CN212229587U

CN212229587U - Liquid cooling heat radiator

Info

Publication number: CN212229587U
Application number: CN202020820079.3U
Authority: CN
Inventors: 李俊宇
Original assignee: Shenzhen Wanjinghua Technology Co ltd
Current assignee: Shenzhen Wanjinghua Technology Co ltd
Priority date: 2020-05-15
Filing date: 2020-05-15
Publication date: 2020-12-25
Anticipated expiration: 2030-05-15

Abstract

The utility model belongs to the technical field of the computer heat dissipation, more specifically say, relate to a liquid cooling heat abstractor. The heat absorption assembly comprises a heat exchange water tank and a heat absorption base, the heat exchange water tank is arranged between the upper water tank and the lower water tank and is communicated with the radiating pipes, the heat absorption base is connected to the bottom of the heat exchange water tank, the bottom surface of the heat absorption base is contacted with a heating structure on a display card, and the top surface of the heat absorption base is contacted with a refrigerant in the heat exchange water tank; the water pump is arranged at the outer side part of the upper water tank and is used for driving the refrigerant to flow among the upper water tank, the heat exchange water tank and the lower water tank through the radiating pipe. The heat exchange water tank is directly connected in series between the upper water tank and the lower water tank through the radiating pipe, an extra heat conduction pipe set is not required to be arranged between the heat exchange water tank and the cold bar to convey the refrigerant, the radiating device is compact in structure, small in occupied space and capable of meeting the miniaturization development requirement of the computer.

Description

Liquid cooling heat radiator

Technical Field

The utility model belongs to the technical field of the computer heat dissipation, more specifically say, relate to a liquid cooling heat abstractor.

Background

With the continuous development of computer technology, the performance of computer equipment is rapidly improved, and the energy consumption of the whole system is also increased rapidly. The computer has the advantages that the energy consumption is increased, the dissipation power of the computer is increased, the requirement of a computer system on heat dissipation is increased, in the using process of the computer, if the heat generated by the system cannot be dissipated in time, the computer is jammed in a light state, and the computer is halted in a heavy state, so that the performance of computer equipment is seriously influenced, and the service life of the computer is shortened. In particular, in a computer main body, heat generated by a high-power semiconductor device may cause a temperature rise of a chip such as a display card chip, and if a proper heat dissipation measure is not taken, the temperature of the chip may exceed an allowable maximum temperature, thereby causing performance deterioration and damage of the device such as the display card.

In the prior art, a radiator commonly used for radiating a display card generally comprises a cold water head, a cold row and a heat conduction pipe group for connecting the cold water head and the cold row, when the radiator is used, the cold row of the radiator is contacted with a heating structure on the display card, such as a Graphic Processing Unit (GPU), a Metal Oxide Semiconductor (MOS) transistor, a display memory and the like, so as to absorb heat, the water head transfers the heat to the cold row of the radiator through the heat conduction pipe group, and the cold row distributes the heat absorbed by the water head through liquid or air circulation. So, the radiator can effectively dispel the heat to the display card, but, radiator overall structure is scattered relatively, need consider the fixed mounting of a plurality of parts respectively during the installation, and dismouting complex operation, installation occupation space is big, can't satisfy the miniaturized development demand of computer.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the utility model is to provide a liquid cooling heat abstractor to solve the liquid cooling radiator overall structure among the prior art dispersion, the loaded down with trivial details, the big technical problem of installation occupation space of dismouting.

In order to achieve the above object, the utility model adopts the following technical scheme: a liquid-cooled heat sink comprising:

the cold water drain comprises an upper water tank, a lower water tank and a plurality of radiating pipes for communicating the upper water tank with the lower water tank;

the heat absorption assembly comprises a heat exchange water tank and a heat absorption base, the heat exchange water tank is arranged between the upper water tank and the lower water tank and communicated with the radiating pipe, the heat absorption base is connected to the bottom of the heat exchange water tank in a sealing mode, the bottom surface of the heat absorption base is exposed out of the heat exchange water tank and used for being in contact with a heating structure on a display card, and the top surface of the heat absorption base is located in the heat exchange water tank and used for being in contact with a refrigerant in the heat exchange water tank;

and the water pump is arranged at the outer side part of the upper water tank and is used for driving a refrigerant to flow among the upper water tank, the heat exchange water tank and the lower water tank through the radiating pipe.

Furthermore, the upper water tank is provided with a water outlet chamber and a water return chamber which are independent from each other, the water pump is arranged on the upper surface of the upper water tank, which is far away from the radiating pipe, and a water inlet and a water outlet of the water pump are respectively communicated with the water return chamber and the water outlet chamber; the radiating pipe comprises a water outlet pipe and a water return pipe;

the heat exchange water tank is vertically arranged in the flowing direction of the refrigerant, the water outlet pipe at least comprises a first water outlet pipe section and a second water outlet pipe section which are arranged according to the sequence along the flowing direction of the refrigerant, the water return pipe at least comprises a first water return pipe section and a second water return pipe section which are arranged according to the sequence along the flowing direction of the refrigerant, the first water outlet pipe section is communicated with the water outlet chamber and the heat exchange water tank, the second water outlet pipe section is communicated with the heat exchange water tank and the water outlet tank, the first water return pipe section is communicated with the water outlet tank and the heat exchange water tank, and the second water outlet pipe section is communicated with the heat exchange water tank and the water return.

Furthermore, water through holes are formed in the positions of the heat exchange water tank corresponding to the first water outlet pipe section, the second water outlet pipe section, the first water return pipe section and the second water return pipe section, and the first water outlet pipe section, the second water outlet pipe section, the first water return pipe section and the second water return pipe section are respectively communicated with the heat exchange water tank through the corresponding water through holes.

Furthermore, a first partition plate arranged in parallel with the radiating pipe and a second partition plate arranged perpendicular to the radiating pipe are arranged between the heat exchange water tanks, the first partition plate and the second partition plate are arranged in a staggered mode and divide the heat exchange water tanks into a first cavity, a second cavity, a third cavity and a fourth cavity, the first water outlet pipe section is communicated with the water outlet chamber and the first cavity, the second water outlet pipe section is communicated with the second cavity and the lower water tank, the first water return pipe section is communicated with the lower water tank and the third cavity, and the second water return pipe section is communicated with the fourth cavity and the water return chamber;

the top surfaces of the first partition plate and the second partition plate are abutted against the inner top surface of the heat exchange water tank, popular gaps are reserved between the bottom surfaces of the first partition plate and the second partition plate and the top surface of the heat absorption base, and a refrigerant in the heat exchange water tank flows in a circulating mode among the first cavity, the second cavity, the third cavity and the fourth cavity through the popular gaps.

Furthermore, a plurality of radiating fins which are arranged in an array mode are convexly arranged on the top surface of the heat absorption base, and the end parts, far away from the heat absorption components, of the radiating fins extend into the popular gaps and are in contact with the refrigerant in the heat exchange water tank.

Further, the heat absorption assembly further comprises a heat exchange bottom plate, the heat exchange bottom plate is connected between the heat absorption base and the heat exchange water tank in a sealing mode, a through hole for the heat dissipation fins to penetrate in an adaptive mode is formed in the position, corresponding to the heat dissipation fins, of the heat exchange bottom plate, the through hole is communicated with the heat exchange water tank, and the heat dissipation fins penetrate through the through hole and then extend into the heat exchange water tank.

Furthermore, the heat absorption assembly further comprises a connecting piece detachably connected to the heat exchange bottom plate, and a stud bolt used for being fixed with the display card in a threaded manner is arranged on the connecting piece in an upward protruding mode.

Furthermore, the liquid cooling heat dissipation device comprises a plurality of groups of heat absorption assemblies which are arranged in series along the flowing direction of the refrigerant, and the heat absorption base of each heat absorption assembly is respectively used for contacting with different heating structures on the display card so as to exchange heat generated by each heating structure.

Furthermore, the radiating pipes are arranged in parallel at intervals, a radiating gap is formed between every two adjacent radiating pipes, a plurality of radiating fins which are uniformly distributed along the flowing direction of the refrigerant are arranged in the radiating gap, and the radiating fins in the same radiating gap are arranged at an angle to form a plurality of ventilation holes.

Furthermore, the liquid cooling heat dissipation device further comprises a fan assembly, the fan assembly comprises an air guide cover and a heat dissipation fan arranged on the air guide cover, the cold air duct further comprises two side plates which are oppositely arranged and fixedly connected between the upper water tank and the lower water tank, the heat dissipation pipe is positioned between the two side plates, two opposite side parts of the air guide cover are respectively connected with the two side plates, and the heat dissipation fan is arranged at the top of the heat dissipation pipe, which is far away from the display card.

The utility model provides an above-mentioned one or more technical scheme in the liquid cooling heat abstractor have one of following technological effect at least: during the use, will cool the row and install on the display card to make heat absorption base and the last heating structure of display card contact such as GPU, MOS pipe and display memory, the heat that GPU, MOS pipe and display memory produced can be absorbed by the heat absorption base, and the refrigerant contacts with the heat absorption base and takes away the absorptive heat of heat absorption base when flowing through heat transfer water tank, thereby dispels the heat to the display card. So, through integrated setting heat absorption subassembly on the cold row, the heat transfer water tank of heat absorption subassembly is direct to be established ties between the upper water tank of cold row and lower water tank through the cooling tube, the refrigerant can directly flow through heat transfer water tank and heat absorption base through the cooling tube and carry out the heat transfer under the drive of water pump, need not to set up extra heat pipe group between heat transfer water tank and the cold row and carry the refrigerant, heat abstractor compact structure, occupation space is little during the use, can satisfy the miniaturized development demand of computer, and, only need during the installation heat abstractor with the cold row with the display card fixed can, dismouting operation loudness is simple.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.

Fig. 1 is a schematic structural view of a liquid-cooled heat dissipation device according to an embodiment of the present invention;

fig. 2 is a schematic structural view of the liquid-cooled heat dissipation device shown in fig. 1 when mounted on a display card;

FIG. 3 is an exploded view of the structure shown in FIG. 2;

FIG. 4 is an exploded view of the liquid-cooled heat sink of FIG. 1;

FIG. 5 is a cut-away view of the liquid-cooled heat sink shown in FIG. 1;

fig. 6 is a schematic diagram illustrating the flow of the refrigerant of the liquid-cooled heat dissipation device shown in fig. 1;

FIG. 7 is a schematic diagram of a heat sink assembly of the liquid-cooled heat sink of FIG. 1;

fig. 8 is a sectional view of the structure taken along line a-a in fig. 7.

Wherein, in the figures, the respective reference numerals:

10-cold water outlet 11-upper water tank 12-lower water tank

13-radiating pipe 14-radiating fin 15-side plate

20-heat absorption component 21-heat exchange water tank 22-heat absorption base

23-heat exchange bottom plate 24-connecting piece 25-support plate

30-water pump 31-shell 32-driving body

40-fan assembly 41-wind guide cover 42-radiating fan

100-display card 101-board body 102-GPU

103-video memory 104-MOS tube 111-water outlet chamber

112-return chamber 131-outlet pipe 132-return pipe

133-heat dissipation gap 134-vent 211-water through hole

212-first partition 213-second partition 214-first cavity

215-second cavity 216-third cavity 217-fourth cavity

221-heat sink 231-through hole 232-first embedded groove

233-second insert groove 241-stud 251-insert hole

1111-water injection hole 1112-water outlet hole 1311-first water outlet pipe section

1312-a second outlet pipe section 1321-a first return pipe section 1322-a second return pipe section.

Detailed Description

In order to make the technical problem, technical scheme and beneficial effect that the utility model will solve more clearly understand, it is right to combine figure 1 ~ 8 and embodiment below the utility model discloses further detailed description proceeds. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

As shown in fig. 1-8, an embodiment of the present invention provides a liquid cooling heat dissipation device, which is used to be installed on a display card 100 for dissipating heat of the display card 100, specifically, as shown in fig. 2 and 3, the display card 100 includes a plate body 101, a GPU102 disposed on one end of the plate body 101, a video memory 103 disposed on the front surface of the plate body 101 and surrounding the GPU102, and a MOS transistor 104 disposed on the front surface of the other end of the plate body 101.

Further, as shown in fig. 1, fig. 2 and fig. 5, the liquid-cooled heat dissipation device includes a cold row 10, a heat absorption assembly 20 and a water pump 30, wherein the cold row 10 is used for absorbing heat by circulating a heat-conducting refrigerant, and the cold row 10 includes an upper water tank 11, a lower water tank 12 and a plurality of heat dissipation pipes 13 communicating the upper water tank 11 and the lower water tank 12; the heat absorption assembly 20 comprises a heat exchange water tank 21 and a heat absorption base 22, the heat exchange water tank 21 is installed between the upper water tank 11 and the lower water tank 12 and communicated with the heat dissipation pipe 13, the heat absorption base 22 is hermetically connected to the bottom of the heat exchange water tank 21, the bottom surface of the heat absorption base 22 is exposed out of the heat exchange water tank 21 and is used for being in contact with a heating structure on the display card 100, such as a GPU102, a MOS tube 104, a video memory 103 and the like, the top surface of the heat absorption base 22 is located in the heat exchange water tank 21 and is used for being in contact with a refrigerant in the heat exchange water tank 21, and in the embodiment, the heat absorption base 22 is a; the water pump 30 is installed at an outer side portion of the upper tank 11 and drives the refrigerant to flow among the upper tank 11, the heat exchange water tank 21, and the lower tank 12 through the heat pipe 13.

The utility model discloses liquid cooling heat abstractor, during the use, install cold row 10 on display card 100 to make the heating structure on heat absorption base 22 and the display card 100 if GPU102, MOS pipe 104 and display deposit contact such as 103, GPU102, MOS pipe 104 and display deposit the heat that produces such as 103 can be absorbed by heat absorption base 22, the refrigerant contacts and takes away the absorptive heat of heat absorption base 22 with heat absorption base 22 when flowing through heat exchange water tank 21, thereby dispels the heat to display card 100. So, through the integrated heat absorption subassembly 20 that sets up on cold row 10, heat exchange water tank 21 of heat absorption subassembly 20 is direct to establish ties between upper water tank 11 and lower water tank 12 of cold row 10 through cooling tube 13, the refrigerant can directly flow through heat exchange water tank 21 and heat absorption base 22 through cooling tube 13 and carry out the heat transfer under water pump 30's drive, need not to set up extra heat pipe group between heat exchange water tank 21 and the cold row 10 and carry the refrigerant, the liquid cooling heat abstractor of this embodiment compact structure, occupation space is little during the use, can satisfy the miniaturized development demand of computer, and, only need during the liquid cooling heat abstractor of installation this embodiment with cold row 10 with display card 100 fixed can, the dismouting loudness of operation is simple.

Further, in this embodiment, after the liquid-cooled heat dissipating device of this embodiment is assembled on the display card 100, the orthographic projection area of the heat absorbing base 22 on the board body 101 exactly corresponds to the orthographic projection area of the heat generating structure of the display card 100, such as the memory 103, etc., on the back of the heat absorbing base 22, that is, the mounting position of the heat absorbing base 22 is approximately opposite to the mounting position of the heat generating structure, so that in the heat conduction process, the shortest conduction distance between the two is ensured, and the heat conduction efficiency is improved.

In another embodiment of the present invention, as shown in fig. 4 and 5, the upper water tank 11 has an outlet chamber 111 and a return chamber 112 that are independent of each other, the water pump 30 is installed on the upper surface of the upper water tank 11 away from the radiating pipe 13, and the water inlet and the water outlet of the water pump 30 are respectively communicated with the return chamber 112 and the outlet chamber 111; the heat pipe 13 includes a water outlet pipe 131 and a water return pipe 132, the water outlet pipe 131 is connected to the water outlet chamber 111 and the water outlet tank 12 for delivering the refrigerant in the water outlet chamber 111 to the water outlet tank 12, and the water return pipe 132 is connected to the water outlet tank 12 and the water return chamber 112 for delivering the refrigerant in the water outlet tank 12 to the water return chamber 112.

Specifically, in this embodiment, as shown in fig. 4, 5 and 6, the upper water tank 11 has a water outlet chamber 111 and a water return chamber 112 that are independent from each other, a water injection hole 1111 for allowing a refrigerant to flow in is disposed on the water outlet chamber 111, and a water outlet hole 1121 for allowing a refrigerant to flow out is disposed on an upper surface of the water return chamber 112 away from the heat dissipation pipe 13; the water pump 30 includes a housing 31 and a driving body 32 installed in the housing 31, the water pump 30 is installed on the upper surface of the upper water tank 11 away from the heat dissipation pipe 13, the driving body 32 is accommodated in the housing 31, a water outlet of the housing 31 is communicated with the water injection hole 1111, a water return port of the housing 31 is communicated with the water outlet hole 1121, a sealing ring (not shown) is disposed at a position where the housing 31 is connected with the upper water tank 11 to prevent the refrigerant from leaking, the water outlet is disposed above the water injection hole 1111, a pipe is not required to be disposed between the water pump 30 and the upper water tank 11, the housing 31 is directly installed on the upper water tank 11, the water pump 30 is integrally installed on the cold bar 10, which is beneficial to realizing the miniaturization design of the liquid cooling heat dissipation device of the present embodiment, and the water pump 30 and the cold bar 10 are fixedly connected into a whole, only, the use is more convenient.

In addition, in the embodiment, the outlet chamber 111 and the return chamber 112 are independent from each other, that is, the outlet chamber 111 and the return chamber 112 are not directly communicated with each other but are only communicated with each other by the heat dissipation pipe 13, so that the refrigerant in the outlet chamber 111 does not have a short flow phenomenon, the water pump 30 is prevented from directly pumping out the refrigerant which has just entered the outlet chamber 111 and has not undergone heat absorption by circulation, and the refrigerant is ensured to complete the heat exchange circulation among the upper water tank 11, the heat exchange water tank 21 and the lower water tank 12 under the driving of the water pump 30.

Further, in the present embodiment, as shown in fig. 5 and fig. 6, the heat exchange water tank 21 is vertically disposed in a flowing direction of the refrigerant, in the present embodiment, a length direction of the heat exchange water tank 21 is perpendicular to the flowing direction of the refrigerant, the water outlet pipe 131 at least includes a first water outlet pipe 1311 and a second water outlet pipe 1312 sequentially disposed along the flowing direction of the refrigerant, and the water return pipe 132 at least includes a first water return pipe 1321 and a second water return pipe 1322 sequentially disposed along the flowing direction of the refrigerant; the first outlet pipe segment 1311 is connected to the outlet chamber 111 and the heat exchange water tank 21 for delivering the refrigerant in the outlet chamber 111 to the heat exchange water tank 21, the second outlet pipe segment 1312 is connected to the heat exchange water tank 21 and the lower water tank 12, for delivering the refrigerant in the heat exchange water tank 21 to the lower water tank 12, the first water return pipe 1321 is connected to the lower water tank 12 and the heat exchange water tank 21, for conveying the refrigerant in the lower water tank 12 to the heat exchange water tank 21, the second outlet pipe 1312 connects the heat exchange water tank 21 and the return chamber 112, and finally conveys the refrigerant in the heat exchange water tank 21 to the return chamber 112, thereby completing the heat exchange cycle of the refrigerant among the water outlet chamber 111, the heat exchange water tank 21, the lower water tank 12 and the water return chamber 112, and ensuring that the refrigerant can flow into and out of the heat exchange water tank 21 under the action of the water pump 30 to exchange heat with the heat absorbing base 22, as shown in fig. 6, wherein the arrows show the flowing direction of the refrigerant.

Further, as shown in fig. 5, 6 and 7, water passing holes 211 are formed at positions of the heat exchange water tank 21 corresponding to the first water outlet pipe 1311, the second water outlet pipe 1312, the first water returning pipe 1321 and the second water returning pipe 1322, in this embodiment, the heat radiating pipe 13 is a flat pipe, the water passing holes 211 are strip-shaped long holes with a size corresponding to that of the heat radiating pipe 13, the first water outlet pipe 1311, the second water outlet pipe 1312, the first water returning pipe 1321 and the second water returning pipe 1322 are respectively communicated with the heat exchange water tank 21 through the corresponding water passing holes 211, specifically, the first water outlet pipe 1311, the second water outlet pipe 1312, the first water returning pipe 1321 and the second water returning pipe 1322 are respectively in fit insertion with the corresponding water passing holes 211, and the insertion positions are further sealed by using a sealant or a sealing ring, so as to prevent the refrigerant from leaking through the insertion gap.

In another embodiment of the present invention, as shown in fig. 6 and 7, a first partition 212 disposed in parallel with the heat dissipation pipe 13 and a second partition 213 disposed in perpendicular to the heat dissipation pipe 13 are disposed between the heat exchange water tanks 21, the first partition 212 and the second partition 213 are disposed alternately and divide the heat exchange water tank 21 into a first cavity 214, a second cavity 215, a third cavity 216 and a fourth cavity 217, the first water outlet pipe 1311 is connected to the water outlet chamber 111 and the first cavity 214, the second water outlet pipe 1312 is connected to the second cavity 215 and the lower water tank 12, the first water return pipe 1321 is connected to the lower water tank 12 and the third cavity 216, and the second water return pipe 1322 is connected to the fourth cavity 217 and the water return chamber 112; the top surfaces of the first partition plate 212 and the second partition plate 213 are both abutted against the inner top surface of the heat exchange water tank 21, a popular gap (not shown) is reserved between the bottom surfaces of the first partition plate 212 and the second partition plate 213 and the top surface of the heat absorption base 22, and the refrigerant in the heat exchange water tank 21 circularly flows among the first cavity 214, the second cavity 215, the third cavity 216 and the fourth cavity 217 through the popular gap. Thus, the first partition plate 212 and the second partition plate 213 are arranged to divide the inner space of the heat exchange water tank 21 into the first cavity 214, the second cavity 215, the third cavity 216 and the fourth cavity 217, and the refrigerant can only circulate among the first cavity 214, the second cavity 215, the third cavity 216 and the fourth cavity 217 through popular gaps or through the radiating pipe 13, so that the popular short circuit of the refrigerant in the heat exchange water tank 21 can be effectively avoided, and the popular heat exchange of the refrigerant is guaranteed, as shown in fig. 5, wherein arrows indicate the flowing direction of the refrigerant.

In another embodiment of the present invention, as shown in fig. 4, 7 and 8, a plurality of radiating fins 221 arranged in an array are protruded from the top surface of the heat absorbing base 22, and the end of the radiating fin 221 away from the heat absorbing assembly 20 extends into the popular gap and contacts with the refrigerant in the heat exchange water tank 21. The plurality of radiating fins 221 are convexly arranged on the top surface of the heat absorption base 22, the plurality of radiating fins 221 are arranged in an array manner, and a flow channel for the circulation of a refrigerant is formed between the radiating fins 221 and the radiating fins 221, so that the heat exchange rate of the refrigerant in the heat absorption base 22 and the heat exchange water tank 21 is increased, and the heat dissipation efficiency of the heat absorption base 22 is improved. In addition, in the present embodiment, the heat absorbing base 22 and the heat dissipating fins 221 are preferably made of aluminum or copper, which provides higher heat exchange efficiency and higher heat dissipation efficiency.

In another embodiment of the present invention, as shown in fig. 4, fig. 7 and fig. 8, the heat absorbing assembly 20 further includes a heat exchanging bottom plate 23, the heat exchanging bottom plate 23 is hermetically connected between the heat absorbing base 22 and the heat exchanging water tank 21, a through hole 231 for the heat sink 221 to pass is provided at a position of the heat exchanging bottom plate 23 corresponding to the heat sink 221, the through hole 231 communicates with the heat exchanging water tank 21, and the heat sink 221 extends into the heat exchanging water tank 21 after passing through the through hole 231. Specifically, the open setting in heat exchange water tank 21's bottom, the concave bottom port adaptation that supplies heat exchange water tank 21 that is equipped with of heat exchange bottom plate 23 inlays the first dress groove 232 that adorns, and the sealed butt of heat exchange water tank 21's bottom port is in first dress groove 232, specifically, be provided with the sealing washer between heat exchange water tank 21's bottom port and the diapire that first dress groove 232, a coolant for sealing heat exchange water tank 21 and avoiding in the heat exchange water tank 21 overflows from the port department, the tank bottom of first dress groove 232 is seted up to through-hole 231, the concave second dress groove 233 that adorns that the adaptation of heat absorption base 22 was inlayed is equipped with in the bottom surface of heat exchange bottom plate 23, heat absorption base 22 seals to inlay and adorns in second dress groove 233, heat absorption subassembly 20 equipment.

Further, in this embodiment, as shown in fig. 4, 7 and 8, the heat absorbing assembly 20 further includes a connecting member 24 detachably connected to the heat exchanging bottom plate 23, a stud 241 for screwing and fixing with the display card 100 is convexly disposed on the connecting member 24, a connecting hole is disposed on the plate body 101 of the display card 100 at a position corresponding to the stud 241, and the connecting member 24 is connected to the plate body 101 through a fastening member such as a screw, so that the liquid-cooled heat dissipating device of this embodiment is mounted on the surface of the plate body 101. Preferably, the two opposite ends of the heat exchange bottom plate 23 are both connected with the connecting pieces 24, and the heat exchange bottom plate 23 is connected with the plate body 101 through the two connecting pieces 24 at the two ends, so that the connection is more stable and reliable.

Furthermore, in the present embodiment, as shown in fig. 4, 7 and 8, the bottom of the heat exchange bottom plate 23 may further be detachably connected with a supporting plate 25, the supporting plate 25 is provided with an embedding hole 251 for the heat absorption base 22 to be embedded, the supporting plate 25 is provided with a limiting hole for the stud 241 to pass through at a position corresponding to the stud 241, and the bottom surface of the heat absorption base 22 is flush with the bottom surface of the supporting plate 25, so as to prevent the heat absorption base 22 from being impacted by external objects due to protrusion, thereby further improving the connection reliability of the heat absorption base 22.

In another embodiment of the present invention, as shown in fig. 4, 5 and 6, the liquid cooling heat dissipation device includes a plurality of heat absorption assemblies 20 connected in series along the flowing direction of the refrigerant, and the heat absorption bases 22 of the heat absorption assemblies 20 are respectively used for contacting different heat generating structures on the display card 100 for exchanging heat generated by the heat generating structures. As shown in fig. 2, 5 and 6, in the present embodiment, two sets of heat absorbing assemblies 20 are disposed at intervals along the refrigerant flowing direction, wherein the heat absorbing base 22 of one set of heat absorbing assembly 20 is in contact with the GPU102 for absorbing heat generated by the GPU102, and the heat absorbing base 22 of the other set of heat absorbing assembly 20 is in contact with the MOS tube 104 for absorbing heat generated by the MOS tube 104, so that two or more sets of heat absorbing assemblies 20 are disposed to correspondingly absorb heat of the heat generating structures at different positions on the display card 100, and the heat dissipation effect of the display card 100 is better.

Further, in the present embodiment, as shown in fig. 6 and 7, when n sets of heat absorbing assemblies 20 are connected in series to the cold row 10, the heat exchange water tanks 21 corresponding to the n sets of heat absorbing assemblies 20 divide the water outlet pipe 131 into n +1 sections, and divide the water return pipe 132 into n +1 sections, so as to ensure that the refrigerant smoothly flows into each heat exchange water tank 21.

In this embodiment, it can be understood that, in order to ensure the heat dissipation effect of the multiple sets of heat absorbing assemblies 20 on different heat generating structures on the display card 100, each heat absorbing assembly 20 should be provided with at least the heat exchange water tank 21 and the heat absorbing base 22, and other components such as the heat exchange bottom plate 23 and the support plate 25 can be selectively arranged according to specific arrangement requirements.

In another embodiment of the present invention, as shown in fig. 3, fig. 4 and fig. 5, each heat dissipation tube 13 is disposed in parallel at intervals, a heat dissipation gap 133 is formed between two adjacent heat dissipation tubes 13, a plurality of heat dissipation fins 14 are disposed in the heat dissipation gap 133 and uniformly disposed along the flow direction of the refrigerant, the heat dissipation fins 14 are disposed in the heat dissipation gap 133 to increase the heat dissipation area of the cold row 10, and each heat dissipation fin 14 in the same heat dissipation gap 133 is disposed at an angle to form a plurality of ventilation holes 143, so that the air passes through the ventilation holes 143 to perform air cooling heat dissipation, thereby further improving the heat dissipation effect.

Further, as shown in fig. 1, fig. 3 and fig. 5, the liquid-cooled heat dissipation apparatus further includes a fan assembly 40, the fan assembly 40 includes an air guiding cover 41 and a heat dissipation fan 42 installed on the air guiding cover 41, the cold row 10 further includes two side plates 15 oppositely disposed and fixedly connected between the upper water tank 11 and the lower water tank 12, the heat dissipation pipe 13 is located between the two side plates 15, two opposite side portions of the air guiding cover 41 are respectively connected with the two side plates 15, the air hood is covered above the cold row 10 and forms an air circulation channel with the cold row 10 at an interval, and the heat dissipation fan 42 is disposed on the top of the heat dissipation pipe 13 away from the graphics card 100. In this way, the heat generated by the heating structures such as the GPU102, the video memory 103, the MOS tube 104, and the like of the display card 100 during operation can be transferred to the cold row 10 by the exchange of the refrigerant, and the heat dissipation fan 42 is started to accelerate the speed of the air flowing in the ventilation hole 143, so as to perform air-cooling heat dissipation on the cold row 10, and then combine the air-cooling heat dissipation on the basis of the liquid-cooling heat dissipation, thereby more effectively improving the heat dissipation effect of the liquid-cooling heat dissipation apparatus of the present embodiment.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. A liquid-cooled heat sink, comprising:

2. The liquid-cooled heat sink of claim 1, wherein: the upper water tank is provided with a water outlet chamber and a water return chamber which are independent from each other, the water pump is arranged on the upper surface of the upper water tank, which is far away from the radiating pipe, and the water inlet and the water outlet of the water pump are respectively communicated with the water return chamber and the water outlet chamber; the radiating pipe comprises a water outlet pipe and a water return pipe;

3. The liquid-cooled heat sink of claim 2, wherein: and water passing holes are formed in the positions of the heat exchange water tank corresponding to the first water outlet pipe section, the second water outlet pipe section, the first water return pipe section and the second water return pipe section, and the first water outlet pipe section, the second water outlet pipe section, the first water return pipe section and the second water return pipe section are respectively communicated with the heat exchange water tank through the corresponding water passing holes.

4. The liquid-cooled heat sink of claim 2, wherein: a first partition plate arranged in parallel with the radiating pipe and a second partition plate arranged perpendicular to the radiating pipe are arranged between the heat exchange water tanks, the first partition plate and the second partition plate are arranged in a staggered mode and divide the heat exchange water tanks into a first cavity, a second cavity, a third cavity and a fourth cavity, the first water outlet pipe section is communicated with the water outlet chamber and the first cavity, the second water outlet pipe section is communicated with the second cavity and the lower water tank, the first water return pipe section is communicated with the lower water tank and the third cavity, and the second water return pipe section is communicated with the fourth cavity and the water return chamber;

5. The liquid-cooled heat sink of claim 4, wherein: the heat absorption base is provided with a plurality of radiating fins which are arranged in an array manner, and the end parts of the radiating fins, far away from the heat absorption component, extend into the popular gaps and are in contact with the refrigerant in the heat exchange water tank.

6. The liquid-cooled heat sink of claim 5, wherein: the heat absorption assembly further comprises a heat exchange bottom plate, the heat exchange bottom plate is connected between the heat absorption base and the heat exchange water tank in a sealing mode, a through hole for the heat dissipation plate to penetrate in an adaptive mode is formed in the position, corresponding to the heat dissipation plate, of the heat dissipation plate, the through hole is communicated with the heat exchange water tank, and the heat dissipation plate penetrates through the through hole and then extends into the heat exchange water tank.

7. The liquid-cooled heat sink of claim 6, wherein: the heat absorption assembly further comprises a connecting piece detachably connected to the heat exchange bottom plate, and a stud bolt used for being fixed with the display card in a threaded manner is arranged on the connecting piece in an upward protruding mode.

8. The liquid-cooled heat dissipating device according to any one of claims 1 to 7, wherein: the liquid cooling heat dissipation device comprises a plurality of groups of heat absorption assemblies which are arranged in series along the flowing direction of a refrigerant, and the heat absorption base of each heat absorption assembly is respectively used for being in contact with different heating structures on the display card and exchanging heat generated by each heating structure.

9. The liquid-cooled heat dissipating device according to any one of claims 1 to 7, wherein: the radiating pipes are arranged in parallel at intervals, a radiating gap is formed between every two adjacent radiating pipes, a plurality of radiating fins which are uniformly distributed along the flowing direction of a refrigerant are arranged in the radiating gap, and the radiating fins in the same radiating gap are arranged at an angle to form a plurality of ventilation holes.

10. The liquid-cooled heat dissipating device according to any one of claims 1 to 7, wherein: the liquid cooling heat dissipation device further comprises a fan assembly, the fan assembly comprises an air guide cover and a heat dissipation fan arranged on the air guide cover, the cold air duct further comprises two side plates which are oppositely arranged and fixedly connected between the upper water tank and the lower water tank, the heat dissipation pipe is arranged between the two side plates, two opposite side parts of the air guide cover are respectively connected with the two side plates, and the heat dissipation fan is arranged at the top of the heat dissipation pipe, which is far away from the display card.