CN213126024U - 4G communication module with radiating assembly - Google Patents
4G communication module with radiating assembly Download PDFInfo
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- CN213126024U CN213126024U CN202021385913.7U CN202021385913U CN213126024U CN 213126024 U CN213126024 U CN 213126024U CN 202021385913 U CN202021385913 U CN 202021385913U CN 213126024 U CN213126024 U CN 213126024U
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Abstract
The utility model provides a 4G communication module with radiator unit. 4G communication module with heat dissipation assembly, including: a PCB board; the module is fixedly arranged on the PCB; the two mounting blocks are fixedly mounted on the PCB; the heat conducting plate is arranged above the module; the heat dissipation plates are fixedly arranged at the top of the heat conduction plate; the two fixed connecting mechanisms are respectively arranged on the two mounting blocks; the heat conduction and shock absorption mechanism is arranged on the heat conduction plate. The utility model provides a 4G communication module with radiator unit has easy operation, radiating effect is good, can protect the advantage of dust.
Description
Technical Field
The utility model relates to the technical field of modules, especially, relate to a 4G communication module with radiator unit.
Background
The 4G communication technology is a fourth generation mobile information system, which is a better improvement on the 3G technology, and has a greater advantage compared with the 3G communication technology, and the WLAN technology and the 3G communication technology are well combined, so that the transmission speed of an image is faster, and the quality of the transmitted image and the image are more clear, a plurality of modules are needed to help the 4G communication technology in the application process, and the modules are fixed on a PCB platelet, but the modules are exposed outside, and generally, heat on the modules is taken away by blowing of an external fan, and only a part of heat on the surfaces of the modules can be taken away by blowing of the fan, and no component capable of helping heat dissipation is arranged on the modules, so that a good heat dissipation effect cannot be achieved.
Therefore, it is necessary to provide a 4G communication module with a heat dissipation assembly to solve the above technical problems.
SUMMERY OF THE UTILITY MODEL
The utility model provides a technical problem provide an easy operation, radiating effect are good, can protect the 4G communication module with radiator unit of dust.
In order to solve the technical problem, the utility model provides a 4G communication module with radiator unit, include: a PCB board; the module is fixedly arranged on the PCB; the two mounting blocks are fixedly mounted on the PCB; the heat conducting plate is arranged above the module; the heat dissipation plates are fixedly arranged at the top of the heat conduction plate; the two fixed connecting mechanisms are respectively arranged on the two mounting blocks; the heat conduction and shock absorption mechanism is arranged on the heat conduction plate.
Preferably, the fixed connection mechanism includes: connecting plate, connecting rod, first recess, connecting block, first cavity, spacing groove and spacing stick, the connecting plate sets up the top of installation piece, connecting rod fixed mounting be in on one side outer wall of connecting plate, just the other end of connecting rod with one side outer wall fixed connection of heat-conducting plate, first recess is seted up the top of installation piece, the connecting block sets up in the first recess, just the top of connecting block with the bottom fixed connection of connecting plate, first cavity is seted up in the installation piece, the spacing groove is seted up on one side inner wall of first cavity is kept away from to first recess, spacing stick sets up in the first cavity, just the one end of spacing stick extends to outside the installation piece, the other end of spacing stick extends to the spacing inslot.
Preferably, the heat-conducting and shock-absorbing mechanism comprises a second cavity, heat-conducting silica gel, a plurality of heat-conducting fins, a plurality of third cavities, a plurality of heat-conducting rods and a plurality of sliding plates, the second cavity is arranged in the heat conducting plate, the heat conducting silica gel is arranged in the second cavity, a plurality of heat conducting fins are arranged on the top of the module and are contacted with the top of the module, a plurality of third cavities are arranged in the heat conducting plate, the third cavities are all positioned above the second cavities, the heat conducting bars are respectively and fixedly arranged at the tops of the heat conducting fins, and a plurality of top ends of the heat conducting rods extend into the plurality of third cavities respectively, the joints of the heat conducting rods and the heat conducting plates are hermetically connected, a plurality of sliding plates are slidably mounted in the plurality of third cavities respectively, and the bottoms of the sliding plates are fixedly connected with the top ends of the heat conducting rods respectively.
Preferably, the last cover of spacing stick is equipped with the spacing ring, the spacing ring is located in the first cavity, the last cover of spacing stick is equipped with first spring, the one end of first spring with one side outer wall fixed connection of spacing ring, the other end of first spring with one side inner wall fixed connection of first cavity.
Preferably, the inner walls of the two sides of the third cavity are both provided with sliding grooves, the outer walls of the two sides of the sliding plate are both fixedly provided with sliding blocks, and the sliding grooves are in sliding connection with the sliding blocks.
Preferably, a second spring is fixedly mounted at the top of the sliding plate, and the top end of the second spring is fixedly connected with the inner wall of the top of the third cavity.
Compared with the prior art, the utility model provides a 4G communication module with radiator unit has following beneficial effect:
during the use, then put into first recess with the connecting block, spacing stick through connection piece and extend to the spacing inslot under the effect of first spring and spacing ring, just so can fix the connecting plate on the installation piece, the connecting plate passes through the connecting rod and fixes the heat-conducting plate, can be with heat transfer to the heat-conducting plate on the module under the effect through a plurality of conducting strips and a plurality of conducting bars, the rethread heat-conducting plate transmits to the heating panel on, can be with better dispelling the heat, and under the effect of heat conduction silica gel, the heat on the module is absorbed to the help heat-conducting plate that can be better, at the third cavity, under the effect of sliding plate and second spring, give a cushioning effect of heat conduction stick, can prevent that the conducting strip from causing the harm to the module.
Drawings
Fig. 1 is a schematic structural diagram of a 4G communication module according to a first embodiment of the present invention;
FIG. 2 is an enlarged schematic view of portion A shown in FIG. 1;
FIG. 3 is an enlarged schematic view of portion B shown in FIG. 1;
fig. 4 is a structural side view of a first embodiment of a 4G communication module with a heat dissipation assembly provided by the present invention;
fig. 5 is a schematic diagram of a second embodiment of a 4G communication module with a heat dissipation assembly according to the present invention;
fig. 6 is a schematic perspective view of the dust cap shown in fig. 5.
Reference numbers in the figures: 1. a PCB board; 2. a module; 3. mounting blocks; 4. a heat conducting plate; 5. a heat dissipation plate; 6. a connecting plate; 7. a connecting rod; 8. a first groove; 9. connecting blocks; 10. a first cavity; 11. a limiting groove; 12. a limiting rod; 13. a second cavity; 14. heat conducting silica gel; 15. a heat conductive sheet; 16. a third cavity; 17. a heat conducting rod; 18. a sliding plate; 19. a dust cover; 20. a fixed block; 21. rectangular ventilation groove.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and embodiments.
First embodiment
Referring to fig. 1 to 4, in a first embodiment of the present invention, a 4G communication module with a heat dissipation assembly includes: a PCB board 1; the module 2 is fixedly arranged on the PCB 1; the two mounting blocks 3 are fixedly mounted on the PCB 1; a heat-conducting plate 4, said heat-conducting plate 4 being disposed above said module 2; the heat dissipation plates 5 are all fixedly arranged at the top of the heat conduction plate 4; the two fixed connecting mechanisms are respectively arranged on the two mounting blocks 3; and the heat conduction and shock absorption mechanism is arranged on the heat conduction plate 4.
The fixed connection mechanism includes: the heat conducting plate comprises a connecting plate 6, a connecting rod 7, a first groove 8, a connecting block 9, a first cavity 10, a limiting groove 11 and a limiting rod 12, wherein the connecting plate 6 is arranged at the top of the mounting block 3, the connecting rod 7 is fixedly arranged on the outer wall of one side of the connecting plate 6, the other end of the connecting rod 7 is fixedly connected with the outer wall of one side of the heat conducting plate 4, the first groove 8 is formed in the top of the mounting block 3, the connecting block 9 is arranged in the first groove 8, the top of the connecting block 9 is fixedly connected with the bottom of the connecting plate 6, the first cavity 10 is formed in the mounting block 3, the limiting groove 11 is formed in the inner wall of one side, far away from the first cavity 10, of the first groove 8, the limiting rod 12 is arranged in the first cavity 10, and one end of the limiting rod 12 extends out of the mounting block 3, the other end of the limiting rod 12 extends into the limiting groove 11.
The heat-conducting and shock-absorbing mechanism comprises a second cavity 13, heat-conducting silica gel 14, a plurality of heat-conducting fins 15, a plurality of third cavities 16, a plurality of heat-conducting rods 17 and a plurality of sliding plates 18, wherein the second cavity 13 is arranged in the heat-conducting plate 4, the heat-conducting silica gel 14 is arranged in the second cavity 13, the heat-conducting fins 15 are all arranged at the top of the module 2 and are in contact with the top of the module 2, the third cavities 16 are all arranged in the heat-conducting plate 4, the third cavities 16 are all positioned above the second cavity 13, the heat-conducting rods 17 are respectively and fixedly arranged at the tops of the heat-conducting fins 15, the top ends of the heat-conducting rods 17 respectively extend into the third cavities 16, the joints of the heat-conducting rods 17 and the heat-conducting plate 4 are respectively in sealing connection, the sliding plates 18 are respectively and slidably arranged in the third cavities 16, and the bottoms of the sliding plates 18 are respectively fixedly connected with the top ends of the heat conducting rods 17.
The cover is equipped with the spacing ring on the gag lever post 12, the spacing ring is located in first cavity 10, the cover is equipped with first spring on the gag lever post 12, the one end of first spring with one side outer wall fixed connection of spacing ring, the other end of first spring with one side inner wall fixed connection of first cavity 10.
The inner walls of the two sides of the third cavity 16 are both provided with sliding grooves, the outer walls of the two sides of the sliding plate 18 are both fixedly provided with sliding blocks, and the sliding grooves are in sliding connection with the sliding blocks.
A second spring is fixedly mounted on the top of the sliding plate 18, and the top end of the second spring is fixedly connected with the inner wall of the top of the third cavity 16.
The utility model provides a 4G communication module with radiator unit's theory of operation as follows:
when the heat conducting plate is used, the limiting rod 12 is pulled to separate the limiting rod 12 from the first groove 8, then the connecting block 9 at the bottom of the connecting plate 6 is placed into the first groove 8 at the top of the mounting block 3, the limiting rod 12 is loosened, the limiting rod 12 penetrates through the connecting block 9 and extends into the limiting groove 11 under the action of the first spring and the limiting ring, so that the connecting plate 6 can be fixed on the mounting block 3, the connecting plate 6 fixes the heat conducting plate 4 through the connecting rod 7, the heat conducting plates 15 are contacted with the top of the module 2, the heat conducting rods 17 are fixedly arranged at the tops of the heat conducting plates 15, the heat conducting rods 17 are connected with the heat conducting plate 4, heat on the module 2 can be transferred to the heat conducting plate 4 through the heat conducting plates 15 and the heat conducting rods 17 and then transferred to the heat radiating plate 5 through the heat conducting plate 4, better heat radiation can be realized, and the heat conducting plate 4 is provided with the heat conducting silica gel 14, the heat conduction silica gel 14 contacts with the outer wall of a plurality of heat conduction rods 17 respectively, and under the effect of heat conduction silica gel 14, the heat on the absorption module 2 that can be better, under the effect of third cavity 16, sliding plate 18 and second spring, can give a cushioning effect to heat conduction rod 17, can prevent that conducting strip 15 from causing the harm to module 2.
Compared with the prior art, the utility model provides a 4G communication module with radiator unit has following beneficial effect:
during the use, then put into first recess 8 with connecting block 9, spacing stick 12 runs through connecting block 9 and extends to spacing inslot 11 under the effect of first spring and spacing ring, just so can fix connecting plate 6 on installation piece 3, connecting plate 6 fixes heat-conducting plate 4 through connecting rod 7, can be with heat transfer to heat-conducting plate 4 on the module 2 under the effect through a plurality of conducting strips 15 and a plurality of conducting rod 17, on heat-conducting plate 4 is passed through to heat-conducting plate 4, can be with better heat dissipation, and under the effect of heat conduction silica gel 14, help heat-conducting plate 4 that can be better absorbs the heat on the module 2, under the effect of third cavity 16, sliding plate 18 and second spring, give the cushioning effect of conducting rod 17, can prevent that conducting strip 15 from causing the harm to module 2.
Second embodiment:
based on the 4G communication module with a heat dissipation assembly provided in the first embodiment of the present application, a second embodiment of the present application proposes another 4G communication module with a heat dissipation assembly. The second embodiment is merely a preferred way of the first embodiment, and the implementation of the second embodiment does not affect the implementation of the first embodiment alone.
The second embodiment of the present invention will be further explained with reference to the drawings and the embodiments.
Referring to fig. 5-6, the 4G communication module with a heat dissipation assembly further includes a dust cover 19, the dust cover 19 is disposed above the plurality of heat dissipation plates 5, fixing blocks 20 are fixedly mounted on outer walls of two sides of the dust cover 19, and the two fixing blocks 20 are respectively fixedly mounted on tops of the two connection plates 6.
The top of the fixed block 20 is provided with a first threaded hole, a bolt is arranged in the first threaded hole, the top of the connecting plate 6 is provided with a second threaded hole, the bottom end of the bolt extends into the second threaded hole and is in threaded connection with the second threaded hole, and the outer wall of the dustproof cover 19 is provided with a plurality of rectangular ventilation grooves 21.
Set up the top to a plurality of heating panels 5 with shield 19 during the use, then use two bolts to fix the fixed block 20 of shield 19 both sides to the top of two connecting plates 6, alright like this with fix shield 19, prevent that the dust from falling on a plurality of heating panels 5, and the heat that a plurality of heating panels 5 gived off can give off outside shield 19 through the ventilative groove 21 of rectangle on the shield 19 outer wall.
The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and the same principle is included in the protection scope of the present invention.
Claims (8)
1. A4G communication module with a heat dissipation assembly, comprising:
a PCB board;
the module is fixedly arranged on the PCB;
the two mounting blocks are fixedly mounted on the PCB;
the heat conducting plate is arranged above the module;
the heat dissipation plates are fixedly arranged at the top of the heat conduction plate;
the two fixed connecting mechanisms are respectively arranged on the two mounting blocks;
the heat conduction and shock absorption mechanism is arranged on the heat conduction plate.
2. The 4G telecommunications module with a heat sink assembly of claim 1, wherein the fixed connection mechanism comprises: connecting plate, connecting rod, first recess, connecting block, first cavity, spacing groove and spacing stick, the connecting plate sets up the top of installation piece, connecting rod fixed mounting be in on one side outer wall of connecting plate, just the other end of connecting rod with one side outer wall fixed connection of heat-conducting plate, first recess is seted up the top of installation piece, the connecting block sets up in the first recess, just the top of connecting block with the bottom fixed connection of connecting plate, first cavity is seted up in the installation piece, the spacing groove is seted up on one side inner wall of first cavity is kept away from to first recess, spacing stick sets up in the first cavity, just the one end of spacing stick extends to outside the installation piece, the other end of spacing stick extends to the spacing inslot.
3. The 4G communication module with the heat dissipation assembly as recited in claim 1, wherein the heat-conducting and shock-absorbing mechanism comprises a second cavity, a heat-conducting silica gel, a plurality of heat-conducting fins, a plurality of third cavities, a plurality of heat-conducting rods and a plurality of sliding plates, the second cavity is disposed in the heat-conducting plate, the heat-conducting silica gel is disposed in the second cavity, the plurality of heat-conducting fins are disposed on the top of the module and contact with the top of the module, the plurality of third cavities are disposed in the heat-conducting plate, the plurality of third cavities are disposed above the second cavity, the plurality of heat-conducting rods are respectively and fixedly mounted on the top of the plurality of heat-conducting fins, the top ends of the plurality of heat-conducting rods respectively extend into the plurality of third cavities, and the joints of the plurality of heat-conducting rods and the heat-conducting plate are all connected in a sealing manner, the sliding plates are respectively and slidably mounted in the third cavities, and the bottoms of the sliding plates are respectively and fixedly connected with the top ends of the heat conducting rods.
4. The 4G communication module with the heat dissipation assembly according to claim 2, wherein a limiting ring is sleeved on the limiting rod, the limiting ring is located in the first cavity, a first spring is sleeved on the limiting rod, one end of the first spring is fixedly connected with an outer wall of one side of the limiting ring, and the other end of the first spring is fixedly connected with an inner wall of one side of the first cavity.
5. The 4G communication module with the heat dissipation assembly as claimed in claim 3, wherein sliding grooves are formed in the inner walls of the two sides of the third cavity, sliding blocks are fixedly mounted on the outer walls of the two sides of the sliding plate, and the sliding grooves are slidably connected with the sliding blocks.
6. The 4G communication module with the heat dissipation assembly as claimed in claim 3, wherein a second spring is fixedly mounted on the top of the sliding plate, and the top end of the second spring is fixedly connected with the inner wall of the top of the third chamber.
7. The 4G communication module with the heat dissipation assembly as claimed in claim 2, wherein a dust cover is disposed above the plurality of heat dissipation plates, fixed blocks are fixedly mounted on outer walls of two sides of the dust cover, and the two fixed blocks are respectively and fixedly mounted on tops of the two connection plates.
8. The 4G communication module with the heat dissipation assembly according to claim 7, wherein a first threaded hole is formed in the top of the fixing block, a bolt is arranged in the first threaded hole, a second threaded hole is formed in the top of the connecting plate, the bottom end of the bolt extends into the second threaded hole and is in threaded connection with the second threaded hole, and a plurality of rectangular ventilation grooves are formed in the outer wall of the dustproof cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021385913.7U CN213126024U (en) | 2020-07-15 | 2020-07-15 | 4G communication module with radiating assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021385913.7U CN213126024U (en) | 2020-07-15 | 2020-07-15 | 4G communication module with radiating assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213126024U true CN213126024U (en) | 2021-05-04 |
Family
ID=75678722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021385913.7U Expired - Fee Related CN213126024U (en) | 2020-07-15 | 2020-07-15 | 4G communication module with radiating assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213126024U (en) |
-
2020
- 2020-07-15 CN CN202021385913.7U patent/CN213126024U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210504 Termination date: 20210715 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |