CN216982358U - Liquid cooling machine box - Google Patents

Abstract

The utility model relates to a liquid-cooled chassis, which comprises a chassis shell, an upper plug-in board, a lower plug-in board and a liquid-cooled module, wherein the upper plug-in board, the lower plug-in board and the liquid-cooled module are accommodated in the chassis shell; each of the liquid cooling module and the at least one computing module is provided with a liquid inlet, a liquid storage box and a liquid outlet; the lower plug-in board and the upper plug-in board are provided with cavities, the liquid outlet or the liquid inlet of the liquid cooling module is respectively communicated with the cavities of the lower plug-in board or the upper plug-in board, and the liquid inlet or the liquid outlet of each module of at least one computing module is respectively communicated with the cavities of the lower plug-in board or the upper plug-in board. This application liquid cooling machine case is through setting up the liquid cooling module in the quick-witted case to the plug-in components board can realize the independent liquid cooling function of quick-witted case about utilizing, accomplishes quick-witted case liquid cooling modularization and miniaturization, can realize quick assembly and the maintenance of liquid cooling machine case.

Description

Liquid cooling machine box

Technical Field

The utility model relates to the field of cases, in particular to a liquid cooling case.

Background

With the change of science and technology, electronic technology is widely applied and rapidly developed, and more electronic devices are also widely applied. Taking a server as an example, the server is an important component in electronic devices and can mainly provide computing services. Since the server needs to respond to and process the service request, the server should generally have the capability of assuming the service and the security service. In the current big data era, a server generally needs to provide a large amount of data calculation services, and in order to guarantee the normal operation capability of the server, higher heat dissipation efficiency needs to be performed on the server.

However, the conventional air-cooled heat dissipation method cannot ensure higher heat dissipation efficiency, and the liquid-cooled heat dissipation has higher heat dissipation efficiency compared with the air-cooled heat dissipation, but the liquid-cooled heat dissipation has a complicated mechanical structure design and has higher requirements on the processing technology. Some liquid cooling chassis heat dissipation technologies and related products are also emerging in the market, but the technologies are not mature enough. At present, a liquid cooling case is generally provided with a closed fluid channel on the side wall of a case body, and the heat inside the case is taken away through the fluid channel, but the heat cannot be effectively dissipated, and the heat dissipation efficiency is low. Therefore, the existing liquid-cooled cabinet technology still needs to be optimized.

SUMMERY OF THE UTILITY MODEL

Aiming at the technical problems in the prior art, the utility model provides a liquid-cooled chassis which comprises a chassis shell, an upper plug-in board, a lower plug-in board and a liquid-cooled module, wherein the upper plug-in board, the lower plug-in board and the liquid-cooled module are accommodated in the chassis shell; each of the liquid cooling module and the at least one computing module is provided with a liquid storage box, and the liquid storage box is provided with a liquid inlet and a liquid outlet; the lower plug-in board is provided with a cavity, a liquid outlet or a liquid inlet of the liquid storage box of the liquid cooling module is communicated with the cavity of the lower plug-in board, and a liquid inlet or a liquid outlet of the liquid storage box of each computing module of the at least one computing module is communicated with the cavity of the lower plug-in board; and a cavity is arranged in the upper plug-in board, a liquid inlet or a liquid outlet of the liquid storage box of the liquid cooling module is communicated with the cavity of the upper plug-in board, and a liquid outlet or a liquid inlet of the liquid storage box of each computing module of the at least one computing module is communicated with the cavity of the upper plug-in board.

In the liquid cooling case, the liquid cooling module and the liquid storage box of each computing module in the at least one computing module are provided with communicating pipes at the liquid inlet, and the communicating pipes of the liquid inlets are communicated with the cavity of the upper plug-in board or the cavity of the lower plug-in board; and/or the liquid cooling module and the liquid storage box liquid outlet of each calculation module in the at least one calculation module are provided with communicating pipes, and the communicating pipes of the liquid outlets are communicated with the cavity of the upper plug-in board or the cavity of the lower plug-in board.

As above liquid cooling machine case, the liquid cooling module includes heat conduction structure, and it includes the refrigeration piece, the heat absorbing surface of refrigeration piece with the stock solution box of liquid cooling module contacts.

The liquid cooling machine case as described above, the heat conducting structure includes a heat conducting block, and the heat radiating surface of the refrigeration sheet is connected with the case shell through the heat conducting block.

The liquid cooling machine box is characterized in that a heat insulation pad is arranged around the refrigerating sheet and is annular so as to separate the heat conduction block from the liquid storage box.

According to the liquid cooling case, the liquid storage box in the computing module comprises one or more bosses, and the size of each boss can be in contact with the chip in the computing module.

In the liquid cooling chassis, the liquid storage box in the liquid cooling module has a curved flow channel; and/or a curved flow channel is arranged in the liquid storage box in the at least one computing module.

In the above liquid cooling enclosure, the area occupied by the cavity of the upper plug-in board is greater than one half of the area of the upper plug-in board.

In the above liquid-cooled enclosure, the cavity of the lower card is elongated.

According to the liquid cooling case, the circulating device is arranged on the liquid cooling module; if the liquid outlet of liquid cooling module liquid storage box with the cavity intercommunication of plug-in components board down, the inlet of liquid cooling module liquid storage box with the cavity intercommunication of last plug-in components board, and, the inlet of each calculation module liquid storage box of at least one calculation module with the cavity intercommunication of plug-in components board down, the liquid outlet of each calculation module liquid storage box of at least one calculation module with the cavity intercommunication of last plug-in components board, then circulating device can make coolant liquid in the liquid storage box of liquid cooling module flows into in the cavity of plug-in components board down to respectively behind the liquid storage box of each calculation module, flow in get back to behind the cavity of last plug-in components board in the liquid storage box of liquid cooling module.

This application liquid cooling machine case is through setting up the liquid cooling module in the quick-witted incasement to the plug-in components board can realize the independent liquid cooling function of quick-witted case about utilizing, accomplishes quick-witted case liquid cooling modularization and miniaturization, can realize the independent assembly and the maintenance of a plurality of liquid cooling machine casees in the rack.

Drawings

Preferred embodiments of the present invention will now be described in further detail with reference to the accompanying drawings, in which:

FIG. 1 is a schematic view of a liquid-cooled enclosure according to one embodiment of the present application;

FIG. 2 is an exploded view of a liquid-cooled enclosure according to one embodiment of the present application;

FIG. 3 is a schematic view of a patch panel according to one embodiment of the present application;

FIG. 4 is an exploded view of a patch panel according to one embodiment of the present application;

FIG. 5 is a schematic view of a liquid cooling module according to one embodiment of the present application;

FIG. 6 is an exploded view of a liquid cooling module according to one embodiment of the present application;

FIG. 7 is a schematic diagram of a calculation module according to one embodiment of the present application; and

FIG. 8 is an exploded view of a computing module according to one embodiment of the present application.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the following detailed description, reference is made to the accompanying drawings that form a part hereof and in which is shown by way of illustration specific embodiments of the application. In the drawings, like numerals describe substantially similar components throughout the different views. Various specific embodiments of the present application are described in sufficient detail below to enable those skilled in the art to practice the teachings of the present application. It is to be understood that other embodiments may be utilized and structural, logical or electrical changes may be made to the embodiments of the present application.

The existing case is usually cooled by air and/or liquid, and the existing air-cooled case has the limitations that the distance from a heating chip of a board card in the case to a radiating fin is long, the thermal resistance of the radiating fin extending to the periphery is large, although the whole area of a cold plate with fins is large, the area capable of effectively realizing the radiating function is limited to the vicinity of the heating chip, and the fin far away from the chip has low utilization rate. If the air-cooled cold plate adopts the temperature-uniforming plate, the problems can be optimized, but compared with the common cold plate, the existing temperature-uniforming plate has the defects of high cost, long processing and maintenance period and temporary difficulty in realizing commercial application. The limitation of the existing liquid cooling machine cases is that the liquid cooling machine cases adopt the liquid cooling pumps outside the machine cases to circularly supply liquid, a unified external pump body is needed to circularly supply liquid, each liquid cooling machine case in the machine cabinet is in a series connection relationship in the liquid circulation process, once one machine case has a problem or the liquid cooling pumps have a problem, all the liquid cooling machine cases are affected, the heat dissipation functions among the liquid cooling machine cases cannot be mutually independent, and the possibility that the heat dissipation functions of different liquid cooling machine cases in the machine cabinet interfere with each other is increased.

The application provides a novel liquid cooling chassis, which comprises a chassis shell, an upper plug-in board, a lower plug-in board and a liquid cooling module, wherein the upper plug-in board, the lower plug-in board and the liquid cooling module are accommodated in the chassis shell; the liquid cooling module and each calculation module in the at least one calculation module are respectively provided with a liquid storage box, and the liquid storage boxes are provided with liquid inlets and liquid outlets; the lower plug-in board is provided with a cavity, a liquid outlet or a liquid inlet of the liquid storage box of the liquid cooling module is communicated with the cavity of the lower plug-in board, and a liquid inlet or a liquid outlet of each liquid storage box of the at least one computing module is communicated with the cavity of the lower plug-in board; and the upper plug-in board is provided with a cavity, the liquid inlet or the liquid outlet of the liquid storage box of the liquid cooling module is communicated with the cavity of the upper plug-in board, and the liquid outlet or the liquid inlet of the liquid storage box of each computing module of at least one computing module is communicated with the cavity of the upper plug-in board.

According to the embodiment of the application, the liquid cooling module is arranged in the case shell, the computing module which is plugged on the upper plug-in board and the lower plug-in board of the case can be cooled, the liquid cooling module is also plugged on the upper plug-in board and the lower plug-in board of the case, the cavity is arranged in the upper plug-in board and the lower plug-in board, the liquid cooling module and the computing module are both communicated with the cavity of the upper plug-in board and the cavity of the lower plug-in board, the cooling liquid can enter the liquid cooling module from the upper plug-in board for cooling and then enter the lower plug-in board, and then enter the upper plug-in board after entering the computing module for cooling and then enter the liquid cooling module again for cooling, so that the liquid cooling heat dissipation of the computing module can be circulated.

In some embodiments, a liquid storage box liquid inlet of each of the liquid cooling module and the at least one computing module is provided with a communicating pipe, and the communicating pipe of the liquid inlet is communicated with a cavity of the upper plug-in board or the lower plug-in board; and/or a communicating pipe is arranged at the liquid outlet of the liquid storage box of each calculation module in the liquid cooling module and the at least one calculation module, and the communicating pipe of the liquid outlet is communicated with the cavity of the upper plug-in board or the lower plug-in board. The water inlets and the water outlets of the liquid cooling module and the calculation module can be connected with the upper and lower plugboard plates through the connecting pipes, so that cooling liquid can circulate between the liquid cooling module and the calculation module conveniently, and liquid cooling heat dissipation of the calculation module is facilitated.

In some embodiments, the liquid cooling module includes a thermally conductive structure including a cooling fin, a heat absorbing surface of the cooling fin contacting a reservoir of the liquid cooling module. This application liquid cooling module refrigerates through the refrigeration piece to contact the heat-absorbing surface and the stock solution box of refrigeration piece, can cool off the coolant liquid through the liquid cooling module fast, improve cooling efficiency.

In some embodiments, the heat conducting structure includes a heat conducting block, and the heat radiating surface of the refrigeration sheet is connected with the chassis housing through the heat conducting block. Through set up the heat conduction piece on the liquid cooling module to contact with the cooling surface of refrigeration piece, the heat conduction that will refrigerate the piece production that can be quick outside quick-witted case, improves the refrigeration effect of refrigeration piece, thereby can improve the radiating efficiency of quick-witted case.

In some embodiments, a heat insulating pad is disposed around the cooling fins, the heat insulating pad having a ring shape to separate the heat conducting block from the reservoir. Through set up adiabatic pad on the refrigeration piece, can prevent that the heat transfer of refrigeration piece radiating surface from to stock solution box, influencing the refrigeration effect of refrigeration piece to influence quick-witted case radiating efficiency. And the annular arrangement of the heat-insulating pad can not influence the contact between the refrigerating sheet and the liquid storage box, and can not influence the refrigeration of the refrigerating sheet.

In some embodiments, the reservoir in the computing module includes one or more bosses thereon, the bosses being sized to contact the chip in the computing module. Through set up the boss on the stock solution box at computing module, can conduct the heat that the computing module chip gived off to in the stock solution box to take away the heat of conduction by the coolant liquid, thereby can mention the radiating efficiency to the computing module chip.

In some embodiments, a boss can be arranged on the board card of the computing module, the chip is arranged on the boss, and the size of the boss enables the chip to be in surface contact with the liquid storage box, so that heat generated by the chip can be directly conducted to the liquid storage box and taken away by cooling liquid, the direct heat dissipation of the chip is facilitated, and the heat dissipation efficiency is improved.

In some embodiments, the liquid storage box in the liquid cooling module is provided with a bent flow passage; and/or the liquid storage box in at least one calculation module is provided with a bent flow channel, the flow length and the residence time of the cooling liquid in the liquid storage box can be increased by arranging the bent flow channel in the liquid storage box, the cooling liquid can be fully refrigerated and/or the calculation module is cooled, and therefore the heat dissipation efficiency of the case can be improved.

In some embodiments, the area occupied by the cavity of the upper plug-in board is larger than one half of the area of the upper plug-in board, one third of the area of the upper plug-in board or one fourth of the area of the upper plug-in board, and the area of the cavity in the upper plug-in board is made larger, so that the cooling liquid flowing out of the computing module can be radiated to the outside of the chassis in advance through the upper plug-in board, the refrigeration intensity of the refrigeration piece is reduced, and the heat radiation effect is improved.

In some embodiments, the cavity of the lower plug-in board is elongated, and the area of the cavity in the lower plug-in board is made smaller, so that the cooling liquid cooled by the liquid cooling module can enter the computing module after entering the lower plug-in board, thereby reducing the retention time of the cooled cooling liquid in the lower plug-in board, and avoiding the influence of heat of the outside of the chassis or other equipment on the cooling liquid entering the computing module and the heat dissipation of the computing module.

In some embodiments, the liquid cooling module is provided with a circulating device; if the liquid outlet of liquid cooling module liquid storage box and the cavity intercommunication of plug-in components board down, the inlet of liquid cooling module liquid storage box and the cavity intercommunication of last plug-in components board, and, the inlet of each calculation module liquid storage box of at least one calculation module and the cavity intercommunication of plug-in components board down, the liquid outlet of each calculation module liquid storage box of at least one calculation module and the cavity intercommunication of last plug-in components board, then circulating device can make the coolant liquid in the liquid storage box of liquid cooling module flow into under in the cavity of plug-in components board, and behind the liquid storage box of each calculation module respectively, flow into the cavity of last plug-in components board and get back to in the liquid storage box of liquid cooling module. The circulation of cooling liquid between the liquid cooling module and the computing module can be accelerated through the circulating device, the heat dissipation of the computing module is accelerated, and the heat dissipation efficiency of the case can be improved.

Various implementations of the present application are described above by using various embodiments, and the technical solutions of the present application are further described below by using specific embodiments. It should be understood by those skilled in the art that the following descriptions are only provided for facilitating the understanding of the technical solutions of the present application, and should not be used to limit the scope of the present application.

Fig. 1 is a schematic diagram of a liquid-cooled enclosure according to one embodiment of the present application. Fig. 2 is an exploded view of a liquid-cooled enclosure according to one embodiment of the present application.

As shown, the liquid-cooled enclosure 100 includes an enclosure housing 110, an upper board insert 121, a lower board insert 122, and a liquid-cooled module 130. Case housing 110 may be configured to accommodate upper and lower cards and liquid cooling modules; the upper card board 121 and the lower card board 122 include a plurality of guide rails 123, which can be used for the chassis to plug a plurality of computing modules 140; the liquid cooling module 130 is also plugged onto the upper board 121 and the lower board 122, and can cool down the plurality of computing modules 140.

In some embodiments, the upper insert plate 121 and the lower insert plate 122 may also provide containment for the flow of cooling fluid therethrough. In some embodiments, the liquid cooling module cools the cooling liquid, then inputs the cooled cooling liquid into the lower plug-in board or the upper plug-in board, and the cooling liquid enters each computing module through the lower plug-in board or the upper plug-in board, and the cooling liquid can take away the heat of the computing module, then enters the upper plug-in board or the lower plug-in board, enters the liquid cooling module through the upper plug-in board or the lower plug-in board, and is cooled again, so that the waterway circulation of liquid cooling heat dissipation is completed. According to a preferred embodiment of the present application, the upper board 121 may provide a passage for receiving cooling fluid from the computing module, and the lower board 122 may provide a passage for receiving cooling fluid from the liquid-cooled module. In other words, the cooling liquid enters the lower plug-in board after coming out of the liquid cooling module, then enters each calculation module, then enters the upper plug-in board, and finally returns to the liquid cooling module, so that the cooling liquid enters the calculation module from bottom to top and can fully flow through the calculation module, and the heat dissipation efficiency of the calculation module is improved.

In some embodiments, the chassis housing 110 is generally rectangular parallelepiped, which may include a plurality of panels, including, for example: a back panel 101, side panels 102 and 103, and a top panel 104 and a bottom panel 105. In some embodiments, each panel is a single panel or a plurality of panels joined together. In some embodiments, the chassis housing 110 may also include an opening 106 that may be used to accommodate liquid-cooled modules as well as computing modules into and out of the chassis housing 110. In some embodiments, the liquid cooling module and the computing module may conceal the chassis opening 106 when the liquid cooling module and the computing module are plugged into the chassis.

In some embodiments, the panels may be fixedly attached to each other, for example, by welding the panels to each other. In some embodiments, multiple panels may also be removably mounted, for example: bolted or snap-fit, etc. So as to facilitate the later maintenance of the chassis. In some embodiments, chassis housing 110 may further include connection panels 108 and 109, which are disposed on side panels 102 and 103, respectively, and extend outward from the chassis, and may be used to connect the chassis to other equipment (e.g., cabinets, etc.).

In some embodiments, the upper card 121 and the lower card 122 are oppositely disposed on the top plate 104 and the bottom plate 105. In some embodiments, the upper insert 121 and the lower insert 122 may be fixedly connected to the side panels 102 and 103. In some embodiments, the upper insert plate 121 and the lower insert plate 122 may also be fixedly connected to or integrally formed with the top plate 104 and the bottom plate 105, respectively. In some embodiments, the top plate 104 includes a plurality of heat dissipation holes 107, which can receive the airflow directly to the upper board 121, and can cool the cooling liquid in the upper board for heat dissipation, so as to reduce the temperature of part of the cooling liquid in advance, and reduce the working strength of the liquid cooling module. In some embodiments, the base plate 105 may also include a plurality of louvers.

In some embodiments, the liquid cooling module is inserted into the guide rails at the edges of the upper board 121 and the lower board 122, so that the liquid cooling module can contact with the side panel 102 or 103 of the chassis, and the side panel 102 or 103 can conduct heat for the liquid cooling module, thereby improving the cooling efficiency of the liquid cooling module.

In some embodiments, the chassis 100 may further include one or more fans (not shown), which may be disposed between the liquid-cooling module and the side panels 102 or 103, or on the connection board 108 or 109, and may perform air-cooling and heat dissipation for the liquid-cooling module, so as to improve the cooling efficiency of the liquid-cooling module.

In some embodiments, the chassis 100 may further include a backplane 150 disposed in the chassis housing 110, and may be plugged into the liquid cooling module and/or the computing module, and may provide a circuit connection or a communication connection for the liquid cooling module and/or the computing module. In some embodiments, the back plate 150 is connected to the upper and lower connector boards 121, 122 to facilitate connection to liquid cooling and/or computing modules plugged into the upper and lower connector boards 121, 122.

The following describes the structure of the plugboard, the liquid cooling module and the computing module in detail to further describe the technical solution of the present application.

FIG. 3 is a schematic diagram of a patch panel according to one embodiment of the present application. Fig. 4 is an exploded view of a patch panel according to one embodiment of the present application. As shown, the card 300 may include a card body 310 and a plurality of guide rails disposed on the card body, wherein the guide rails may be used to guide the liquid-cooled module and/or the computing module into the chassis.

In some embodiments, the card body 310 is generally rectangular in shape and includes a cavity 311 that may be used to contain a cooling fluid. In some embodiments, the card body 310 may further include a plurality of through holes 312 disposed on a side of the card body, communicating with the cavity 311, and may be connected to the liquid-cooled module and/or the computing module. In some embodiments, the through holes 312 may correspond to rail strips, thereby allowing a card inserted into the chassis to connect to the cavity of the card. In some embodiments, the cavity of the upper board and the cavity of the lower board of the chassis may be different in size. For example: the area occupied by the cavity of the upper plug-in board is more than one half, one third or one fourth of the area of the plug-in board; the cavity of the lower plug-in board is slender; the cooling liquid that is favorable to the cooling of liquid cooling module to come out enters into calculation module as early as possible, avoid long-time stop in plug-in board down, can improve the radiating efficiency to calculation module, and the cooling liquid that calculation module came out can stay in last plug-in board as far as possible, can cool down the cooling liquid in advance through chassis exterior, then get into the liquid cooling module, reduce the cooling intensity of liquid cooling module, be favorable to reducing the temperature of cooling liquid to lower through cooling many times, improve the radiating efficiency to the quick-witted case.

In some embodiments, the card body 310 may further include a plurality of fastening holes 313 disposed on both sides of each through hole 312, which may be used for fastening with the liquid cooling module and/or the computing module inserted into the chassis. In some embodiments, the card body 310 may include an openable cover 314 that may be opened to expose the cavity 311 for later maintenance of the card. In some embodiments, the card body 310 may further include one or more stiffening strips 315 disposed in the cavity 311, which may improve the strength of the card body 310 and may also direct the flow of coolant within the cavity. In some embodiments, equally spaced arrays of reinforcing strips 315 are disposed in the cavity 311.

In some embodiments, the plugboard 300 may further include a plurality of connectors (not shown) disposed on the through holes 312, and configured to control the opening and closing of the through holes 312, so as to control the cooling liquid entering or leaving the cavity 311. In some embodiments, the communicator may also facilitate connection with the liquid cooling module and/or the computing module. In some embodiments, the communication vessel may be a valve. For example: a one-way valve.

Fig. 5 is a schematic diagram of a liquid cooling module according to an embodiment of the present application. Fig. 6 is an exploded view of a liquid cooling module according to one embodiment of the present application.

As shown, the liquid cooling module 500 includes a board 510, a reservoir 520, and an inlet tube 530 and an outlet tube 540. The liquid storage box 520 is arranged on the board card 510 and can be used for storing and containing cooling liquid; the water inlet pipe 530 is connected with the water inlet of the liquid storage box 520 and can be used for containing cooling liquid to enter the liquid storage box; the outlet tube 540 is connected to the outlet of the reservoir and can be used to contain coolant leaving the reservoir. In some embodiments, the board 510 may be plugged into a chassis backplane to obtain power or communications.

In some embodiments, the liquid cooling module 500 may further include a plurality of cooling fins 550 disposed between the board 510 and the liquid storage box 520, which may cool the cooling liquid in the liquid storage box. In some embodiments, the heat absorbing surface of the cooling fins 550 is in contact with the reservoir 520 of the liquid-cooled module and can directly conduct heat from the cooling liquid. In some embodiments, the refrigeration sheet may be a semiconductor refrigeration sheet, and the required power may be directly obtained from the backplane by the board 510. In other words, the circuit of the cooling plate may be directly connected to the board 510.

In some embodiments, the liquid cooling module 500 may further include a heat conducting block 560 disposed on the board 510 and penetrating through the board 510, and may contact with a side panel of the chassis housing, and the heat dissipating surface of the cooling fin 550 may contact with the heat conducting block, so as to directly conduct heat to the outside of the chassis, thereby improving the cooling efficiency of the cooling fin. In some embodiments, the heat conducting block 560 may surround the perimeter of the cooling fins 550, thereby conducting as much heat as possible from the cooling fins out of the enclosure. In some embodiments, the heat conducting block 560 includes a recess (not shown) therein that can be used to accommodate passage of the wiring of the refrigeration pill.

In some embodiments, the liquid cooling module 500 may further include a thermal insulation pad 570 disposed around the cooling plate and between the heat conducting block and the liquid storage box, so as to prevent the heat generated by the cooling plate from affecting the temperature of the cooling liquid in the liquid storage box, and further improve the heat dissipation efficiency of the chassis.

In some embodiments, the liquid storage box 520 includes a plurality of reinforcing bars 521, which are disposed in the liquid storage box in a staggered manner, so that the liquid storage box has a curved coolant flow channel, which is beneficial to increasing the retention time of the coolant in the liquid storage box, improving the cooling efficiency of the coolant, and increasing the strength of the liquid storage box. In some embodiments, the reservoir 520 may further include an openable cover 522, which may cover the cavity inside the reservoir, and the opening of the cover 533 may expose the cavity inside the reservoir, thereby facilitating later maintenance of the reservoir.

In some embodiments, the liquid cooling module 500 may further include a circulating device 580 disposed on the outlet pipe 540, which may increase the pressure of the cooling liquid in the outlet pipe, accelerate the circulation of the cooling liquid between the liquid cooling module and the computing module, and improve the heat dissipation efficiency. In some embodiments, the circulation device 580 may include an aspiration port that may be in communication with the outlet of the reservoir 520 and a drain port that is in communication with the lower insert plate. In some embodiments, the circulation device may be connected to the board 510 by a wire so that the power supply is available. In some embodiments, the circulation device may be a circulation pump.

In some embodiments, the liquid cooling module 500 may further include a panel 590, which is disposed on one side of the board 510 or the liquid storage box 520, and may fix the inlet pipe and/or the outlet pipe, and may shield the chassis. When the liquid cooling module is inserted into the chassis, the panel 590 may be stopped by the upper and lower insertion plates to block the interior of the chassis, and the water inlet pipe and the water outlet pipe are directly inserted into the upper and lower insertion plates.

FIG. 7 is a diagram of a computing module, according to one embodiment of the present application. FIG. 8 is an exploded view of a computing module according to one embodiment of the present application.

As shown, the computing module 700 includes a board card 710, a reservoir 720, and an inlet tube 730 and an outlet tube 740. The liquid storage box 720 is arranged on the board card 710 and can be used for storing and containing cooling liquid; the water inlet pipe 730 is connected with the water inlet of the liquid storage box 720 and can be used for containing cooling liquid to enter the liquid storage box; the outlet tube 740 is connected to the outlet of the reservoir and can be used to contain coolant away from the reservoir. In some embodiments, the board 710 may be plugged into a chassis backplane to obtain power or communications.

In some embodiments, the board card 710 includes one or more chips 711, where the chips in the computing module may be disposed on the bosses of the board card 710, so that the chips may contact the liquid storage box of the computing module, which is beneficial for the cooling liquid in the liquid storage box to dissipate heat of the chips. In some embodiments, the side of the reservoir 720 facing the board 710 may also include one or more bosses (not shown) that may contact the chip on the board, so that heat generated by the chip may be conducted directly to the reservoir and carried away by the cooling fluid in the reservoir. In some embodiments, the reservoir 720 is similar to the liquid-cooled module reservoir and therefore not described in detail herein.

In some embodiments, the computing module 700 may further include a panel 750 disposed on one side of the board 710 or the liquid storage box 720, which may fix the water inlet pipe and/or the water outlet pipe, and may shield the chassis. When the computing module is inserted into the case, the panel 750 can stop on the upper and lower insertion plates to shield the inside of the case, and the water inlet pipe and the water outlet pipe are directly inserted into the upper and lower insertion plates

This application liquid cooling machine case, the liquid cooling module is pegged graft on quick-witted case, its liquid outlet and lower plug-in components board intercommunication, the inlet of liquid cooling module and the cavity intercommunication of last plug-in components board, and the inlet and lower plug-in components board intercommunication of calculation module, the liquid outlet and the last plug-in components board intercommunication of calculation module, circulating device can make the coolant liquid in the liquid cooling module liquid storage box flow into down in the plug-in components board, and respectively behind the liquid storage box of each calculation module, get back to the liquid cooling module behind the cavity of the plug-in components board of inflow, accomplish the circulative cooling of coolant liquid.

The above embodiments are provided only for illustrating the present invention and not for limiting the present invention, and those skilled in the art can make various changes and modifications without departing from the scope of the present invention, and therefore, all equivalent technical solutions should also fall within the scope of the present disclosure.

Claims (10)

1. A liquid-cooled chassis is characterized by comprising a chassis shell, an upper plug-in board, a lower plug-in board and a liquid-cooled module, wherein the upper plug-in board, the lower plug-in board and the liquid-cooled module are accommodated in the chassis shell; wherein, the first and the second end of the pipe are connected with each other,

each of the liquid cooling module and the at least one computing module is provided with a liquid storage box, and the liquid storage box is provided with a liquid inlet and a liquid outlet;

the lower plug-in board is provided with a cavity, a liquid outlet or a liquid inlet of the liquid storage box of the liquid cooling module is communicated with the cavity of the lower plug-in board, and a liquid inlet or a liquid outlet of the liquid storage box of each computing module of the at least one computing module is communicated with the cavity of the lower plug-in board; and also,

the liquid cooling module liquid storage box comprises a liquid cooling module liquid storage box, at least one calculation module and at least one plug-in board, wherein a cavity is formed in the plug-in board, a liquid inlet or a liquid outlet of the liquid cooling module liquid storage box is communicated with the cavity of the plug-in board, and a liquid outlet or a liquid inlet of each calculation module liquid storage box of the at least one calculation module is communicated with the cavity of the plug-in board.

2. The liquid cooling chassis of claim 1, wherein a liquid inlet of each of the liquid cooling module and the at least one computing module is provided with a communication pipe, and the communication pipe of the liquid inlet is communicated with the cavity of the upper plug-in board or the lower plug-in board; and/or the liquid cooling module and the liquid storage box liquid outlet of each calculation module in the at least one calculation module are provided with communicating pipes, and the communicating pipes of the liquid outlets are communicated with the cavity of the upper plug-in board or the cavity of the lower plug-in board.

3. The liquid cooled chassis of claim 1, wherein the liquid cooled module comprises a thermally conductive structure comprising a cooling plate, a heat absorbing surface of the cooling plate contacting a liquid storage box of the liquid cooled module.

4. The liquid-cooled chassis of claim 3, wherein the heat-conducting structure comprises a heat-conducting block, and wherein the cooling surface of the cooling fins is connected to the chassis housing via the heat-conducting block.

5. The liquid cooled cabinet of claim 4, wherein a thermal insulating pad is disposed around the cooling fins, the thermal insulating pad having an annular shape to separate the heat conducting block from the liquid storage box.

6. The liquid cooled chassis of claim 1, wherein the reservoir in the computing module includes one or more bosses thereon, the bosses being sized to contact a chip in the computing module.

7. The liquid cooled chassis of claim 1, wherein a curved flow channel is provided in a reservoir in the liquid cooled module; and/or a curved flow channel is arranged in the liquid storage box in the at least one computing module.

8. The liquid cooled chassis of claim 1, wherein the cavity of the upper card occupies more than one-half of the area of the upper card.

9. The liquid cooled chassis of claim 1, wherein the cavity of the lower insert plate is elongated.

10. The liquid cooled enclosure of claim 1, wherein a circulation device is disposed on the liquid cooled module; if the liquid outlet of liquid cooling module liquid storage box with the cavity intercommunication of plug-in components board down, the inlet of liquid cooling module liquid storage box with the cavity intercommunication of last plug-in components board, and, the inlet of each calculation module liquid storage box of at least one calculation module with the cavity intercommunication of plug-in components board down, the liquid outlet of each calculation module liquid storage box of at least one calculation module with the cavity intercommunication of last plug-in components board, then circulating device can make coolant liquid in the liquid storage box of liquid cooling module flows into in the cavity of plug-in components board down to respectively behind the liquid storage box of each calculation module, flow in get back to behind the cavity of last plug-in components board in the liquid storage box of liquid cooling module.

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