CN215420897U - Mixed-compression high-frequency double-layer circuit board with heat insulation structure - Google Patents
Mixed-compression high-frequency double-layer circuit board with heat insulation structure Download PDFInfo
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- CN215420897U CN215420897U CN202121263104.3U CN202121263104U CN215420897U CN 215420897 U CN215420897 U CN 215420897U CN 202121263104 U CN202121263104 U CN 202121263104U CN 215420897 U CN215420897 U CN 215420897U
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- circuit board
- heat insulation
- layer circuit
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Abstract
The utility model discloses a mixed-compression high-frequency double-layer circuit board with a heat insulation structure, which comprises an upper layer circuit board and a lower layer circuit board, wherein an upper heat insulation sleeve is fixedly inserted into the outer surface of the upper layer circuit board, a lower heat insulation sleeve is fixedly inserted into the outer surface of the lower layer circuit board, four connecting cylinders are fixedly installed between the upper heat insulation sleeve and the lower heat insulation sleeve, the four connecting cylinders are symmetrically distributed in pairs in a left-right mode, damping protection devices are fixedly installed at the upper end of the upper heat insulation sleeve and the lower end of the lower heat insulation sleeve, fixing devices are fixedly installed in the middle of the front end and the middle of the rear end of the lower damping protection device, and heat insulation devices are fixedly inserted into the left end and the right end of the upper heat insulation sleeve and the lower heat insulation sleeve. According to the mixed-compression high-frequency double-layer circuit board with the heat insulation structure, the use effect of the double-layer circuit board and the connection stability between the double-layer circuit boards are improved through the heat insulation device, and the service life of the double-layer circuit board is prolonged through the shock absorption protection device.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a mixed-compression high-frequency double-layer circuit board with a heat insulation structure.
Background
The double-layer circuit board has copper on both sides and metallized holes, namely, the copper on both sides, because the area of the double-layer board is doubled compared with that of a single panel, the double-layer circuit board has the advantages of convenient and concise wiring and lower wiring labor intensity, and the double-layer board with shorter circuit length solves the difficulty of wiring staggering in the single panel, and is more suitable for being used on a circuit which is more complicated than the single panel. 1. The existing mixed-compression high-frequency double-layer circuit board is simple in overall structure and does not have a heat insulation structure, and the double-layer circuit board is easily subjected to the condition that heat is conducted on the double-layer circuit board by an external environment when in use, so that the use effect of the double-layer circuit board is influenced, and the connection stability between the circuit boards is also influenced; 2. the existing mixed-compression high-frequency double-layer circuit board does not have a good damping protection device, and the double-layer circuit board is easy to be damaged by external collision to cause internal precision parts, so that the service life of the circuit board is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a mixed-compression high-frequency double-layer circuit board with a heat insulation structure, which can effectively solve the problems in the background technology.
In order to achieve the purpose, the utility model adopts the technical scheme that:
the utility model provides a thoughtlessly press high frequency double-deck circuit board with thermal-insulated structure, includes upper strata circuit board and lower floor's circuit board, upper strata circuit board surface interlude fixed mounting has last radiation shield, lower floor's circuit board surface interlude fixed mounting has lower radiation shield, go up four connection cylinders of fixed mounting between radiation shield and the lower radiation shield, four two liang bilateral symmetry of connection cylinder distribute, go up radiation shield upper end and the equal fixed mounting of lower radiation shield lower extreme have shock attenuation protector, lower part shock attenuation protector front end middle part and the equal fixed mounting in rear end middle part have fixing device, it has heat-proof device with lower radiation shield left end and right-hand member all to alternate fixed mounting to go up the radiation shield.
Preferably, heat-proof device is including fixed cover, fixed cover left end alternates fixed mounting and has the heat insulating board, fixed cover right-hand member is opened there is the fixed mouth of radiation shield, fixed cover upper end front portion and the equal threaded connection in upper end rear portion have a fixed screw, it has the circuit board fixed slot to go up the radiation shield left end and open, fixed cover alternates fixed mounting at the left end of last radiation shield through a screw hole.
Preferably, the shock attenuation protector includes guard plate and spring post, two spread grooves have all been opened to guard plate upper end left part and upper end right part, the spring post is provided with four, four the equal fixed mounting in spring post upper end has the connecting plate, four the spring post all alternates fixed mounting at the guard plate lower extreme through the spread groove, the guard plate is through four spring post fixed mounting on last radiation shield upper portion.
Preferably, fixing device includes the support frame, No. two screw holes, two have all been opened to support frame upper end left part and upper end right part No. two equal threaded connection in screw hole upper end has No. two fixed screws, support frame fixed mounting is in the lower part shock attenuation protector front end middle part.
Preferably, the first fixing screw and the first screw hole are consistent in size and correspond in position to each other.
Preferably, the two damping protection devices are distributed in an up-and-down symmetrical mode by taking the upper layer circuit board and the lower layer circuit board as centers.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the mixed-compression high-frequency double-layer circuit board with the heat insulation structure, the circuit board is fixed through the circuit board fixing grooves in the upper heat insulation sleeve and the lower heat insulation sleeve, and the two ends of the upper heat insulation sleeve and the two ends of the lower heat insulation sleeve are sleeved through the four fixing sleeves in the four heat insulation devices, so that the circuit board is sealed and insulated by the heat insulation plates and the heat insulation sleeves on the fixing sleeves, the double-layer circuit board is prevented from being conducted by the external environment, the use effect of the double-layer circuit board is improved, and the connection stability between the double-layer circuit boards is also improved.
2. According to the mixed-compression high-frequency double-layer circuit board with the heat insulation structure, the protection plate on the shock absorption protection device is used for effectively protecting the double-layer circuit board when the double-layer circuit board is subjected to external collision, and the shock absorption is carried out through the spring column at the lower end, so that the damage of internal precision parts caused by collision of the double-layer circuit board is avoided, and the service life of the circuit board is prolonged.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a mixed-compression high-frequency double-layer circuit board with a heat insulation structure according to the present invention;
FIG. 2 is a schematic diagram of the overall structure of the heat-insulating device of the mixed-compression high-frequency double-layer circuit board with the heat-insulating structure according to the present invention;
FIG. 3 is a schematic view of the overall structure of the shock absorption protection device of the mixed-compression high-frequency double-layer circuit board with the heat insulation structure according to the present invention;
fig. 4 is a schematic overall structure diagram of a fixing device of a mixed-compression high-frequency double-layer circuit board with a heat insulation structure according to the utility model.
In the figure: 1. an upper layer circuit board; 2. a thermal insulation device; 3. a shock absorbing guard; 4. a fixing device; 5. a lower layer circuit board; 6. an upper heat insulation sleeve; 7. a lower heat insulation sleeve; 8. connecting the columns; 9. a first screw hole; 20. fixing a sleeve; 21. a heat insulation plate; 22. a first fixing screw; 23. a heat insulation sleeve fixing opening; 24. a circuit board fixing groove; 30. a protection plate; 31. a spring post; 32. connecting grooves; 33. a connecting plate; 40. a support frame; 41. a second screw hole; 42. and a second fixing screw.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-4, a mixed-compression high-frequency double-layer circuit board with a heat insulation structure comprises an upper layer circuit board 1 and a lower layer circuit board 5, an upper heat insulation sleeve 6 is fixedly installed on the outer surface of the upper layer circuit board 1 in an inserting manner, a lower heat insulation sleeve 7 is fixedly installed on the outer surface of the lower layer circuit board 5 in an inserting manner, four connecting cylinders 8 are fixedly installed between the upper heat insulation sleeve 6 and the lower heat insulation sleeve 7, the four connecting cylinders 8 are bilaterally and symmetrically distributed, a shock absorption protection device 3 is fixedly installed on the upper end of the upper heat insulation sleeve 6 and on the lower end of the lower heat insulation sleeve 7, a fixing device 4 is fixedly installed in the middle of the front end and in the middle of the rear end of the lower shock absorption protection device 3, and a heat insulation device 2 is fixedly installed on the left end and on the right end of the upper heat insulation sleeve 6 and on the lower heat insulation sleeve 7 in an inserting manner.
The heat insulation device 2 comprises a fixing sleeve 20, a heat insulation plate 21 is fixedly installed at the left end of the fixing sleeve 20 in an inserting mode, a heat insulation sleeve fixing opening 23 is formed at the right end of the fixing sleeve 20, a first fixing screw 22 is in threaded connection with the front portion of the upper end and the rear portion of the upper end of the fixing sleeve 20, a circuit board fixing groove 24 is formed at the left end of the upper heat insulation sleeve 6 in an inserting mode, the fixing sleeve 20 is fixedly installed at the left end of the upper heat insulation sleeve 6 in an inserting mode through a first screw hole 9, two circuit boards are fixed through the circuit board fixing grooves 24 in the upper heat insulation sleeve 6 and the lower heat insulation sleeve 7, and the two ends of the upper heat insulation sleeve 6 and the two ends of the lower heat insulation sleeve 7 are sleeved through the four fixing sleeves 20, so that the heat insulation plate 21 and the heat insulation sleeve on the fixing sleeve 20 can seal and insulate heat of the two circuit boards; the shock absorption protection device 3 comprises a protection plate 30 and spring columns 31, two connecting grooves 32 are formed in the left portion of the upper end and the right portion of the upper end of the protection plate 30, four spring columns 31 are arranged, connecting plates 33 are fixedly mounted at the upper ends of the four spring columns 31, the four spring columns 31 are fixedly mounted at the lower end of the protection plate 30 in a penetrating mode through the connecting grooves 32, the protection plate 30 is fixedly mounted at the upper portion of the upper heat insulation sleeve 6 through the four spring columns 31, effective protection is conducted when the double-layer circuit board is subjected to external collision through the protection plate 30, shock absorption is conducted through the spring columns 31 at the lower end, and damage to internal precision parts caused by collision of the double-layer circuit board is avoided; the fixing device 4 comprises a support frame 40, the left part and the right part of the upper end of the support frame 40 are both provided with a second screw hole 41, the upper ends of the two second screw holes 41 are both in threaded connection with a second fixing screw 42, the support frame 40 is fixedly arranged in the middle of the front end of the lower damping protection device 3, and the support frame 40 is fixed by twisting the second fixing screw 42, so that the device is fixed; the first fixing screw 22 and the first screw hole 9 are consistent in size and correspond in position; the two shock absorption protective devices 3 are distributed in an up-and-down symmetrical mode by taking the upper layer circuit board 1 and the lower layer circuit board 5 as centers.
It should be noted that the utility model is a mixed-compression high-frequency double-layer circuit board with a heat insulation structure, firstly, the support frame 40 is fixed by twisting the second fixing screw 42 on the fixing device 4, thereby fixing the device at a required position, then the upper layer circuit board 1 and the lower layer circuit board 5 are sleeved and fixed by the upper heat insulation sleeve 6 on the heat insulation device 2 and the circuit board fixing groove 24 on the lower heat insulation sleeve 7, and then the four fixing sleeves 20 are sleeved and connected with the two ends of the upper heat insulation sleeve 6 and the lower heat insulation sleeve 7, thereby the heat insulation plate 21 on the fixing sleeve 20 and the heat insulation sleeve are used for sealing and insulating the upper layer circuit board 1 and the lower layer circuit board 5, thereby avoiding the heat conduction of the external environment to the double-layer circuit board, not only improving the use effect of the double-layer circuit board, but also improving the connection stability between the double-layer circuit boards, when the double-layer circuit boards are collided, the protection plate 30 on the shock absorption protection device 3 effectively protects the double-layer circuit board when the double-layer circuit board is subjected to external collision, and the shock absorption is carried out through the spring column 31 at the lower end, so that the damage to internal precision parts caused by collision of the double-layer circuit board is avoided, and the service life of the double-layer circuit board is prolonged.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a thoughtlessly press high frequency double-deck circuit board with thermal-insulated structure, includes upper circuit board (1) and lower floor's circuit board (5), its characterized in that: the utility model discloses a thermal insulation structure, including upper circuit board (1), lower floor's circuit board (5), upper strata circuit board (1) surface alternates fixed mounting and has last radiation shield (6), lower floor's circuit board (5) surface alternates fixed mounting and has lower radiation shield (7), go up between radiation shield (6) and lower radiation shield (7) fixed mounting have four connection cylinder (8), four connect cylinder (8) two liang bilateral symmetry and distribute, go up radiation shield (6) upper end and the equal fixed mounting of radiation shield (7) lower extreme has shock attenuation protector (3), lower part shock attenuation protector (3) front end middle part and the equal fixed mounting in rear end middle part have fixing device (4), it has heat-proof device (2) all to alternate fixed mounting with lower radiation shield (7) left end and right-hand member to go up radiation shield (6).
2. The mixed-compression high-frequency double-layer circuit board with the heat insulation structure as claimed in claim 1, wherein: heat-proof device (2) are including fixed cover (20), fixed cover (20) left end alternates fixed mounting and has heat insulating board (21), fixed cover (20) right-hand member is opened has fixed mouthful of heat insulating sleeve (23), fixed cover (20) upper end front portion and the equal threaded connection in upper end rear portion have fixed screw (22) No. one, it has circuit board fixed slot (24) to go up heat insulating sleeve (6) left end division, fixed cover (20) alternate fixed mounting at the left end of last heat insulating sleeve (6) through a screw hole (9).
3. The mixed-compression high-frequency double-layer circuit board with the heat insulation structure as claimed in claim 1, wherein: shock attenuation protector (3) are including guard plate (30) and spring post (31), two spread groove (32) have all been opened to guard plate (30) upper end left part and upper end right part, spring post (31) are provided with four, four there are connecting plate (33), four equal fixed mounting in spring post (31) upper end spring post (31) all alternates fixed mounting at guard plate (30) lower extreme through spread groove (32), guard plate (30) are through four spring post (31) fixed mounting on last radiation shield (6) upper portion.
4. The mixed-compression high-frequency double-layer circuit board with the heat insulation structure as claimed in claim 1, wherein: fixing device (4) are including support frame (40), No. two screw holes (41), two have all been opened to support frame (40) upper end left part and upper end right part No. two equal threaded connection has No. two set screw (42) on screw hole (41), support frame (40) fixed mounting is in the lower part shock attenuation protector (3) front end middle part.
5. The mixed-compression high-frequency double-layer circuit board with the heat insulation structure as claimed in claim 2, wherein: the first fixing screw (22) and the first screw hole (9) are consistent in size and correspond in position.
6. The mixed-compression high-frequency double-layer circuit board with the heat insulation structure as claimed in claim 1, wherein: the two damping protection devices (3) are distributed in an up-down symmetrical mode by taking the upper layer circuit board (1) and the lower layer circuit board (5) as centers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121263104.3U CN215420897U (en) | 2021-06-07 | 2021-06-07 | Mixed-compression high-frequency double-layer circuit board with heat insulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121263104.3U CN215420897U (en) | 2021-06-07 | 2021-06-07 | Mixed-compression high-frequency double-layer circuit board with heat insulation structure |
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| Publication Number | Publication Date |
|---|---|
| CN215420897U true CN215420897U (en) | 2022-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121263104.3U Active CN215420897U (en) | 2021-06-07 | 2021-06-07 | Mixed-compression high-frequency double-layer circuit board with heat insulation structure |
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| CN (1) | CN215420897U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115003021A (en) * | 2022-06-13 | 2022-09-02 | 鹤山市众一电路有限公司 | Mixed-compression high-frequency double-layer circuit board with heat insulation structure |
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2021
- 2021-06-07 CN CN202121263104.3U patent/CN215420897U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115003021A (en) * | 2022-06-13 | 2022-09-02 | 鹤山市众一电路有限公司 | Mixed-compression high-frequency double-layer circuit board with heat insulation structure |
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