CN214708152U - Multilayer circuit board capable of quickly radiating heat - Google Patents
Multilayer circuit board capable of quickly radiating heat Download PDFInfo
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- CN214708152U CN214708152U CN202120799524.7U CN202120799524U CN214708152U CN 214708152 U CN214708152 U CN 214708152U CN 202120799524 U CN202120799524 U CN 202120799524U CN 214708152 U CN214708152 U CN 214708152U
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- circuit board
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- wall
- multilayer circuit
- dissipating heat
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Abstract
The utility model belongs to the field of circuit boards, in particular to a multilayer circuit board capable of quickly dissipating heat, which provides the following proposal aiming at the existing problems, which comprises a first circuit board and a second circuit board, wherein the second circuit board is respectively provided with two cavities inside, and the inner wall of one side of the cavity is provided with a through hole, one side of the first circuit board is respectively and fixedly provided with one end of two cross bars, the other end of the cross bar penetrates through the through hole, and extends into the cavity, the top side of the cross bar is provided with an insertion hole, the inner walls of the two cavities close to each other are provided with the same connecting hole, and the inner walls of the two cavities far away from each other are provided with grooves, the utility model solves the defects in the prior art, replaces the prior complex connecting and assembling mode, the circuit board can be assembled more quickly and conveniently by people, and the requirements of people are met.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a multilayer circuit board that can dispel the heat fast.
Background
The multilayer printed circuit board is a circuit board with a multilayer combined structure for electric appliance element installation and circuit conduction, is widely applied to electronic processing factories and PCB production factories, and has a good use effect.
The patent of application number CN202021202252.X discloses a multilayer printed wiring board that can dispel the heat fast, including the circuit board main part, the last fixed surface of circuit board main part installs the heat conduction copper billet, the upper surface of heat conduction copper billet is provided with two heat conduction pipelines, the outer fixed surface in upper end of heat conduction pipeline installs heat radiation fins, the lower fixed surface of circuit board main part installs the bottom heat-conducting plate, the inboard of bottom heat-conducting plate is provided with a plurality of heat-conducting plate screws, the printing of one side position that the upper surface of circuit board main part is located the heat conduction copper billet is installed a plurality of printed conductor. A multilayer printed wiring board that can dispel heat fast, can increase heat-conducting efficiency, more efficient dispels the heat with the air contact, has improved the radiating effect, can laminate the parcel in the below to the circuit board, guide-in the heat to the heat conduction copper billet dispels the heat again, more comprehensive dispels the heat to the circuit board, improves thermal conduction area.
The multilayer printed circuit board capable of dissipating heat quickly related to the patent sometimes needs to be assembled to place more components, but the traditional assembly connection mode is complex and complex, and improvement is urgently needed.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a multilayer circuit board capable of quickly radiating.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a multilayer circuit board that can dispel heat fast, includes first circuit board and second circuit board, two cavitys have been seted up respectively to the inside of second circuit board, and have seted up the through-hole on the inner wall of cavity one side, one side of first circuit board fixed mounting has the one end of two horizontal poles respectively, and the other end of horizontal pole runs through the through-hole to extend to in the cavity, the jack has been seted up to the top side of horizontal pole, and two cavitys have seted up same even hole on being close to the inner wall of one side each other, and all set up flutedly on two cavitys keep away from the inner wall of one side each other, slidable mounting has U type pole in the recess, and the one end of U type pole runs through the jack to outside extending to the horizontal pole, even having seted up straight hole on the inner wall that the hole is close to first circuit board one side, and slidable mounting has the rack in the straight hole.
Preferably, the inner walls of the two sides of the groove are provided with sliding grooves, one side of each sliding block is arranged in each sliding groove in a sliding mode, and the other side of each sliding block is fixedly arranged on the U-shaped rod.
Preferably, one end of a spring is fixedly connected to the inner wall of the top side of the sliding groove, and the other end of the spring is fixedly connected to the sliding block.
Preferably, the same thread sleeve is sleeved at one end, close to each other, of each of the two U-shaped rods, and the threads on the two U-shaped rods are oppositely arranged.
Preferably, an elongated slot is formed in the inner wall of one side of the connecting hole, and the elongated slot is matched with the rack.
Preferably, the threaded sleeve is fixedly sleeved with a gear, and the gear is meshed with the rack.
In the utility model, if the first circuit board and the second circuit board are assembled, firstly, the two cross rods are inserted into the cavity through the through holes, at the moment, the first circuit board can extrude the rack to move the rack into the elongated slot, and then the gear drives the threaded sleeve to rotate, then the two U-shaped rods move into the threaded sleeve until the two U-shaped rods are inserted into the through holes, and then the assembly is completed;
the utility model provides a shortcoming among the prior art, replaced loaded down with trivial details complicated connection equipment mode in the past for people can accomplish the equipment to the circuit board fast more conveniently, have satisfied people's demand.
Drawings
Fig. 1 is a schematic front view of a multilayer circuit board capable of dissipating heat rapidly according to the present invention;
fig. 2 is a schematic structural diagram of a part a of a multilayer circuit board capable of dissipating heat rapidly according to the present invention;
fig. 3 is a schematic diagram of a part B of a multilayer circuit board capable of dissipating heat rapidly according to the present invention.
In the figure: the structure comprises a first circuit board 1, a second circuit board 2, a cavity 3, a through hole 4, a cross rod 5, a jack 6, a connecting hole 7, a groove 8, a U-shaped rod 9, a sliding groove 10, a sliding block 11, a spring 12, a thread sleeve 13, a straight hole 14, a long groove 15, a rack 16 and a gear 17.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Example one
Referring to fig. 1-3, a multilayer circuit board capable of dissipating heat rapidly comprises a first circuit board 1 and a second circuit board 2, two cavities 3 are respectively arranged inside the second circuit board 2, a through hole 4 is arranged on the inner wall of one side of the cavity 3, one side of the first circuit board 1 is respectively and fixedly provided with one end of two cross rods 5, the other end of each cross rod 5 penetrates through the through hole 4, and extends into the cavities 3, the top side of the cross bar 5 is provided with a jack 6, the inner walls of the two cavities 3 close to each other are provided with a same connecting hole 7, and the inner walls of the two cavities 3 far away from each other are respectively provided with a groove 8, a U-shaped rod 9 is arranged in the groove 8 in a sliding way, one end of the U-shaped rod 9 penetrates through the jack 6, and extend to the outside of the cross rod 5, a straight hole 14 is arranged on the inner wall of the connecting hole 7 close to one side of the first circuit board 1, and a rack 16 is arranged in the straight hole 14 in a sliding manner.
The utility model discloses in, all seted up spout 10 on the inner wall of recess 8 both sides, and slidable mounting has one side of slider 11 in spout 10, and slider 11's opposite side fixed mounting is on U type pole 9, and spout 10 and slider 11 mutually support to slide for making U type pole 9 better.
The utility model discloses in, fixedly connected with spring 12's one end on the inner wall of spout 10 top side, and spring 12's other end fixed connection is on slider 11, and spring 12 is in order to maintain the initial position of U type pole 9.
The utility model discloses in, same thread bush 13 has been cup jointed to the one end that two U type poles 9 are close to each other, and the screw thread on two U type poles 9 sets up for opposite.
The utility model discloses in, seted up elongated slot 15 on the inner wall of even hole 7 one side, and elongated slot 15 and rack 16 looks adaptation, elongated slot 15 is for not influencing the removal of rack 16.
The utility model discloses in, the fixed gear 17 that has cup jointed on the thread bush 13, and gear 17 meshes with rack 16 mutually, and the removal through rack 16 forces gear 17 to take thread bush 13 to rotate.
Example two
Referring to fig. 1-3, a multilayer circuit board capable of dissipating heat rapidly comprises a first circuit board 1 and a second circuit board 2, two cavities 3 are respectively arranged inside the second circuit board 2, a through hole 4 is arranged on the inner wall of one side of the cavity 3, one side of the first circuit board 1 is respectively and fixedly provided with one end of two cross rods 5, the other end of each cross rod 5 penetrates through the through hole 4, and extends into the cavities 3, the top side of the cross bar 5 is provided with a jack 6, the inner walls of the two cavities 3 close to each other are provided with a same connecting hole 7, and the inner walls of the two cavities 3 far away from each other are respectively provided with a groove 8, a U-shaped rod 9 is arranged in the groove 8 in a sliding way, one end of the U-shaped rod 9 penetrates through the jack 6, and extend to the outside of the cross rod 5, a straight hole 14 is arranged on the inner wall of the connecting hole 7 close to one side of the first circuit board 1, and a rack 16 is arranged in the straight hole 14 in a sliding manner.
The utility model discloses in, all dig on the inner wall of 8 both sides of recess and be equipped with spout 10, and sliding mounting has one side of slider 11 in spout 10, and the opposite side fixed mounting of slider 11 is on U type pole 9.
The utility model discloses in, fixed welding has the one end of spring 12 on the inner wall of spout 10 top sides, and the fixed welding of the other end of spring 12 is on slider 11.
The utility model discloses in, same thread bush 13 has been cup jointed to the one end that two U type poles 9 are close to each other, and the screw thread on two U type poles 9 sets up for opposite.
In the utility model, the inner wall of one side of the connecting hole 7 is provided with the long groove 15, and the long groove 15 is matched with the rack 16.
In the utility model, the threaded sleeve 13 is fixedly sleeved with a gear 17, and the gear 17 is meshed with the rack 16.
The utility model discloses in, if will assemble first circuit board 1 and second circuit board 2, at first insert cavity 3 with two horizontal poles 5 through-hole 4 in, first circuit board 1 will extrude rack 16 and make its immigration elongated slot 15 this moment in, and then gear 17 will take thread bush 13 to rotate, then two U type poles 9 will remove in to thread bush 13, until two U type poles 9 insert in jack 6, just accomplished the equipment this moment.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. A multilayer circuit board capable of dissipating heat quickly comprises a first circuit board (1) and a second circuit board (2) and is characterized in that two cavities (3) are formed in the second circuit board (2) respectively, a through hole (4) is formed in the inner wall of one side of each cavity (3), one end of each transverse rod (5) is fixedly mounted on one side of the first circuit board (1) respectively, the other end of each transverse rod (5) penetrates through the through hole (4) and extends into the corresponding cavity (3), jacks (6) are formed in the top sides of the transverse rods (5), the same connecting hole (7) is formed in the inner wall of one side, close to each other, of the two cavities (3), grooves (8) are formed in the inner walls of the sides, far away from each other, of the two cavities (3), U-shaped rods (9) are slidably mounted in the grooves (8), and one ends of the U-shaped rods (9) penetrate through the jacks (6), and extend to outside horizontal pole (5), link hole (7) and be close to and seted up on the inner wall of first circuit board (1) one side straight hole (14), and slidable mounting has rack (16) in straight hole (14).
2. The multilayer circuit board capable of dissipating heat rapidly according to claim 1, wherein the inner walls of the two sides of the groove (8) are both provided with a sliding groove (10), one side of the sliding block (11) is slidably mounted in the sliding groove (10), and the other side of the sliding block (11) is fixedly mounted on the U-shaped rod (9).
3. The multilayer circuit board capable of dissipating heat rapidly according to claim 2, wherein one end of the spring (12) is fixedly connected to the inner wall of the top side of the sliding groove (10), and the other end of the spring (12) is fixedly connected to the sliding block (11).
4. The multilayer circuit board capable of dissipating heat rapidly according to claim 1, wherein the same thread bushing (13) is sleeved at the end of the two U-shaped rods (9) close to each other, and the threads on the two U-shaped rods (9) are arranged oppositely.
5. The multilayer circuit board capable of dissipating heat rapidly according to claim 1, wherein an elongated slot (15) is formed on an inner wall of one side of the connecting hole (7), and the elongated slot (15) is adapted to the rack (16).
6. The multilayer circuit board capable of dissipating heat rapidly as claimed in claim 4, wherein a gear (17) is fixedly sleeved on the threaded sleeve (13), and the gear (17) is engaged with the rack (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120799524.7U CN214708152U (en) | 2021-04-19 | 2021-04-19 | Multilayer circuit board capable of quickly radiating heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120799524.7U CN214708152U (en) | 2021-04-19 | 2021-04-19 | Multilayer circuit board capable of quickly radiating heat |
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| Publication Number | Publication Date |
|---|---|
| CN214708152U true CN214708152U (en) | 2021-11-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120799524.7U Active CN214708152U (en) | 2021-04-19 | 2021-04-19 | Multilayer circuit board capable of quickly radiating heat |
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| Country | Link |
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| CN (1) | CN214708152U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115003021A (en) * | 2022-06-13 | 2022-09-02 | 鹤山市众一电路有限公司 | Mixed-compression high-frequency double-layer circuit board with heat insulation structure |
-
2021
- 2021-04-19 CN CN202120799524.7U patent/CN214708152U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115003021A (en) * | 2022-06-13 | 2022-09-02 | 鹤山市众一电路有限公司 | Mixed-compression high-frequency double-layer circuit board with heat insulation structure |
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