CN210579472U - Connecting and fixing part of double-layer circuit board - Google Patents
Connecting and fixing part of double-layer circuit board Download PDFInfo
- Publication number
- CN210579472U CN210579472U CN201921746055.1U CN201921746055U CN210579472U CN 210579472 U CN210579472 U CN 210579472U CN 201921746055 U CN201921746055 U CN 201921746055U CN 210579472 U CN210579472 U CN 210579472U
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- Prior art keywords
- circuit board
- double
- support column
- heat dissipation
- screw
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000000741 silica gel Substances 0.000 claims abstract description 19
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 19
- 230000017525 heat dissipation Effects 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 12
- 238000000926 separation method Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 description 6
- 238000005299 abrasion Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a connecting and fixing part of a double-layer circuit board, which comprises a first circuit board, wherein the upper surface of the first circuit board is provided with a support column, the inner sides of the two ends of the support column are in threaded connection with screw blocks, connecting rods are fixed on the screw blocks, the top ends of the connecting rods are provided with limit blocks, a pin column is fixed on one side wall of the support column through the connecting blocks, a second circuit board is arranged on the support column, and the lower surface of the second circuit board is provided with a pin groove; through being provided with the support column, the spiral shell piece, the connecting rod, stopper and round pin post, avoid needing to be connected through screwed pipe and two screw cooperations and fix second circuit board and first circuit board, cause the screw to take place to incline and the risk that screw and screwed pipe separation lead to the screw to lose, through being provided with louvre, sheetmetal and porous silica gel board, avoid double-deck circuit board middle part radiating effect not good, cause the easy thermal fatigue degree increase of double-deck circuit board, influence the life of device.
Description
Technical Field
The utility model belongs to the technical field of double-deck circuit board is connected fixedly, concretely relates to connection mounting of double-deck circuit board.
Background
The circuit board makes the circuit miniize, the intuition, to the batch production of fixed circuit with optimize with electrical apparatus overall arrangement important role, the circuit board can be called printed circuit board or printed circuit board, double-deck circuit board passes through screwed pipe and two screws when connecting more, connects fixedly to two circuit boards, the structure is comparatively simple, easily the installation.
When the existing double-layer circuit board connecting and fixing piece is installed, a screw and a threaded pipe are of a separation structure, the screw is very easy to incline when being installed, the installation effect is poor, meanwhile, the screw is also at a risk of being lost, the using effect is poor, the middle part of the double-layer circuit board is not provided with a good heat dissipation mechanism, the thermal fatigue of the double-layer circuit board is increased easily, the service life of the device is influenced, and therefore the double-layer circuit board connecting and fixing piece is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a connection mounting of double-deck circuit board to propose current connection mounting to double-deck circuit board in solving above-mentioned background art when the installation, screw and screwed pipe are the isolating construction, very easily take place the slope when leading to the mounting screw, cause the installation effect not good, the screw also has the risk of losing simultaneously, the result of use is not good, double-deck circuit board middle part does not have fine heat dissipation mechanism in addition, cause the easy thermal fatigue degree increase of double-deck circuit board, influence the life's of device problem.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a connection mounting of double-deck circuit board, includes first circuit board, first circuit board upper surface is provided with the support column, the inboard threaded connection in support column both ends has the spiral shell piece, be fixed with the connecting rod on the spiral shell piece, the connecting rod top is provided with the stopper, a support column lateral wall is fixed with the round pin post through the connecting block, be provided with the second circuit board on the support column, the round pin groove has been seted up to second circuit board lower surface, the round pin post cooperates through the round pin groove with the second circuit board and is connected, the mounting groove has been seted up to second circuit board lateral wall, the mounting groove is corresponding with the position of stopper, the inboard middle part of second circuit board.
Preferably, the heat dissipation mechanism comprises heat dissipation holes, metal sheets and a porous silica gel plate, the heat dissipation holes are formed in the middle of the inner side of the second circuit board and penetrate through the surfaces of the two sides of the second circuit board, the metal sheets are fixed in the middle of the inner side wall of each heat dissipation hole, the porous silica gel plate is fixed at the upper end of the inner side of each heat dissipation hole, and the porous silica gel plate is circular.
Preferably, the metal sheets are provided with two to twenty, and the plurality of metal sheets are uniformly distributed along the circumferential direction of the heat dissipation holes.
Preferably, the heat dissipation hole is provided with two positions, and the other position is located on the inner side of the first circuit board.
Preferably, the upper surface of the limiting block is provided with a groove, and the groove is in a shape of a straight line.
Preferably, the outer diameter of the limiting block is equal to that of the support columns, and the number of the support columns is four.
Preferably, the two end faces of the support column are fixedly adhered with insulating silica gel pads through glue, and the thickness of each insulating silica gel pad is zero five millimeters.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) through being provided with support column, spiral shell piece, connecting rod, stopper and round pin post, be convenient for be connected second circuit board and first circuit board, avoid need being connected through screwed pipe and two screw cooperations and fix second circuit board and first circuit board, cause the screw to take place to incline and the risk that screw and screwed pipe separation lead to the screw to lose, be convenient for improve the practicality of device, improve the installation effect.
(2) Through being provided with louvre, sheetmetal and porous silica gel board, be convenient for improve the radiating effect at double-deck circuit board middle part, avoid double-deck circuit board middle part radiating effect not good, cause the increase of double-deck circuit board thermal fatigue degree, influence the life of device, be convenient for improve the result of use of device.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic top view of the present invention;
FIG. 3 is a schematic view of the structure of the support pillar of the present invention;
in the figure: 1. a first circuit board; 2. a support pillar; 3. a screw block; 4. a connecting rod; 5. mounting grooves; 6. a second circuit board; 7. a metal sheet; 8. a porous silica gel plate; 9. heat dissipation holes; 10. a limiting block; 11. a groove; 12. an insulating silica gel pad; 13. and (4) a pin.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a connection mounting of double-deck circuit board, including first circuit board 1, 1 upper surface of first circuit board is provided with support column 2, the inboard threaded connection in 2 both ends of support column has spiral shell piece 3, be convenient for adjust the position of stopper 10, be fixed with connecting rod 4 on spiral shell piece 3, 4 tops of connecting rod are provided with stopper 10, be convenient for carry out the clamping to two circuit boards, 2 a lateral wall of support column is fixed with round pin post 13 through the connecting block, be provided with second circuit board 6 on the support column 2, the keyway has been seted up to 6 lower surfaces of second circuit board, round pin post 13 cooperates through the keyway with second circuit board 6 and is connected, be convenient for install support column 2, mounting groove 5 has been seted up to 6 lateral walls of second circuit board, mounting groove 5 is corresponding with stopper 10's position, 6 inboard.
In this embodiment, preferably, the heat dissipation mechanism includes heat dissipation hole 9, sheetmetal 7 and porous silica gel plate 8, and heat dissipation hole 9 has been seted up at the inboard middle part of second circuit board 6, and heat dissipation hole 9 runs through the both sides surface of second circuit board 6, and heat dissipation hole 9 inside wall middle part is fixed with sheetmetal 7, and heat dissipation hole 9 inboard upper end is fixed with porous silica gel plate 8, and porous silica gel plate 8 is circular, the better radiating effect of being convenient for.
In this embodiment, preferably, two to twenty metal sheets 7 are provided, and the plurality of metal sheets 7 are uniformly distributed along the circumferential direction of the heat dissipation hole 9, so as to facilitate a larger heat dissipation area.
In this embodiment, preferably, the heat dissipation hole 9 is provided with two positions, and the other position is located at the inner side of the first circuit board 1, so as to facilitate better heat dissipation.
In this embodiment, preferably, the upper surface of the limiting block 10 is provided with a groove 11, and the groove 11 is in a shape like a Chinese character 'yi', so that the limiting block 10 can be conveniently rotated.
In this embodiment, it is preferable that the outer diameter of the limiting block 10 is equal to the outer diameter of the supporting column 2, and the number of the supporting columns 2 is four, so that a better installation effect is facilitated.
In this embodiment, preferably, the two end surfaces of the supporting pillar 2 are adhered and fixed with the insulating silica gel pad 12 by glue, so as to reduce the abrasion between the second circuit board 6 and the supporting pillar 2, and the thickness of the insulating silica gel pad 12 is zero five millimeters.
The utility model discloses a theory of operation and use flow: when in use, the two ends of the supporting column 2 are connected with the second circuit board 6 and the first circuit board 1 through the pins 13 and the pin grooves in a matching way, then the limiting blocks 10 are respectively rotated to move towards one side close to the supporting column 2, and the supporting column 2 is matched with the limiting blocks 10 to respectively clamp and fix the second circuit board 6 and the first circuit board 1, so as to be convenient for connecting and fixing the same, the operation is simple, the inconvenience that the screws are easily inclined when being placed manually and the risk of losing the screws are reduced, the air inlet effect of the middle parts of the second circuit board 6 and the first circuit board 1 is convenient to improve through the radiating holes 9 in the use process, the contact area with natural wind is convenient to improve through the metal sheets 7, the radiating effect of the middle parts of the second circuit board 6 and the first circuit board 1 is convenient to improve, the poor radiating effect of the middle parts of the double-layer circuit board during the, the service life of the device is prolonged conveniently.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a connection mounting of double-deck circuit board, includes first circuit board (1), its characterized in that: first circuit board (1) upper surface is provided with support column (2), the inboard threaded connection in support column (2) both ends has spiral shell piece (3), be fixed with connecting rod (4) on spiral shell piece (3), connecting rod (4) top is provided with stopper (10), a lateral wall of support column (2) is fixed with round pin post (13) through the connecting block, be provided with second circuit board (6) on support column (2), the keyway has been seted up to second circuit board (6) lower surface, round pin post (13) cooperate through the keyway with second circuit board (6) to be connected, mounting groove (5) have been seted up to second circuit board (6) lateral wall, mounting groove (5) are corresponding with the position of stopper (10), second circuit board (6) inboard middle part is provided with heat dissipation mechanism.
2. The connection fixture of a double-layer circuit board according to claim 1, wherein: the heat dissipation mechanism comprises heat dissipation holes (9), metal sheets (7) and a porous silica gel plate (8), the heat dissipation holes (9) are formed in the middle of the inner side of the second circuit board (6), the heat dissipation holes (9) penetrate through the surfaces of the two sides of the second circuit board (6), the metal sheets (7) are fixed in the middle of the inner side wall of the heat dissipation holes (9), the porous silica gel plate (8) is fixed to the upper end of the inner side of the heat dissipation holes (9), and the porous silica gel plate (8) is circular.
3. The connection fixture of a double-layer circuit board according to claim 2, wherein: the metal sheets (7) are arranged in a number of two to twenty, and the metal sheets (7) are circumferentially and uniformly distributed along the heat dissipation holes (9).
4. The connection fixture of a double-layer circuit board according to claim 2, wherein: the radiating hole (9) is provided with two positions, and the other position is positioned at the inner side of the first circuit board (1).
5. The connection fixture of a double-layer circuit board according to claim 1, wherein: the upper surface of the limiting block (10) is provided with a groove (11), and the groove (11) is in a straight shape.
6. The connection fixture of a double-layer circuit board according to claim 1, wherein: the outer diameter of the limiting block (10) is equal to that of the support column (2), and the number of the support columns (2) is four.
7. The connection fixture of a double-layer circuit board according to claim 1, wherein: the support column (2) both ends face is fixed with insulating silica gel pad (12) through glue gluing, insulating silica gel pad (12) thickness is five millimeters at zero point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921746055.1U CN210579472U (en) | 2019-10-17 | 2019-10-17 | Connecting and fixing part of double-layer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921746055.1U CN210579472U (en) | 2019-10-17 | 2019-10-17 | Connecting and fixing part of double-layer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210579472U true CN210579472U (en) | 2020-05-19 |
Family
ID=70640851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921746055.1U Active CN210579472U (en) | 2019-10-17 | 2019-10-17 | Connecting and fixing part of double-layer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210579472U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115003021A (en) * | 2022-06-13 | 2022-09-02 | 鹤山市众一电路有限公司 | Mixed-compression high-frequency double-layer circuit board with heat insulation structure |
-
2019
- 2019-10-17 CN CN201921746055.1U patent/CN210579472U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115003021A (en) * | 2022-06-13 | 2022-09-02 | 鹤山市众一电路有限公司 | Mixed-compression high-frequency double-layer circuit board with heat insulation structure |
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