CN215181838U

CN215181838U - Embedded passive heat conduction case of computer

Info

Publication number: CN215181838U
Application number: CN202121797412.4U
Authority: CN
Inventors: 贾名准
Original assignee: Zhonghong Yimai Beijing Technology Co ltd
Current assignee: Zhonghong Yimai Beijing Technology Co ltd
Priority date: 2021-08-03
Filing date: 2021-08-03
Publication date: 2021-12-14
Anticipated expiration: 2031-08-03

Abstract

The utility model belongs to the field of computer fittings, in particular to an embedded computer passive heat conduction case, which comprises a first case body, a second case body without a bottom wall is fixed on the outer top wall of the first case body, cooling liquid is arranged in the first case body, fixed blocks are fixed on both sides of the outer top wall of the first case body positioned at the inner side of the second case body, heat conduction silica gel blocks are fixed on the top ends of the two fixed blocks, a plurality of fixed holes are equidistantly arranged along the length direction in the middle section of the top wall of the first case body positioned between the two fixed blocks, a vertical heat conduction plate is fixed in the fixed holes, the middle section of the heat conduction plate is positioned in the first case body, the bottom end of the heat conduction plate extends to the lower side of the first case body, a plurality of heat conduction grooves are equidistantly arranged along the length direction on the bottom wall of the heat conduction silica gel block, the utility model has novel design and strong heat dissipation performance, and can prevent the embedded computer assembly from being damaged due to overhigh temperature, the service life of the embedded computer is prolonged, and the embedded computer is worthy of popularization.

Description

Embedded passive heat conduction case of computer

Technical Field

The utility model relates to a computer fittings technical field especially relates to an embedded passive heat conduction machine case of computer.

Background

The embedded computer has high integration level, and is formed by integrating a mainboard, a CPU, an internal memory, a hard disk and other embedded computer components on a single-board computer. The embedded computer component is installed inside the embedded computer case.

However, the existing embedded computer case has poor heat dissipation performance, which causes that the embedded computer components inside the embedded computer case are easily damaged due to too high temperature, and the service life of the embedded computer is affected.

SUMMERY OF THE UTILITY MODEL

The utility model provides a pair of embedded computer passive heat conduction machine case, the heat dispersion of having solved current embedded computer machine case is relatively poor, leads to embedded computer components of embedded computer machine incasement portion to damage because of too high temperature easily, influences embedded computer's life's problem.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a passive heat conduction case of an embedded computer comprises a first case body, a second case body without a bottom wall is fixed on the outer top wall of the first case body, cooling liquid is arranged in the first case body, fixing blocks are fixed on two sides of the outer top wall of the first case body positioned on the inner side of the second case body, heat conduction silica gel blocks are fixed at the top ends of the two fixing blocks, a plurality of fixing holes are formed in the middle section of the top wall of the first case body positioned between the two fixing blocks at equal intervals along the length direction, a vertical heat conduction plate is fixed in the fixing holes, the middle section of the heat conduction plate is positioned in the first case body, the bottom end of the heat conduction plate extends to the lower side of the first case body, a plurality of heat conduction grooves are formed in the bottom wall of the heat conduction silica gel block at equal intervals along the length direction, the top end of the heat conduction plate extends to the inner parts of the heat conduction grooves, both sides of the top wall of the second case body are provided with heat conduction grooves, all seted up the mounting hole on the both sides lateral wall at the top of first box, be fixed with the horizontally cooling tube in the mounting hole, the horizontally biax motor is installed to the interlude of the interior roof of second box, the equal fixed connection in both sides output of biax motor has the horizontally transfer line, two the one end that the transfer line was kept away from each other extends to two respectively the inside of cooling tube, two the one end that the transfer line was kept away from each other all is fixed with the fan leaf.

Preferably, supporting legs are fixed to four corners of the outer bottom wall of the first box body, and the bottom end of the heat conduction plate is higher than the bottom ends of the supporting legs.

Preferably, a liquid feeding hole is formed in the side wall of the first box body, a hole sealing plug is connected to the liquid feeding hole in a threaded mode, and an operation block is fixed to the side end of the hole sealing plug.

Preferably, a first dustproof net is fixed at one end, away from each other, of each of the two radiating pipes, and a second dustproof net is fixed on the inner wall of each radiating hole.

Preferably, a plurality of sealed holes have been seted up along length direction equidistance on the diapire of first box, the heat-conducting plate bonds in the inside in sealed hole through sealed glue.

Preferably, the second box is fixed on the outer top wall of the first box through screws.

The utility model has the advantages that:

through the cooperation of the first box body, the support legs, the heat conducting plate, the second box body, the heat radiating pipes, the cooling liquid, the heat conducting silica gel blocks, the double-shaft motor, the transmission rods, the heat radiating holes and the fan blades, the heat radiating performance of the embedded computer case can be effectively improved, the embedded computer assembly in the embedded computer case can be effectively prevented from being damaged due to overhigh temperature, and the service life of the embedded computer is favorably prolonged.

The utility model relates to a novelty, heat dispersion is stronger, can prevent that embedded computer subassembly from damaging because of too high temperature, is favorable to promoting embedded computer's life, is worth promoting.

Drawings

Fig. 1 is a schematic structural diagram of a passive heat-conducting chassis of an embedded computer according to the present invention;

fig. 2 is a cross-sectional view of a passive heat-conducting case of an embedded computer according to the present invention;

fig. 3 is a partially enlarged view of a portion a in fig. 2.

Reference numbers in the figures: 1. a first case; 2. a support leg; 3. a heat conducting plate; 4. a second case; 5. a radiating pipe; 6. cooling liquid; 7. a fixed block; 8. a thermally conductive silicone block; 9. a dual-axis motor; 10. a transmission rod; 11. heat dissipation holes; 12. a fan blade.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-3, a passive heat conduction chassis of an embedded computer comprises a first box body 1, a second box body 4 without a bottom wall is fixed on the outer top wall of the first box body 1, a cooling liquid 6 is arranged in the first box body 1, fixing blocks 7 are fixed on both sides of the outer top wall of the first box body 1 positioned at the inner side of the second box body 4, heat conduction silica gel blocks 8 are fixed on the top ends of the two fixing blocks 7, a plurality of fixing holes are equidistantly arranged along the length direction in the middle section of the top wall of the first box body 1 positioned between the two fixing blocks 7, a vertical heat conduction plate 3 is fixed in the fixing holes, the middle section of the heat conduction plate 3 is positioned in the first box body 1, the bottom end of the heat conduction plate 3 extends to the lower side of the first box body 1, a plurality of heat conduction grooves are equidistantly arranged along the length direction on the bottom wall of the heat conduction silica gel block 8, the top end of the heat conduction plate 3 extends to the inside of the heat conduction grooves, size and heat-conducting plate 3's size looks adaptation of heat-conducting groove, louvre 11 has all been seted up to the both sides of the roof of second box 4, the mounting hole has all been seted up on the both sides lateral wall at the top of first box 1, be fixed with horizontally cooling tube 5 in the mounting hole, horizontally biax motor 9 is installed to the interlude of the interior roof of second box 4, the equal fixedly connected with horizontally transfer line 10 of the both sides output of biax motor 9, the one end that two transfer lines 10 kept away from each other extends to the inside of two cooling tubes 5 respectively, the one end that two transfer lines 10 kept away from each other all is fixed with fan leaf 12.

The four corners of the outer bottom wall of the first box body 1 are all fixed with support legs 2, and the bottom end of the heat conduction plate 3 is higher than the bottom ends of the support legs 2.

The liquid feeding hole has been seted up on the lateral wall of first box 1, and threaded connection has a hole sealing stopper in the liquid feeding hole, and the side of hole sealing stopper is fixed with the operation piece, drives the hole sealing stopper through rotating the operation piece and rotates for after the hole sealing stopper breaks away from the liquid feeding hole, can be through liquid feeding hole to the inside addition coolant liquid 6 of first box 1.

One end of each radiating pipe 5, which is far away from each other, is fixed with a first dustproof net, and the inner wall of each radiating hole 11 is fixed with a second dustproof net, so that dust can be prevented from entering the inside of the second box body 4.

A plurality of sealed holes have been seted up along length direction equidistance on the diapire of first box 1, and heat-conducting plate 3 bonds in the inside in sealed hole through sealed glue.

The second box 4 is fixed on the outer top wall of the first box 1 through screws, so that the second box 4 is convenient to disassemble and assemble.

The working principle is as follows: when an embedded computer component needs to be installed, firstly, the screws for fixing the second box body 4 are taken down, the second box body 4 can be separated from the first box body 1, then the embedded computer component is fixed on the inner side wall of the second box body 4 through the screws, then the second box body 4 is fixed on the outer top wall of the first box body 1 through the screws, at the moment, the top end of the heat-conducting silica gel block 8 is contacted with the embedded computer component, when the temperature in the second box body 4 is higher, the heat in the second box body 4 can be dissipated through the heat dissipation holes 11, the two transmission rods 10 can be driven to rotate through the operation of the double-shaft motor 9, the two fan blades 12 can be driven to rotate, the air is exhausted towards the direction far away from each other when the two fan blades 12 rotate, the heat in the second box body 4 can be rapidly exhausted through the two radiating pipes 5, and the heat on the embedded computer component can be absorbed through the heat-conducting silica gel block 8, can heat up after heat conduction silica gel piece 8 absorbs the heat on the embedded computer subassembly, can absorb the heat on the heat conduction silica gel piece 8 through heat-conducting plate 3, heat-conducting plate 3 can heat up after absorbing the heat on the heat conduction silica gel piece 8, heat on the heat-conducting plate 3 can be effused through the bottom of heat-conducting plate 3, can absorb the heat on the heat-conducting plate 3 through coolant liquid 6, thereby make heat-conducting plate 3 maintain the low temperature state, can continuously absorb the heat on the heat conduction silica gel piece 8 through heat-conducting plate 3, can make embedded computer subassembly cool down fast, thereby the effectual heat dispersion who promotes embedded computer machine case, can effectually prevent that the embedded computer subassembly of embedded computer machine incasement portion from damaging because of too high temperature.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The passive heat conduction case of the embedded computer comprises a first case body (1) and is characterized in that a second case body (4) without a bottom wall is fixed on the outer top wall of the first case body (1), cooling liquid (6) is arranged in the first case body (1), fixing blocks (7) are fixed on two sides of the outer top wall of the first case body (1) and located on the inner side of the second case body (4), heat conduction silica gel blocks (8) are fixed on the top ends of the two fixing blocks (7), a plurality of fixing holes are formed in the middle section of the top wall of the first case body (1) between the two fixing blocks (7) along the length direction at equal intervals, a vertical heat conduction plate (3) is fixed in the fixing holes, the middle section of the heat conduction plate (3) is located in the first case body (1), and the bottom end of the heat conduction plate (3) extends to the lower side of the first case body (1), a plurality of heat conduction grooves are formed in the bottom wall of the heat conduction silica gel block (8) along the length direction at equal intervals, the top end of the heat conduction plate (3) extends to the inside of the heat conduction grooves, heat dissipation holes (11) are formed in the two sides of the top wall of the second box body (4), mounting holes are formed in the side walls of the two sides of the top of the first box body (1), horizontal heat dissipation pipes (5) are fixed in the mounting holes, a horizontal double-shaft motor (9) is installed in the middle section of the inner top wall of the second box body (4), the output ends of the two sides of the double-shaft motor (9) are fixedly connected with horizontal transmission rods (10) and two of the transmission rods (10) are respectively extended to two of the inside of the heat dissipation pipes (5) and two of the transmission rods (10) are fixedly connected with fan blades (12) at the ends far away from each other.

2. The embedded computer passive heat-conducting case of claim 1, characterized in that the four corners of the outer bottom wall of the first case (1) are fixed with support legs (2), and the bottom end of the heat-conducting plate (3) is higher than the bottom ends of the support legs (2).

3. The embedded computer passive heat-conducting case according to claim 1, wherein a liquid feeding hole is formed in the side wall of the first case (1), a hole sealing plug is connected to the liquid feeding hole in a threaded manner, and an operation block is fixed to the side end of the hole sealing plug.

4. The embedded computer passive heat conduction case of claim 1, wherein a first dust screen is fixed at the end of each of the two heat dissipation pipes (5) away from each other, and a second dust screen is fixed on the inner wall of the heat dissipation hole (11).

5. The embedded computer passive heat-conducting case according to claim 1, wherein a plurality of sealing holes are formed in the bottom wall of the first case (1) at equal intervals along the length direction, and the heat-conducting plate (3) is bonded inside the sealing holes by sealant.

6. The embedded computer passive heat-conducting case of claim 1, characterized in that the second case (4) is fixed on the outer top wall of the first case (1) by screws.