has great current carrying capacity, but the ceramic substrate material has high cost, low toughness and frangibility, and the rejection rate in each process is relatively high, so that the application field of the existing metal substrate is wider, and at least the following defects are caused in the using process of the existing metal substrate: 1. the existing metal substrate is poor in heat dissipation performance in the use process, and for electronic elements such as LED illuminating lamp beads and the like which need high heat conduction, the heat conduction rate cannot meet the requirements of equipment; 2. the existing metal substrate is often directly installed and fixed through screws when being installed, the substrate cannot be protected after the metal substrate is installed, the substrate is easily damaged, and economic burden is increased.

SUMMERY OF THE UTILITY MODEL

The main objective of the present invention is to provide a metal substrate that can replace a ceramic substrate, which can effectively solve the problems in the background art.

In order to achieve the purpose, the utility model adopts the technical scheme that:

the utility model provides a metal substrate of fungible ceramic substrate, includes metal-based layer, metal-based layer upper end fixedly connected with insulating layer, insulating layer upper end fixedly connected with circuit layer, the pilot hole that has upper and lower break-over is all opened in circuit layer, insulating layer and metal-based layer upper end four corners, the equal joint in metal-based layer upper end left part and upper end right part has heat abstractor, two the heat abstractor upper end all is provided with the LED lamp pole, circuit layer, insulating layer and metal-based layer alternate swing joint jointly and have protector.

Preferably, the upper end of the circuit layer and the upper end of the insulating layer are both provided with two penetrating grooves which are vertically penetrated, the upper end of the metal base layer is provided with two grooves, two circular grooves are formed in the left part of the inner wall of the groove and the right part of the inner wall of the groove, the penetrating grooves correspond to the two grooves in position, and the heat dissipation devices are located in the two grooves.

Preferably, protector includes punch holder and lower plate, the common fixedly connected with guard plate of one end that punch holder and lower plate are close to each other, the guard plate is "L" shape structure, punch holder and lower plate alternate swing joint jointly and have the fixed screw, the thread groove has been opened to punch holder surface lower part, fixed screw surface has cup jointed a spring and No. two springs, a spring and No. two springs are located between punch holder and the lower plate.

Preferably, the fixing screw penetrates through assembly holes in the circuit layer, the insulating layer and the metal base layer, the first spring and the upper clamping plate are located on the upper portion of the circuit layer, and the second spring and the lower clamping plate are located on the lower portion of the metal base layer.

Preferably, heat abstractor includes the heat conduction copper billet, open the heat conduction copper billet upper end has the mounting groove, a plurality of lug of heat conduction copper billet lower extreme fixedly connected with, heat conduction copper billet surface left part and surface right part all have opened No. two circular slots, two all be provided with rebound spring in No. two circular slots, two equal swing joint has the circular billet in No. two circular slots.

Preferably, two the rebound spring all is located between two circle pieces, two the circle piece all with a circular slot joint, two the LED lamp pole all is located the mounting groove.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, the first spring and the second spring are arranged on the protective device, the first spring is positioned at the upper part of the circuit layer, the second spring is positioned at the lower part of the metal base layer, so that the vibration of the whole metal substrate can be reduced after the installation is finished, the metal substrate is prevented from being damaged by the vibration of the installation part, the service life is prolonged, and the protective plate is arranged between the lower clamp plate and the upper clamp plate and has an L-shaped structure, so that the corners of the metal substrate can be protected, and the collision can be avoided;

2. according to the utility model, the heat dissipation device penetrates through the circuit layer and the insulating layer and is clamped in the metal base layer, the outer surface of the heat conduction copper block is attached to the inner walls of the through grooves in the circuit layer and the insulating layer, so that heat on an electronic element can be directly diffused to the metal base layer through the heat conduction copper block, the lower end of the heat conduction copper block is provided with the lug, the heat conductivity can be improved, and the round block is arranged on the heat conduction copper block and is clamped with the first round groove through the round block, so that the mounting stability can be improved, and the use is convenient.

Drawings

FIG. 1 is a schematic view of an overall structure of a metal substrate that can be used as a substitute for a ceramic substrate according to the present invention;

FIG. 2 is a schematic view of an overall structure of a metal substrate that can be used to replace a ceramic substrate according to the present invention;

FIG. 3 is a schematic view of the overall structure of a metal substrate protection device that can replace a ceramic substrate according to the present invention;

fig. 4 is a schematic view of an overall structure of a heat dissipation device of a metal substrate that can replace a ceramic substrate according to the present invention.

In the figure: 1. a metal base layer; 2. an insulating layer; 3. an assembly hole; 4. a circuit layer; 5. an LED lamp post; 6. a heat sink; 7. a guard device; 11. a groove; 12. a first circular groove; 41. penetrating a groove; 61. a heat-conducting copper block; 62. mounting grooves; 63. a second round groove; 64. a round block; 65. a rebound spring; 66. a bump; 71. an upper splint; 72. a lower splint; 73. a protection plate; 74. fixing screws; 75. a first spring; 76. a second spring; 77. a thread groove.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Examples

Referring to fig. 1-4, the present invention provides a technical solution:

the utility model provides a metal substrate of fungible ceramic substrate, including metal

basic unit

1, 1 upper end fixedly connected with insulating layer 2 of metal basic unit, 2 upper end fixedly connected with circuit layers 4 of insulating layer, circuit layers 4, the pilot hole 3 of break-over about

insulating layer

2 and 1 upper end four corners of metal basic unit have all been opened, 1 upper end left part of metal basic unit and the equal joint in upper end right part have heat abstractor 6, two heat abstractor 6 upper ends all are provided with LED lamp pole 5, circuit layers 4,

insulating layer

2 and 1 common interlude swing joint of metal basic unit have protector 7.

In this embodiment, the upper end of the circuit layer 4 and the upper end of the insulating layer 2 are both provided with two through grooves 41 which are vertically penetrated, the upper end of the metal base layer 1 is provided with two grooves 11, the left parts of the inner walls of the two grooves 11 and the right parts of the inner walls of the two grooves 11 are both provided with two first round grooves 12, the positions of the four through grooves 41 correspond to the positions of the two grooves 11, and the two heat dissipation devices 6 are both positioned in the two grooves 11; the protection device 7 comprises an upper clamping plate 71 and a lower clamping plate 72, one ends, close to each other, of the upper clamping plate 71 and the lower clamping plate 72 are fixedly connected with a protection plate 73 together, the protection plate 73 is of an L-shaped structure, the upper clamping plate 71 and the lower clamping plate 72 are movably connected with fixing screws 74 together in a penetrating mode, the lower portion of the outer surface of the upper clamping plate 71 is provided with a thread groove 77, the outer surface of the fixing screws 74 is sleeved with a first spring 75 and a second spring 76, and the first spring 75 and the second spring 76 are located between the upper clamping plate 71 and the lower clamping plate 72; fixed screw 74 runs through circuit layer 4, pilot hole 3 on insulating layer 2 and the metal-based layer 1, spring 75 and punch holder 71 are located circuit layer 4 upper portion, No. two springs 76 and lower plate 72 are located metal-based layer 1 lower part, guard plate 73 is located punch holder 71 and lower plate 72 middle part, fix when can being convenient for a plurality of metal substrate installation, can protect the metal substrate corner simultaneously, avoid colliding with, and service life is prolonged, spring 75 and No. two springs 76 can carry out the shock attenuation to whole metal substrate, and service life is prolonged.

In this embodiment, the heat dissipation device 6 includes a heat conducting copper block 61, an installation groove 62 is formed at the upper end of the heat conducting copper block 61, a plurality of bumps 66 are fixedly connected to the lower end of the heat conducting copper block 61, second round grooves 63 are formed in the left portion and the right portion of the outer surface of the heat conducting copper block 61, a rebound spring 65 is arranged in each of the two second round grooves 63, and a round block 64 is movably connected in each of the two second round grooves 63; two resilience springs 65 all are located between two circle pieces 64, and two circle pieces 64 all with a circular slot 12 joint, two LED lamp poles 5 all are located mounting groove 62, and circle piece 64 can make heat conduction copper billet 61 and a circular slot 12 joint together, the installation of being convenient for, improvement stability.

It should be noted that, the utility model is a metal substrate that can replace the ceramic substrate, in the using process, the circuit layer 4 is electrically connected with the LED lamp post 5, and then the LED lamp post 5 is installed in the installation groove 62, because the heat conducting copper block 61 is the copper metal with good heat conducting effect, the heat emitted by the LED lamp post 5 can be diffused to the metal base layer 1 through the heat conducting copper block 61, so that the heat can be rapidly dispersed, because the lower end of the heat conducting copper block 61 is provided with a plurality of convex blocks 66, the heat conducting copper block 61 and the lower groove wall of the groove 11 form a gap, the heat dissipation effect is improved, the round block 64 is clamped in the second round groove 63, and the rebound spring 65 is arranged between the round block 64 and the second round groove 63, the heat dissipation device 6 can be directly clamped with the metal base layer 1, the installation efficiency and stability are improved, when the metal substrate needs to be installed, the fixing screws 74 respectively penetrate through the upper clamping plate 71, the lower clamping plate, and the lower clamping plate, and the lower clamping the heat dissipation device 6, and the lower clamping plate, and the lower clamping plate, and the lower clamping the, Pilot hole 3 and lower plate 72, again with the screw thread groove 77 mounted position threaded connection of fixed screw 74 lower part, because spring 75 surface has cup jointed spring 75 and spring 76 No. two, can play the cushioning effect to whole metal substrate after the installation, it causes jolting and leads to the fact the damage to metal substrate to avoid the removal after the installation, and install guard plate 73 between punch holder 71 and the lower plate 72, can protect metal substrate's half angle, avoid colliding with each other when installing together individual metal substrate and causing the damage, and the service life is prolonged, whole metal substrate heat conduction efficiency is high, and the protective effect is good, and stability is high, and the ceramic substrate's substitute use is suitable for.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. A metal substrate that can replace a ceramic substrate, comprising a metal base layer (1), characterized in that: fixedly connected with insulating layer (2) in metal basic unit (1) upper end, insulating layer (2) upper end fixedly connected with circuit layer (4), pilot hole (3) of break-over about all opened in circuit layer (4), insulating layer (2) and metal basic unit (1) upper end four corners, the equal joint in metal basic unit (1) upper end left part and upper end right part has heat abstractor (6), two heat abstractor (6) upper end all is provided with LED lamp pole (5), circuit layer (4), insulating layer (2) and metal basic unit (1) alternate swing joint jointly and have protector (7).

2. A metal substrate that can replace a ceramic substrate according to claim 1, wherein: two penetrating grooves (41) penetrating from top to bottom are formed in the upper end of the circuit layer (4) and the upper end of the insulating layer (2), two grooves (11) are formed in the upper end of the metal base layer (1), two circular grooves (12) are formed in the left portion of the inner wall and the right portion of the inner wall of each groove (11), four penetrating grooves (41) correspond to two grooves (11), and the heat dissipation devices (6) are located in the two grooves (11).

3. A metal substrate that can replace a ceramic substrate according to claim 1, wherein: protector (7) include punch holder (71) and lower plate (72), the common fixedly connected with guard plate (73) of one end that punch holder (71) and lower plate (72) are close to each other, guard plate (73) are "L" shape structure, punch holder (71) and lower plate (72) interlude swing joint jointly and have set screw (74), open thread groove (77) have been seted up to punch holder (71) surface lower part, set screw (74) surface has cup jointed a spring (75) and No. two spring (76), a spring (75) and No. two spring (76) are located between punch holder (71) and lower plate (72).

4. A metal substrate as claimed in claim 3, which is a ceramic substrate substitute, wherein: the fixing screw (74) runs through assembly holes (3) in the circuit layer (4), the insulating layer (2) and the metal base layer (1), the first spring (75) and the upper clamping plate (71) are located on the upper portion of the circuit layer (4), and the second spring (76) and the lower clamping plate (72) are located on the lower portion of the metal base layer (1).

5. A metal substrate that can replace a ceramic substrate according to claim 1, wherein: heat abstractor (6) are including heat conduction copper billet (61), open heat conduction copper billet (61) upper end has mounting groove (62), heat conduction copper billet (61) lower extreme fixedly connected with a plurality of lug (66), heat conduction copper billet (61) surface left part and surface right part all opened No. two circular slots (63), two all be provided with rebound spring (65), two in No. two circular slots (63) equal swing joint has circular billet (64) in No. two circular slots (63).

6. The metal substrate as claimed in claim 5, wherein: two rebound spring (65) all are located between two circle pieces (64), two circle piece (64) all with a circular slot (12) joint, two LED lamp pole (5) all are located mounting groove (62).