CN220528433U - Power board heat radiation structure - Google Patents

Abstract

The utility model provides a power board heat dissipation structure, which includes a card holder. A cooling fan is installed on the side of the card holder. A power board is installed in the card holder. A first and a second heat equalizing plate are installed in the card holder. , the power board is located on the upper side of the first vapor chamber. A plurality of heat conduction rods are installed between the first vapor chamber and the second vapor chamber. The opposite sides of the card holder are slidably fitted with plug-in blocks. The first vapor chamber is Slots are provided on opposite sides of the board, and the slots correspond to the plug-in blocks. C-shaped rods are elastically fitted on opposite sides of the card holder, and the C-shaped rods correspond to the power board. In the present utility model, a first vapor chamber and a second vapor chamber are installed in the card holder. The first vapor chamber and the second vapor chamber can disperse the relatively concentrated heat to prevent the installation of electronic components. The higher density leads to heat accumulation, and can increase the heat dissipation area and speed up the heat dissipation efficiency. Install plug-ins and C-shaped rods on the opposite sides of the card holder to facilitate the disassembly of the power board, the first vapor chamber and the second vapor chamber. .

Description

A power board heat dissipation structure

Technical field

The utility model relates to the technical field of power boards, specifically a power board heat dissipation structure.

Background technique

The principle of the power board is a buck topology, using MOS tubes instead of conventional diodes to form a synchronous BUCK. Most of the existing power boards are composed of electronic components welded on the PCB board, but the electronic components will Heat is generated, and if the power board is not dissipated in time, the temperature on the power board will be high, causing damage to electronic components. Most of the existing heat dissipation of power boards is completed through cooling fans and cooling fins, as disclosed The patent No. CN213991513U discloses a heat dissipation power board, which includes a board body. Card holders are fixed on both sides of the board body. An elastic card is clamped in the card holder. A heat conductive plate is attached to the back of the board body. , fins are provided on the heat transfer plate, connection plates are fixed on both sides of the heat transfer plate, the elastic card is fixedly connected to the connection plate, an alignment block is fixed on the connection plate, and an alignment seat is provided on the sliding sleeve of the alignment block. The heat conduction plate and the fins can be used to dissipate the heat from the board body. Then, the cooling fan is used to increase the air flow rate and take away the heat on the heat conduction plate and fins, thus improving the heat dissipation effect and preventing the temperature of the board body from being too high.

However, the number and types of electronic components welded on different power boards are different. For some power boards with high density, many types of electronic components, and rapid heating, simply using cooling fans and cooling fins may not achieve good results. However, for some power boards with low electronic component density, few types, and low heat dissipation, more powerful heat dissipation will increase the cost and be more wasteful.

To this end, the utility model provides a power board heat dissipation structure.

Utility model content

In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a power board heat dissipation structure to solve the problems raised in the above background technology. The utility model can disperse relatively concentrated heat to prevent the installation of electronic components. Higher density leads to heat accumulation, increases the heat dissipation area, speeds up heat dissipation efficiency, and has a strong heat dissipation effect; it can also be applied to power boards that do not require strong heat dissipation effects, reducing costs.

In order to achieve the above purpose, the present utility model is realized through the following technical solutions: a power board heat dissipation structure, including a card holder, a cooling fan is installed on the side of the card holder, a power board is installed in the card holder, and the card holder is equipped with a heat dissipation fan. There is a first vapor chamber and a second vapor chamber. The power board is located above the first vapor chamber. A plurality of heat conduction rods are installed between the first vapor chamber and the second vapor chamber. The opposite sides of the card holder are There are plug-in blocks slidingly fitted on both sides. Slots are provided on opposite sides of the first vapor chamber. The slots correspond to the plug-in blocks. C-shaped rods are elastically fitted on opposite sides of the card holder. The C-shaped rod is connected to the power board. Corresponding.

Furthermore, clamping blocks are fixed on opposite sides of the power board, and a clamping slot is provided in the clamping block. One end of the C-shaped rod is fixedly connected with a clamping ball, and the clamping ball corresponds to the clamping slot.

Furthermore, grooves are provided on opposite sides of the card holder. The groove is a C-shaped groove structure. The C-shaped rod is located in the groove, and a spring is installed between the C-shaped rod and the groove wall. .

Further, the chute is provided on opposite sides of the card holder, and the chute is in sliding fit with the plug-in block, and the opposite sides of the card holder are threaded with threaded rods, one end of the threaded rod is located in the chute, and the thread One end of the rod located in the chute is rotationally matched with the inserting block.

Further, the power plate is in contact with the first vapor chamber, the second vapor chamber is in contact with the bottom of the card holder, and a plurality of heat chambers are installed on the opposite inner sides of the first vapor chamber and the second vapor chamber. Cooling fins.

Furthermore, a plurality of air vents are provided on the side of the card holder.

Beneficial effects of the utility model: The utility model is a power board heat dissipation structure, which includes a card holder; a first soaking plate; a second soaking plate; an insert block; a C-shaped rod; and a power board.

Install the first vapor chamber and the second vapor chamber in the card holder. The first vapor chamber and the second vapor chamber can disperse the concentrated heat to prevent heat accumulation due to the high installation density of electronic components. , and can increase the heat dissipation area, speed up the heat dissipation efficiency, and have a strong heat dissipation effect. Install plug-ins and C-shaped rods on the opposite sides of the card holder to facilitate the installation of the power board, the first vapor chamber and the second vapor chamber. disassembly, so that the device can be applied to power boards that do not require strong heat dissipation effects and reduce costs.

Description of drawings

Figure 1 is a schematic diagram of the assembled three-dimensional structure of the card holder and the cooling fan in a power board heat dissipation structure of the present invention;

Figure 2 is a schematic diagram of the assembled three-dimensional structure of the card holder and the power board in a power board heat dissipation structure of the present invention;

Figure 3 is a schematic cross-sectional structural diagram of the overall assembly of a power board heat dissipation structure of the present invention;

In the picture: 1. Card holder; 2. Power board; 3. First vapor chamber; 4. Second vapor chamber; 5. Heat conduction rod; 6. Cooling fins; 7. Slot; 8. Plug-in block; 9. Threaded rod; 10. Groove; 11. C-shaped rod; 12. Spring; 13. Clamping ball; 14. Air outlet; 15. Cooling fan; 16. Clamping block.

Detailed ways

In order to make it easy to understand the technical means, creative features, objectives and effects of the present utility model, the present utility model will be further elaborated below in conjunction with specific implementation modes.

Please refer to Figures 1 to 3. The present utility model provides a technical solution: a power board heat dissipation structure, including a card holder 1. A cooling fan 15 is installed on the side of the card holder 1, and a power board is installed inside the card holder 1. 2. The card holder 1 is equipped with a first vapor chamber 3 and a second vapor chamber 4. The power board 2 is located above the first vapor chamber 3 and between the first vapor chamber 3 and the second vapor chamber 4. A plurality of heat-conducting rods 5 are installed, and plug-in blocks 8 are slidably fitted on opposite sides of the card holder 1. Slots 7 are provided on opposite sides of the first vapor chamber 3, and the slots 7 correspond to the plug-in blocks 8. C-shaped rods 11 are elastically fitted on opposite sides of the card base 1 , and the C-shaped rods 11 correspond to the power board 2 .

In this embodiment, clamping blocks 16 are fixed on opposite sides of the power board 2. A clamping slot is provided in the clamping block 16. One end of the C-shaped rod 11 is fixedly connected with a clamping ball 13. The clamping ball 13 corresponds to the clamping slot. There are grooves 10 on opposite sides of the seat 1. The groove 10 is a C-shaped groove structure. The C-shaped rod 11 is located in the groove 10, and there is a groove between the C-shaped rod 11 and the groove wall of the groove 10. Spring 12, when you need to disassemble the power board 2, you only need to press one end of the C-shaped rod 11 so that the C-shaped rod 11 completely enters the groove 10. At this time, the spring 12 is compressed and the clamping ball 13 is lost from the slot. Once connected, the power board 2 can be removed.

There are slide grooves on opposite sides of the card base 1, and the slide grooves are slidingly matched with the plug-in block 8, and there are threaded rods 9 on the opposite sides of the card base 1. One end of the threaded rod 9 is located in the slide groove, and the threaded rod 9 is threaded. One end of the rod 9 located in the chute rotates with the plug-in block 8. When it is necessary to disassemble the first vapor chamber 3 and the second vapor chamber 4, the threaded rod 9 is rotated so that the threaded rod 9 drives the plug-in block 8 to slide. , the plug-in block 8 and the slot 7 lose the engagement relationship, you can take out the first vapor chamber 3 and the second vapor chamber 4, and then reverse the threaded rod 9 to reset the plug-in block 8. At this time, the plug-in block 8 pairs The power board 2 plays a supporting role, and a gap is created between the power board 2 and the bottom of the card holder 1 to facilitate heat dissipation.

The power plate 2 is in contact with the first vapor chamber 3, and the second vapor chamber 4 is in contact with the bottom of the card holder 1. The first vapor chamber 3 and the second vapor chamber 4 are equipped with multiple devices on the opposite inner sides. There are two heat dissipation fins 6, and a plurality of air vents 14 are provided on the side of the deck 1. When heat dissipation is required, the first vapor chamber 3 and the second vapor chamber 4 play a role in dispersing heat and conducting heat. It will gather around the heat dissipation fins 6, and then start the cooling fan 15 to blow out the hot air to achieve the heat dissipation effect.

Working principle, when strong heat dissipation is required, the power board 2, the first vapor chamber 3 and the second vapor chamber 4 are installed in the card holder 1. The power board 2 generates heat when working, and then the first The vapor chamber 3 and the second vapor chamber 4 disperse heat, and the heat dissipation fan 15 can be started to dissipate heat.

When ordinary heat dissipation can maintain the temperature of the power board 2, press the C-shaped rod 11 to remove the power board 2, and then turn the threaded rod 9 to separate the first vapor chamber 3 and the second Disassemble the vapor chamber 4. After the disassembly is completed, reverse the threaded rod 9 to reset the plug 8, and then install the power board 2. At this time, the plug 8 supports the power board 2. When heat dissipation is required, directly Just start the cooling fan 15.

In addition, it should be understood that although this specification is described in terms of implementations, not each implementation only contains an independent technical solution. This description of the specification is only for the sake of clarity, and those skilled in the art should take the specification as a whole. , the technical solutions in each embodiment can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims (6)

1. The utility model provides a power board heat radiation structure, includes cassette (1), its characterized in that, radiator fan (15) have been installed to cassette (1) side, be equipped with power board (2) in cassette (1), be equipped with first vapor chamber (3) and second vapor chamber (4) in cassette (1), power board (2) are located first vapor chamber (3) upside, a plurality of heat conduction rods (5) have been installed between first vapor chamber (3) and second vapor chamber (4), slot (7) have been seted up to the equal sliding fit in opposite both sides of cassette (1), slot (7) are corresponding with plug (8) in the opposite both sides of first vapor chamber (3), C shape pole (11) are corresponding with power board (2) in the elastic fit in opposite both sides of cassette (1).

2. A power board heat dissipating structure according to claim 1, wherein: clamping blocks (16) are fixed on two opposite sides of the power board (2), clamping grooves are formed in the clamping blocks (16), clamping balls (13) are fixedly connected to one end of the C-shaped rod (11), and the clamping balls (13) correspond to the clamping grooves.

3. A power board heat dissipating structure according to claim 1, wherein: the clamping seat is characterized in that grooves (10) are formed in two opposite sides of the clamping seat (1), the grooves (10) are of C-shaped groove body structures, a C-shaped rod (11) is located in the grooves (10), and springs (12) are arranged between the C-shaped rod (11) and groove walls of the grooves (10).

4. A power board heat dissipating structure according to claim 1, wherein: the sliding grooves are formed in the two opposite sides of the clamping seat (1), the sliding grooves are in sliding fit with the inserting blocks (8), the threaded rods (9) are in threaded fit with the two opposite sides of the clamping seat (1), one ends of the threaded rods (9) are located in the sliding grooves, and one ends of the threaded rods (9) located in the sliding grooves are in running fit with the inserting blocks (8).

5. A power board heat dissipating structure according to claim 1, wherein: the power board (2) is contacted with the first vapor chamber (3), the second vapor chamber (4) is contacted with the bottom in the clamping seat (1), and a plurality of heat dissipation fins (6) are arranged on the inner sides of the first vapor chamber (3) and the second vapor chamber (4).

6. A power board heat dissipating structure according to claim 1, wherein: a plurality of air openings (14) are formed in the side face of the clamping seat (1).