CN116981158B - Heat abstractor for be used for 5G high frequency circuit board - Google Patents
Heat abstractor for be used for 5G high frequency circuit board Download PDFInfo
- Publication number
- CN116981158B CN116981158B CN202311177608.7A CN202311177608A CN116981158B CN 116981158 B CN116981158 B CN 116981158B CN 202311177608 A CN202311177608 A CN 202311177608A CN 116981158 B CN116981158 B CN 116981158B
- Authority
- CN
- China
- Prior art keywords
- heat conducting
- circuit board
- heat
- conducting strip
- fixedly connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001816 cooling Methods 0.000 claims abstract description 74
- 230000017525 heat dissipation Effects 0.000 claims abstract description 31
- 239000007788 liquid Substances 0.000 claims abstract description 28
- 239000000110 cooling liquid Substances 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims description 28
- 238000005057 refrigeration Methods 0.000 claims description 10
- 239000000428 dust Substances 0.000 claims description 7
- 238000001914 filtration Methods 0.000 claims description 5
- 238000007664 blowing Methods 0.000 claims description 4
- 238000009423 ventilation Methods 0.000 claims description 2
- 230000020169 heat generation Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 238000001035 drying Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat dissipation device for a 5G high-frequency circuit board, which relates to the technical field of circuit board heat dissipation, and comprises a shell, a clamping mechanism and a heat dissipation mechanism, wherein the clamping mechanism is arranged on the shell and used for clamping and fixing the circuit board body, one side of the circuit board body, on which the heat dissipation device is arranged, faces the shell, the heat dissipation mechanism comprises an air cooling assembly and a liquid cooling assembly, the air cooling assembly is arranged on the shell, the air cooling assembly dissipates heat of the heat dissipation device on the circuit board body through air circulation, and the liquid cooling assembly dissipates heat of the heat dissipation device on the circuit board body through the flow of cooling liquid. The heat dissipation device has the advantages that heat dissipation is carried out by means of the combination of air cooling and liquid cooling, and heat transfer of the heat conduction column, the main heat conduction strip, the first auxiliary heat conduction strip and the second auxiliary heat conduction strip is achieved, so that the heat dissipation area is increased, and the heat dissipation effect is improved.
Description
Technical Field
The invention relates to the technical field of circuit board heat dissipation, in particular to a heat dissipation device for a 5G high-frequency circuit board.
Background
In the field of 5G communications, integrated circuit devices used for 5G communications include high frequency circuit boards, also called printed circuit boards, which miniaturize circuits and visualize and play an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. The circuit board can send and receive signals for a large amount of time, so that the condition of overhigh temperature can occur, and moreover, as is well known, if the circuit board cannot timely dissipate heat after long-time working, the high temperature can not only lead to unstable system operation, shorten the service life, and even possibly burn certain parts. Therefore, a heat sink is required to perform heat dissipation treatment on the circuit board.
At present, the existing heat dissipation device of the electronic circuit board only dissipates heat in a single air cooling mode, and the heat dissipation efficiency is low.
Disclosure of Invention
Aiming at the defects existing in the prior art, the invention aims to provide a heat dissipating device for a 5G high-frequency circuit board, which aims to solve the technical problems.
In order to achieve the above purpose, the present invention provides the following technical solutions: a heat dissipating device for a 5G high frequency circuit board for dissipating heat from a heat generating device on a circuit board body, the heat dissipating device for a 5G high frequency circuit board comprising:
a housing;
the clamping mechanism is arranged on the shell and used for clamping and fixing the circuit board body, and one side, provided with the heating device, of the circuit board body is arranged towards the shell;
the heat dissipation mechanism comprises an air cooling assembly and a liquid cooling assembly, the air cooling assembly is arranged on the shell, the air cooling assembly dissipates heat of the heating device on the circuit board body through air circulation, and the liquid cooling assembly dissipates heat of the heating device on the circuit board body through the flow of cooling liquid;
the liquid cooling assembly comprises a heat conducting block, a heat conducting column, a second spring, a heat conducting plate, a cooling pipe and a refrigerating circulation box, wherein the heat conducting plate is fixedly installed at the position, close to the circuit board body, of the outer shell, a plurality of grooves are formed in the heat conducting plate, facing one side of the circuit board body, the grooves are in sliding connection with the heat conducting block, the heat conducting block is in friction contact with a heating device on the circuit board body, one end, far away from the heating device, of the heat conducting block is fixedly connected with the heat conducting column, the heat conducting column penetrates through the heat conducting plate and is in sliding connection with the heat conducting plate, the side portion, located between the heat conducting block and the bottom wall of the grooves, of the heat conducting column is sleeved with the second spring, one end of the second spring is fixedly connected with the heat conducting block, the other end of the second spring is fixedly connected with the bottom wall of the grooves, the position, close to the grooves, in the heat conducting plate is embedded with the cooling pipe, the input end of the cooling pipe is communicated with the liquid inlet pipe, the output end of the cooling pipe is communicated with the liquid outlet pipe, one end, far away from the cooling pipe, is communicated with the refrigerating circulation box, and the one end, far away from the cooling pipe, of the cooling pipe is used for cooling liquid after absorbing heat in the cooling circulation box.
As a further scheme of the invention: the clamping mechanism comprises a supporting seat, a supporting plate, a third sliding block, a clamping plate, a first spring, side plates, a guide rod and a handle, wherein the supporting seat is fixedly connected to the shell, one end of the supporting seat, which is far away from the shell, is fixedly connected with the supporting plate, the number of the supporting plates is two, the supporting plates are symmetrically arranged on the shell along the feeding direction, the third sliding groove is formed in one side, which is far away from the supporting seat, of the supporting plate, the setting direction of the third sliding groove is perpendicular to the feeding direction, the third sliding block is connected with the third sliding block in a sliding manner, the guide rod is fixedly connected to the clamping plate along the setting direction of the third sliding groove, one side, which is far away from the circuit board body, of the clamping plate is fixedly connected with the guide rod, one end, which is far away from the clamping plate, of the guide rod penetrates through the side plates and is fixedly connected with the handle, the part, which is located between the side plates, of the guide rod is sleeved with the first spring, one end of the first spring is fixedly connected with the clamping plate, and the other end of the first spring is fixedly connected with the side plates.
As a further scheme of the invention: the air cooling assembly comprises a frame and a fan, wherein the frame is fixedly arranged on the shell, the fan is arranged on the frame, and the heat conducting plate is provided with air holes, and the fan is used for blowing air towards the direction of the circuit board body.
As a further scheme of the invention: the position that the frame is close to the fan is installed the filter screen, and the filter screen is located one side that the fan kept away from the circuit board body, the filter screen is arranged in filtering the dust in the flowing air.
As a further scheme of the invention: the filter screen is embedded with a drying filter screen, and the drying filter screen is used for absorbing water vapor in the air.
As a further scheme of the invention: the air cooling assembly further comprises main heat conducting strips, the main heat conducting strips are fixedly connected to the shell, limit grooves are formed in the position, facing one end of the heat conducting plates, of the main heat conducting strips, the heat conducting columns are in sliding connection with the limit grooves, and the number of the main heat conducting strips is multiple, and the main heat conducting strips are arranged in parallel.
As a further scheme of the invention: the air cooling assembly further comprises a motor, a screw rod, a first sliding block, a first auxiliary heat conducting strip, a fourth sliding block, a connecting rod, a second sliding block, a second auxiliary heat conducting strip and a fifth sliding block, wherein the screw rod is fixedly connected to the output end of the motor, the first sliding block is connected to the screw rod in a threaded mode, the first auxiliary heat conducting strip is arranged along the axial line direction of the screw rod, a first sliding groove is formed in one end, facing the screw rod, of the first auxiliary heat conducting strip, the first sliding block is in sliding connection with the first auxiliary heat conducting strip through the first sliding groove, a fourth sliding groove is fixedly connected to one end, facing the main heat conducting strip, of the first auxiliary heat conducting strip, the fourth sliding groove is in sliding connection with the main heat conducting strip through the fourth sliding groove, a connecting rod is connected to the first sliding block in a rotating mode, one end, far away from the first sliding block, of the connecting rod is connected with the second sliding block in a rotating mode, the setting direction of the second auxiliary heat conducting strip is consistent with the setting direction of the first auxiliary heat conducting strip, a second sliding groove is formed in one end, facing the screw rod is connected with the first auxiliary heat conducting strip in a sliding mode, a second sliding groove is fixedly connected with the fifth sliding groove is formed in one end, facing the main heat conducting strip, and the fourth sliding connection with the fourth sliding groove is fixedly connected with the fourth sliding groove;
the screw threads at two ends of the screw rod are opposite in rotation direction, the first sliding blocks are arranged in pairs, the second sliding blocks are arranged in pairs, and connecting rods which are arranged in pairs and are located between the first auxiliary heat conducting strips and the second auxiliary heat conducting strips which are arranged adjacently are connected in a rotating mode.
Compared with the prior art, the technical scheme provided by the embodiment of the invention has at least the following beneficial effects:
the device is provided with the clamping mechanism and the heat dissipation mechanism, the clamping mechanism is used for clamping and fixing the circuit board body so as to fix the working position of the circuit board body, the heat dissipation mechanism comprises the air cooling component and the liquid cooling component, the liquid cooling component continuously absorbs heat in the heat conducting plate through continuous refrigeration of the refrigeration circulation box, and the heat of the heating device is indirectly transmitted through the heat conducting block so as to realize liquid cooling; and the heat conduction block is through the heat transfer of heat conduction post, leading heat strip, first vice heat strip and the vice heat strip of second, increased radiating area, under the effect of fan, with the help of the quick circulation of air, the surface of heat conduction post, leading heat strip, first vice heat strip and the vice heat strip of second is flicked to the air to realize cooling down fast, improve radiating efficiency.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, it being obvious that the drawings described below are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic three-dimensional structure of a heat dissipating device for a 5G high frequency circuit board;
FIG. 2 is a schematic diagram showing a two-dimensional cross-sectional structure of a heat sink for a 5G high-frequency circuit board;
FIG. 3 is an enlarged schematic view of the structure shown at A in FIG. 2;
FIG. 4 is a schematic diagram of a part of an air cooling assembly in a heat dissipating device for a 5G high frequency circuit board;
FIG. 5 is a schematic diagram showing a part of an air cooling assembly in a heat dissipating device for a 5G high frequency circuit board;
fig. 6 is a schematic diagram of a part of an air cooling assembly in a heat dissipating device for a 5G high frequency circuit board;
fig. 7 is a schematic structural diagram of a heat conducting plate and a cooling tube in a heat dissipating device for a 5G high frequency circuit board.
Reference numerals:
1. a motor; 2. a housing; 3. a liquid inlet pipe; 4. a refrigeration cycle tank; 5. a liquid outlet pipe; 6. a support base; 7. a support plate; 8. a circuit board body; 10. a side plate; 11. a first spring; 12. a clamping plate; 13. a guide rod; 14. a handle; 15. a third slider; 16. a third chute; 18. a heat generating device; 19. a heat conduction block; 20. ventilation holes; 21. a cooling tube; 22. a heat conducting column; 23. a main heat conducting strip; 24. a fourth slider; 25. a first secondary heat conducting strip; 26. a first chute; 27. a first slider; 28. a filter screen; 29. a blower; 30. a frame; 31. a screw rod; 32. a heat conductive plate; 33. a groove; 34. a second spring; 35. a limit groove; 36. a fourth chute; 37. a second secondary heat conducting strip; 38. a fifth slider; 39. a connecting rod; 40. a second chute; 41. and a second slider.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is evident that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
An embodiment of a heat sink for a 5G high frequency circuit board according to the present invention will be further described with reference to fig. 1 to 7.
Referring to fig. 1 to 7, an embodiment of the present invention provides a heat dissipating device for a 5G high frequency circuit board, for dissipating heat from a heat generating device 18 on a circuit board body 8, the heat dissipating device comprising:
a housing 2;
the clamping mechanism is arranged on the shell 2 and used for clamping and fixing the circuit board body 8, and one side, provided with the heating device 18, of the circuit board body 8 is arranged towards the shell 2;
1-3, the clamping mechanism comprises a supporting seat 6, a supporting plate 7, a third sliding block 15, a clamping plate 12, a first spring 11, a side plate 10, a guide rod 13 and a handle 14, wherein the supporting seat 6 is fixedly connected to the housing 2, one end of the supporting seat 6 far away from the housing 2 is fixedly connected with the supporting plate 7, two supporting plates 7 are symmetrically arranged on the housing 2 along the feeding direction, the feeding direction is the direction indicated by an arrow in FIG. 1, a third sliding groove 16 is formed in one side of the supporting plate 7 far away from the supporting seat 6, the setting direction of the third sliding groove 16 is perpendicular to the feeding direction, the third sliding block 15 is connected to the clamping plate 12 in a sliding manner, one side of the clamping plate 12 far away from the circuit board body 8 is fixedly connected with the guide rod 13 along the setting direction of the third sliding groove 16, one end of the guide rod 13 far away from the clamping plate 12 penetrates through the side plate 10 and is fixedly connected with the handle 14, the part of the guide rod 13 between the side plate 10 and the clamping plate 12 is fixedly connected with the first spring 11, and the other end of the clamping plate 12 is fixedly connected with the first spring 11;
the heat dissipation mechanism comprises an air cooling assembly and a liquid cooling assembly, wherein the air cooling assembly is arranged on the shell 2, the air cooling assembly dissipates heat of the heating device 18 on the circuit board body 8 through air circulation, and the liquid cooling assembly dissipates heat of the heating device 18 on the circuit board body 8 through the flow of cooling liquid;
in one embodiment, referring to fig. 2, 4 and 7, the air cooling assembly includes a frame 30 and a fan 29, the frame 30 is fixedly mounted on the housing 2, the fan 29 is mounted on the frame 30, and the air holes 20 are formed in the heat conducting plate 32, where the fan 29 is used for blowing air in the direction of the circuit board body 8; the filter screen 28 is installed at the position of the frame 30, which is close to the fan 29, and the filter screen 28 is located at one side of the fan 29, which is far away from the circuit board body 8, the filter screen 28 is used for filtering dust in flowing air, wherein a drying filter screen can be embedded in the filter screen 28, and is used for absorbing water vapor in the air, through the operation of the fan 29, the air is subjected to dust removal, drying and filtration of the filter screen 28, so that the dust is effectively prevented from flowing and gathering towards the direction of the circuit board body 8 for a long time, the water vapor is prevented from entering the periphery of the device along with the air, and the normal operation of the device is ensured;
the liquid cooling assembly comprises a heat conducting block 19, a heat conducting column 22, a second spring 34, a heat conducting plate 32, a cooling pipe 21 and a refrigerating circulation box 4, wherein the heat conducting plate 32 is fixedly installed at the position, close to the circuit board body 8, of the shell 2, a plurality of grooves 33 are formed in the heat conducting plate 32, towards one side of the circuit board body 8, the grooves 33 are in sliding connection with the heat conducting block 19, the heat conducting block 19 is in friction contact with a heating device 18 on the circuit board body 8, one end, far away from the heating device 18, of the heat conducting block 19 is fixedly connected with the heat conducting column 22, the heat conducting column 22 penetrates through the heat conducting plate 32 and is in sliding connection with the heat conducting plate 32, the side portion, located between the heat conducting column 22 and the bottom wall of the grooves 33, of the heat conducting block 19 is sleeved with the second spring 34, one end of the second spring 34 is fixedly connected with the heat conducting block 19, the other end of the second spring 34 is fixedly connected with the bottom wall of the grooves 33, the position, close to the grooves 33, of the heat conducting plate 32 is embedded with the cooling pipe 21, the input end of the cooling pipe 21 is communicated with the liquid inlet pipe 3, the output end of the cooling pipe 21 is communicated with the liquid outlet pipe 5, one end of the cooling pipe 21 is communicated with the liquid outlet pipe 3, one end of the cooling pipe 21 is far away from the refrigerating circulation box 4, and is communicated with one end of the refrigerating circulation box 4, and is far away from the cooling pipe 4, and cooled down.
In the above embodiment, the handle 14 is held by hand, and the handle 14 is pulled outward, so that the two clamping plates 12 move in opposite directions to compress the first spring 11, at this time, the circuit board body 8 is pushed between the two clamping plates 12 along the feeding direction shown in fig. 1, the handle 14 is released, under the elastic force of the first spring 11, the clamping plates 12 move to friction against the side wall of the circuit board body 8 in the direction approaching the circuit board body 8, so as to realize clamping and fixing of the circuit board body 8, at this time, the heating device 18 on the circuit board body 8 is in friction contact with the corresponding heat conducting block 19;
in the actual use process of the circuit board body 8, heat is generated when the heating device 18 runs, at the moment, the heat conduction block 19 is in physical contact with the heat conduction plate 32, and low-temperature cooling liquid is continuously conveyed from the refrigeration cycle box 4 by means of the cooling pipe 21 so as to absorb the heat of the heat conduction plate 32 and indirectly absorb the heat of the heat conduction block 19, so that the physical cooling of the heating device 18 is realized, and the thickness sizes of the heating devices 18 on the circuit board body 8 are different, at the moment, the heating devices 18 with different thickness sizes are in contact with the corresponding heat conduction blocks 19, so that the heat conduction blocks 19 and the grooves 33 have different sliding displacement, the heat conduction blocks 19 compress the second springs 34, and flexible friction contact between the heat conduction blocks 19 and the heating devices 18 is realized;
and the heat conduction columns 22 extending out of the heat conduction plate 32 increase the physical heat dissipation surface, and the auxiliary liquid cooling assembly greatly improves the heat dissipation effect on the heating device 18 under the air cooling effect of the fan 29.
With continued reference to fig. 2 and fig. 4, the air cooling assembly further includes a main heat conducting bar 23, the main heat conducting bar 23 is fixedly connected to the housing 2, a limit groove 35 is provided at one end of the main heat conducting bar 23 facing the heat conducting plate 32, and the heat conducting columns 22 are slidably connected with the limit groove 35, where the number of the main heat conducting bars 23 is plural, and the plural main heat conducting bars 23 are arranged in parallel;
in the above embodiment, fig. 2 is a schematic cross-sectional structure of the three-dimensional structure shown in fig. 1 along the direction perpendicular to the feeding direction, in which the arrangement direction of the main heat strips 23 is consistent with the feeding direction, and each main heat strip 23 is slidably connected with a plurality of heat conducting columns 22, so that the heat dissipation area is further increased by the heat conducting columns 22, and the air-cooled heat dissipation of the heat generating device 18 is realized under the operation of the fan 29.
In an embodiment, please continue to refer to fig. 5 to fig. 7, the air cooling assembly further includes a motor 1, a screw rod 31, a first slider 27, a first auxiliary heat conducting strip 25, a fourth slider 24, a connecting rod 39, a second slider 41, a second auxiliary heat conducting strip 37 and a fifth slider 38, the output end of the motor 1 is fixedly connected with the screw rod 31, the screw rod 31 is in threaded connection with the first slider 27, the first auxiliary heat conducting strip 25 is disposed along the axial line direction of the screw rod 31, a first chute 26 is disposed at one end of the first auxiliary heat conducting strip 25 facing the screw rod 31, the first slider 27 is in sliding connection with the first auxiliary heat conducting strip 25 through the first chute 26, one end of the first auxiliary heat conducting strip 25 facing the main heat conducting strip 23 is fixedly connected with the fourth slider 24, the main heat conducting strip 23 faces one end of the first auxiliary heat conducting strip 25, the fourth slider 36 is in sliding connection with the first auxiliary heat conducting strip 23 through the fourth chute 36, one end of the connecting rod 39 far from the first slider 31 is in rotating connection with the second slider 27, the second auxiliary heat conducting strip 41 is disposed at one end of the second auxiliary heat conducting strip 37 facing the second auxiliary heat conducting strip 37 is in sliding connection with the second slider 38 through the first chute 37, and the second auxiliary heat conducting strip 37 is in sliding connection with the second auxiliary heat conducting strip 37 is in the same direction as the second slider 37;
wherein, the screw threads at the two ends of the screw rod 31 are opposite in rotation direction, the first sliding blocks 27 are arranged in pairs, the second sliding blocks 41 are arranged in pairs, and the connecting rods 39 arranged in pairs between the first auxiliary heat conducting strip 25 and the second auxiliary heat conducting strip 37 arranged adjacently are connected in a mutually rotating manner.
In the above embodiment, in order to further increase the heat dissipation area, the first auxiliary heat conducting strip 25 and the second auxiliary heat conducting strip 37 are slidingly connected to the main heat conducting strip 23, and the screw rod 31 drives the first slider 27 to slide in opposite directions under the driving of the motor 1, and the connecting rods 39 arranged in pairs between the first auxiliary heat conducting strip 25 and the second auxiliary heat conducting strip 37 adjacently arranged are mutually rotationally connected, so that the connecting rods 39 drive the second slider 41 to slide in opposite directions, under the sliding constraint of the fifth slider 38 and the fourth chute 36, the second auxiliary heat conducting strip 37 slides in a direction away from the first auxiliary heat conducting strip 25, and the distance between the first auxiliary heat conducting strip 25 and the second auxiliary heat conducting strip 37 is increased, so that under the operation of the fan 29, air uniformly flows over the surfaces of the first auxiliary heat conducting strip 25 and the second auxiliary heat conducting strip 37, and the heat dissipation efficiency is greatly improved.
Working principle: before the device is used, the handle 14 is held by hand, the handle 14 is pulled outwards, the two clamping plates 12 are moved reversely to compress the first spring 11, at the moment, the circuit board body 8 is pushed between the two clamping plates 12 along the feeding direction shown in the figure 1, the handle 14 is loosened, under the action of the elastic force of the first spring 11, the clamping plates 12 move to be in friction contact with the side wall of the circuit board body 8 in the direction close to the circuit board body 8 so as to realize clamping and fixing of the circuit board body 8, at the moment, the heating devices 18 on the circuit board body 8 are in friction contact with the corresponding heat conducting blocks 19, and the heat conducting blocks 19 are stably in friction contact with the corresponding heating devices 18 under the action of the elastic force of the second springs 34 due to the fact that the thickness of the heating devices 18 is different, so that the flexibility is high, and the situation that part of the heat conducting blocks 19 cannot be contacted with the heating devices 18 is avoided;
meanwhile, the motor 1 is started, the motor 1 drives the screw rod 31, the screw rod 31 drives the two first sliding blocks 27 to slide in opposite directions, as the connecting rods 39 arranged in pairs between the first auxiliary heat conducting strip 25 and the second auxiliary heat conducting strip 37 arranged adjacently are connected in a rotating way, the connecting rods 39 drive the second sliding blocks 41 to slide in opposite directions, under the sliding constraint of the fifth sliding blocks 38 and the fourth sliding grooves 36, the second auxiliary heat conducting strip 37 slides in the direction away from the first auxiliary heat conducting strip 25, the distance between the first auxiliary heat conducting strip 25 and the second auxiliary heat conducting strip 37 is increased, and after adjustment, the motor 1 is turned off;
in the working process of the circuit board body 8, the heating device 18 operates, at the moment, the refrigeration cycle box 4 and the fan 29 are started, the cooling liquid sequentially passes through the liquid inlet pipe 3, the cooling pipe 21, the liquid outlet pipe 5 and the refrigeration cycle box 4, and the heat absorbed by the heat conducting plate 32 from the heat conducting block 19 is transferred through the heat of the cooling liquid, so that the heat dissipation effect on the heating device 18 is realized; and, the heat conducted on the heat conduction block 19 is conducted through the heat conduction column 22, the main heat conduction strip 23, the first auxiliary heat conduction strip 25 and the second auxiliary heat conduction strip 37, the heat dissipation area is increased, the air flows under the blowing of the fan 29, so that the air cooling and heat dissipation are realized, a drying filter screen can be embedded in the filter screen 28, the drying filter screen is used for absorbing water vapor in the air, the air is subjected to dust removal, drying and filtration through the fan 29, the dust is effectively prevented from flowing and gathering along with the air along with the direction of the circuit board body 8 for a long time, the water vapor is prevented from entering the periphery of the device, and the normal operation of the device is ensured.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above examples, and all technical solutions belonging to the concept of the present invention belong to the protection scope of the present invention. It should be noted that modifications and adaptations to the present invention may occur to one skilled in the art without departing from the principles of the present invention and are intended to be within the scope of the present invention.
Claims (7)
1. A heat dissipating device for a 5G high frequency circuit board for dissipating heat from a heat generating device (18) on a circuit board body (8), characterized in that the heat dissipating device for a 5G high frequency circuit board comprises:
a housing (2);
the clamping mechanism is arranged on the shell (2) and used for clamping and fixing the circuit board body (8), and one side, provided with the heating device (18), of the circuit board body (8) is arranged towards the shell (2);
the heat dissipation mechanism comprises an air cooling assembly and a liquid cooling assembly, wherein the air cooling assembly is arranged on the shell (2), the air cooling assembly dissipates heat of a heating device (18) on the circuit board body (8) through air circulation, and the liquid cooling assembly dissipates heat of the heating device (18) on the circuit board body (8) through the flow of cooling liquid;
wherein the liquid cooling assembly comprises a heat conduction block (19), a heat conduction column (22), a second spring (34), a heat conduction plate (32), a cooling pipe (21) and a refrigeration cycle box (4), the heat conduction plate (32) is fixedly arranged at the position, close to the circuit board body (8), of the shell (2), a plurality of grooves (33) are formed in one side, facing the circuit board body (8), of the heat conduction plate (32), the grooves (33) are in sliding connection with the heat conduction block (19), the heat conduction block (19) is in friction contact with a heating device (18) on the circuit board body (8), one end, far away from the heat generation device (18), of the heat conduction block (19) is fixedly connected with the heat conduction column (22), the heat conduction column (22) penetrates through the heat conduction plate (32) and is in sliding connection with the heat conduction plate (32), the side part, located between the heat conduction block (19) and the bottom wall of the grooves (33), of the second spring (34) is fixedly connected with the grooves (19), the other end of the second spring (34) is fixedly connected with the bottom wall of the grooves (33), the heat conduction column (22) is fixedly connected with the bottom wall of the grooves (33), the heat conduction plate (21) is embedded into the cooling pipe (21), the cooling pipe (21) is communicated with the cooling pipe (3), the output end of the cooling pipe (21) is communicated with the liquid outlet pipe (5), one end, far away from the cooling pipe (21), of the liquid inlet pipe (3) is communicated with the refrigeration cycle box (4), one end, far away from the cooling pipe (21), of the liquid outlet pipe (5) is communicated with the refrigeration cycle box (4), and the refrigeration cycle box (4) is used for refrigerating and cooling liquid after absorbing heat in the cooling pipe (21).
2. The heat dissipating device for a 5G high frequency circuit board according to claim 1, wherein the clamping mechanism comprises a supporting base (6), a supporting plate (7), a third sliding block (15), a clamping plate (12), a first spring (11), a side plate (10), a guide rod (13) and a handle (14), the supporting base (6) is fixedly connected to the housing (2), one end of the supporting base (6) far away from the housing (2) is fixedly connected with the supporting plate (7), wherein two supporting plates (7) are symmetrically arranged on the housing (2) along the feeding direction, one side of the supporting plate (7) far away from the supporting base (6) is provided with a third sliding groove (16), the arrangement direction of the third sliding groove (16) is perpendicular to the feeding direction, the third sliding groove (16) is slidably connected with the third sliding block (15), the third sliding block (15) is fixedly connected to the clamping plate (12), one side of the clamping plate (12) far away from the circuit board body (8) is fixedly connected with the guide rod (13) along the arrangement direction of the third sliding groove (16), one end of the guide rod (13) far away from the handle (14) is fixedly connected with the side plate (13), the part of the guide rod (13) between the side plate (10) and the clamping plate (12) is sleeved with a first spring (11), one end of the first spring (11) is fixedly connected with the clamping plate (12), and the other end of the first spring (11) is fixedly connected with the side plate (10).
3. The heat dissipating device for a 5G high frequency circuit board according to claim 1, wherein the air cooling assembly comprises a frame (30) and a blower (29), the frame (30) is fixedly mounted on the housing (2), the blower (29) is mounted on the frame (30), and the heat conducting plate (32) is provided with ventilation holes (20), wherein the blower (29) is used for blowing air in the direction of the circuit board body (8).
4. A heat sink for a 5G high frequency circuit board according to claim 3, characterized in that the frame (30) is provided with a filter screen (28) at a position close to the fan (29), and the filter screen (28) is located at a side of the fan (29) remote from the circuit board body (8), and the filter screen (28) is used for filtering dust in flowing air.
5. The heat sink for a 5G high frequency circuit board according to claim 4, wherein a dry filter screen for absorbing moisture in the air is embedded in the filter screen (28).
6. A heat dissipation device for a 5G high frequency circuit board according to claim 3, wherein the air cooling assembly further comprises a main heat conducting strip (23), the main heat conducting strip (23) is fixedly connected to the housing (2), a limit groove (35) is formed at one end of the main heat conducting strip (23) facing the heat conducting plate (32), the heat conducting columns (22) are slidably connected with the limit groove (35), and a plurality of the main heat conducting strips (23) are arranged in parallel.
7. The heat dissipating device for a 5G high-frequency circuit board according to claim 6, wherein the air cooling assembly further comprises a motor (1), a screw rod (31), a first slider (27), a first auxiliary heat conducting strip (25), a fourth slider (24), a connecting rod (39), a second slider (41), a second auxiliary heat conducting strip (37) and a fifth slider (38), the output end of the motor (1) is fixedly connected with the screw rod (31), the screw rod (31) is threaded with the first slider (27), the first auxiliary heat conducting strip (25) is arranged along the axial line direction of the screw rod (31), a first sliding groove (26) is formed at one end of the first auxiliary heat conducting strip (25) facing the screw rod (31), the first slider (27) is in sliding connection with the first auxiliary heat conducting strip (25) through the first sliding groove (26), the fourth slider (24) is fixedly connected at one end of the first auxiliary heat conducting strip (25) facing the main heat conducting strip (23), a fourth sliding groove (36) is formed at one end of the heat conducting strip (23) facing the first auxiliary heat conducting strip (25), the fourth sliding groove (36) is connected with the first auxiliary heat conducting strip (23) through the first sliding groove (36), one end of the connecting rod (39) far away from the first sliding block (27) is rotationally connected with a second sliding block (41), the setting direction of the second auxiliary heat conducting strip (37) is consistent with that of the first auxiliary heat conducting strip (25), one end of the second auxiliary heat conducting strip (37) facing the screw rod (31) is provided with a second sliding groove (40), the second sliding block (41) is in sliding connection with the second auxiliary heat conducting strip (37) through the second sliding groove (40), one end of the second auxiliary heat conducting strip (37) facing the main heat conducting strip (23) is fixedly connected with a fifth sliding block (38), and the fifth sliding block (38) is in sliding connection with the fourth sliding groove (36);
the screw threads at two ends of the screw rod (31) are opposite in rotation direction, the first sliding blocks (27) are arranged in pairs, the second sliding blocks (41) are arranged in pairs, and the connecting rods (39) arranged in pairs and positioned between the first auxiliary heat conducting strips (25) and the second auxiliary heat conducting strips (37) which are adjacently arranged are connected in a mutually rotating mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311177608.7A CN116981158B (en) | 2023-09-12 | 2023-09-12 | Heat abstractor for be used for 5G high frequency circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311177608.7A CN116981158B (en) | 2023-09-12 | 2023-09-12 | Heat abstractor for be used for 5G high frequency circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116981158A CN116981158A (en) | 2023-10-31 |
| CN116981158B true CN116981158B (en) | 2024-01-23 |
Family
ID=88483423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311177608.7A Active CN116981158B (en) | 2023-09-12 | 2023-09-12 | Heat abstractor for be used for 5G high frequency circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116981158B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05315782A (en) * | 1992-05-11 | 1993-11-26 | Fujitsu Ltd | Heat dissipating structure of printed circuit board |
| CN213522784U (en) * | 2020-11-25 | 2021-06-22 | 深圳市鹏金乐科电子科技有限公司 | Heat radiator for electronic circuit board |
| CN115003021A (en) * | 2022-06-13 | 2022-09-02 | 鹤山市众一电路有限公司 | Mixed-compression high-frequency double-layer circuit board with heat insulation structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI404904B (en) * | 2010-11-19 | 2013-08-11 | Inventec Corp | Separable liquid-cooling heat-dissipation module |
-
2023
- 2023-09-12 CN CN202311177608.7A patent/CN116981158B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05315782A (en) * | 1992-05-11 | 1993-11-26 | Fujitsu Ltd | Heat dissipating structure of printed circuit board |
| CN213522784U (en) * | 2020-11-25 | 2021-06-22 | 深圳市鹏金乐科电子科技有限公司 | Heat radiator for electronic circuit board |
| CN115003021A (en) * | 2022-06-13 | 2022-09-02 | 鹤山市众一电路有限公司 | Mixed-compression high-frequency double-layer circuit board with heat insulation structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116981158A (en) | 2023-10-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114828577A (en) | Novel high-efficient data center server liquid cooling heat dissipation cabinet | |
| CN211656743U (en) | Liquid cooling type virtual digital currency processing equipment | |
| CN111258392B (en) | Compact water-cooling machine case of computer | |
| CN116981158B (en) | Heat abstractor for be used for 5G high frequency circuit board | |
| CN212115993U (en) | Heat pipe type temperature control cabinet using heat pipe as heat conducting element | |
| JP5209428B2 (en) | Electronics | |
| CN113745722B (en) | Outdoor power supply module structure with power-off protection function and dust-free heat dissipation | |
| CN108024488B (en) | Water jacket type circuit board heat abstractor | |
| CN110582189B (en) | Heat pipe type temperature control cabinet using heat pipe as heat conducting element | |
| CN212987792U (en) | Self-heat-dissipation cold drying machine | |
| CN220307674U (en) | Water cooling structure of power supply module | |
| CN220528433U (en) | Power board heat radiation structure | |
| KR100660388B1 (en) | Cooler assembly | |
| CN216795593U (en) | Television mainboard with infrared detection function | |
| CN220210836U (en) | Uniform temperature type heat pipe arrangement heat dissipation module | |
| CN219145725U (en) | Embedded PCB board heat radiation structure | |
| CN220271853U (en) | External computer host heat abstractor | |
| CN218298951U (en) | Adsorption type radiator for server | |
| CN115033072A (en) | Low-power consumption computer motherboard | |
| CN212839158U (en) | Water-cooled screw brine unit with shockproof protection at bottom | |
| CN214222778U (en) | LED module with good heat dissipation effect | |
| CN217884341U (en) | Radiator for power electronic device | |
| CN216218522U (en) | Heat dissipation mechanism of frequency converter | |
| CN213072573U (en) | Photovoltaic module with good cooling effect | |
| CN210778152U (en) | Transformer with cooling function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |