CN115003021A - Mixed-compression high-frequency double-layer circuit board with heat insulation structure - Google Patents
Mixed-compression high-frequency double-layer circuit board with heat insulation structure Download PDFInfo
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- CN115003021A CN115003021A CN202210661436.XA CN202210661436A CN115003021A CN 115003021 A CN115003021 A CN 115003021A CN 202210661436 A CN202210661436 A CN 202210661436A CN 115003021 A CN115003021 A CN 115003021A
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- 238000009413 insulation Methods 0.000 title claims abstract description 33
- 238000007906 compression Methods 0.000 title claims abstract description 17
- 238000011084 recovery Methods 0.000 claims description 55
- 238000009434 installation Methods 0.000 claims description 36
- 238000005192 partition Methods 0.000 claims description 33
- 239000000428 dust Substances 0.000 claims description 28
- 230000017525 heat dissipation Effects 0.000 claims description 20
- 238000004804 winding Methods 0.000 claims description 19
- 230000008878 coupling Effects 0.000 claims description 18
- 238000010168 coupling process Methods 0.000 claims description 18
- 238000005859 coupling reaction Methods 0.000 claims description 18
- 238000003780 insertion Methods 0.000 claims description 8
- 230000037431 insertion Effects 0.000 claims description 8
- 238000004064 recycling Methods 0.000 claims description 7
- 238000007790 scraping Methods 0.000 claims description 7
- 238000001179 sorption measurement Methods 0.000 claims description 6
- 238000009423 ventilation Methods 0.000 claims description 6
- 230000007306 turnover Effects 0.000 claims description 4
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- 239000006260 foam Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 230000008859 change Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005307 ferromagnetism Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/24—Structural elements or technologies for improving thermal insulation
- Y02A30/242—Slab shaped vacuum insulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B80/00—Architectural or constructional elements improving the thermal performance of buildings
- Y02B80/10—Insulation, e.g. vacuum or aerogel insulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a mixed-compression high-frequency double-layer circuit board with a heat insulation structure, which comprises a first circuit board and a second circuit board, wherein the first circuit board and the second circuit board are connected through a connecting assembly, and heat insulation boxes are sleeved outside the first circuit board and the second circuit board. Therefore, the high-frequency double-layer circuit board can solve the technical problems that the existing mixed-compression high-frequency double-layer circuit board does not have a heat insulation effect, and due to the fact that copper is arranged on the circuit board, heat in the external environment is easily conducted to the circuit board, the temperature of the circuit board rises, the working stability of the circuit board is affected by the rise of the temperature, and the service life of the circuit board is shortened.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a mixed-compression high-frequency double-layer circuit board with a heat insulation structure.
Background
Mix and press high frequency double-layer circuit board is the circuit board of compriseing two circuit boards and a connecting plate, and current mixes and presses high frequency double-layer circuit board and does not have the heat-proof effect, because there is copper on the circuit board, on heat among the external environment conducts to the circuit board easily, leads to the circuit board temperature to rise, and the rising of temperature can influence the job stabilization nature of circuit board, reduces the life of circuit board.
Disclosure of Invention
The invention provides a mixed-compression high-frequency double-layer circuit board with a heat insulation structure, which is used for solving the technical problems that the existing mixed-compression high-frequency double-layer circuit board does not have a heat insulation effect, and the temperature of the circuit board is increased due to the fact that copper is arranged on the circuit board and heat in the external environment is easily conducted to the circuit board, so that the working stability of the circuit board is influenced by the temperature increase, and the service life of the circuit board is shortened.
In order to solve the technical problem, the invention discloses a mixed-compression high-frequency double-layer circuit board with a heat insulation structure, which comprises a first circuit board and a second circuit board, wherein the first circuit board and the second circuit board are connected through a connecting assembly, and heat insulation boxes are sleeved outside the first circuit board and the second circuit board.
Preferably, the heat insulation box is of a hollow cubic structure consisting of heat insulation plates.
Preferably, the insulation panel is any one of a foam panel and a vacuum insulation panel.
Preferably, the bottom of the second circuit board is connected with a mounting plate through two symmetrically arranged buffering assemblies.
Preferably, a plurality of bolts are connected to the mounting plate in a penetrating manner.
Preferably, the buffer assembly includes:
the threaded connecting base is fixedly connected to the second circuit board, and internal threads are formed in the threaded connecting base;
the threaded connection cylinder is provided with an external thread and is in threaded connection with the threaded connection seat through the external thread;
the connecting partition plate is fixedly connected in the threaded connecting cylinder;
the first elastic piece is fixedly connected between the connecting partition plate and the mounting plate.
Preferably, coupling assembling includes first coupling assembling and second coupling assembling, first coupling assembling one end with the connection can be dismantled to first circuit board, first coupling assembling other end sliding connection be in the second coupling assembling, second coupling assembling keeps away from first coupling assembling's one end can be dismantled to connect on the second circuit board.
Preferably, the first connection assembly includes:
one end of the first connecting assembly shell is connected in the first connecting hole of the first circuit board, and the other end of the first connecting assembly shell is provided with a sliding table;
the mounting block is fixedly connected in the first connecting component shell, and a mounting cavity and two guide holes which are symmetrically arranged relative to the mounting cavity are formed in the mounting block;
the clamping driving assembly is arranged in the mounting cavity;
the clamping execution assemblies penetrate through the guide holes and are connected with the clamping driving assembly in a sliding manner;
the joint drive assembly includes:
the short shaft is fixedly connected in the mounting cavity;
the first hinge rod is hinged to the short shaft, one end of the first hinge rod is fixedly connected with the first electromagnet, and the other end of the first hinge rod is provided with a first sliding chute;
the second hinge rod is hinged to the short shaft, one end of the second hinge rod is fixedly connected with a second electromagnet, and the other end of the second hinge rod is provided with a second sliding chute;
the power supply assembly is arranged in the mounting cavity and used for supplying power to the first electromagnet and the second electromagnet, and the ferromagnetism of the first electromagnet is opposite to that of the second electromagnet;
the second elastic part is fixedly connected between the first hinge rod and one end of the second hinge rod, which is provided with the electromagnet;
the joint executive component comprises:
the two guide rods are respectively connected in the two guide holes in a sliding manner, and one ends of the two guide rods are respectively connected in the first sliding groove and the second sliding groove in a sliding manner;
the two clamping blocks are respectively and fixedly connected to one ends, far away from the first sliding groove and the second sliding groove, of the two guide rods, and the clamping blocks are matched with clamping grooves formed in the first connecting holes in shape;
the third elastic piece is sleeved on the guide rod;
the second connection assembly includes:
the mounting head is arranged in a second connecting hole of the second circuit board, and internal threads are arranged on the mounting head;
the second connecting assembly shell is provided with an external thread and is in threaded connection with the mounting head;
the first partition plate is fixedly connected in the second connecting assembly shell, and a third sliding groove is formed in the first partition plate;
the adjusting slide blocks are symmetrically arranged and are connected to the third sliding groove in a sliding mode, a first driving piece is arranged on each adjusting slide block, and the first driving piece is used for driving the adjusting slide blocks to slide along the third sliding groove;
one end of the adjusting connecting rod is hinged to the adjusting sliding block, and the other end of the adjusting connecting rod is hinged to the T-shaped connecting rod;
the T-shaped connecting rod comprises a table body, a rod and an inserting block, and the inserting block is used for being matched with an inserting hole formed in the second connecting hole;
the driving switch is fixedly connected to the inner wall of the shell of the second connecting assembly;
the driving plate is fixedly connected to the rod and used for triggering the driving switch;
the fans are rotationally connected in the second connecting component shell, the fans are electrically connected with the driving switch, and the driving switch is used for controlling the working state of the fans;
the second partition plate is fixedly connected in the second connecting assembly shell, and the rod penetrates through the second partition plate;
the guide disc is in sliding connection in the second connecting assembly shell, a fifth elastic piece is sleeved on the rod and located between the guide disc and the inner wall of the mounting head.
Preferably, an installation block is arranged in the first connecting assembly, a first partition plate is fixedly connected in the second connecting assembly, and an adjusting assembly is arranged between the installation block and the first partition plate;
the adjustment assembly includes:
the micro motor is fixedly connected to the first partition plate;
the winding wheel is connected to the output end of the micro motor, a winding is wound on the winding wheel, and one end, far away from the winding wheel, of the winding wheel is fixedly connected to the mounting block;
and the fourth elastic piece is fixedly connected between the mounting block and the first partition plate.
Preferably, the bottom of the second circuit board is connected with a mounting plate, the mounting plate is provided with two symmetrically arranged adjusting chutes, and the adjusting chutes are connected with auxiliary components in a sliding manner;
the auxiliary assembly includes:
the circuit board mounting assembly shell is fixedly connected with a connecting sliding block, the connecting sliding block is connected in the adjusting sliding groove in a sliding manner, and the circuit board mounting assembly shell is hinged with a flip cover;
the auxiliary heat dissipation assembly is arranged in the flip cover and comprises an auxiliary heat dissipation fan and a ventilation net, the auxiliary heat dissipation fan is rotationally connected in the flip cover, a second driving piece is arranged on the auxiliary heat dissipation fan and used for driving the auxiliary heat dissipation fan to rotate, and the ventilation net is fixedly connected to the flip cover;
dust absorption assembly, dust absorption assembly includes adsorption component, strikes off the subassembly, collects the subassembly and opens and shuts the subassembly:
the suction assembly comprises a negative pressure fan and a filter screen, the negative pressure fan is rotationally connected in the dust collection assembly mounting cavity, a second driving piece is arranged on the negative pressure fan and used for driving the negative pressure fan to rotate, and the filter screen is arranged in the dust collection assembly mounting cavity;
the scraping assembly comprises two symmetrically arranged scrapers and a filter screen recovery assembly, the scrapers are slidably connected in a scraper accommodating groove, a third driving piece is arranged on the scrapers and used for driving the scrapers to slide along the scraper accommodating groove, the filter screen recovery assembly comprises a recovery rack and a recovery gear, the recovery rack is fixedly connected with the filter screen, the recovery rack is slidably connected in the recovery groove up and down, the recovery gear is rotatably connected in the recovery groove, the recovery rack is meshed with the recovery gear, a fourth driving piece is arranged on the recovery gear and used for driving the recovery gear to rotate;
the collecting component comprises a leakage net and a collecting bin, the collecting bin is communicated with the dust collection component mounting cavity through the leakage net, and an electric telescopic push plate is fixedly connected in the collecting bin;
the opening and closing assembly comprises an opening and closing driving gear, an opening and closing driving rack and a flashboard, the opening and closing driving rack is fixedly connected with the flashboard and slides up and down on the circuit board mounting assembly shell, and the opening and closing driving gear and the opening and closing driving rack are meshed with each other;
the circuit board auxiliary mounting assembly comprises an arc-shaped rod, a mounting execution assembly and an arc-shaped rod recovery assembly;
the arc-shaped rod is fixedly connected to the turning cover, and a recovery clamping groove is formed in the working end of the arc-shaped rod;
the installation executing assembly is arranged in an executing assembly installing cavity and comprises two symmetrically-arranged telescopic rods, one end of each telescopic rod is hinged in the executing assembly installing cavity, the other end of each telescopic rod is hinged on a buckling T-shaped rod, an arc-shaped rod installing hole is formed in each buckling T-shaped rod, a buckling hole is formed in the second circuit board and used for being matched with the buckling T-shaped rods, two symmetrically-arranged wedge blocks are radially and slidably connected in the buckling holes along the buckling holes, a reset elastic piece is fixedly connected between each wedge block and each buckling hole, a fifth driving piece is arranged on each wedge block and used for driving each wedge block to radially slide along the buckling holes;
the subassembly setting is retrieved to the arc pole in retrieving the subassembly installation cavity, the arc pole is retrieved the subassembly and is including retrieving the guide bar, it is in to retrieve the guide bar fixed connection retrieve the subassembly installation cavity, sliding connection has the recovery guide block on retrieving the guide bar, retrieve the guide block with retrieve the flexible elastic component of fixedly connected with between the subassembly installation cavity, it has middle connecting rod to retrieve hinged joint on the guide block, middle connecting rod is kept away from the one end hinged joint who retrieves the guide block has the cell type fixture block, the cell type fixture block be used for with retrieve the draw-in groove and mutually support.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic diagram of the circuit board structure of the present invention.
Fig. 2 is a partially enlarged view of fig. 1 at a.
FIG. 3 is a schematic view of a card driving assembly according to the present invention.
FIG. 4 is a schematic view of the position of the auxiliary assembly according to the present invention.
FIG. 5 is a schematic view of the auxiliary assembly of the present invention.
FIG. 6 is a partial enlarged view of FIG. 4 at B.
In the figure: 1. a first circuit board; 2. a second circuit board; 3. a connection assembly; 300. a first connection assembly; 3000. a first connection assembly housing; 3001. a first connection hole; 3002. a sliding table; 3003. mounting blocks; 3004. a mounting cavity; 3005. clamping the driving assembly; 3006. clamping the executing assembly; 3007. a guide hole; 3008. a minor axis; 3009. a first hinge lever; 301. a second connection assembly; 3010. a mounting head; 3011. a second connection hole; 3012. a second separator; 3013. a third chute; 3014. adjusting the slide block; 3015. adjusting the connecting rod; 3016. a T-shaped connecting rod; 3017. a stage body; 3018. a rod; 3019. an insertion block; 302. a second hinge lever; 3020. a first electromagnet; 3021. a first chute; 3022. a second electromagnet; 3023. a second chute; 3024. a mounting cavity; 3025. a guide bar; 3026. a clamping block; 3027. a third elastic member; 3028. a card slot; 3029. a second connection assembly housing; 303. a first separator; 3030. inserting holes; 3031. a drive plate; 3032. a drive switch; 3033. a fan; 3034. a guide disc; 3035. a fifth elastic member; 304. an adjustment assembly; 3040. a micro motor; 3041. a reel; 3042. a fourth elastic member; 3043. winding; 4. a buffer assembly; 400. a threaded connection base; 401. a threaded connection barrel; 402. connecting the partition boards; 403. a first elastic member; 5. mounting a plate; 6. an auxiliary component; 600. a circuit board mounting assembly housing; 6000. connecting the sliding block; 6001. a cover is turned; 6002. an auxiliary heat dissipation assembly; 6003. a dust collection assembly; 6004. an auxiliary heat radiation fan; 6005. a breathable net; 6006. a dust collection assembly mounting cavity; 6007. an adsorption component; 6008. a collection assembly; 6009. an opening and closing assembly; 601. filtering with a screen; 6010. a scraping assembly; 6011. a scraper; 6012. a scraper receiving groove; 6013. a screen recovery assembly; 6014. recovering the rack; 6015. recovering the gear; 6016. a recovery tank; 6017. a collection bin; 6018. an electric telescopic push plate; 6019. an opening and closing assembly; 602. an opening and closing driving gear; 6020. the driving rack is opened and closed; 6021. a shutter plate; 6022. the circuit board assists the installation assembly; 6023. installing an execution component; 6024. an arcuate rod recovery assembly; 6025. an execution component mounting cavity; 6026. a recovery assembly mounting cavity; 6027. an arc-shaped rod; 6028. a telescopic rod; 6029. buckling the T-shaped rod; 603. an arc-shaped rod mounting hole; 6030. buckling holes; 6031. a wedge block; 6032. a restoring elastic member; 6033. a recovery card slot; 6034. a recovery guide rod; 6035. a flexible elastic member; 6036. a middle connecting rod; 6037. a groove-shaped clamping block; 6038. recovering the guide block; 6039. and (4) leaking the net.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
In addition, the descriptions related to the first, the second, etc. in the present invention are only used for description purposes, do not particularly refer to an order or sequence, and do not limit the present invention, but only distinguish components or operations described in the same technical terms, and are not understood to indicate or imply relative importance or implicitly indicate the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions and technical features between the various embodiments may be combined with each other, but must be based on the realization of the capability of a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The present invention provides the following examples:
example 1
The embodiment of the invention provides a mixed-compression high-frequency double-layer circuit board with a heat insulation structure, which comprises a first circuit board 1 and a second circuit board 2 as shown in figures 1-6, wherein the first circuit board 1 and the second circuit board 2 are connected through a connecting component 3, and a heat insulation box 3 is sleeved outside both the first circuit board 1 and the second circuit board 2.
The working principle and the beneficial effects of the technical scheme are as follows: the design of heat insulation box 3 has avoided heat conduction among the external environment to first circuit board 1 and second circuit board 2 on to having solved current thoughtlessly to press the high frequency double-layer circuit board and not having the heat-proof effect, owing to have copper on the circuit board, heat among the external environment conducts to the circuit board easily on, leads to the circuit board temperature to rise, and the operating stability of circuit board can be influenced in the rising of temperature, reduces the technical problem of the life of circuit board.
Example 2
On the basis of the embodiment 1, the heat insulation box 3 is a hollow cubic structure formed by heat insulation boards;
the heat insulation plate adopts any one of a foam plate and a vacuum heat insulation plate;
the bottom of the second circuit board 2 is connected with a mounting plate 5 through two symmetrically arranged buffering components 4;
a plurality of bolts are connected to the mounting plate 5 in a penetrating manner;
the buffer assembly 4 comprises:
the threaded connection seat 400 is fixedly connected to the second circuit board 2, and internal threads are formed in the threaded connection seat 400;
the threaded connection barrel 401 is provided with an external thread, and the threaded connection barrel 401 is in threaded connection with the threaded connection seat 400 through the external thread;
a connecting partition plate 402, wherein the connecting partition plate 402 is fixedly connected in the threaded connecting cylinder 401;
a first elastic member 403, the first elastic member 403 being fixedly connected between the connecting spacer 402 and the mounting plate 5.
The working principle and the beneficial effects of the technical scheme are as follows: when the circuit board is installed, the installation plate 5 is connected to the installed part by using bolts;
when the buffer assembly 4 is installed, the threaded connection barrel 401 is screwed on the threaded connection seat 400, and the first elastic member 403 is designed to provide a displacement space when the circuit board is impacted by an external force, so that the influence of the external force on the circuit board is reduced.
Example 3
On the basis of embodiment 1 or 2, the connecting assembly 3 comprises a first connecting assembly 300 and a second connecting assembly 301, one end of the first connecting assembly 300 is detachably connected with the first circuit board 1, the other end of the first connecting assembly 300 is slidably connected in the second connecting assembly 301, and one end of the second connecting assembly 301, which is far away from the first connecting assembly 300, is detachably connected on the second circuit board 2;
the first connection assembly 300 includes:
one end of the first connection assembly housing 3000 is connected to the first connection hole 3001 of the first circuit board 1, and the other end of the first connection assembly housing 3000 is provided with a sliding table 3002;
a mounting block 3003, wherein the mounting block 3003 is fixedly connected in the first connecting assembly housing 3000, and a mounting cavity 3004 and two guide holes 3007 symmetrically arranged with respect to the mounting cavity 3004 are formed in the mounting block 3003;
the clamping driving assembly 3005 is arranged in the installation cavity 3004;
the clamping actuating components 3006 are symmetrically arranged, and the clamping actuating components 3006 penetrate through the guide holes 3007 and are connected with the clamping driving components 3005 in a sliding mode;
the clamping drive assembly 3005 comprises:
a stub 3008, wherein the stub 3008 is fixedly connected in the mounting cavity 3004;
the first hinge rod 3009 is hinged to the short shaft 3008, one end of the first hinge rod 3009 is fixedly connected with a first electromagnet 3020, and the other end of the first hinge rod 3009 is provided with a first chute 3021;
the second hinge rod 302 is hinged to the short shaft 3008, one end of the second hinge rod 302 is fixedly connected with a second electromagnet 3022, and the other end of the second hinge rod 302 is provided with a second sliding chute 3023;
a power supply assembly disposed in the mounting cavity 3004, the power supply assembly being configured to supply power to the first electromagnet 3020 and the second electromagnet 3022, the first electromagnet 3020 and the second electromagnet 3022 being opposite in magnetism;
a second elastic member 3024, wherein the second elastic member 3024 is fixedly connected between the first hinge rod 3009 and one end of the second hinge rod 302, at which the electromagnet is installed;
the card actuator assembly 3006 comprises:
two symmetrically arranged guide rods 3025, the two guide rods 3025 are slidably connected in the two guide holes 3007, and one ends of the two guide rods 3025 are slidably connected in the first sliding chute 3021 and the second sliding chute 3023, respectively;
the two symmetrically arranged fixture blocks 3026 are respectively and fixedly connected to one ends of the two guide rods 3025 far away from the first sliding groove 3021 and the second sliding groove 3023, and the fixture blocks 3026 are matched with the fixture grooves 3028 formed in the first connection holes 3001 in shape;
a third elastic member 3027, wherein the third elastic member 3027 is sleeved on the guide rod 3025;
the second connection assembly 301 includes:
the mounting head 3010, the mounting head 3010 is set up in the second attachment hole 3011 of the said second circuit board 2, there are female screws on the said mounting head 3010;
a second connecting assembly housing 3029, wherein an external thread is arranged on the second connecting assembly housing 3029, and the second connecting assembly housing 3029 is in threaded connection with the mounting head 3010;
the first partition plate 303 is fixedly connected in the second connecting assembly shell 3029, and a third sliding groove 3013 is formed in the first partition plate 303;
the adjusting sliders 3014 are symmetrically arranged, the adjusting sliders 3014 are slidably connected to the third sliding groove 3013, and a first driving piece is arranged on the adjusting sliders 3014 and used for driving the adjusting sliders 3014 to slide along the third sliding groove 3013;
one end of the adjusting connecting rod 3015 is hinged to the adjusting slider 3014, and the other end of the adjusting connecting rod 3015 is hinged to the T-shaped connecting rod 3016;
the T-shaped connecting rod 3016 comprises a table body 3017, a rod 3018 and an insertion block 3019, and the insertion block 3019 is used for being matched with an insertion hole 3030 formed in the second connecting hole 3011;
the driving switch 3032, the driving switch 3032 is fixedly connected to the inner wall of the second connecting assembly shell 3029;
the driving plate 3031 is fixedly connected to the rod 3018, and the driving plate 3031 is used for triggering the driving switch 3032;
two symmetrically arranged fans 3033, wherein the fans 3033 are rotatably connected in the second connecting assembly housing 3029, the fans 3033 are electrically connected with the driving switch 3032, and the driving switch 3032 is used for controlling the working state of the fans 3033;
a second partition 3012, the second partition 3012 is fixedly connected in the second connecting component shell 3029, and the rod 3018 penetrates through the second partition 3012;
a guide plate 3034, wherein the guide plate 3034 is slidably connected in the second connection assembly housing 3029, a fifth elastic member 3035 is sleeved on the rod 3018, and the fifth elastic member 3035 is located between the guide plate 3034 and the inner wall of the mounting head 3010;
an installation block 3003 is arranged in the first connecting assembly 300, a first partition plate 303 is fixedly connected in the second connecting assembly 301, and an adjusting assembly 304 is arranged between the installation block 3003 and the first partition plate 303;
the adjustment assembly 304 includes:
the micro motor 3040, the micro motor 3040 is fixedly connected to the first partition 303;
a winding wheel 3041, wherein the winding wheel 3041 is connected to the output end of the micro motor 3040, a winding 3043 is wound on the winding wheel 3041, and one end of the winding 3043, which is far away from the winding wheel 3041, is fixedly connected to the mounting block 3003;
a fourth elastic member 3042, the fourth elastic member 3042 being fixedly connected between the mounting block 3003 and the first barrier 303.
The working principle and the beneficial effects of the technical scheme are as follows: when the first circuit board 1 and the second circuit board 2 are connected and mounted, the mounting head 3010 is screwed on the second connecting component housing 3029, then the mounting head 3010 is inserted into the second connecting hole 3011, then the first driving member drives the adjusting slider 3014 to slide along the third sliding slot 3013, and drives the adjusting link 3015 to move, the adjusting link 3015 moves to push the T-shaped connecting rod 3016 to move downward, so that the plugging block 3019 and the plugging hole 3030 are mutually matched, when the plugging block 3019 and the plugging hole 3030 are mutually matched, the driving plate 3031 moves to be in contact with the driving switch 3032, so that the driving switch 3032 is triggered to drive the fan 3033 to rotate, the fan 3033 rotates to play a role in cooling the second circuit board 2 and the first circuit board 1, and at this time, the second connecting component 301 is mounted on the second circuit board 2;
then the first connecting assembly housing 3000 is inserted into the first connecting hole 3001, before the first connecting assembly housing 3000 is inserted into the first connecting hole 3001, since the first electromagnet 3020 and the second electromagnet 3022 are not energized, the electromagnet-carrying ends of the first hinge rod 3009 and the second hinge rod 302 are moved away from each other by the second elastic member 3024, so that the third elastic member 3027 is compressed, and at this time, the locking piece 3026 and the locking groove 3028 are moved away from each other, so that the insertion of the first connecting assembly housing 3000 into the first connecting hole 3001 is facilitated, and after the first connecting assembly housing 3000 is inserted into the first connecting hole 3001, the power supply assembly supplies power to the first electromagnet 3020 and the second electromagnet 3022, so that the first electromagnet 3020 and the second electromagnet 3022 attract each other, and the first electromagnet 3020 and the second electromagnet 3022 drive the electromagnet-carrying ends of the first hinge rod 3009 and the second hinge rod 302 away from each other, therefore, the clamping block 3026 and the clamping groove 3028 are matched with each other, and the first connecting assembly shell 3000 is connected with the first circuit board 1;
so far, the connection and installation between the first circuit board 1 and the second circuit board 2 are realized, because the fourth elastic member 3042 is fixedly connected between the installation block 3003 and the first partition plate 303, and the sliding table 3002 is slidably connected in the second connection assembly housing 3029, the first circuit board 1 or the second circuit board 2 can automatically buffer and adjust the external force when being extruded by the external force;
when the distance between the first circuit board 1 and the second circuit board 2 is adjusted to adapt to the installation environment, the micro motor 3040 drives the reel 3041 to rotate, the reel 3041 rotates to drive the winding 3043 to pull the sliding table 3002 to slide along the second connecting assembly shell 3029, and therefore the distance between the first circuit board 1 and the second circuit board 2 is changed;
the design of coupling assembling 3 is convenient for the installation of first circuit board 1 and second circuit board 2 and has been made things convenient for the later stage maintenance of first circuit board 1 and second circuit board 2 with dismantling, is convenient for adjust the distance between first circuit board 1 and the second circuit board 2 simultaneously, can make the different installation environment of its better adaptation, the effect of heat dissipation cooling in addition simultaneously to the life of first circuit board 1 of extension and second circuit board 2.
Example 4
On the basis of embodiment 3, the bottom of the second circuit board 2 is connected with a mounting plate 5, two symmetrically arranged adjusting chutes 500 are arranged on the mounting plate 5, and an auxiliary assembly 6 is slidably connected in the adjusting chutes 500;
the auxiliary assembly 6 comprises:
the circuit board mounting assembly comprises a circuit board mounting assembly shell 600, wherein a connecting sliding block 6000 is fixedly connected to the circuit board mounting assembly shell 600, the connecting sliding block 6000 is connected in the adjusting sliding groove 500 in a sliding mode, and a turnover cover 6001 is hinged to the circuit board mounting assembly shell 600;
the auxiliary heat dissipation assembly 6002 is disposed in the flip 6001, the auxiliary heat dissipation assembly 6002 includes an auxiliary heat dissipation fan 6004 and a ventilation net 6005, the auxiliary heat dissipation fan 6004 is rotatably connected in the flip 6001, a second driving member is disposed on the auxiliary heat dissipation fan 6004, the second driving member is configured to drive the auxiliary heat dissipation fan 6004 to rotate, and the ventilation net 6005 is fixedly connected to the flip 6001;
a dust collection assembly 6003, said dust collection assembly 6003 comprising an adsorption assembly 6007, a scraping assembly 6010, a collection assembly 6008 and an opening and closing assembly 6019:
the adsorption assembly 6007 comprises a negative pressure fan 6009 and a filter screen 601, the negative pressure fan 6009 is rotatably connected in the dust collection assembly mounting cavity 6006, a second driving member is arranged on the negative pressure fan 6009 and is used for driving the negative pressure fan 6009 to rotate, and the filter screen 601 is arranged in the dust collection assembly mounting cavity 6006;
the scraping assembly 6010 comprises two symmetrically arranged scrapers 6011 and a filter screen recovery assembly 6013, the scrapers 6011 are slidably connected in a scraper storage groove 6012, a third driving member is arranged on the scrapers 6011 and is used for driving the scrapers 6011 to slide along the scraper storage groove 6012, the filter screen recovery assembly 6013 comprises a recovery rack 6014 and a recovery gear 6015, the recovery rack 6014 is fixedly connected with the filter screen 601, the recovery rack 6014 is slidably connected in a recovery groove 6016 up and down, the recovery gear 6015 is rotatably connected in the recovery groove 6016, the recovery rack 6014 is engaged with the recovery gear 6015, a fourth driving member is arranged on the recovery gear 6015, and the fourth driving member is used for driving the recovery gear 6015 to rotate;
the collecting assembly 6008 comprises a drain net 6039 and a collecting bin 6017, the collecting bin 6017 is communicated with the dust collecting assembly mounting cavity 6006 through the drain net 6039, and an electric telescopic push plate 6018 is fixedly connected in the collecting bin 6017;
the opening and closing assembly 6019 comprises an opening and closing driving gear 602, an opening and closing driving rack 6020 and a shutter 6021, wherein the opening and closing driving rack 6020 and the shutter 6021 are fixedly connected and slide on the circuit board mounting assembly shell 600 up and down, and the opening and closing driving gear 602 is meshed with the opening and closing driving rack 6020;
the circuit board auxiliary mounting assembly 6022 comprises an arc-shaped rod 6027, a mounting execution assembly 6023 and an arc-shaped rod recycling assembly 6024;
the arc-shaped rod 6027 is fixedly connected to the turnover cover 6001, and a recovery clamping groove 6033 is arranged at the working end of the arc-shaped rod 6027;
the installation executing assembly 6023 is arranged in the executing assembly installation cavity 6025, the installation executing assembly 6023 comprises two symmetrically arranged telescopic rods 6028, one end of the telescopic rod 6028 is hinged in the executing assembly installation cavity 6025, the other end of the telescopic rod 6028 is hinged in the buckling T-shaped rod 6029, an arc-shaped rod installation hole 603 is formed in the buckling T-shaped rod 6029, a buckling hole 6030 is formed in the second circuit board 2, the buckling hole 6030 is used for being matched with the buckling T-shaped rod 6029, two symmetrically arranged wedge blocks 6031 are connected in the buckling hole 6030 in a radial sliding manner along the buckling hole 6030, a reset elastic member 6032 is fixedly connected between the wedge block 6031 and the buckling hole 6030, a fifth driving member is arranged on the wedge block 6031, and the fifth driving member is used for driving the wedge block 6031 to slide in a radial direction along the buckling hole 6030;
The working principle and the beneficial effects of the technical scheme are as follows: when the second circuit board 2 is connected with the mounting board 5, the recovery guide block 6038 is pushed by hand to slide along the recovery guide rod 6034, the recovery guide block 6038 slides along the recovery guide rod 6034 to drive the middle connecting rod 6036 to pull the groove-shaped fixture block 6037 to be separated from the recovery clamping groove 6033, then the turning cover 6001 is rotated to the position shown in fig. 5, at this time, the mutually matched position of the arc-shaped rod 6027 and the arc-shaped rod mounting hole 603 is shown in fig. 5, in the process that the arc-shaped rod 6027 is matched with the arc-shaped rod mounting hole 603, the fastened T-shaped rod 6029 is changed from the state in the execution component mounting cavity 6025 to the state of extending out of the execution component mounting cavity 6025 until the fastened T-shaped rod 6029 is matched with the fastening hole 6030, in the process that the fastened T-shaped rod 6029 extends into the fastening hole 6030, the fastened T-shaped rod 6029 pushes the wedge 6031 to move away from the fastening hole 6030, at this time, the reset elastic member 6032 is compressed, and when the fastened T-shaped rod 6029 is completely extended into the fastening hole 6030, the reset elastic part 6032 restores the original length, and the wedge-shaped block 6031 is in the state shown in fig. 5, so that the connection between the second circuit board 2 and the mounting plate 5 is realized;
meanwhile, as the connecting sliding block 6000 is slidably connected in the adjusting sliding groove 500, the distance between the two auxiliary components 6 can be adjusted, so that the installation of the second circuit boards 2 with different lengths can be met, and the installation adaptability of the auxiliary components 6 is improved;
in the working process of the second circuit board 2, the second driving piece can drive the auxiliary cooling fan 6004 to rotate, the auxiliary cooling fan 6004 rotates to accelerate the cooling of the second circuit board 2, and the service life of the second circuit board 2 is prolonged;
meanwhile, the dust collection assembly 6003 can be started to absorb dust in the surrounding environment of the second circuit board 2, so that the second circuit board 2 is prevented from being covered by dust to influence the work of the second circuit board 2, when the dust collection assembly 6003 works, the opening and closing drive gear 602 rotates to drive the opening and closing drive rack 6020 to move upwards, the opening and closing drive rack 6020 moves upwards to drive the shutter 6021 to move upwards, so that the dust collection assembly installation cavity 6006 is communicated with the outside environment, then the negative pressure fan 6009 is started to suck outside dust into the dust collection assembly installation cavity 6006, the dust is attached to the filter screen 601, when the filter screen 601 is to be cleaned, the third driving piece drives the scraper 6011 to slide along the scraper accommodating groove 6012, so that the scraper 6011 is in contact with the surface of the filter screen 601, then the fourth driving piece drives the recovery gear 6015 to rotate, and the recovery gear 6015 rotates to drive the recovery rack 6014 to move, the recycling rack 6014 moves to drive the filter screen 601 to move upwards, dust attached to the filter screen 601 in the process of moving upwards is scraped down through the drain net 6039 and falls to the collection bin 6017, and when the dust in the collection bin 6017 is cleaned, the electric telescopic push plate 6018 extends to push the dust out of the collection bin 6017.
Example 5
On the basis of embodiment 1, the method further comprises the following steps:
the circuit board replacement prompting system is arranged on the first circuit board 1 and the second circuit board 2 and used for monitoring the use conditions of the first circuit board 1 and the second circuit board 2 and giving an alarm according to the use conditions of the first circuit board 1 and the second circuit board 2 (the first circuit board 1 and the second circuit board 2 are made of the same material);
the circuit board replacement prompt system further comprises:
the first temperature sensor is arranged on the first circuit board 1 and used for detecting the temperature of the first circuit board 1;
a second temperature sensor provided on the second wiring board 2 for detecting the temperature of the second wiring board 2;
the third temperature sensor is arranged in the environment where the circuit board is located and used for detecting the temperature of the environment;
the timer is arranged on the circuit board (the first circuit board 1 or the second circuit board 2) and used for detecting the total working time of the circuit board;
the first stress sensor is arranged on the first circuit board 1 and used for detecting the stress borne by the first circuit board 1;
the second stress sensor is arranged on the second circuit board 2 and used for detecting the stress borne by the second circuit board 2;
the controller, the alarm, the controller with first temperature sensor the second temperature sensor the third temperature sensor the time-recorder, first stress sensor the second stress sensor with the alarm electricity is connected, the controller is based on first temperature sensor the second temperature sensor the third temperature sensor the time-recorder, first stress sensor with second stress sensor control the alarm is reported to the police, includes following step:
the method comprises the following steps: calculating an actual replacement prompt coefficient of the circuit board based on the first temperature sensor, the second temperature sensor, the third temperature sensor, the timer, the first stress sensor and the second stress sensor:
wherein,
the actual replacement prompting coefficient of the circuit board is shown, beta is a reference strain value of the materials of the first circuit board 1 and the second circuit board 2, gamma is the yield strength of the materials of the first circuit board 1 and the second circuit board 2, and N is 1T Is the preset bearing capacity N borne by the first circuit board 1 when the temperature is T 2T Is a predetermined bearing capacity, sigma, to which the second circuit board 2 is subjected when the temperature is T 1T Is a value detected by the first stress sensor, σ 2T Is a value detected by the second stress sensor, δ 0 Is the critical bearing capacity of the first circuit board 1 and the second circuit board 2, G is the thermal conductivity of the materials of the first circuit board 1 and the second circuit board 2, tau is the Poisson's ratio of the materials of the first circuit board 1 and the second circuit board 2,
is the thermal expansion coefficient of the materials of the first circuit board 1 and the second circuit board 2, T is the detection value of the timer, T 1 Is a value detected by the first temperature sensor, T 2 Is a value detected by the second temperature sensor, T 0 Lg is a logarithm with the base of 10, and is a detection value of the third temperature sensor;
step two: the controller compares the actual change prompt coefficient of circuit board and the preset change prompt coefficient of circuit board, if the actual change prompt coefficient of circuit board is greater than the preset change prompt coefficient of circuit board, then the controller controls the alarm to alarm, reminds the staff to change the circuit board.
The working principle and the beneficial effects of the technical scheme are as follows: the design of the circuit board replacement prompt system ensures that the circuit board is replaced in time when the use condition is not good, and the physical coefficients of the first circuit board 1 and the second circuit board 2 are introduced when the actual replacement prompt coefficient of the circuit board is calculated
Tau, G and other physical quantities, so that the calculation result is more accurate, and the stress sigma borne by the first circuit board 1 1T And the stress σ to which the second wiring board 2 is subjected 2T The larger, the wireThe actual change prompt coefficient of the circuit board is larger, the total working time t of the circuit board is larger, the actual change prompt coefficient of the circuit board is larger, the temperature difference between the temperature of the first circuit board 1 and the environment and the temperature difference between the temperature of the second circuit board 2 and the environment are larger, and the actual change prompt coefficient of the circuit board is larger.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. The utility model provides a thoughtlessly press high frequency double-deck circuit board with thermal-insulated structure which characterized in that, includes first circuit board (1) and second circuit board (2), first circuit board (1) and second circuit board (2) are connected through coupling assembling (3), first circuit board (1) and second circuit board (2) all overlap and are equipped with hot box (3) outward.
2. The mixed-compression high-frequency double-layer circuit board with the heat insulation structure as claimed in claim 1, wherein the heat insulation box (3) is a hollow cubic structure composed of heat insulation boards.
3. The mixed-compression high-frequency double-layer circuit board with the heat insulation structure as claimed in claim 2, wherein the heat insulation board is any one of a foam board and a vacuum heat insulation board.
4. The mixed-compression high-frequency double-layer circuit board with the heat insulation structure as claimed in claim 1, wherein the bottom of the second circuit board (2) is connected with a mounting plate (5) through two symmetrically arranged buffer assemblies (4).
5. The mixed-compression high-frequency double-layer circuit board with the heat insulation structure as claimed in claim 4, wherein a plurality of bolts are connected to the mounting plate (5) in a penetrating manner.
6. The mixed-compression high-frequency double-layer circuit board with the thermal insulation structure according to claim 4, wherein the buffer assembly (4) comprises:
the threaded connection seat (400), the threaded connection seat (400) is fixedly connected to the second circuit board (2), and internal threads are arranged in the threaded connection seat (400);
the threaded connection barrel (401) is provided with an external thread, and the threaded connection barrel (401) is in threaded connection with the threaded connection seat (400) through the external thread;
the connecting partition plate (402), the connecting partition plate (402) is fixedly connected in the threaded connecting cylinder (401);
a first resilient member (403), the first resilient member (403) being fixedly connected between the connecting spacer (402) and the mounting plate (5).
7. The mixed-compression high-frequency double-layer circuit board with the heat insulation structure as claimed in claim 6,
coupling assembling (3) include first coupling assembling (300) and second coupling assembling (301), first coupling assembling (300) one end with first circuit board (1) can dismantle the connection, first coupling assembling (300) other end sliding connection be in second coupling assembling (301), second coupling assembling (301) are kept away from the one end of first coupling assembling (300) can be dismantled the connection and be in on second circuit board (2).
8. The mixed-compression high-frequency double-layer circuit board with the heat insulation structure as claimed in claim 7,
the first connection assembly (300) comprises:
one end of the first connecting assembly shell (3000) is connected into a first connecting hole (3001) of the first circuit board (1), and the other end of the first connecting assembly shell (3000) is provided with a sliding table (3002);
the mounting block (3003) is fixedly connected in the first connecting assembly shell (3000), and a mounting cavity (3004) and two guide holes (3007) which are symmetrically arranged relative to the mounting cavity (3004) are formed in the mounting block (3003);
the clamping driving assembly (3005) is arranged in the mounting cavity (3004);
the clamping actuating components (3006) are symmetrically arranged, and the clamping actuating components (3006) penetrate through the guide holes (3007) and are connected with the clamping driving components (3005) in a sliding mode;
the clamping drive assembly (3005) comprises:
a stub shaft (3008), the stub shaft (3008) being fixedly connected within the mounting cavity (3004);
the first hinge rod (3009) is hinged to the short shaft (3008), one end of the first hinge rod (3009) is fixedly connected with a first electromagnet (3020), and the other end of the first hinge rod (3009) is provided with a first sliding chute (3021);
the second hinge rod (302) is hinged to the short shaft (3008), one end of the second hinge rod (302) is fixedly connected with a second electromagnet (3022), and the other end of the second hinge rod (302) is provided with a second sliding chute (3023);
a power supply assembly disposed within the mounting cavity (3004), the power supply assembly configured to supply power to the first electromagnet (3020) and the second electromagnet (3022), the first electromagnet (3020) and the second electromagnet (3022) being magnetically opposite;
a second elastic piece (3024), wherein the second elastic piece (3024) is fixedly connected between the first hinge rod (3009) and one end of the second hinge rod (302) provided with an electromagnet;
the card-engaging actuator assembly (3006) comprises:
the two guide rods (3025) are symmetrically arranged, the two guide rods (3025) are respectively connected in the two guide holes (3007) in a sliding manner, and one ends of the two guide rods (3025) are respectively connected in the first sliding chute (3021) and the second sliding chute (3023) in a sliding manner;
the two symmetrically arranged fixture blocks (3026), the two fixture blocks (3026) are respectively and fixedly connected to one ends of the two guide rods (3025) far away from the first sliding groove (3021) and the second sliding groove (3023), and the fixture blocks (3026) are matched with the clamp grooves (3028) formed in the first connecting hole (3001) in shape;
the third elastic piece (3027), the third elastic piece (3027) is sleeved on the guide rod (3025);
the second connection assembly (301) comprises:
the mounting head (3010), the said mounting head (3010) is set up in the second attachment hole (3011) of the said second breadboard (2), there are female screws on the said mounting head (3010);
a second connecting assembly housing (3029), wherein an external thread is arranged on the second connecting assembly housing (3029), and the second connecting assembly housing (3029) is in threaded connection with the mounting head (3010);
the first partition plate (303), the first partition plate (303) is fixedly connected in the second connecting assembly shell (3029), and a third sliding groove (3013) is formed in the first partition plate (303);
the adjusting device comprises two adjusting sliding blocks (3014) which are symmetrically arranged, the adjusting sliding blocks (3014) are connected to the third sliding groove (3013) in a sliding mode, a first driving piece is arranged on the adjusting sliding blocks (3014), and the first driving piece is used for driving the adjusting sliding blocks (3014) to slide along the third sliding groove (3013);
one end of the adjusting connecting rod (3015) is hinged to the adjusting sliding block (3014), and the other end of the adjusting connecting rod (3015) is hinged to the T-shaped connecting rod (3016);
the T-shaped connecting rod (3016), the T-shaped connecting rod (3016) includes the stage body (3017), pole (3018) and insertion block (3019), the insertion block (3019) is used for cooperating with the insertion hole (3030) that offers in the second connecting hole (3011);
a drive switch (3032), wherein the drive switch (3032) is fixedly connected with the inner wall of the second connecting assembly shell (3029);
the driving plate (3031), the driving plate (3031) is fixedly connected to the rod (3018), and the driving plate (3031) is used for triggering the driving switch (3032);
two symmetrically arranged fans (3033), wherein the fans (3033) are rotatably connected in the second connecting assembly shell (3029), the fans (3033) are electrically connected with the drive switch (3032), and the drive switch (3032) is used for controlling the working state of the fans (3033);
a second partition plate (3012), wherein the second partition plate (3012) is fixedly connected in the second connecting assembly shell (3029), and the rod (3018) penetrates through the second partition plate (3012);
the guide disc (3034) is connected in the second connecting assembly shell (3029) in a sliding mode, a fifth elastic piece (3035) is sleeved on the rod (3018), and the fifth elastic piece (3035) is located between the guide disc (3034) and the inner wall of the mounting head (3010).
9. The mixed-compression high-frequency double-layer circuit board with the heat insulation structure as claimed in claim 7,
an installation block (3003) is arranged in the first connecting assembly (300), a first partition plate (303) is fixedly connected in the second connecting assembly (301), and an adjusting assembly (304) is arranged between the installation block (3003) and the first partition plate (303);
the adjustment assembly (304) comprises:
the micro motor (3040), the micro motor (3040) is fixedly connected to the first partition plate (303);
the winding wheel (3041), the winding wheel (3041) is connected to the output end of the micro motor (3040), a winding wire (3043) is wound on the winding wheel (3041), and one end, far away from the winding wheel (3041), of the winding wire (3043) is fixedly connected to the mounting block (3003);
a fourth elastic member (3042), the fourth elastic member (3042) being fixedly connected between the mounting block (3003) and the first barrier (303).
10. The mixed-compression high-frequency double-layer circuit board with the heat insulation structure as claimed in claim 1,
the bottom of the second circuit board (2) is connected with a mounting plate (5), two symmetrically arranged adjusting sliding grooves (500) are formed in the mounting plate (5), and an auxiliary assembly (6) is connected in the adjusting sliding grooves (500) in a sliding manner;
the auxiliary assembly (6) comprises:
the circuit board mounting assembly comprises a circuit board mounting assembly shell (600), wherein a connecting sliding block (6000) is fixedly connected to the circuit board mounting assembly shell (600), the connecting sliding block (6000) is connected into the adjusting sliding groove (500) in a sliding mode, and a turnover cover (6001) is hinged to the circuit board mounting assembly shell (600);
the auxiliary heat dissipation assembly (6002), the auxiliary heat dissipation assembly (6002) is arranged in the flip cover (6001), the auxiliary heat dissipation assembly (6002) comprises an auxiliary heat dissipation fan (6004) and a ventilation net (6005), the auxiliary heat dissipation fan (6004) is rotatably connected in the flip cover (6001), a second driving member is arranged on the auxiliary heat dissipation fan (6004) and is used for driving the auxiliary heat dissipation fan (6004) to rotate, and the ventilation net (6005) is fixedly connected to the flip cover (6001);
a dust collection assembly (6003), the dust collection assembly (6003) comprising an adsorption assembly (6007), a scraping assembly (6010), a collection assembly (6008), and an opening and closing assembly (6019):
the adsorption assembly (6007) comprises a negative pressure fan (6009) and a filter screen (601), the negative pressure fan (6009) is rotatably connected in the dust collection assembly mounting cavity (6006), a second driving piece is arranged on the negative pressure fan (6009) and is used for driving the negative pressure fan (6009) to rotate, and the filter screen (601) is arranged in the dust collection assembly mounting cavity (6006);
a scraping assembly (6010), the scraping assembly (6010) comprising two symmetrically arranged scrapers (6011) and a screen recovery assembly (6013), the scraper (6011) is slidably connected in the scraper receiving groove (6012), a third driving piece is arranged on the scraper (6011), the third driving piece is used for driving the scraper (6011) to slide along the scraper accommodating groove (6012), the filter screen recovery assembly (6013) comprises a recovery rack (6014) and a recovery gear (6015), the recovery rack (6014) is fixedly connected with the filter screen (601), the recovery rack (6014) is connected in a recovery tank (6016) in a vertical sliding manner, the recycling gear (6015) is rotatably connected in the recycling groove (6016), the recycling rack (6014) is meshed with the recycling gear (6015), a fourth driving part is arranged on the recovery gear (6015) and used for driving the recovery gear (6015) to rotate;
the collecting assembly (6008) comprises a drain net (6039) and a collecting bin (6017), the collecting bin (6017) is communicated with the dust collection assembly mounting cavity (6006) through the drain net (6039), and an electric telescopic push plate (6018) is fixedly connected in the collecting bin (6017);
the opening and closing assembly (6019) comprises an opening and closing driving gear (602), an opening and closing driving rack (6020) and a flashboard (6021), wherein the opening and closing driving rack (6020) is fixedly connected with the flashboard (6021) and slides up and down on the circuit board mounting assembly shell (600), and the opening and closing driving gear (602) is meshed with the opening and closing driving rack (6020);
a circuit board auxiliary mounting assembly (6022), the circuit board auxiliary mounting assembly (6022) comprising an arc-shaped rod (6027), a mounting execution assembly (6023), and an arc-shaped rod recycling assembly (6024);
the arc-shaped rod (6027) is fixedly connected to the turnover cover (6001), and a recovery clamping groove (6033) is arranged at the working end of the arc-shaped rod (6027);
the installation execution assembly (6023) is arranged in the execution assembly installation cavity (6025), the installation execution assembly (6023) comprises two symmetrically arranged telescopic rods (6028), one end of the telescopic rod (6028) is hinged in the execution component mounting cavity (6025), the other end is hinged on the buckling T-shaped rod (6029), an arc-shaped rod mounting hole (603) is formed in the buckling T-shaped rod (6029), a buckling hole (6030) is formed in the second circuit board (2), the buckling hole (6030) is used for being matched with the buckling T-shaped rod (6029), two symmetrically arranged wedge blocks (6031) are connected in the buckling hole (6030) in a radial sliding way along the buckling hole (6030), a reset elastic piece (6032) is fixedly connected between the wedge block (6031) and the buckling hole (6030), a fifth driving piece is arranged on the wedge-shaped block (6031) and is used for driving the wedge-shaped block (6031) to slide along the radial direction of the buckling hole (6030);
subassembly (6024) is retrieved to arc pole sets up in retrieving subassembly installation cavity (6026), subassembly (6024) is retrieved including retrieving guide bar (6034) to the arc pole, retrieve guide bar (6034) fixed connection be in retrieve in the subassembly installation cavity (6026), sliding connection retrieves guide block (6038) on retrieving guide bar (6034), retrieve guide block (6038) with retrieve the flexible elastic component (6035) of fixedly connected with between subassembly installation cavity (6026), it has intermediate connecting rod (6036) to retrieve hinged joint on guide block (6038), intermediate connecting rod (6036) are kept away from the one end hinged joint of retrieving guide block (6038) has cell type fixture block (6037), cell type fixture block (6037) be used for with retrieve draw-in groove (6033) and mutually support.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210661436.XA CN115003021B (en) | 2022-06-13 | 2022-06-13 | Mixed-compression high-frequency double-layer circuit board with heat insulation structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210661436.XA CN115003021B (en) | 2022-06-13 | 2022-06-13 | Mixed-compression high-frequency double-layer circuit board with heat insulation structure |
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| Publication Number | Publication Date |
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| CN115003021A true CN115003021A (en) | 2022-09-02 |
| CN115003021B CN115003021B (en) | 2023-03-21 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116981158A (en) * | 2023-09-12 | 2023-10-31 | 江苏艾诺信电路技术有限公司 | Heat abstractor for be used for 5G high frequency circuit board |
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| CN215420904U (en) * | 2021-06-22 | 2022-01-04 | 深圳市联合多层线路板有限公司 | High-frequency mixed-voltage circuit board capable of dissipating heat quickly |
| CN216491243U (en) * | 2021-12-13 | 2022-05-10 | 瑞安市金都汽车零部件有限公司 | Oxidation-resistant long-life circuit board |
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| CN116981158A (en) * | 2023-09-12 | 2023-10-31 | 江苏艾诺信电路技术有限公司 | Heat abstractor for be used for 5G high frequency circuit board |
| CN116981158B (en) * | 2023-09-12 | 2024-01-23 | 江苏艾诺信电路技术有限公司 | Heat abstractor for be used for 5G high frequency circuit board |
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| Publication number | Publication date |
|---|---|
| CN115003021B (en) | 2023-03-21 |
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