CN213904288U - Computer power supply capable of improving heat dissipation performance - Google Patents
Computer power supply capable of improving heat dissipation performance Download PDFInfo
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- CN213904288U CN213904288U CN202022918858.XU CN202022918858U CN213904288U CN 213904288 U CN213904288 U CN 213904288U CN 202022918858 U CN202022918858 U CN 202022918858U CN 213904288 U CN213904288 U CN 213904288U
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- heat dissipation
- power supply
- computer power
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Abstract
The utility model discloses a computer power supply for improving heat dissipation performance, which comprises a shell, an integrated circuit board positioned in the shell and a heat dissipation fan arranged on the shell; an interlayer is arranged at the bottom of the shell, a drawable drawer is arranged between an upper clapboard and a lower clapboard of the interlayer, a storage cavity with an upward opening is arranged in the drawer, ice crystals are arranged in the storage cavity, and the drawer is also provided with an aluminum cover which can seal the storage cavity in an opening and closing manner; the integrated circuit board transversely extends and is arranged between the heat dissipation fan and the interlayer so as to realize double heat dissipation of the upper side and the lower side. The heat radiation fan is arranged on the shell, the interlayer is arranged on the bottom surface of the shell, the upper surface of the interlayer is used for fixing the integrated circuit board, the drawable drawer cabinet is arranged in the interlayer in a matching manner, ice crystals are arranged in the drawer cabinet, the whole drawer cabinet is cooled before use, and the interlayer is inserted when the drawer cabinet is used; the dual heat dissipation of upper and lower side is realized, promotes the thermal diffusivity of computer power.
Description
Technical Field
The utility model relates to a computer power field technique especially indicates a promote heat dispersion's computer power.
Background
At present, each household is basically provided with a computer, the heat dissipation performance of a computer power supply becomes one of the reference standards for the current users to purchase the computer power supply, although an integrated circuit board in the existing computer power supply has heat dissipation fins, the heat dissipation efficiency is still insufficient in a long-time working state, and in addition, when a heat dissipation fan runs at a high speed, larger noise can be generated to influence the experience of the users.
Therefore, there is a need for an improved power supply for computers.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention is directed to the deficiency of the prior art, and the main objective of the present invention is to provide a computer power supply with improved heat dissipation performance, which effectively improves the heat dissipation efficiency of the computer power supply.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a computer power supply for improving heat dissipation performance comprises a shell, an integrated circuit board positioned in the shell, and a heat dissipation fan arranged on the shell;
an interlayer is arranged at the bottom of the shell, a drawable drawer is arranged between an upper clapboard and a lower clapboard of the interlayer, a storage cavity with an upward opening is arranged in the drawer, ice crystals are arranged in the storage cavity, and the drawer is also provided with an aluminum cover which can seal the storage cavity in an opening and closing manner;
the integrated circuit board transversely extends and is arranged between the heat dissipation fan and the interlayer so as to realize double heat dissipation of the upper side and the lower side.
As a preferred scheme, the air inlet of the heat dissipation fan is arranged at the top of the housing, and the side surface of the housing is provided with the air outlet.
As a preferred scheme, a heat dissipation member is connected to the integrated circuit board, a positioning pin is arranged at the bottom of the heat dissipation member, the positioning pin is inserted into the integrated circuit board, a plurality of rows of heat dissipation fins are integrally and horizontally extended from the top of the heat dissipation member to be located above the electronic component on the integrated circuit board, and the heat dissipation fan blows air on the upper side of the heat dissipation fins corresponding to the heat dissipation fins.
As a preferable scheme, the upper partition plate is an aluminum plate, and the integrated circuit board is located on the upper surface of the upper partition plate in a contact manner.
Preferably, the housing is further provided with a noise absorption device.
Preferably, the heat dissipation fins each include a base plate extending perpendicular to the horizontal direction and a plurality of heat dissipation fins extending upward from the base plate, and a gap is formed between adjacent rows of heat dissipation fins.
As a preferred scheme, the shell comprises an upper shell and a lower shell, the interlayer is located in the lower shell, the upper shell and the lower shell are assembled to form an accommodating space, and the integrated circuit board is located in the storage cavity and fixed on the upper surface of the interlayer.
Preferably, the noise absorption device is disposed beside the blowing opening of the cooling fan.
Preferably, the noise absorption device is made of noise absorption cotton, and the noise absorption cotton is adhered to the bottom surface of the cooling fan.
Preferably, the lower ends of the positioning pins penetrate through the lower surface of the integrated circuit board, and the lower ends of the positioning pins are in contact with the upper partition plate to conduct heat.
Compared with the prior art, the utility model obvious advantage and beneficial effect have, particularly, can know by above-mentioned technical scheme:
the integrated circuit drawing cabinet is mainly characterized in that a cooling fan is arranged on a shell, an interlayer is arranged on the bottom surface of the shell, the upper surface of the interlayer is used for fixing an integrated circuit board, a drawing type drawing cabinet is arranged in the interlayer in a matching mode, a storage cavity with an upward opening is arranged in the drawing cabinet, ice crystals are arranged in the storage cavity, the drawing cabinet is further provided with an aluminum cover used for sealing the storage cavity, and the aluminum cover prevents the ice crystals from leaking; before use, the drawer cabinet is wholly cooled, and an interlayer is inserted when the drawer cabinet is used; therefore, double heat dissipation of the upper side and the lower side is realized, and the heat dissipation performance of the computer power supply is improved;
secondly, the heat dissipation part is skillfully arranged, the lower end of the heat dissipation part penetrates through the integrated circuit board to be in contact with the upper partition plate for heat conduction, and the upper side of the heat dissipation part extends to the upper side of the electronic element on the integrated circuit board, so that the heat dissipation fan is used for blowing air corresponding to the upper side of the heat dissipation fins, the heat dissipation of the upper side and the lower side is integrated, the heat dissipation in the whole shell is uniform, and the local heat accumulation is avoided;
and a noise reduction device is arranged in the shell, so that the noise generated by a computer power supply is reduced, and the user experience is improved.
To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a perspective view of a preferred embodiment of the present invention;
FIG. 2 is a perspective view from another perspective of the preferred embodiment of the present invention;
fig. 3 is an exploded view of the preferred embodiment of the present invention.
The attached drawings indicate the following:
10. housing 11, upper partition
12. Lower partition plate 13 and upper shell
14. Lower case 101, accommodation space
102. Air outlet 20 and integrated circuit board
21. Heat sink 211 and heat sink fins
30. Radiator fan 103, air intake
40. Drawer cabinet 41 and aluminum cover
401. Storage cavity 50 and ice crystals
60. A noise absorbing device.
Detailed Description
Referring to fig. 1 to 3, a specific structure of a preferred embodiment of the present invention is shown, which includes a housing 10, an integrated circuit board 20 located in the housing 10, and a heat dissipation fan 30 mounted on the housing;
an interlayer is arranged at the bottom of the shell 10, a drawable drawer 40 is arranged between an upper clapboard 11 and a lower clapboard 12 of the interlayer, a storage cavity 401 with an upward opening is arranged in the drawer 40, ice crystals 50 are arranged in the storage cavity 401, and the drawer 40 is also provided with an aluminum cover 41 which can seal the storage cavity 401 in an opening and closing manner;
the integrated circuit board 20 extends laterally and is located between the heat dissipation fan 30 and the partition to achieve dual heat dissipation on the upper side and the lower side.
The ice crystal is usually cold storage liquid (white thick liquid) in refrigeration equipment, the ice point is frozen at minus 12 ℃, the freezing point is lower than that of water, so that the stored cold quantity and the cold quantity released in the dissolving process are far greater than that of water, the cooling and refrigeration are enhanced directly, and the ice crystal has the characteristics of sufficient cold storage, high cooling speed, low cooling speed and the like, is favorable for heat dissipation of a computer power supply, and improves the heat dissipation efficiency of the computer power supply.
Specifically, the housing 10 includes an upper shell 13 and a lower shell 14, the partition is located in the lower shell 14, the upper shell 13 and the lower shell 14 are assembled to form an accommodating space 101, and the integrated circuit board 20 is located in the storage cavity 101 and fixed on the upper surface of the partition;
an air inlet 103 of the cooling fan 30 is arranged at the top of the upper casing 13, and an air outlet 102 is arranged at the side of the lower casing 14;
the integrated circuit board 20 is connected with a heat dissipation member 21, the bottom of the heat dissipation member 21 is provided with a positioning pin (not shown), the positioning pin is inserted into the integrated circuit board 20, the top of the heat dissipation member 21 integrally extends horizontally to form a plurality of rows of heat dissipation fins 211 to be located above electronic components on the integrated circuit board 20, and the heat dissipation fan 20 blows air on the upper side corresponding to the heat dissipation fins 211.
Furthermore, the upper partition plate 11 is an aluminum plate, the integrated circuit board 20 is in contact with the upper surface of the upper partition plate 11, heat generated by the integrated circuit board 20 is transferred to the ice crystal 50 through the aluminum cover through the upper partition plate 11, the structural design is ingenious, and the heat dissipation efficiency of the computer power supply is further improved;
the heat dissipation fins 211 each include a base plate extending perpendicular to the horizontal direction and a plurality of heat dissipation fins extending upward from the base plate, and a gap is formed between adjacent rows of heat dissipation fins.
Preferably, the housing 10 is further provided with a noise absorption device 60, the noise absorption device 60 is disposed beside the blowing port of the cooling fan 30, in general, the cooling fan 30 generates a large noise when running at a high speed, the noise affects the mood of the user and is easy to be irritated, and the noise generated by the computer power supply is reduced by the noise absorption device 60, so that the use experience of the user is improved;
the noise absorption device 60 is made of noise absorption cotton, and the noise absorption cotton is adhered to the bottom surface of the heat dissipation fan 30;
in addition, the lower end of the positioning pin penetrates through the lower surface of the integrated circuit board 20, the lower end of the positioning pin is in contact with the upper partition plate for heat conduction, and the positioning pin is in contact with the upper partition plate for increasing the heat dissipation efficiency of the heat dissipation piece 21.
The utility model discloses a design focus lies in:
the integrated circuit drawing cabinet is mainly characterized in that a cooling fan is arranged on a shell, an interlayer is arranged on the bottom surface of the shell, the upper surface of the interlayer is used for fixing an integrated circuit board, a drawing type drawing cabinet is arranged in the interlayer in a matching mode, a storage cavity with an upward opening is arranged in the drawing cabinet, ice crystals are arranged in the storage cavity, the drawing cabinet is further provided with an aluminum cover used for sealing the storage cavity, and the aluminum cover prevents the ice crystals from leaking; before use, the drawer cabinet is wholly cooled, and an interlayer is inserted when the drawer cabinet is used; therefore, double heat dissipation of the upper side and the lower side is realized, and the heat dissipation performance of the computer power supply is improved;
secondly, the heat dissipation part is skillfully arranged, the lower end of the heat dissipation part penetrates through the integrated circuit board to be in contact with the upper partition plate for heat conduction, and the upper side of the heat dissipation part extends to the upper side of the electronic element on the integrated circuit board, so that the heat dissipation fan is used for blowing air corresponding to the upper side of the heat dissipation fins, the heat dissipation of the upper side and the lower side is integrated, the heat dissipation in the whole shell is uniform, and the local heat accumulation is avoided;
and a noise reduction device is arranged in the shell, so that the noise generated by a computer power supply is reduced, and the user experience is improved.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.
Claims (10)
1. A computer power supply for improving heat dissipation performance is characterized in that: comprises a shell, an integrated circuit board positioned in the shell and a cooling fan arranged on the shell;
an interlayer is arranged at the bottom of the shell, a drawable drawer is arranged between an upper clapboard and a lower clapboard of the interlayer, a storage cavity with an upward opening is arranged in the drawer, ice crystals are arranged in the storage cavity, and the drawer is also provided with an aluminum cover which can seal the storage cavity in an opening and closing manner;
the integrated circuit board transversely extends and is arranged between the heat dissipation fan and the interlayer so as to realize double heat dissipation of the upper side and the lower side.
2. The computer power supply of claim 1, wherein the heat dissipation capability of the computer power supply is improved by: the air inlet of the cooling fan is arranged at the top of the shell, and the side face of the shell is provided with an air outlet.
3. The computer power supply of claim 2, wherein the heat dissipation capability of the computer power supply is improved by: the integrated circuit board is connected with a heat dissipation part, the bottom of the heat dissipation part is provided with a positioning pin, the positioning pin is inserted into the integrated circuit board, the top of the heat dissipation part is integrally and horizontally extended with a plurality of rows of heat dissipation fins to be positioned above electronic elements on the integrated circuit board, and the heat dissipation fan blows air on the upper side of the heat dissipation fins correspondingly.
4. The computer power supply of claim 3, wherein the heat dissipation capability of the computer power supply is improved by: the upper baffle plate is an aluminum plate, and the integrated circuit board is in contact with the upper surface of the upper baffle plate.
5. The computer power supply of claim 1, wherein the heat dissipation capability of the computer power supply is improved by: the shell is also internally provided with a noise absorption device.
6. The computer power supply of claim 3, wherein the heat dissipation capability of the computer power supply is improved by: the radiating fins comprise base plates extending vertically to the horizontal direction and a plurality of radiating fins extending upwards from the base plates, and gaps are formed between adjacent rows of radiating fins.
7. The computer power supply of claim 1, wherein the heat dissipation capability of the computer power supply is improved by: the shell comprises an upper shell and a lower shell, the interlayer is located in the lower shell, the upper shell and the lower shell are assembled to form an accommodating space, and the integrated circuit board is located in the storage cavity and fixed on the upper surface of the interlayer.
8. The computer power supply of claim 5, wherein the heat dissipation capability of the computer power supply is improved by: the noise absorption device is arranged beside the side of the air blowing opening of the cooling fan.
9. The computer power supply of claim 8, wherein the heat dissipation capability of the computer power supply is improved by: the noise absorption device is made of noise absorption cotton, and the noise absorption cotton is adhered to the bottom surface of the cooling fan.
10. The computer power supply of claim 4, wherein the heat dissipation capability of the computer power supply is improved by: the lower end of the positioning pin penetrates through the lower surface of the integrated circuit board, and the lower end of the positioning pin is in contact with the upper partition plate for heat conduction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022918858.XU CN213904288U (en) | 2020-12-08 | 2020-12-08 | Computer power supply capable of improving heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022918858.XU CN213904288U (en) | 2020-12-08 | 2020-12-08 | Computer power supply capable of improving heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213904288U true CN213904288U (en) | 2021-08-06 |
Family
ID=77100987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022918858.XU Active CN213904288U (en) | 2020-12-08 | 2020-12-08 | Computer power supply capable of improving heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213904288U (en) |
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2020
- 2020-12-08 CN CN202022918858.XU patent/CN213904288U/en active Active
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