CN210515219U

CN210515219U - Heat radiation structure for power chip

Info

Publication number: CN210515219U
Application number: CN201922203483.6U
Authority: CN
Inventors: 邹芹; 谈晓东; 谈心语
Original assignee: Shenzhen Elanpo Electronic Technology Co ltd
Current assignee: Shenzhen Elanpo Electronic Technology Co ltd
Priority date: 2019-12-11
Filing date: 2019-12-11
Publication date: 2020-05-12
Anticipated expiration: 2029-12-11

Abstract

The utility model belongs to the technical field of heat dissipation structure, and discloses a heat dissipation structure for power supply chip, which comprises a bottom plate and a fastener, wherein the upper surface wall of the bottom plate is symmetrically fixed with a second fixing plate, the outer surface wall of the second fixing plate is provided with a chip mounting groove, the inner two side walls of the chip mounting groove are symmetrically provided with clamping grooves, the top end of the second fixing plate is fixed with a first fixing plate, the outer surface wall of the first fixing plate is equidistantly provided with radiating fin mounting grooves, the inner bottom end of the radiating fin mounting groove is provided with a slot, the inside of the slot is inserted with a radiating insert matched with the slot, the utility model can realize the free disassembly of the radiating fin through the matching of the radiating fin mounting groove, the slot and the radiating insert, can be quickly disassembled for deashing or replacing after the radiating fin is used for a period of time, the deashing is, the subsequent heat dissipation effect is effectively improved, and the burning-out of the power supply chip is avoided.

Description

Heat radiation structure for power chip

Technical Field

The utility model belongs to the technical field of heat radiation structure, concretely relates to heat radiation structure for power chip.

Background

As is well known, a power panel is one of the main components of a computer circuit board, a power chip is the core component of the power panel, and the power chip has a larger heat productivity, so that the power chip is provided with a heat dissipation structure, and the service life of the power chip can be prolonged by heat dissipation through the heat dissipation structure.

But present current power is heat radiation structure for chip has certain defect, and traditional heat radiation structure's fin can not be dismantled, uses the fin to glue the dust for a period and is difficult to the clearance thoroughly, influences the radiating effect, and in addition, traditional power chip's heat dissipation is mostly the single face heat dissipation, and the radiating effect is poor, and is inefficient, is difficult to satisfy the heat dissipation demand of high calorific capacity power chip.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat radiation structure for power chip to the fin that proposes traditional heat radiation structure in solving above-mentioned background art can not dismantle, and the fin is stained with the dust and is difficult to clear up thorough problem, and in addition, traditional power chip's heat dissipation is mostly the single face heat dissipation, and the radiating effect is poor, the problem of inefficiency.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a heat radiation structure for power chip, includes bottom plate and fastener, the last wall symmetry of going up of bottom plate is fixed with the second fixed plate, the chip mounting groove has been seted up to the exterior wall of second fixed plate, the draw-in groove has been seted up to the inside both sides wall symmetry of chip mounting groove, the top of second fixed plate is fixed with first fixed plate, the fin mounting groove has been seted up to the equidistant of the exterior wall of first fixed plate, the slot has been seted up to the inside bottom of fin mounting groove, the inside of slot is inserted and is equipped with the heat dissipation inserted block rather than the looks adaptation, the internal connection that just is located the fin mounting groove in heat dissipation inserted block top has radiating.

Preferably, the lower surface wall of the bottom plate is provided with a serpentine cooling pipe through a fastener, the serpentine cooling pipe is filled with cooling liquid, two ends of the serpentine cooling pipe are fixed with sealing blocks, and the middle position of the lower surface wall of the bottom plate is provided with a through groove.

Preferably, baffles are symmetrically fixed at the edge of the lower surface wall of the bottom plate, and the baffles are square.

Preferably, the side wall of the baffle is symmetrically connected with mounting blocks, and mounting holes are formed in the outer wall of each mounting block.

Preferably, a heat-conducting silica gel layer is bonded to the lower surface wall of the heat-dissipating insert, and the lower surface wall of the heat-conducting silica gel layer is in contact with the upper surface wall of the power supply chip.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) the utility model discloses a fin mounting groove, slot and heat dissipation inserted block's cooperation can realize radiating fin's freedom dismantlement, can pull down fast after radiating fin uses a period and carry out the deashing or change, and the deashing is thoroughly clean, and labour saving and time saving has effectively improved subsequent radiating effect, has avoided burning out of power chip.

(2) The utility model discloses an add the snakelike cooling tube that packs and have the coolant liquid, make power chip's the snakelike cooling tube of lower table wall contact, snakelike cooling tube can fully absorb power chip from the heat that the lower table wall effluvium, improves the efficiency of heat exchange, and the radiating effect is good, and is efficient, has prolonged power chip's life.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a top view of the bottom plate of the present invention;

fig. 3 is a side view of the heat dissipating fin of the present invention;

FIG. 4 is an enlarged view of portion A of FIG. 1;

in the figure: 1-bottom plate, 2-chip mounting groove, 3-mounting block, 4-clamping groove, 5-radiating fin, 6-radiating fin mounting groove, 7-first fixing plate, 8-second fixing plate, 9-baffle, 10-radiating insertion block, 11-fastener, 12-serpentine cooling tube, 13-through groove, 14-sealing block, 15-heat-conducting silica gel layer and 16-slot.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a heat radiation structure for a power supply chip comprises a bottom plate 1 and a fastener 11, wherein a second fixing plate 8 is symmetrically fixed on the upper surface wall of the bottom plate 1, a chip mounting groove 2 is formed on the outer surface wall of the second fixing plate 8, clamping grooves 4 are symmetrically formed in two inner side walls of the chip mounting groove 2, a first fixing plate 7 is fixed at the top end of the second fixing plate 8, heat radiating fin mounting grooves 6 are formed in the outer surface wall of the first fixing plate 7 at equal intervals, a slot 16 is formed in the inner bottom end of the heat radiating fin mounting groove 6, a heat radiating insert 10 matched with the slot 16 is inserted in the slot 16, when the heat radiating fin 5 needs to be cleaned or replaced, a worker can draw the heat radiating insert 10 out of the slot 16, can take the heat radiating fin 5 out of the heat radiating fin mounting groove 6, then clean the heat radiating fin completely, save time and labor, effectively improve the subsequent heat, the top end of the heat dissipation insert 10 and the inside of the heat dissipation fin installation groove 6 are connected with heat dissipation fins 5.

Further, snakelike cooling tube 12 is installed through fastener 11 to the lower table wall of bottom plate 1, the inside packing of snakelike cooling tube 12 has the coolant liquid, and the both ends of snakelike cooling tube 12 all are fixed with seal block 14, logical groove 13 has been seted up to the lower table wall intermediate position department of bottom plate 1, power chip's lower table wall sees through logical groove 13 contact and is filled the snakelike cooling tube 12 of coolant liquid, the heat that power chip follow lower table wall dispels can be fully absorbed, the efficiency of the heat exchange is improved, the radiating effect is good, high efficiency.

Further, the baffle 9 is fixed with to the lower table wall edge position department symmetry of bottom plate 1, and the baffle 9 is square, and the snakelike cooling tube 12 of effectively protecting can be reduced to baffle 9, and the probability that snakelike cooling tube 12 collided with and damaged is reduced.

Further, the lateral wall symmetric connection of baffle 9 has installation piece 3, and the mounting hole has been seted up to the exterior wall of installation piece 3, and the installation of this heat radiation structure is convenient for firmly through the installation piece 3 of seting up the mounting hole, avoids becoming flexible.

Further, the lower surface wall of the heat dissipation insert 10 is bonded with a heat conduction silica gel layer 15, the lower surface wall of the heat conduction silica gel layer 15 is in contact with the upper surface wall of the power supply chip, the heat conduction silica gel layer 15 can accelerate the conduction and dissipation of internal heat, and the heat dissipation efficiency is improved in a double mode.

The utility model discloses a theory of operation and use flow: when the utility model is used, the power chip is fixed by the chip mounting groove 2 and the clamping groove 4 which are arranged on the outer surface wall of the second fixing plate 8, then the heat dissipation structure can dissipate the heat of the power chip, the heat dissipation fins 5 and the heat-conducting silica gel layer 15 can dissipate the heat from the upper surface wall of the power chip, when the heat dissipation fins 5 need to be cleaned or replaced, the worker can draw out the heat dissipation insert 10 from the inserting groove 16, the heat dissipation fins 5 can be taken out from the heat dissipation fin mounting groove 6, then the cleaning is thorough, time and labor are saved, the subsequent heat dissipation effect is effectively improved, the burning-out of the power chip is avoided, in addition, the serpentine cooling pipe 12 which is arranged on the lower surface wall of the bottom plate 1 and is filled with the cooling liquid can fully absorb the heat dissipated from the lower surface wall of the power chip through the fastener 11, the heat exchange efficiency is improved, the heat dissipation effect, the service life of the power supply chip is prolonged, in addition, the serpentine cooling pipe 12 can be effectively protected through the baffle 9, and the probability of collision and damage of the serpentine cooling pipe 12 is reduced.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a heat radiation structure for power chip which characterized in that: including bottom plate (1) and fastener (11), the last wall symmetry of bottom plate (1) is fixed with second fixed plate (8), chip mounting groove (2) have been seted up to the exterior wall of second fixed plate (8), draw-in groove (4) have been seted up to the inside both sides wall symmetry of chip mounting groove (2), the top of second fixed plate (8) is fixed with first fixed plate (7), fin mounting groove (6) have been seted up to the outer surface wall equidistant of first fixed plate (7), slot (16) have been seted up to the inside bottom of fin mounting groove (6), heat dissipation inserted block (10) that are equipped with rather than the looks adaptation are inserted to the inside of slot (16), the internal connection that heat dissipation inserted block (10) top just is located fin mounting groove (6) has radiating fin (5).

2. The heat dissipation structure for a power chip according to claim 1, wherein: the lower surface wall of bottom plate (1) installs snakelike cooling tube (12) through fastener (11), the inside packing of snakelike cooling tube (12) has the coolant liquid, and the both ends of snakelike cooling tube (12) all are fixed with sealed piece (14), logical groove (13) have been seted up to the lower surface wall intermediate position department of bottom plate (1).

3. The heat dissipation structure for a power chip according to claim 1, wherein: the baffle plate (9) is symmetrically fixed at the edge of the lower surface wall of the bottom plate (1), and the baffle plate (9) is square.

4. The heat dissipation structure for a power chip according to claim 3, wherein: the side wall of baffle (9) is connected with installation piece (3) symmetrically, the mounting hole has been seted up to the exterior wall of installation piece (3).

5. The heat dissipation structure for a power chip according to claim 1, wherein: and the lower surface wall of the heat dissipation insert block (10) is bonded with a heat conduction silica gel layer (15), and the lower surface wall of the heat conduction silica gel layer (15) is contacted with the upper surface wall of the power supply chip.