KR100660388B1 - Cooler assembly - Google Patents

Abstract

The present invention relates to a cooler assembly for cooling one or more circuit boards inserted into a parallel slot by a refrigerant, the heat absorbing part for absorbing heat, a base plate on which the heat radiating part is installed, and a plate for elastically supporting the heat radiating part to the base plate. LM block provided with a unit block including a spring structure and the unit block facing each circuit board, the unit block is installed and operated back and forth so that the heat dissipation portion of the unit block is detached from the circuit board, and the inlet and outlet manifold for circulating the refrigerant And a refrigerant tube connecting the manifold of the LM block and the heat dissipation unit of each unit block to circulate the refrigerant inside the heat dissipation unit through the outflow manifold. According to the present invention, since the heat radiating portion and the tube cooling the plurality of boards inserted in the parallel slots are interlocked with each other, the heat radiating portion can be easily detached from the board regardless of the length of the refrigerant tube. In addition, the use of the leaf spring structure that can be deflected up, down, left, and right, there is an advantage that even if the alignment state of some of the board and / or unit block is misaligned, it is possible to maintain the close contact state of the board and the heat dissipation unit.

Cooler, Cooling, Refrigerant, Leaf Spring, Heat Sink

Description

Cooler Assembly {COOLER ASSEMBLY}

1A to 1C are a perspective view, a front view, and a rear view, respectively, of a unit block in which a heat dissipation unit for absorbing heat corresponding to one circuit board is installed according to a preferred embodiment of the present invention;

Figure 2 is an assembled state of the heat dissipation unit and the leaf spring structure of Figures 1a to 1c.

3A to 3C are a perspective view, a front view, and a plan view, respectively, of a cooler assembly in which a plurality of unit blocks are coupled according to a preferred embodiment of the present invention.

4 is a perspective view of an LM block with a manifold attached in accordance with a preferred embodiment of the present invention.

Figure 5 is a photograph of the completed form of the cooler assembly according to a preferred embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

100: unit block 110: heat dissipation unit

120: base plate 130: leaf spring

140: connecting rod 150: tube fitting

160: guide groove 170: washer

210: LM block 220: manifold

230: cylinder block 240: LM guide

250: pusher bar 260: pusher shaft

270: cylinder 280: floating joint

290: Stopper

The present invention relates to a cooler, and more particularly, to a cooler assembly designed to efficiently cool a plurality of boards inserted in a parallel slot such as a semiconductor tester and to be easily removed when replacing a board.

In response to the high speed and large capacity of the memory, the semiconductor tester tests a plurality of memories simultaneously through parallel processing in a high speed test environment. To this end, the semiconductor tester has a plurality of pattern generation boards that generate a test pattern signal and compare the test results with a target value, and a plurality of power drive boards that provide the power required for the test are inserted in parallel slots. do.

By the way, in these circuit boards (circuit boards), various semiconductor elements and circuit components are mounted in order to perform the above-mentioned function, and considerable heat generate | occur | produces because of a high speed operation environment. Moreover, since these boards are densely arranged in a limited space, water-cooled coolers with excellent cooling capability are commonly used. The water-cooled cooler uses a cooling cycle or a heat pipe principle, and includes, for example, a refrigerant tank for storing refrigerant, a radiator for dissipating heat, a circulation pump for circulating the refrigerant, a heat dissipation unit that absorbs heat in close contact with a board or a semiconductor element. And a tube constituting the refrigerant circulation path. For example, a heat dissipation unit and a tube are installed inside a device such as a semiconductor tester, and are connected to a refrigerant tank, a radiator, a circulation pump (which may be integrally manufactured) and a tube installed in an external separate space.

As such, unlike a conventional air-cooled cooler, a tube for refrigerant circulation must be separately installed inside the semiconductor tester, and a heat dissipation part must be completely adhered to each circuit board to obtain higher cooling efficiency.

However, in many circuit boards arranged in a narrow space such as a semiconductor tester, it is quite difficult to fix or detach the heat dissipation portion to the circuit board while the tube is connected. For example, when a part of the board is to be replaced due to a bad board, since the tube length is not large due to the space constraint between the boards, the distance from which the heat sink can be separated from the board is not limited, Excessive force may be applied to the connection of the tube. In addition, in the conventional case, since the heat dissipation parts are individually removed for each board, there was also a disadvantage in that a considerable amount of time was consumed when the cooler was replaced or the board was replaced.

In order to solve the above problems, the present invention provides a cooler assembly that can easily attach and detach the heat dissipation unit from the plurality of boards inserted in the parallel slots, such as a semiconductor tester, and firmly maintain the close contact between the heat dissipation unit and the board. The purpose is to provide.

In order to achieve the above object, according to an aspect of the present invention, a cooler assembly for cooling one or more circuit boards inserted in a parallel slot by a refrigerant, a heat sink for absorbing heat, a base plate on which the heat sink is installed; A unit block including a leaf spring structure to elastically support the heat radiating portion to the base plate, and the unit block is installed to face each circuit board, and the heat radiating portion of the unit block is moved back and forth to be detached from the circuit board, and the refrigerant And an LM block having an outlet manifold for circulating the refrigerant, and a refrigerant tube connecting the manifold of the LM block to the heat dissipation unit of the unit block, and circulating the refrigerant inside the heat dissipating unit through the outlet manifold. It is done.

At this time, the heat radiating portion of the unit block may be elastically supported so as to be able to deflect up and down and left and right by the leaf spring structure. In addition, the base plate of the unit block is bent along the left and right directions so that the center portion protrudes toward the circuit board, the heat radiating portion may be located in the center portion of the base plate.

In addition, the base plate of the unit block may be formed with a guide groove for accommodating the rear surface of the heat radiating portion is deflected to the left and right by the leaf spring structure extending in the left and right directions.

The leaf spring structure of the unit block may include: a plurality of leaf springs contacting a rear surface of the heat dissipation part at upper and lower sides of the guide groove; For each leaf spring, one end may be retractably supported on the rear surface of the base plate, and the other end may include a connecting rod fixed through the base plate and fixed at the contact point of the leaf spring and the radiator.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings, and like reference numerals refer to like or similar components throughout the drawings. In addition, below, close contact with a circuit board includes the case where it adhere | attaches with the semiconductor chip provided in the circuit board like a normal case.

1A to 1C are respectively a perspective view, a front view, and a rear view of a unit block in which a heat dissipation unit for absorbing heat corresponding to one circuit board is installed according to a preferred embodiment of the present invention, and FIG. 2 is FIGS. 1A to 1C. The heat dissipation portion and the assembled state of the leaf spring structure is shown in detail.

As shown, the unit block 100 according to a preferred embodiment of the present invention consists of a heat dissipation unit 110, a base plate 120, a leaf spring 130, the connecting rod 140.

First, the heat dissipation unit 110 has a refrigerant circulated therein, and contacts the front surface of the semiconductor chip mounted on the board to transfer heat of the semiconductor chip to the refrigerant. The heat dissipation unit 110 is made of a metal material having excellent thermal conductivity, and has a pattern for improving the heat transfer area and inducing turbulent flow of the refrigerant.

On the other hand, the inside of the heat dissipating unit 110 is filled with a predetermined volume of refrigerant, at least a portion of the rear surface of the heat dissipating unit 110 protrudes along the left and right directions to secure the internal space. In addition, an outlet inlet for circulation of the coolant is formed at left and right sides of the heat dissipation unit 110, and a tube fitting 150 for connecting the coolant tube is fastened. In addition, the rear of the heat dissipation unit 110 is formed with a screw groove for fastening the pair of connecting rods 140 up and down.

The base plate 120 is formed in an extended form along the left and right directions, and is bent along the left and right directions so that the center portion protrudes toward the board positioned at the front side, and the heat dissipation portion 110 is positioned at the protruding center portion. In addition, the base plate 120 is formed with a guide groove 160 having a width that can accommodate the protruding rear surface of the heat dissipation unit 110 in the left and right directions, even if the heat dissipation unit 110 is not aligned with the board. The heat dissipation unit 110 may be inclined to the left or the right to be inclined to closely contact the board.

The leaf spring 130 and the connecting rod 140 form a leaf spring structure that elastically supports the heat dissipation unit 110 to the base plate. The leaf springs 130 are respectively installed on upper and lower sides of the guide groove 160, and the protrusions contact the rear surface of the heat dissipation unit 110. The protrusion of the leaf spring 130 is formed with a through hole for fastening the connecting rod 140 to the rear of the heat dissipation unit.

The connecting rod 140 is inserted through the through hole of the base plate 120 in a state in which the washer 170 is fastened to one end thereof, and the other end thereof is formed with a screw thread so that the contact point between the plate spring 130 and the heat dissipation unit 110 ( Corresponding to the protrusion of the leaf spring 130).

On the other hand, as the washer 170 is fastened to one end of the connecting rod 140, the connecting rod can be retracted from the rear of the base plate 120 as the leaf spring 130 is compressed, even if the leaf spring 130 is extended Since it is supported by the washer 170, the position of the heat dissipation part 110 can be maintained within a predetermined distance corresponding to the connecting rod length from the plate.

3A to 3C are, respectively, a perspective view, a front view, and a plan view of a cooler assembly in which one or more unit blocks are coupled in accordance with a preferred embodiment of the present invention, and FIG. 4 is a diagram illustrating detaching an LM block to which a manifold is attached from the cooler assembly. It is shown.

As shown, the cooler assembly according to a preferred embodiment of the present invention is one or more unit block 100, LM block 210, manifold 220, cylinder block 230, LM guide 240, pusher bar 250, a pusher shaft 260, a cylinder 270, a joint 280, and a stopper 290.

First, the LM block (Linear Motion Block) 210 accommodates a plurality of unit blocks 100 side by side, the heat dissipation portion of the unit block installed in the LM block is opposed to each circuit board. The LM block 210 is configured to be linearly movable back and forth on the LM guide 240. Accordingly, the heat dissipation unit of the unit block 100 may be in close contact with or separated from the circuit board by the front and rear operation of the LM block, and as described above, the close contact state is firmly maintained by the plate spring structure of the unit block.

The manifold 220 is installed at the lower portion of the manifold 220 so as to be able to operate back and forth together with the LM block 210. As illustrated in FIG. 4, the manifold 220 is provided with a refrigerant outlet inlet corresponding to each unit block 100. The manifold 220 has a flow path for supply / recovery of refrigerant along the longitudinal direction therein, and is connected to an external device such as a refrigerant tank, a radiator, a circulation pump, and the like by a tube, so that each unit block ( The refrigerant is circulated in the heat radiating portion of 100).

Meanwhile, although not shown in FIGS. 3A to 3C, each of the refrigerant outlet inlets of the manifold 220 and the heat dissipation unit of the corresponding unit block is connected to the refrigerant tube. Fittings are installed.

The cylinder block 230 partitions both front and left and right sides of the cooler assembly according to a preferred embodiment of the present invention, and an inner side surrounded by the cylinder block is provided with an LM block 210 in which a unit block is installed, as shown. The in front portion is provided with a mechanism for driving the LM block back and forth.

The LM guide 240 is installed on the inner wall of the left and right cylinder block 230 and guides the LM block 210 to linearly move forward and backward.

Next, in relation to the drive mechanism, the pusher bar 250, the pusher shaft 260 and the floating joint 280 constitute a link portion that transmits the driving force of the cylinder 270 to the LM block 210. That is, the pusher bar 250 is connected to the left and right LM blocks 210 and extends forward through the through holes of the front cylinder block 230. The pusher shaft 260 is connected to the left and right sides of the front end of the pusher bar 250 on both sides, and a floating joint 280 is provided at the center thereof.

The cylinder 270 is installed at the outer center of the front cylinder block 230, and drives the shaft back and forth by, for example, pneumatic pressure, and the shaft is connected to the floating joint 280. Accordingly, when the cylinder 270 is operated, the driving force is applied to the floating joint 280, so that the pusher shaft 260, the pusher bar 250, and the LM block 210 work together.

The stopper 290 limits the operating range of the pusher bar 250 connected to the shaft of the cylinder 270 so that the circuit board and the unit block do not collide by the forward or backward of the LM block. That is, the stopper 290 limits the operating range of the pusher bar 250 so that the front and rear working distance of the LM block is within the distance between the circuit boards.

Figure 5 shows the completed form of the cooler assembly according to a preferred embodiment of the present invention.

As shown in the drawing, a parallel slot for inserting a circuit board is disposed at the bottom of the cooler assembly according to a preferred embodiment of the present invention, and the board can be inserted or removed with the unit block retracted by driving a cylinder. have. Once the board is inserted, the LM block can be advanced to get in close contact with the circuit board. On the other hand, since the heat radiating portion of the unit block and the manifold connected thereto operate in conjunction with each other, no external force is applied to the tube connecting the radiating portion and the manifold.

Although the preferred embodiment according to the present invention has been described above, this is merely exemplary and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the protection scope of the present invention should be defined by the following claims.

As described above, according to the present invention, since the heat radiating portion and the tube for cooling the plurality of boards inserted in the parallel slots are interlocked with each other, the heat radiating portion can be easily detached from the board regardless of the length of the refrigerant tube. have. In addition, since the heat dissipation unit can be detachably attached to the entire board, there is an advantage that time and effort can be reduced as compared with attaching the heat dissipation unit for each board.

Further, the present invention has the advantage that by using the plate spring structure that can be deflected up and down, left and right, even if the alignment state of some boards and / or unit blocks are misaligned, the board and the heat dissipation unit can be maintained tightly.

Claims (6)

A cooler assembly that cools one or more circuit boards inserted into parallel slots by a refrigerant. A unit block including a heat dissipation unit for absorbing heat, a base plate on which the heat dissipation unit is installed, and a leaf spring structure for elastically supporting the heat dissipation unit on the base plate; An LM block provided with the unit block facing each circuit board, the LM block having an inflow and outflow manifold for circulating the refrigerant so that the heat radiating portion of the unit block is detached from the circuit board; A refrigerant tube connecting the manifold of the LM block and the heat dissipation unit of each unit block to circulate the refrigerant inside the heat dissipation unit through the inflow and outflow manifold. Cooler assembly comprising a. The heat dissipation unit of claim 1, wherein the heat dissipation unit of the unit block is formed. Cooler assembly characterized in that it is elastically supported so as to be deflectable up and down and left and right by the leaf spring structure. The method of claim 2, The base plate of the unit block is bent along the left and right directions so that the center portion protrudes toward the circuit board, the heat dissipation unit is characterized in that located in the center of the base plate. According to claim 2, wherein the base plate of the unit block And a guide groove accommodating the rear surface thereof extends in the left and right directions when the heat radiating portion is deflected from side to side by the leaf spring structure. The leaf spring structure of claim 4, wherein the leaf spring structure of the unit block A plurality of leaf springs contacting the rear surface of the heat dissipation unit at both upper and lower sides of the guide groove; For each leaf spring, one end is retractably supported at the rear of the base plate, and the other end penetrates the base plate and is fixed at the contact point of the leaf spring and the heat radiating part. Cooler assembly comprising a. The method according to any one of claims 1 to 5, With cylinder working back and forth, A link unit for transmitting the back and forth operating force of the cylinder to the LM block; Stopper for limiting the operating range of the LM block so that the circuit board and the unit block does not collide by the retraction of the LM block Cooler assembly further comprising.

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