CN218587393U

CN218587393U - Multilayer printed circuit board

Info

Publication number: CN218587393U
Application number: CN202221678152.3U
Authority: CN
Inventors: 黄祖嘉
Original assignee: Putian Jiayi Technology Co ltd
Current assignee: Putian Jiayi Technology Co ltd
Priority date: 2022-07-01
Filing date: 2022-07-01
Publication date: 2023-03-07
Anticipated expiration: 2032-07-01

Abstract

The utility model discloses a multilayer printed circuit board contains the bottom plate, and bottom plate one side is equipped with the heating panel, and heating panel one side is equipped with the reinforcing plate, and reinforcing plate one side is equipped with the insulation board, and insulation board one side is equipped with the current conducting plate, and the bottom plate is equipped with the support, and the support is equipped with draws the piece, draws a both sides and is equipped with the stopper, and the support is equipped with the fluting, draws the piece to be equipped with the pull rod, and the pull rod is equipped with the backup pad, is equipped with the bearing in the backup pad, and the spring housing is established on the pull rod, and the support is equipped with the spout, and the backup pad is close to support one side and is equipped with the slider. The utility model discloses a pull-up the piece that draws that support top set up and drive the pull rod, the pull rod drives the backup pad and receives pressure contraction when gliding upwards, puts into the support with the circuit board after, puts down the pull rod, the spring resumes the form, and the pull rod passes spacing hole and fixes the circuit board, has solved when meetting the narrow and small equipment of inner space, and the operation is inconvenient when installing or dismantling the circuit board to lead to the condition that matter is more done and more than done, work efficiency is low.

Description

Multilayer printed circuit board

Technical Field

The utility model relates to a multilayer printed circuit board technical field specifically is a multilayer printed circuit board.

Background

Printed circuit boards, which are now an integral part of most electrical and electronic devices, function essentially as conductors to help current flow to where needed and to perform the required work, function essentially as mapping to the device circuitry, and have a number of slots and holes through which current can flow and other circuit components can also be connected together.

The existing multilayer printed circuit board is generally installed and fixed by bolts when being installed, and is inconvenient to operate when the circuit board is installed or disassembled when meeting equipment with narrow internal space, thereby resulting in half the effort and low working efficiency.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a multilayer printed circuit board to solve above-mentioned technical problem.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a multilayer printed circuit board, contains the bottom plate, bottom plate one side is equipped with the heating panel, heating panel one side is equipped with the reinforcing plate, reinforcing plate one side is equipped with the insulation board, insulation board one side is equipped with the current conducting plate, the bottom plate bilateral symmetry is equipped with the support, the support top all around is equipped with draws the piece, it is equipped with the stopper to draw the piece both sides, the support top is equipped with the fluting, and stopper and fluting sliding connection, draw the piece bottom to be equipped with the pull rod, the pull rod runs through the support top, the pull rod middle-end is equipped with the backup pad, be equipped with the bearing in the backup pad, pull rod and bearing inner circle fixed connection, the backup pad is close to and draws piece one side to be equipped with the spring, the spring housing is established on the pull rod, the support is equipped with the spout, the backup pad is close to support one side and is equipped with the slider, and slider embedding spout forms sliding connection.

Preferably, the reinforcing plate contains an inorganic ceramic substrate.

Preferably, conducting plate one side is equipped with wiring structure, wiring structure contains the casing, the casing bottom is equipped with the terminal block, the casing top is equipped with the bolt, and the bolt runs through casing and terminal block threaded connection.

Preferably, the bottom plate is provided with a plurality of heat dissipation ports.

Preferably, adhesive glue is coated between the contact surfaces of the bottom plate, the heat dissipation plate, the reinforcing plate, the insulating plate and the conductive plate.

Preferably, the bottom plate, the heat dissipation plate, the reinforcing plate, the insulating plate and the conductive plate are uniformly provided with limiting holes at the periphery.

Compared with the prior art, the beneficial effects of the utility model are that: the pull rod is driven by the pull block arranged at the top of the support, the pull rod drives the support plate to slide upwards, the spring is contracted under pressure when the support plate slides upwards, the circuit board is placed into the support, the pull rod is put down, the spring recovers the shape, and the pull rod penetrates through the limiting hole to fix the circuit board, so that the problem that the operation is inconvenient when the circuit board is installed or disassembled when narrow equipment in the internal space is encountered is solved, and the problem of half work and low working efficiency are caused.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic view of the overall structure of the present embodiment;

FIG. 2 is a circuit board layer diagram of the overall structure of the present embodiment;

FIG. 3 is a schematic view of a holder of the overall structure of the present embodiment;

FIG. 4 is a sectional view of the holder of the overall structure of the present embodiment;

fig. 5 is a front view of the wiring device of the overall structure of the present embodiment.

In the drawings, the components represented by the respective reference numerals are listed below:

1. a base plate; 2. a support; 3. pulling the block; 4. a pull rod; 5. a support plate; 6. a spring; 7. a wiring structure; 8. a limiting hole; 10. a heat dissipation port; 11. a heat dissipation plate; 12. a reinforcing plate; 13. an insulating plate; 14. a conductive plate; 21. a chute; 31. a limiting block; 32. grooving; 51. a bearing; 52. a slider; 71. a housing; 72. a junction block; 73. and (4) bolts.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: a multilayer printed circuit board characterized by: comprises a bottom plate 1, wherein a heat dissipation plate 11 is arranged on one side of the bottom plate 1 and used for dissipating high temperature carried by a reinforced plate 12; a reinforcing plate 12 is arranged on one side of the heat dissipation plate 11 and used for bearing high temperature generated by a high-power device; one side of the reinforced plate 12 is provided with an insulating plate 13 for isolating the electric energy of the conductive plate 14; one side of the insulating plate 13 is provided with a conductive plate 14 for connecting electronic components; the two sides of the bottom plate 1 are symmetrically provided with brackets 2 for placing a circuit board; the top of the periphery of the support 2 is provided with a pulling block 3, two sides of the pulling block 3 are provided with limiting blocks 31, the top of the support 2 is provided with a slot 32, the limiting blocks 31 are in sliding connection with the slot 32, and the limiting blocks 31 are used for separating from the slot 32 to abut against the bottom of the support 2 after the pulling block 3 is pulled upwards to play a limiting role; the bottom of the pull block 3 is provided with a pull rod 4, the pull rod 4 penetrates through the top of the bracket 2, and the middle end of the pull rod 4 is provided with a support plate 5 for supporting a spring 6 sleeved on the pull rod 4; a bearing 51 is arranged in the supporting plate 5, the pull rod 4 is fixedly connected with an inner ring of the bearing 51 and is used for driving the pull rod 4 to rotate when the pull block 3 rotates, and the supporting plate 5 is prevented from rotating when the pull rod 4 rotates; backup pad 5 is close to and draws 3 one side of piece to be equipped with spring 6, and spring 6 cover is established on pull rod 4 for drive pull rod 4 recovers, and support 2 is equipped with spout 21, and backup pad 5 is close to support 2 one side and is equipped with slider 52, and slider 52 embedding slip 21 groove forms sliding connection, is used for backup pad 5 to avoid the side to side beat when reciprocating.

Specifically, the reinforcing plate 12 contains an inorganic ceramic substrate for improving the thermal conductivity, high insulation property and high air tightness of the circuit board, and has the effects of high temperature resistance and corrosion resistance, and can bear the high temperature generated by a high-power device and improve the function of the circuit board.

Specifically, one side of the conductive plate 14 is provided with the wiring structure 7, the wiring structure 7 comprises a housing 71, the bottom of the housing 71 is provided with a wiring block 72, the top of the housing 71 is provided with a bolt 73, and the bolt 73 penetrates through the housing 71 and is in threaded connection with the wiring block 72, so that the bolt 73 drives the wiring block 72 to move when rotating upwards, and the electric wire is clamped after being placed into the wiring block.

Specifically, the bottom plate 1 is provided with a plurality of heat dissipation ports 10 for discharging heat energy dissipated by the heat dissipation block 11.

Specifically, adhesive glue is coated among contact surfaces of the bottom plate 1, the heat dissipation plate 11, the reinforcing plate 12, the insulating plate 13 and the conductive plate 14, and is used for bonding the plate layers to play a role in fixing the plate layers.

Specifically, the peripheries of the bottom plate 1, the heat dissipation plate 11, the reinforcing plate 12, the insulating plate 13 and the conductive plate 14 are uniformly provided with limiting holes 8, and the pulling rod 4 is used for fixing the circuit board after penetrating into the limiting holes 8.

One specific application example of this embodiment is:

when the device is used, the top pull block 3 of the bracket 2 is pulled upwards during installation, the pull block 3 drives the pull rod 4 to move upwards, the pull rod 4 drives the bearing 51 to move upwards, the slide block 52 on one side of the supporting plate 5 slides on the chute 21, the spring 6 sleeved between the pull rod 4 and the supporting plate 5 is compressed upwards, the limit blocks 31 on two sides of the pull block 3 leave the open groove 32, and the pull block 3 is rotated towards any direction to enable the limit blocks 31 to abut against the top of the bracket 2; after the circuit board slides into the bracket 2, the limiting blocks 31 at two sides of the pulling block 3 are rotated to the open slot 32 and put down, the spring 6 generates elasticity, and the pull rod 4 penetrates into the limiting hole 8 on the circuit board, so that the mounting and fixing effects are achieved; when the circuit board needs to be disassembled, the pulling block 3 is pulled upwards, then the pulling block 3 is rotated, the limiting block 31 abuts against the top of the bracket 2, and the pulling block 3 is recovered after the circuit board is taken out; after the circuit board is electrified, the electronic components connected to the conductive plate 14 operate, the insulating plate 13 on the lower layer of the conductive plate 14 plays a role in electric shock protection, the reinforcing plate 12 arranged on the lower layer of the insulating plate 13 contains inorganic ceramic substrates, and the reinforcing plate 12 has heat conductivity, high insulativity, high air tightness, high temperature resistance and corrosion resistance, can bear high temperature generated by a high-power device, and improves the effect of the whole structure of the circuit board; the lower layer of the reinforced plate 12 is provided with a heat dissipation plate 11, the heat dissipation plate 11 dissipates the high temperature carried by the reinforced plate 12, and the dissipated heat energy is discharged from the heat dissipation port 10 of the bottom plate 1; if the circuit board needs to be externally connected with an electric wire, the bolt 73 at the top of the shell 71 of the wiring structure 7 can be rotated, the bolt 73 drives the wiring board 72 to move upwards, the bolt 73 is restored after the electric wire is placed into the wiring board 72, and the bolt 73 drives the wiring board 72 to contact and fix the electric wire, so that wiring can be completed.

In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like, indicate orientations or positional relationships based on the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it would be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the claims and their equivalents.

Claims

1. A multilayer printed circuit board characterized by: comprises a bottom plate (1), a heat dissipation plate (11) is arranged on one side of the bottom plate (1), a reinforcing plate (12) is arranged on one side of the heat dissipation plate (11), an insulating plate (13) is arranged on one side of the reinforcing plate (12), one side of the insulating plate (13) is provided with a conductive plate (14), two sides of the bottom plate (1) are symmetrically provided with brackets (2), the top of the periphery of the bracket (2) is provided with a pulling block (3), two sides of the pulling block (3) are provided with limit blocks (31), the top of the bracket (2) is provided with a slot (32), the limiting block (31) is connected with the open slot (32) in a sliding way, the bottom of the pulling block (3) is provided with a pulling rod (4), the pull rod (4) penetrates through the top of the bracket (2), a support plate (5) is arranged at the middle end of the pull rod (4), a bearing (51) is arranged in the supporting plate (5), the pull rod (4) is fixedly connected with an inner ring of the bearing (51), a spring (6) is arranged on one side of the supporting plate (5) close to the pulling block (3), the spring (6) is sleeved on the pull rod (4), the bracket (2) is provided with a sliding groove (21), a slide block (52) is arranged on one side of the supporting plate (5) close to the bracket (2), and the sliding block (52) is embedded into the sliding groove (21) to form sliding connection.

2. A multilayer printed circuit board according to claim 1, wherein: the reinforcing plate (12) contains an inorganic ceramic substrate.

3. A multilayer printed circuit board according to claim 1, wherein: conducting plate (14) one side is equipped with wiring structure (7), wiring structure contains casing (71), casing (71) bottom is equipped with terminal block (72), casing (71) top is equipped with bolt (73), and bolt (73) run through casing (71) and terminal block (72) threaded connection.

4. A multilayer printed circuit board according to claim 1, wherein: the bottom plate (1) is provided with a plurality of radiating holes (10).

5. A multilayer printed circuit board according to claim 1, wherein: and adhesive glue is coated among the contact surfaces of the bottom plate (1), the heat dissipation plate (11), the reinforcing plate (12), the insulating plate (13) and the conductive plate (14).

6. A multilayer printed circuit board according to claim 1, wherein: and limiting holes (8) are uniformly formed around the bottom plate (1), the heat dissipation plate (11), the reinforcing plate (12), the insulating plate (13) and the conductive plate (14).