TWI672097B - Temperature controlled aquarium - Google Patents

Abstract

The present invention relates to a temperature-controlled aquarium comprising a body, at least one heat conducting plate and at least a uniform cold wafer device; the body has an inner space formed by a plurality of wall surfaces; the heat conducting plate abuts against an outer wall surface of the body; and the cooling chip device The heat-dissipating plate is disposed on the other side of the heat-conducting plate, and the heat-dissipating plate is disposed on the other side of the heat-conducting plate relative to the body; the cooling chip is connected to the heat-dissipating seat; The cold-wafer device controls the temperature of the heat-conducting plate, thereby controlling the water temperature to reach the aquarium constant temperature. The large-area heat-conducting plate achieves rapid and uniform water temperature adjustment, and the heat-dissipating block can quickly cool the wafer. The generated heat is carried away to improve the efficiency of the overall cooling wafer.

Description

Temperature controlled aquarium

The invention relates to an aquarium, in particular to a temperature-controlled aquarium capable of controlling water temperature.

In the prior art aquarium, if a temperature-controlled function is required, most of the aquariums with a temperature control rod are used. There is a smart aquarium as described in Taiwan's new bulletin No. M535951, which includes a box body and has a housing. The space is for accommodating the liquid water; a central processing unit; a water changing unit is connected to the accommodating space of the box and electrically connected to the central processing unit; a temperature control unit, an oxygenation unit and a PH value The sensor is respectively received in the accommodating space of the box and electrically connected to the central processing unit; the PH sensor detects the PH value of the liquid water in the box and transmits to the central processing a unit, when the PH value is less than or greater than a predetermined range of pH values, the central processing unit drives the water exchange unit to pump water or fill water; a water level sensor is accommodated in the housing space of the aquarium, and the central portion The processing unit is electrically connected; the water level sensor is configured to detect the water level of the liquid water in the box and transmit to the central processing unit, and when the water level is less than or greater than a predetermined water level, the central processing unit drives the water change The water temperature sensor is placed in the accommodating space of the aquarium and electrically connected to the central processing unit; the water temperature sensor is used for detecting the liquid water in the tank. Water temperature is transmitted to the central processing unit, and when the water temperature is higher or lower than a predetermined water temperature, the central processing unit drives the temperature control unit to cool or heat the liquid water; and an oxygen sensor, And is disposed in the accommodating space of the aquarium and electrically connected to the central processing unit; the oxygen sensor detects the oxygen content of the liquid water in the tank and transmits the oxygen to the central processing unit. When the oxygen content is lower than a predetermined oxygen content, the central processing unit drives the oxygenation unit to inject oxygen into the liquid water; the water quality in the aquarium is detected by the above components, and the treatment is performed to maintain the aquarium The life and health of the water creatures that are raised within.

However, if the temperature control aquarium of the prior art adopts the design of the temperature control rod, when it is applied in a larger aquarium, it is easy to cause uneven temperature distribution of the water temperature in the aquarium; for example, when the temperature control rod is heated At first, only the water temperature around the temperature control rod will heat up due to the temperature control rod. The area away from the temperature control rod needs to wait for a long heating time, and the heat can be transmitted to the area, so the overall heating efficiency is poor; In addition, the additional temperature control rod device components not only consume a lot of power components, but also occupy the space inside the aquarium, and easily affect the overall appearance of the interior.

Therefore, the temperature-controlled aquarium of the prior art has the problems and disadvantages as described above, and needs to be improved.

In view of the shortcomings and deficiencies of the prior art, the present invention provides a temperature-controlled aquarium capable of controlling the temperature of a heat-conducting plate by a cooling chip device disposed on a heat-conducting plate, thereby controlling the temperature of the water to reach a constant temperature of the aquarium.

In order to achieve the above object, the technical means adopted by the present invention is to design a temperature-controlled aquarium comprising: a body having an inner space formed by a plurality of walls and an upper opening communicating with the inner space; At least one heat conducting plate abutting against an outer wall surface of the body; at least a uniform cold wafer device disposed on each of the heat conducting plates and opposite to the other side of the body, and each of the cooling chip devices comprises: a heat sink The heat conducting plate is disposed on the other side of the heat conducting plate with respect to the other side of the heat conducting plate, and is connected to the heat sink seat, and can generate heat conduction with the heat sink seat and the heat conducting plate.

The invention has the advantages that the temperature of the heat conducting plate is controlled by the cooling chip device disposed on the heat conducting plate, thereby controlling the temperature of the water in the aquarium to achieve the purpose of constant temperature; thereby the design not only simplifies the overall device structure It is also possible to achieve rapid and uniform water temperature adjustment by a large-area heat conducting plate, thereby improving the temperature control efficiency; and the cooling chip device is provided with a heat sink, and the heat generated by the cooling chip can be quickly taken away. Improve the efficiency of the execution of the cooled wafer.

Further, in the temperature control aquarium, the number of the at least one identical cold chip device is two, and the heat sink of each of the refrigerant chip devices is formed with a heat conducting groove, and the heat conducting groove is recessed adjacent to each of the heat sinks. One side of each of the heat conducting plates, and each of the cooling fins is disposed in the heat conducting groove.

Further, the temperature control aquarium, wherein each of the refrigerating wafer devices further comprises a first heat pipe and a second heat pipe, the first heat pipe is disposed between the refrigerant chip and the heat conducting plate And contacting the cooling chip and the heat conducting plate; the second heat pipe is disposed in the heat conducting groove of the heat sink and is in contact with the cooling chip.

Further, the temperature-controlled aquarium further includes at least one heat insulation board, each of the heat insulation boards being disposed between the first heat pipe and the second heat pipe and attached to the heat conduction plate, each of The heat shield has two perforations, and the two cooled wafers of the two refrigeration devices respectively penetrate the two perforations.

Further, the temperature control aquarium, wherein each of the heat sinks further comprises a plurality of fins, the plurality of fins are extended and arranged in parallel on the other side of the heat sink relative to the heat conducting slot; The cooling device includes a baffle and a fan, the baffle cover is disposed on the heat sink adjacent to the plurality of fins, and the baffle is inserted through an air inlet, and the fan is disposed on the deflector On the other side of the plurality of fins and corresponding to the air inlet.

Further, in the temperature control aquarium, at least one wall surface of the plurality of walls of the body is a heat conducting plate.

Further, the temperature-controlled aquarium further includes a cover body and an operation interface, the cover body is disposed on the refrigeration chip device and the refrigeration chip device is received therein, and the operation interface is disposed The lid body is electrically connected to the refrigerating wafer device.

Further, in the temperature control aquarium, the cover body has a plurality of heat dissipation holes and corresponds to both sides of the fan and the plurality of fins.

The technical means adopted by the present invention for achieving the intended purpose of the invention are further described below in conjunction with the drawings and preferred embodiments of the invention.

Referring to FIG. 1 and FIG. 2, the temperature control aquarium of the present invention comprises a body 10, at least one heat conducting plate 20, at least a uniform cold wafer device 30 and at least one heat insulating plate 40.

The body 10 has an inner space formed by a plurality of walls and an upper opening communicating with the inner space; the body 10 is a transparent glass box, and the inside can be filled with water for breeding aquatic plants; in the embodiment, the body 10 is external A heat conducting plate 20 is mounted on the wall surface. The heat conducting plate 20 is a metal plate. The heat conducting plate 20 abuts against the outer wall surface of the body 10, and the shape thereof corresponds to the outer wall surface of the body 10. However, not limited thereto, any heat transfer can be achieved. The board of effect can be used.

Referring to FIG. 1 to FIG. 4, a preferred embodiment of the present invention is provided with two refrigerating wafer devices 30. The two refrigerating wafer devices 30 are disposed in parallel and in parallel, but not limited thereto. The user needs are arbitrarily changed; each of the refrigerating chip devices 30 includes a heat sink 31, a uniform cold chip 32, a first heat pipe 33, a second heat pipe 34, a baffle 50, and a fan 60.

The cooling device 30 is disposed on the other side of the heat conducting plate 20 relative to the body 10, and the heat sink 31 is disposed on the other side of the heat conducting plate 20 relative to the body 10, and is locked to the heat conducting plate by the first locking member 35. 20, the cooling chip 32 is connected to the heat sink 31, and can generate heat conduction with the heat sink 31 and the heat conducting board 20. In the embodiment, the cooling chip 32 is disposed on a side of the heat sink 20 adjacent to the heat conducting board 20. However, the position and the connection mode can be changed according to the requirements of the user. The heat sink 31 includes a heat conducting slot 311 and a plurality of fins 312. The heat conducting slot 311 is recessed and formed on each heat sink 31 adjacent to the heat conducting board. One side of the 20, and the cooling chip 32 is disposed in the heat conducting groove 311. The heat conducting groove 311 is a groove extending toward both ends of the heat sink seat 31, and the groove shape corresponds to the cooling chip 32, so that the cooling chip 32 can be The fins 312 are formed in the trenches, and are not limited thereto. The fins 312 are formed in parallel and arranged in parallel on the other side of the heat dissipating block 31 relative to the heat conducting slot 311, but not limited thereto. And the shape can be arbitrarily changed according to the user's needs, only to achieve heat dissipation The effect can be.

The first heat pipe 33 is disposed between the refrigerant chip 32 and the heat conducting plate 20, and is in contact with the cooling chip 32 and the heat conducting plate 20; the second heat pipe 34 is disposed in the heat conducting groove 311 of the heat sink 31 and the cooling chip 32 contact, in this embodiment, the first heat pipe 33 and the second heat pipe 34 are all elongated rectangular cylinders, but not limited thereto, the shape can be arbitrarily changed according to user requirements; the first heat pipe 33 is used to transfer the high temperature or low temperature generated by the cooling wafer 32 to the heat conducting plate 20, and the second heat pipe 34 is used to transfer the low temperature or high temperature generated by the cooling chip 32 to the heat sink 31.

Referring to FIG. 2 to FIG. 4 , the baffle 50 is disposed on the heat sink 31 adjacent to the fin 312 , and the baffle 50 is inserted through an air inlet 51 , and the fan 60 is disposed on the deflector 50 relative to the fin The other side of the piece 312 corresponds to the air inlet 51; in this embodiment, the fan 60 is locked to the deflector 50 by the second lock 61, and the baffle 50 is used to blow the fan 60 to the fin The air guide 312 moves along the surface of the fin 312 toward both ends such that air passes intact through the surface of the fin 312.

Referring to FIG. 2 and FIG. 4 , the heat shield 40 is disposed between the first heat pipe 33 and the second heat pipe 34 and is attached to the heat conductive plate 20 . The heat shield 40 has two through holes 41 and two cooled chips. The two cooling fins 32 of the device 30 respectively penetrate the two through holes 41; in this embodiment, a side surface of the heat insulating plate 40 is convexly provided with a convex portion corresponding to the heat conducting groove 311 on the heat sink seat 31, and the heat insulating plate 40 is further A recess corresponding to the refrigerant chip 32 and the first heat pipe 33 is recessed on one side, and the two through holes 41 respectively penetrate the recess and the protrusion, so that the refrigerant chip 32 can be received in the through hole 41 through the heat shield 40.

Referring to the second embodiment shown in FIG. 5, one of the wall surfaces of the body 10A is a heat conducting plate 20A. In other words, the heat conducting plate 20A can be directly combined with other wall surfaces of the body 10A to form an internal space, which is a part of the body 10A. Further, the water accommodated inside the body 10A can be directly heated or cooled without indirectly heating or cooling the internal water through a plurality of wall surfaces.

Referring to the third embodiment shown in FIG. 6, the device further includes a cover 70 and an operation interface 80. The cover 70 is disposed on the refrigerating wafer device 30 and houses the refrigerating wafer device 30 therein. 80 is disposed on the cover body 70 and electrically connected to the cooling wafer device 30. In the embodiment, the cover body 70 further penetrates the heat dissipation hole 71 and corresponds to both sides of the fan 60 and the fin 312, so that the fan 60 can The external air is sucked through the heat dissipation hole 71 of the cover 70 near the fan 60 side and blown through the heat dissipation holes 71 near the two sides to achieve a heat dissipation effect, and the operation interface 80 can be a commonly used switch operation component.

In other embodiments, two heat conducting plates 20, two cooling chip devices 30, and two heat insulating plates 40 may be disposed. The two heat conducting plates 20 may respectively abut on any two outer sides of the body 10, and the two cooling chip devices 30 respectively It is disposed on the two heat conducting plates 20, and the two heat insulating plates 40 are also respectively disposed on the two heat conducting plates 20 to achieve more contact area, improve temperature control efficiency, and so on, and the heat conducting plate 20 can be increased or decreased according to user requirements. The number of the cooled wafer device 30 and the heat shield 40.

Referring to FIG. 1 , when the present invention is used, the cooling chip 32 can be switched to a heat dissipation or warming mode. When in the heat dissipation mode, the cooling chip 32 faces the heat conduction plate 20 as a cold end, and the heat conductive plate 20 is subjected to The cold end absorbs heat and the temperature drops, which in turn causes the water temperature to drop, but the other side of the cooled wafer 32 is the hot end to generate heat, and the heat source dissipates the heat source in the air by the heat sink 31; otherwise, the heat retention mode, the cooling chip 32 is heated toward one side of the heat conducting plate 20, and the other side of the cooling chip 32 is a cold end; thereby, the rapid control of the water temperature by the cooling chip 32 can be achieved, and the water temperature is maintained at the temperature set by the user. .

In the foregoing process, since the large-area heat-conducting plate 20 is used as the medium for heat transfer, the water temperature can be more easily maintained, and the purpose of saving electricity can be achieved; and the heat-conducting plate 20 is set as one of the walls of the body 10. It can also directly heat or cool the water in the internal space to improve the overall operation efficiency.

In the foregoing process, since the heat sink 31 is provided with the design of the deflector 50 and the fan 60, the heat generated by the cooled wafer 32 can be quickly dispersed to the fins 312, and then blown into the wind by the fan 60 and transmitted through the guide. The flow plate 50 guides the wind to both ends to uniformly remove the heat on the fins 312, thereby improving the overall operation efficiency.

In the foregoing process, since the first heat pipe 33 and the second heat pipe 34 are provided, heat or cold generated by the refrigerant chip 32 can be more quickly conducted to the heat conducting plate 20 and the heat sink 31.

In the foregoing process, since the design of the heat insulating plate 40 is provided, the area of the heat conducting plate 20 in contact with the air can be reduced, and the heat conducted by the cooling chip 32 to the heat conducting plate 20 can be dissipated.

The above is only a preferred embodiment of the present invention, and is not intended to limit the invention in any way. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and A person skilled in the art can make some modifications or modifications as equivalent equivalents when using the technical content disclosed above without departing from the technical scope of the present invention, but the content is not deviated from the technical solution of the present invention. The present invention is not limited to any simple modifications, equivalent changes and modifications of the above embodiments.

10, 10A‧‧‧ ontology

20, 20A‧‧‧heat conducting plate

30‧‧‧Cryogenic wafer device

31‧‧‧ Heat sink

311‧‧‧heat conduction slot

312‧‧‧Fins

32‧‧‧Chilled wafer

33‧‧‧First heat pipe

34‧‧‧Second heat pipe

35‧‧‧First lock firmware

40‧‧‧ Thermal insulation board

41‧‧‧Perforation

50‧‧‧ deflector

51‧‧‧Air inlet

60‧‧‧fan

61‧‧‧Second lock firmware

70‧‧‧ cover

71‧‧‧ vents

80‧‧‧Operator interface

Figure 1 is a perspective view of the present invention. Figure 2 is an exploded view of the present invention. Figure 3 is a rear view of the invention. Figure 4 is a side view of the invention. Figure 5 is a schematic view of a second embodiment of the present invention. Figure 6 is a rear elevational view of a third embodiment of the present invention.

Claims (8)

A temperature-controlled aquarium comprising: a body having an inner space formed by a plurality of walls and an upper opening communicating with the inner space; at least one heat conducting plate abutting against an outer wall surface of the body; a uniform cold chip device disposed on each of the heat conducting plates and opposite to the other side of the body, and each of the cooling chip devices includes: a heat sink disposed on the other side of the heat conducting plate relative to the body; A uniform cold wafer connected to the heat sink and capable of generating heat conduction with the heat sink and the heat conducting plate. The temperature control aquarium according to claim 1, wherein the number of the at least one identical cold chip device is two, and the heat sink of each of the refrigerant chip devices is formed with a heat conducting groove, and the heat conducting groove is recessed adjacent to each of the heat sinks. One side of each of the heat conducting plates, and each of the cooling fins is disposed in the heat conducting groove. The temperature-controlled aquarium of claim 2, wherein each of the refrigerating wafer devices further comprises a first heat pipe and a second heat pipe, the first heat pipe being disposed between the refrigerant chip and the heat conducting plate And contacting the cooling chip and the heat conducting plate; the second heat pipe is disposed in the heat conducting groove of the heat sink and is in contact with the cooling chip. The temperature-controlled aquarium of claim 3, further comprising at least one heat insulation plate, each of the heat insulation plates being disposed between the first heat pipe and the second heat pipe and attached to the heat conduction plate, each The heat shield has two perforations, and the two cooled wafers of the two refrigeration devices respectively penetrate the two perforations. The temperature control aquarium of claim 4, wherein each of the heat sinks further comprises a plurality of fins, and the plurality of fins are extended and arranged in parallel on the other side of the heat sink relative to the heat conducting slot; The cooling chip device includes a deflector and a fan, and the deflector cover is disposed on the heat sink Adjacent to the plurality of fins, the baffle is inserted through an air inlet, and the fan is disposed on the other side of the baffle relative to the plurality of fins and corresponds to the air inlet. The temperature-controlled aquarium of claim 5, wherein at least one wall of the plurality of walls of the body is a heat conducting plate. The temperature-controlled aquarium according to claim 5 or 6, further comprising a cover body and an operation interface, the cover body being disposed on the refrigerating wafer device and accommodating the refrigerating wafer device therein The interface is disposed on the cover and electrically connected to the refrigerating chip device. The temperature control aquarium of claim 7, wherein the cover body has a plurality of heat dissipation holes and corresponds to the fan and the two sides of the plurality of fins.