CN215647537U

CN215647537U - Temperature change resistant anti-cracking ceramic substrate

Info

Publication number: CN215647537U
Application number: CN202121322797.9U
Authority: CN
Inventors: 潘海欣; 潘国良
Original assignee: SHANGHAI XINMAO PRECISION CERAMIC TECHNOLOGY CO LTD
Current assignee: SHANGHAI XINMAO PRECISION CERAMIC TECHNOLOGY CO LTD
Priority date: 2021-06-11
Filing date: 2021-06-11
Publication date: 2022-01-25
Anticipated expiration: 2031-06-11

Abstract

The utility model discloses a temperature-change-resistant and crack-resistant ceramic substrate which comprises a ceramic substrate, wherein a data storage module is fixedly arranged in the middle of the upper end of the ceramic substrate, a data processing module is fixedly arranged at the front part of the upper end of the ceramic substrate, a data receiving module is fixedly arranged on the upper end of the ceramic substrate, a heat dissipation device is fixedly arranged at the lower end of the ceramic substrate, a fixing clamping device is fixedly arranged on the left part of the front end, the right part of the front end, the left part of the rear end and the right part of the rear end of the heat dissipation device of the ceramic substrate, two fixing support columns are fixedly arranged on the left part of the upper end and the right part of the upper end of the ceramic substrate, and a dustproof device is fixedly arranged on the upper ends of the four fixing support columns in a penetrating and penetrating mode. According to the temperature change resistant and crack resistant ceramic substrate, the crack resistance of the ceramic substrate is improved through the fixing clamping device, the practicability of the device is improved, the use effect of the ceramic substrate is improved through the dustproof device and the heat dissipation device, and the service life of the ceramic substrate is prolonged.

Description

Temperature change resistant anti-cracking ceramic substrate

Technical Field

The utility model relates to the technical field of ceramic substrates, in particular to a temperature change resistant and crack resistant ceramic substrate.

Background

The ceramic substrate refers to a special process plate in which copper foil is directly bonded to the surface of an alumina or aluminum nitride ceramic substrate at a high temperature. The manufactured ultrathin composite substrate has excellent electrical insulation performance, high heat conduction characteristic, excellent soft solderability and high adhesion strength, can be etched into various patterns like a PCB (printed circuit board), and has great current carrying capacity. Therefore, the ceramic substrate has become a basic material for high-power electronic circuit structure technology and interconnection technology. 1. When the existing ceramic substrate is installed and used, the ceramic substrate is mostly fixed on an installation plate through a plurality of screws, so a plurality of threaded holes are formed in the ceramic substrate, and when the ceramic substrate is used, the formed threaded holes are easily heated and cracked, so that the ceramic substrate is loosened; 2. the temperature resistance of each part in the existing ceramic substrate is different, and the interior of the ceramic substrate is overheated after being used for a long time, thereby influencing the service life of the ceramic substrate.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a temperature change resistant and crack resistant ceramic substrate, which can effectively solve the problems in the background technology.

In order to achieve the purpose, the utility model adopts the technical scheme that:

the utility model provides a ceramic substrate that anti-cracking is become in temperature resistant, includes ceramic substrate, ceramic substrate upper end middle part fixed mounting has data storage module, the anterior fixed mounting in ceramic substrate upper end has data processing module, ceramic substrate upper end fixed mounting has data receiving module, ceramic substrate lower extreme fixed mounting has heat abstractor, ceramic substrate and heat abstractor front end left part, front end right part, rear end left part and the equal common fixed mounting in rear end right part have fixed chucking device, the equal fixed mounting in ceramic substrate upper end left part and upper end right part has two fixed stay posts, four fixed stay post upper end alternates fixed mounting jointly has dust keeper.

Preferably, fixed chucking device includes a fixed plate and No. two fixed plates, the screw hole has all been opened to a fixed plate and No. two fixed plate upper end left parts and upper end right parts, four the common threaded connection in two liang of upper ends of screw hole has the chucking bolt, two the equal threaded connection in chucking bolt lower extreme has the chucking nut, two the chucking nut all is located a fixed plate lower extreme, a fixed plate fixed mounting is at the ceramic substrate lower extreme, No. two fixed plate fixed mounting is in the heat abstractor upper end.

Preferably, dust keeper includes fixed frame, fixed frame upper end left part and upper end right part have all been opened two fixed slots, fixed mounting has two backup pads, two between fixed frame front end inner wall and the rear end inner wall the backup pad upper end alternates fixed mounting jointly and has the fan, fixed frame alternates fixed mounting in four fixed stay post upper ends through four fixed slots.

Preferably, the heat dissipation device comprises a connecting plate, the upper end of the connecting plate is inserted and fixedly provided with a heat dissipation fin, the upper end of the heat dissipation fin is provided with a plurality of heat dissipation holes, and the heat dissipation fin is fixedly arranged at the lower end of the ceramic substrate through the connecting plate.

Preferably, the four fixing and clamping devices are symmetrically distributed in front and back directions by taking the ceramic substrate as a center.

Preferably, the fixing grooves and the fixing support columns are consistent in size and correspond in position to each other.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the temperature-change-resistant and crack-resistant ceramic substrate, the first fixing plate and the second fixing plate on the fixing clamping device are attached to the upper end of the ceramic substrate and the lower end of the connecting plate, the first fixing plate and the second fixing plate are connected through the clamping bolt through the screw holes, the two fixing plates are fixed by rotating the clamping nut, the ceramic substrate is prevented from being fixed by the fixing clamping device through the screw holes, the crack resistance of the ceramic substrate is improved, meanwhile, the ceramic substrates with different thicknesses can be fixed through the first fixing plate and the second fixing plate, and therefore the practicability of the device is improved.

2. According to the temperature-change-resistant and crack-resistant ceramic substrate, the two fans on the dustproof device rotate, so that the ceramic substrate is dustproof and cooled, and meanwhile, the ceramic substrate can be subjected to heat conduction and cooling through the radiating fins on the radiating device, so that the ceramic substrate is better in heat dissipation, the use effect of the ceramic substrate is improved, and the service life of the ceramic substrate is prolonged.

Drawings

FIG. 1 is a schematic view of the overall structure of a temperature change resistant and crack resistant ceramic substrate according to the present invention;

FIG. 2 is a schematic view of the overall structure of a fixing and clamping device for a temperature-change resistant and crack-resistant ceramic substrate according to the present invention;

FIG. 3 is a schematic view of the overall structure of a dustproof device for a temperature-resistant and crack-resistant ceramic substrate according to the present invention;

fig. 4 is a schematic view of the overall structure of a heat dissipation device of a temperature-resistant and crack-resistant ceramic substrate according to the present invention.

In the figure: 1. a ceramic substrate; 2. fixing the clamping device; 3. a dust-proof device; 4. a heat sink; 5. a data storage module; 6. a data receiving module; 7. a data processing module; 8. fixing the support columns; 20. a first fixing plate; 21. a second fixing plate; 22. a screw hole; 23. clamping the bolt; 24. clamping the nut; 30. a fixed frame; 31. a support plate; 32. a fan; 33. fixing grooves; 40. a connecting plate; 41. a heat sink; 42. and (4) heat dissipation holes.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-4, a ceramic substrate resistant to cracking caused by temperature change comprises a ceramic substrate 1, a data storage module 5 is fixedly mounted in the middle of the upper end of the ceramic substrate 1, a data processing module 7 is fixedly mounted at the front part of the upper end of the ceramic substrate 1, a data receiving module 6 is fixedly mounted at the upper end of the ceramic substrate 1, a heat dissipation device 4 is fixedly mounted at the lower end of the ceramic substrate 1, a left front part of the ceramic substrate 1 and the heat dissipation device 4, a right front part of the ceramic substrate, a left rear part and a right rear end part of the ceramic substrate are both fixedly mounted with a fixing clamping device 2, two fixing support columns 8 are both fixedly mounted at the left upper end and the right upper end of the ceramic substrate 1, and a dust-proof device 3 is fixedly mounted on the upper ends of the four fixing support columns 8 in a penetrating manner.

The fixed clamping device 2 comprises a first fixed plate 20 and a second fixed plate 21, screw holes 22 are respectively arranged at the left part and the right part of the upper ends of the first fixed plate 20 and the second fixed plate 21, clamping bolts 23 are respectively and jointly screwed at the upper ends of two pairs of the screw holes 22, clamping nuts 24 are respectively screwed at the lower ends of the two clamping bolts 23, the two clamping nuts 24 are respectively positioned at the lower end of the first fixed plate 20, the first fixed plate 20 is fixedly arranged at the lower end of the ceramic substrate 1, the second fixed plate 21 is fixedly arranged at the upper end of the heat dissipation device 4, the upper end of the ceramic substrate 1 is attached to the lower end of the connecting plate 40 through the first fixing plate 20 and the second fixing plate 21, the first fixing plate 20 is connected with the second fixing plate 21 through the clamping bolt 23 through the screw hole 22, and finally the two fixing plates are fixed by rotating the clamping nut 24, so that the ceramic substrate 1 is fixed; the dustproof device 3 comprises a fixed frame 30, two fixing grooves 33 are formed in the left portion and the right portion of the upper end of the fixed frame 30, two support plates 31 are fixedly installed between the inner wall of the front end and the inner wall of the rear end of the fixed frame 30, fans 32 are fixedly installed on the upper ends of the two support plates 31 in an inserting mode, the fixed frame 30 is fixedly installed on the upper ends of the four fixed support columns 8 in an inserting mode through the four fixing grooves 33, and the fans 32 on the upper ends of the two support plates 31 rotate to blow air, so that the dustproof and cooling of the ceramic substrate 1 are achieved; the heat dissipation device 4 comprises a connecting plate 40, a heat dissipation fin 41 is fixedly inserted into the upper end of the connecting plate 40, a plurality of heat dissipation holes 42 are formed in the upper end of the heat dissipation fin 41, the heat dissipation fin 41 is fixedly arranged at the lower end of the ceramic substrate 1 through the connecting plate 40, and the heat conduction and cooling can be carried out on the ceramic substrate 1 through the heat dissipation fin 41, so that the heat dissipation performance of the ceramic substrate 1 is improved; the four fixing and clamping devices 2 are symmetrically distributed in front and back by taking the ceramic substrate 1 as a center; the fixing grooves 33 correspond to the fixing support columns 8 in size and position.

It should be noted that, the utility model is a temperature change resistant and crack resistant ceramic substrate, first, the first fixing plate 20 and the second fixing plate 21 on the fixing clamping device 2 are jointed with the upper end of the ceramic substrate 1 and the lower end of the connecting plate 40, then the first fixing plate 20 and the second fixing plate 21 are connected by the screw hole 22 through the clamping bolt 23, finally, the two fixing plates are fixed by rotating the clamping nut 24, thereby realizing the fixing of the ceramic substrate 1, not only the ceramic substrate 1 is prevented from being provided with the bolt groove for fixing by fixing the clamping device 2, thereby improving the crack resistance of the ceramic substrate 1, but also the ceramic substrate 1 with different thickness can be fixed by the first fixing plate 20 and the second fixing plate 21, thereby improving the practicability of the device, then, the fan 32 on the upper ends of the two supporting plates 31 on the dustproof device 3 is rotated to blow air, therefore, the ceramic substrate 1 is prevented from being dust and cooled, and the ceramic substrate 1 can be cooled through heat conduction by the radiating fins 41 on the heat radiating device 4, so that the heat radiation performance of the ceramic substrate 1 is improved through the dust preventing device 3 and the heat radiating device 4, the use effect of the ceramic substrate 1 is also improved, and the service life of the ceramic substrate 1 is prolonged.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. A ceramic substrate resistant to temperature change and cracking comprises a ceramic substrate (1), and is characterized in that: ceramic substrate (1) upper end middle part fixed mounting has data storage module (5), the anterior fixed mounting in ceramic substrate (1) upper end has data processing module (7), ceramic substrate (1) upper end fixed mounting has data receiving module (6), ceramic substrate (1) lower extreme fixed mounting has heat abstractor (4), ceramic substrate (1) and heat abstractor (4) front end left part, front end right part, rear end left part and the equal common fixed mounting of rear end right part have fixed chucking device (2), the equal fixed mounting in ceramic substrate (1) upper end left part and upper end right part has two fixed stay post (8), four fixed stay post (8) upper end alternates fixed mounting jointly has dust keeper (3).

2. The temperature change resistant and crack resistant ceramic substrate of claim 1, wherein: fixed chucking device (2) are including fixed plate (20) and No. two fixed plates (21), screw hole (22), four have all been opened to fixed plate (20) and No. two fixed plate (21) upper end left part and upper end right part the common threaded connection in two liang upper ends of screw hole (22) has chucking bolt (23), two chucking bolt (23) lower extreme equal threaded connection has chucking nut (24), two chucking nut (24) all are located fixed plate (20) lower extreme, fixed plate (20) fixed mounting is at ceramic substrate (1) lower extreme, No. two fixed plate (21) fixed mounting is in heat abstractor (4) upper end.

3. The temperature change resistant and crack resistant ceramic substrate of claim 1, wherein: dust keeper (3) are including fixed frame (30), fixed frame (30) upper end left part and upper end right part all opened two fixed slots (33), fixed frame (30) fixed mounting has two backup pad (31), two between front end inner wall and the rear end inner wall backup pad (31) upper end alternates fixed mounting jointly and has fan (32), fixed frame (30) alternates fixed mounting in four fixed stay post (8) upper ends through four fixed slots (33).

4. The temperature change resistant and crack resistant ceramic substrate of claim 1, wherein: the heat dissipation device (4) comprises a connecting plate (40), heat dissipation fins (41) are fixedly installed at the upper end of the connecting plate (40) in a penetrating mode, a plurality of heat dissipation holes (42) are formed in the upper ends of the heat dissipation fins (41), and the heat dissipation fins (41) are fixedly installed at the lower end of the ceramic substrate (1) through the connecting plate (40).

5. The temperature change resistant and crack resistant ceramic substrate of claim 1, wherein: the four fixing and clamping devices (2) are symmetrically distributed in front and back directions by taking the ceramic substrate (1) as a center.

6. The temperature change resistant and crack resistant ceramic substrate of claim 3, wherein: the fixing grooves (33) are consistent in size with the fixing support columns (8) and correspond to the fixing support columns in position.