CN215420904U - High-frequency mixed-voltage circuit board capable of dissipating heat quickly - Google Patents
High-frequency mixed-voltage circuit board capable of dissipating heat quickly Download PDFInfo
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- CN215420904U CN215420904U CN202121391687.8U CN202121391687U CN215420904U CN 215420904 U CN215420904 U CN 215420904U CN 202121391687 U CN202121391687 U CN 202121391687U CN 215420904 U CN215420904 U CN 215420904U
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Abstract
The utility model discloses a high-frequency mixed compression circuit board capable of quickly dissipating heat, which comprises a mixed compression circuit board, wherein a working processing element is fixedly installed at the upper end of the mixed compression circuit board, a core plate layer is fixedly installed at the lower end of the mixed compression circuit board, a semi-cured layer is fixedly installed at the lower end of the core plate layer, a heat conduction device is fixedly installed at the lower end of the semi-cured layer, adjusting devices are fixedly installed at the left end and the right end of the heat conduction device, the two adjusting devices are symmetrically distributed in a left-right mode by taking the heat conduction device as a center, and a heat dissipation device is fixedly installed at the upper ends of the two adjusting devices in a penetrating mode. According to the high-frequency mixed-compression circuit board capable of quickly dissipating heat, the heat dissipating device is used for conducting blowing heat dissipation on the upper layer of the circuit board and the heat conducting device is used for conducting heat conduction on the lower layer of the circuit board, so that double quick heat dissipation is conducted, the using effect and the service life of the circuit board are improved, the using effect of the fan is improved through the adjusting device, and the space utilization efficiency is also improved.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a high-frequency mixed-voltage circuit board capable of quickly dissipating heat.
Background
The circuit board is also called as a circuit board, is a highly reliable and excellent flexible printed circuit board which is made of polyimide or polyester film as a base material and has the characteristics of high wiring density, light weight, thin thickness and good bending property, so the circuit board plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances. 1. After a high-power component is mounted on the surface of the existing high-frequency mixed-compression circuit board, the high-frequency daughter board keeps a high-temperature state for a long time, so that the internal temperature of the component is overhigh, and the internal part of the high-frequency mixed-compression circuit board cannot be quickly and effectively radiated only by virtue of the radiating fin, so that the using effect of the circuit board is influenced, the circuit board can be damaged after a long time, and economic loss is caused; 2. when the existing high-frequency mixed-compression circuit board is used for installing a fan, the fan is mostly fixed, the distance between the fan and the circuit board cannot be adjusted according to the actual space, the best heat dissipation effect cannot be achieved, and the space utilization efficiency is low.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a high-frequency mixed-voltage circuit board capable of quickly dissipating heat, which can effectively solve the problems in the background technology.
In order to achieve the purpose, the utility model adopts the technical scheme that:
the utility model provides a high frequency that dispels heat fast mixes compression circuit board, is including mixing the compression circuit board, mix compression circuit board upper end fixed mounting has work processing element, mix compression circuit board lower extreme fixed mounting has the core layer, core layer lower extreme fixed mounting has semi-cured layer, semi-cured layer lower extreme fixed mounting has heat conduction device, the equal fixed mounting of heat conduction device left end and right-hand member has adjusting device, two adjusting device uses heat conduction device to distribute as central bilateral symmetry, two adjusting device upper end alternates fixed mounting jointly has heat abstractor.
Preferably, heat abstractor includes fixed frame, fixed frame upper end middle part and upper end right part have all been opened two fixed slots, fixed mounting has two supporting and fixing plates, two between fixed frame front end inner wall and the rear end inner wall supporting and fixing plate upper end middle part all alternates fixed mounting and has radiator fan, fixed frame alternates fixed mounting in two adjusting device upper ends.
Preferably, adjusting device is including supporting the base and rotating the sleeve, support the equal fixed mounting in base upper end front portion and upper end rear portion and have the stand, two the stand surface is all carved with the rotation screw thread, it is provided with two, two to rotate the sleeve lower extreme and all opened threaded interface, two it all passes through threaded interface threaded connection on two stands to rotate the sleeve, support base fixed mounting at the heat-transfer device left end.
Preferably, the heat conduction device includes the mount, mount upper end middle part alternates fixed mounting and has the copper foil, the equal fixed mounting in copper foil upper end left part and upper end right part has three heat conduction cylinder, three cylinder interface has all been opened to core plate layer and semi-solid layer upper end left part and upper end right part, core plate layer and semi-solid layer all alternate fixed mounting in the heat conduction cylinder upper end through the cylinder interface, the mount passes through heat conduction cylinder fixed mounting at semi-solid layer lower extreme.
Preferably, the fixing groove and the rotating sleeve are consistent in size and correspond to each other in position.
Preferably, the upper end face of the heat conduction column is attached to the lower end face of the mixed-compression circuit board.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the high-frequency mixed-compression circuit board capable of fast radiating, air is blown in a rotating mode through the two radiating fans on the radiating device, so that a working processing element on the mixed-compression circuit board is radiated, meanwhile, heat conducting cylinders on the heat conducting device transmit the heat inside the core board layer and the semi-curing layer to the copper foil for conducting heat, and the circuit board is subjected to double fast radiating through the radiating device and the heat conducting device up and down, so that the using effect of the circuit board is improved, and the service life of the circuit board is prolonged.
2. According to the high-frequency mixed-compression circuit board capable of quickly dissipating heat, disclosed by the utility model, the rotating sleeve on the adjusting device is sleeved on the stand column through the rotating thread, and when the distance between the cooling fan and the circuit board needs to be adjusted, the rotating sleeve on the stand column is rotated through the rotating thread, so that the height of the fan is adjusted, the using effect of the fan is improved, and the space utilization efficiency is also improved.
Drawings
Fig. 1 is a schematic view of an overall structure of a high-frequency mixed-voltage circuit board capable of dissipating heat quickly according to the present invention;
fig. 2 is a schematic view of the overall structure of a waterproof device of a fast heat dissipation high-frequency mixed-compression circuit board according to the present invention;
fig. 3 is a schematic view of the overall structure of the fixing device for the fast heat dissipation high-frequency mixed-voltage circuit board according to the present invention;
fig. 4 is a schematic view of the overall structure of the heat dissipation drying device for a fast heat dissipation high-frequency mixed-voltage circuit board according to the present invention.
In the figure: 1. mixing and pressing the circuit board; 2. a heat sink; 3. an adjustment device; 4. a heat conducting device; 5. a core layer; 6. semi-curing the layer; 7. a work processing element; 20. a fixed frame; 21. fixing grooves; 22. a support fixing plate; 23. a heat radiation fan; 30. a support base; 31. rotating the sleeve; 32. a column; 33. rotating the screw thread; 34. a threaded interface; 40. a fixed mount; 41. copper foil; 42. a heat-conducting cylinder; 43. and a cylinder interface.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-4, a high-frequency mixed-compression circuit board capable of rapidly dissipating heat comprises a mixed-compression circuit board 1, a working processing element 7 is fixedly mounted at the upper end of the mixed-compression circuit board 1, a core board layer 5 is fixedly mounted at the lower end of the mixed-compression circuit board 1, a semi-cured layer 6 is fixedly mounted at the lower end of the core board layer 5, a heat conducting device 4 is fixedly mounted at the lower end of the semi-cured layer 6, adjusting devices 3 are fixedly mounted at the left end and the right end of the heat conducting device 4, the two adjusting devices 3 are distributed in bilateral symmetry by taking the heat conducting device 4 as a center, and a heat dissipating device 2 is fixedly mounted at the upper ends of the two adjusting devices 3 in a penetrating manner.
The heat dissipation device 2 comprises a fixed frame 20, two fixing grooves 21 are formed in the middle of the upper end and the right portion of the upper end of the fixed frame 20, two supporting and fixing plates 22 are fixedly installed between the inner wall of the front end and the inner wall of the rear end of the fixed frame 20, heat dissipation fans 23 are fixedly installed in the middle of the upper ends of the two supporting and fixing plates 22 in an inserting mode, the fixed frame 20 is fixedly installed at the upper ends of the two adjusting devices 3 in an inserting mode, air is blown in a rotating mode through the two heat dissipation fans 23, therefore, heat dissipation is conducted on the work processing elements 7 on the mixed compression circuit board 1, and therefore the service life of the circuit board is prolonged; the adjusting device 3 comprises a supporting base 30 and two rotating sleeves 31, wherein the front part of the upper end and the rear part of the upper end of the supporting base 30 are fixedly provided with stand columns 32, the outer surfaces of the two stand columns 32 are respectively carved with a rotating thread 33, the two rotating sleeves 31 are provided with two screw interfaces 34, the two rotating sleeves 31 are respectively connected to the two stand columns 32 through the screw interfaces 34, the supporting base 30 is fixedly arranged at the left end of the heat conducting device 4, when the distance between the cooling fan 23 and the mixed pressure circuit board 1 needs to be adjusted, the rotating sleeves 31 on the stand columns 32 are rotated through the rotating threads 33 by rotating the rotating sleeves 31 on the stand columns 32, and therefore the height of the fan is adjusted; the heat conduction device 4 comprises a fixing frame 40, a copper foil 41 is fixedly installed in the middle of the upper end of the fixing frame 40 in an inserting mode, three heat conduction cylinders 42 are fixedly installed on the left portion of the upper end and the right portion of the upper end of the copper foil 41, three cylinder connectors 43 are respectively arranged on the left portion of the upper end and the right portion of the upper end of the core plate layer 5 and the semi-solidified layer 6 in the inserting mode, the core plate layer 5 and the semi-solidified layer 6 are fixedly installed on the upper ends of the heat conduction cylinders 42 in the inserting mode through the cylinder connectors 43, the fixing frame 40 is fixedly installed at the lower end of the semi-solidified layer 6 through the heat conduction cylinders 42, and heat inside the core plate layer 5 and the semi-solidified layer 6 is transmitted to the copper foil 41 through the heat conduction cylinders 42 to conduct heat treatment, so that the using effect of the hybrid circuit board 1 is improved; the fixed groove 21 and the rotating sleeve 31 have the same size and the positions are corresponding to each other up and down; the upper end face of the heat conducting column 42 is attached to the lower end face of the mixed-pressure circuit board 1.
It should be noted that, the utility model is a high-frequency mixed-compression circuit board capable of fast heat dissipation, first, the rotating sleeve 31 on the adjusting device 3 is clamped with the fixing groove 21 on the heat dissipating device 2, so as to fix the heat dissipating fan 23 above the mixed-compression circuit board 1, when the heat dissipating fan 23 needs to adjust the distance between the heat dissipating fan 23 and the mixed-compression circuit board 1, the rotating sleeve 31 on the upright post 32 is rotated by the rotating thread 33, then the heat dissipating fan 23 is fixed by the fixing groove 21, so as to adjust the height of the heat dissipating fan 23, not only the use effect of the heat dissipating fan 23 is improved, but also the space utilization efficiency is provided, meanwhile, when the mixed-compression circuit board 1 is overheated, the two heat dissipating fans 23 rotate to blow air firstly, so as to dissipate the heat of the working processing element 7 on the mixed-compression circuit board 1, and then the heat inside the core board layer 5 and the semi-curing layer 6 is transmitted to the copper foil 41 through the heat conducting cylinder 42 on the heat conducting device 4 for conducting heat treatment, the circuit board is subjected to double rapid heat dissipation up and down through the heat dissipation device 2 and the heat conduction device 4, so that the using effect of the circuit board is improved, and the service life of the circuit board is prolonged.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a circuit board is thoughtlessly pressed to quick heat dissipation high frequency, includes thoughtlessly presses circuit board (1), its characterized in that: mix compress circuit board (1) upper end fixed mounting have work processing element (7), mix compress circuit board (1) lower extreme fixed mounting have core layer (5), core layer (5) lower extreme fixed mounting has semi-cured layer (6), semi-cured layer (6) lower extreme fixed mounting has heat conduction device (4), the equal fixed mounting of heat conduction device (4) left end and right-hand member has adjusting device (3), two adjusting device (3) use heat conduction device (4) as central bilateral symmetry distribution, two adjusting device (3) upper end alternates fixed mounting jointly and has heat abstractor (2).
2. The high-frequency mixed-voltage circuit board capable of dissipating heat quickly according to claim 1, wherein: heat abstractor (2) is including fixed frame (20), fixed frame (20) upper end middle part and upper end right part have all been opened two fixed slots (21), fixed frame (20) fixed mounting has two supporting and fixing plate (22), two between front end inner wall and the rear end inner wall supporting and fixing plate (22) upper end middle part all alternates fixed mounting and has radiator fan (23), fixed frame (20) alternates fixed mounting in two adjusting device (3) upper ends.
3. The high-frequency mixed-voltage circuit board capable of dissipating heat quickly according to claim 1, wherein: adjusting device (3) are including supporting base (30) and rotating sleeve (31), support base (30) upper end front portion and the equal fixed mounting in upper end rear portion have stand (32), two stand (32) surface is all carved with and is rotated screw thread (33), it is provided with two, two to rotate sleeve (31) the screw thread interface (34) has all been opened to rotation sleeve (31) lower extreme, two it all passes through screw thread interface (34) threaded connection on two stands (32) to rotate sleeve (31), support base (30) fixed mounting is in heat-transfer device (4) left end.
4. The high-frequency mixed-voltage circuit board capable of dissipating heat quickly according to claim 1, wherein: heat conduction device (4) are including mount (40), fixed mounting has copper foil (41) to alternate in mount (40) upper end middle part, the equal fixed mounting in copper foil (41) upper end left part and upper end right part has three heat conduction cylinder (42), three cylinder interface (43) have all been opened to core board layer (5) and semi-solid layer (6) upper end left part and upper end right part, fixed mounting is alternated in heat conduction cylinder (42) upper end through cylinder interface (43) in core board layer (5) and semi-solid layer (6), mount (40) are through heat conduction cylinder (42) fixed mounting at semi-solid layer (6) lower extreme.
5. The high-frequency mixed-voltage circuit board capable of rapidly dissipating heat according to claim 2, wherein: the fixed groove (21) and the rotating sleeve (31) are consistent in size and correspond to each other in position.
6. The fast heat dissipation high frequency mixed voltage circuit board of claim 4, characterized in that: the upper end face of the heat conduction column (42) is attached to the lower end face of the mixed-compression circuit board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121391687.8U CN215420904U (en) | 2021-06-22 | 2021-06-22 | High-frequency mixed-voltage circuit board capable of dissipating heat quickly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121391687.8U CN215420904U (en) | 2021-06-22 | 2021-06-22 | High-frequency mixed-voltage circuit board capable of dissipating heat quickly |
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| Publication Number | Publication Date |
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| CN215420904U true CN215420904U (en) | 2022-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121391687.8U Active CN215420904U (en) | 2021-06-22 | 2021-06-22 | High-frequency mixed-voltage circuit board capable of dissipating heat quickly |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115003021A (en) * | 2022-06-13 | 2022-09-02 | 鹤山市众一电路有限公司 | Mixed-compression high-frequency double-layer circuit board with heat insulation structure |
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2021
- 2021-06-22 CN CN202121391687.8U patent/CN215420904U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115003021A (en) * | 2022-06-13 | 2022-09-02 | 鹤山市众一电路有限公司 | Mixed-compression high-frequency double-layer circuit board with heat insulation structure |
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