WO2019144740A1

WO2019144740A1 - Spray type liquid-cooled server

Info

Publication number: WO2019144740A1
Application number: PCT/CN2018/122989
Authority: WO
Inventors: 王伟; 汪斌强
Original assignee: 广东合一新材料研究院有限公司
Priority date: 2018-01-29
Filing date: 2018-12-24
Publication date: 2019-08-01
Also published as: CN108563305A; TWI693013B; TW201933979A; CN108563305B

Abstract

A spray type liquid-cooled server, comprising a box (1), a board, and electronic devices. The box mainly consists of a box body (11) having an opening on the top surface and a cover plate (12) disposed on the opening of the box body (11). A closed spray cavity used for holding insulating cooling liquid is formed on the inner surface of the cover plate (12); a cooling liquid inlet (4) used for introducing the insulating cooling liquid is formed on the closed spray cavity, and the cooling liquid inlet (4) extends to the cover plate (12); through spray holes are distributed on the bottom surface of the closed spray cavity; a cooling liquid outlet (6) is formed on the bottom plate of the box body (11). A spray type liquid-cooling mode is used, thereby improving the utilization rate of the space in the server; the radiator used on the extension surface of the devices can be decreased, so that the height of the box is reduced, and thus more compact device layout can be formed in the original framework space, the integration level is high, and the computing capability of the server is enhanced; the noise is decreased, the working environment of the an operator is optimized and the power consumption is reduced; a heat dissipation effect is achieved and the service life is prolonged.

Description

Spray type liquid cooling server

Technical field

The invention relates to a liquid cooling server, in particular to a spray type liquid cooling server.

Background technique

With the rapid development of the computer communication industry and the electronics industry, IDC room high-density servers are increasing, server integration and processing power are gradually increasing, but at the same time, the power consumption of the server is also increased, so that the internal electronic components of the server are cooled. The problem has become a technical problem that needs to be solved in the industry.

At present, most of the servers rely on air cooling to force the convection heat dissipation of their electronic devices. However, the air cooling mode is an indirect contact cooling method with very low heat transfer efficiency, which takes up a large space inside the server and has a high total thermal resistance. The heat dissipation effect is poor. In order to move the waste tropics of higher power devices or achieve lower total thermal resistance, the industry typically uses higher power fans or lower inlet air temperatures to control the temperature of the electronics, however, the former approach It will cause more noise, and the latter method is prone to the problem of wet air condensation caused by low temperature.

Because the product of the liquid refrigerant density and the specific heat of the liquid cooling heat dissipation capacity is nearly 2000 times higher than that of the air cooling heat dissipation mode, the liquid cooling heat will surely be in the near future. Become the mainstream technology for server cooling. The spray liquid cooling system developed by the company directly sprays the insulating coolant onto the surface of the heat-generating device of the server or sprays onto the extended surface in contact with the heat-generating device, and the coolant takes away the waste heat discharged from the heat-generating device. Thereby efficient heat management of the heat generating device.

Although the cooling efficiency of the above-described spray-type liquid cooling system is several orders of magnitude higher than that of the air-cooling heat-dissipating mode, the structure of the conventional server is an architecture suitable for the air-cooling heat-dissipating mode, and its structure is It is not suitable for the spray type liquid cooling method, which causes the waste of the internal space of the server and the disadvantage of low integration.

Summary of the invention

The object of the present invention is to provide a spray-type liquid cooling server which can improve space utilization, reduce noise, reduce energy consumption, has high integration, has good heat dissipation effect, and can prolong service life.

The object of the present invention is achieved by the following technical measures: a spray type liquid cooling server, comprising a chassis, a card built in the chassis, and an electronic device disposed on the card, the chassis is mainly a box with an open top surface And a cover plate disposed on the opening of the box body, wherein: a closed spray chamber for holding the insulating coolant is disposed on the inner surface of the cover plate, and the sealed spray chamber is provided on the cover a coolant inlet for introducing an insulating coolant, and the coolant inlet extends to the cover plate, and a spray nozzle is disposed on a bottom surface of the sealed spray chamber, and the bottom plate of the box is provided The coolant outlet, the insulating coolant enters the sealed spray chamber from the coolant inlet, and is sprayed onto the heat-generating electronic device or the extended surface in contact with it through the spray hole, and the heat generated by the operation of the electronic device is taken away, sucking The heated insulating coolant flows out of the coolant outlet, is cooled by a cooling device outside the chassis, and is returned to the coolant inlet, thus circulating.

The invention adopts a spray liquid cooling mode instead of the traditional air cooling mode, and since the fan is not used, the internal space of the server is saved, the space utilization rate of the server is improved, and the invention adopts the spray liquid cooling method, the electronic The heat sink used for the extended surface of the device can be reduced, so that the height of the chassis is reduced, a tighter device layout can be formed in the original architectural space, and the integration is high, which improves the computing power of the server. Performance is approximately four times better than that of a conventional air-cooled server. Moreover, since the present invention does not use a fan, noise is reduced, the operating environment of the operator is optimized, and power consumption of the server is reduced. In addition, the heat dissipation effect of the invention is good, the operating temperature rise of the electronic device is significantly reduced, and the uniformity and stability of the internal device temperature of the server are better, keeping the devices in the server working in the most efficient temperature range, reducing power consumption, and Extended service life.

As a preferred embodiment of the present invention, the shower holes located directly above the electronic device having a larger heat generation are arranged more densely; the lower hole edge of the shower hole extends downward to become a short cylindrical shape. The spray hole has a square, circular or polygonal cross section, or the spray hole is a large upper and lower cone.

As an improvement of the present invention, the electronic device on the card includes a processor, a hard disk, a memory, a system bus, and a power source, and the power source includes a power supply case and a heat generating device located therein, and the power supply case is provided with The liquid hole and the liquid outlet hole, the insulating coolant flows from the liquid inlet hole into the power source casing to cool the heat generating device, and then flows out from the liquid outlet hole into the tank body. The insulating coolant of the solution may be an insulating coolant under a direct spray flow, or may be an insulating coolant including a direct spray stream and an insulating coolant that has flowed through other electronic devices, wherein it has flowed through other electronic devices. The insulating coolant then cools the relevant heat-generating device inside the power supply through the liquid inlet and the liquid outlet of the power supply casing, which means that the power supply is not in the same layer as other heat-generating devices.

The spray type liquid cooling server of the present invention further comprises a power source located outside the chassis, the power source comprising a power supply case and a heat generating device located inside the power supply case, and a liquid inlet hole and a liquid outlet hole are arranged on the power source case, and the power supply case is provided in the power supply case The heat generating device flows from the liquid inlet hole through the insulating coolant sprayed outside the casing and then flows out from the liquid outlet hole for cooling.

The hard disk of the present invention is directly sprayed by the insulating coolant, or is disposed on the heat generating surface of the hard disk and is closely attached to the heat conducting structure to discharge the heat generated by the hard disk to the inside or the outside of the case, and then spray the heat conductive structure by the insulating coolant. Leaking heat.

As a preferred embodiment of the present invention, the heat conducting structure is a high efficiency heat transfer element or a heat conductive sheet, or the heat conducting structure is composed of a heat conducting sheet external heat sink, or the heat conducting structure is composed of an efficient heat transfer element external heat sink.

The cover plate of the invention is integrally formed with the sealed spray chamber, the top surface of the sealed spray chamber is the inner surface of the cover plate, or the cover plate and the sealed spray chamber are independently arranged, the sealed spray The cavity is fixed inside the cover.

The invention adds a PCB board in the chassis, and the PCB board is disposed at a position of a conventional server fan and a ventilation channel, wherein the PCB board is provided with a chip and an extended surface thereof, and the chip is a newly added chip, or After the original chip, or including the new chip and the original chip, and after removing the multi-layer traditional server fan and/or reducing the extended surface of the electronic device, the height of the chassis can be reduced, and the internal space of the server is compact and greatly Improve the computing power of the server unit space.

In order to accurately control the temperature of each electronic device of the server, as a further improvement of the present invention, a liquid temperature sensing system is provided in the casing, the liquid temperature sensing system including a controller, a control valve and a setting provided on the coolant inlet. a temperature sensor on the heating electronic device and the coolant outlet, the temperature sensor and the control valve are respectively connected to the controller, and each temperature sensor separately collects the temperature signal of the heating electronic device and the coolant outlet and transmits it to the control. The controller controls the temperature of the insulating coolant entering the coolant inlet, and controls the opening of the control valve to adjust the flow rate of the insulating coolant entering the sealed spray chamber, thereby achieving spray cooling of the electronic device. Automatic adjustment.

As a preferred embodiment of the present invention, the insulating coolant is mineral oil, silicone oil or a fluorinated liquid. In practical applications, the insulating coolant may be thermally conductive and insulated.

The invention can also be improved as follows: a plurality of the spray-type liquid-cooled servers are placed in the same cabinet, and each cabinet cooperates with a spray-type liquid cooling system, that is, the spray-type liquid cooling system includes a circulation pipeline The radiator, the fuel tank and the coolant circulation power system are arranged on the circulation pipeline, and the coolant inlet and the coolant outlet of each spray type liquid cooling server in each cabinet pass through the oil inlet and the oil return on the cabinet where the cabinet is located The port is connected in the circulation line of the spray liquid cooling system; the controller of the liquid temperature sensing system of each spray type liquid cooling server is integrated to form a control system, and the overall operation of the spray system liquid cooling system by the control system The status is automatically controlled.

Compared with the prior art, the present invention has the following remarkable effects:

(1) The invention adopts a spray liquid cooling mode instead of the traditional air cooling mode. Since no fan is used, the internal space of the server is saved, and the space utilization of the server is improved, that is, the original layer of the traditional server is used for placing the fan. The position can be used to place the PCB board. In addition, the high-density server fan has a large number of fans, sometimes it needs to be divided into two layers. After the fan is removed, the server height can be reduced, and because the invention adopts the spray liquid cooling method, the electronic The heat sink used in the extended surface of the device can be reduced, which reduces the height of the chassis. Therefore, a tighter device layout can be formed in the original architecture space of the traditional server, and the integration is high, which improves the computing power of the server and is verified. Compared with the conventional air-cooled server, the performance of the invention is about four times higher than that in the conventional air-cooled server.

(2) Since the present invention does not use a fan, noise is reduced, the operating environment of the operator is optimized, and the power consumption of the server is reduced.

(3) The heat dissipation effect of the invention is good, the working temperature rise of the electronic device is obviously reduced, and the uniformity and stability of the internal device temperature of the server are good, the device in the server is kept in the most efficient temperature range, the power consumption is reduced, and the power is extended. Service life.

DRAWINGS

The invention will be further described in detail below with reference to the drawings and specific embodiments.

Figure 1 is a schematic view of the overall structure of the present invention;

Figure 2 is a second schematic view of the overall structure of the present invention (removing the side panels);

Figure 3 is a third schematic view of the overall structure of the present invention (removing the side panels, the cover plate and the sealed spray chamber);

Figure 4 is a schematic view showing the structure of the sealed spray chamber of the present invention.

Detailed ways

As shown in FIG. 1 to FIG. 4, a spray type liquid cooling server includes a chassis 1, a card 2 built in the chassis 1, and an electronic device disposed on the card 2. The chassis 1 is mainly a box with an open top. The body 11 is composed of a cover plate 12 disposed on the opening of the casing 11, and a sealed spray chamber 3 for containing an insulating coolant is disposed on the inner surface of the cover plate 12. The insulating coolant may be mineral oil, silicone oil or fluorine. For the chemical liquid, etc., the insulating coolant can be insulated as long as it is thermally conductive. In this embodiment, the cover plate 12 is integrally formed with the sealed spray chamber 3, and the top surface of the sealed spray chamber 3 is the inner surface of the cover plate 12. In other embodiments, the cover plate 12 and the sealed spray are The chambers 3 can also be provided separately, and the sealed spray chamber 3 is fixed inside the cover plate 12. The sealed spray chamber 3 is provided with a coolant inlet 4 for introducing an insulating coolant, and the coolant inlet 4 extends to the cover plate, and a spray nozzle 5 is disposed on the bottom surface of the sealed spray chamber 3, The shower hole 5 located directly above the electronic device having a larger heat generation is arranged denser; the lower hole edge of the shower hole 5 extends downward to become a short cylindrical shape, and specifically, the cross section of the spray hole may be square In the shape of a circle or a polygon, or when the flow rate of the coolant is required to be large, the spray hole can be designed as a large and small cone. A coolant outlet 6 is disposed on the bottom plate of the casing 11, and the insulating coolant enters the sealed shower chamber 3 from the coolant inlet 4, and is sprayed through the shower hole 5 onto the heat-generating electronic device or the extended surface in contact therewith. The heat generated by the operation of the electronic device is carried away, and the heat-absorbing insulating coolant flows out from the coolant outlet 6, and is cooled by a cooling device outside the chassis, and then returned to the coolant inlet 4, and thus circulated.

The electronic device on the server board 2 includes a processor 7, a hard disk 8, a memory, a system bus, and a power supply 9. The power supply 9 includes a power supply case and a heat generating device located therein, and a liquid inlet and a liquid outlet are respectively disposed on the power supply case. The hole and the insulating coolant flow from the inlet hole into the power supply case to cool the heat generating device, and then flow out from the liquid outlet hole into the case body. Preferably, the inlet opening is located on the top surface of the power supply housing and the liquid outlet is located on the bottom surface of the power supply housing. In other embodiments, the power supply of the spray-type liquid-cooled server is located outside the chassis, and the power source includes a power supply case and a heat-generating device located therein, and the power supply case is provided with a liquid inlet and a liquid outlet, and the heat-emitting device in the power supply case The insulating coolant sprayed outside the casing flows from the inlet hole and then flows out from the outlet hole to be cooled.

The hard disk 8 is directly sprayed by the insulating coolant, or the heat generated by the hard disk is discharged to the inside or the outside of the case through a heat-conducting structure disposed on the heat-generating surface of the hard disk 8 and then sprayed on the heat-conducting structure by the insulating coolant. Cooling. The solid state hard disk, the xenon hard disk, and the like can adopt the above two heat dissipation modes, and the mechanical hard disk preferably dissipates heat through the heat conduction structure. Specifically, the heat conductive structure may be a high-efficiency heat transfer element or a heat conductive sheet, or the heat conductive structure is composed of an external heat sink of the heat conductive sheet, or the heat conductive structure is composed of an external heat sink of the high efficiency heat transfer element.

The invention adds a PCB board in the chassis 1, and the PCB board is disposed at a position of a traditional server fan and a ventilation passage. The PCB board is provided with a chip and an extended surface thereof, and the chip is a new chip or an original chip, or Including the new chip and the original chip, and after removing the multi-layer traditional server fan and / or reducing the extended surface of the electronic device, the height of the chassis can be reduced, the internal space of the server is saved, and the space utilization of the server is improved. At the same time, because the invention adopts the spray liquid cooling method, the heat sink used for the extended surface of the electronic device can be reduced, so that the height of the chassis is reduced, and a tighter device layout can be formed in the original architectural space, and the integration degree is high and the lifting is improved. The computing power of the server.

In order to accurately control the temperature of each electronic device of the server, a liquid temperature sensing system is provided in the chassis 1. The liquid temperature sensing system includes a controller, a control valve disposed on the coolant inlet, and an electronic device and a coolant disposed on the heat generating device. The temperature sensor on the outlet, the temperature sensor and the control valve are respectively connected to the controller, and each temperature sensor separately collects the temperature signal of the heating electronic device and the coolant outlet and transmits it to the controller, and the controller enters the coolant inlet. The temperature of the insulating coolant is controlled, and the opening of the control valve is controlled to adjust the flow rate of the insulating coolant entering the sealed spray chamber, thereby realizing the automatic adjustment of the spray cooling of the electronic device.

Multiple spray-type liquid-cooled servers are placed in the same cabinet, and each cabinet is matched with a spray-type liquid cooling system, that is, the spray-type liquid cooling system includes a circulation line, a radiator disposed on the circulation line, a fuel tank, and cooling. The liquid circulation power system, the coolant inlet 4 and the coolant outlet 6 of each spray type liquid cooling server in each cabinet are connected to the circulation of the spray liquid cooling system through the oil inlet and the oil return port on the cabinet where the cabinet is located In the pipeline, the controller of the liquid temperature sensing system of each spray type liquid cooling server is integrated to form a control system, and the overall working state of the spray liquid cooling system is automatically controlled by the control system.

The working process of the present invention is as follows:

(1) Before the server starts to work, the spray liquid cooling system starts. When the server is officially started, the core components in the server start to heat up, and the insulating coolant of the spray liquid cooling system is transferred to the closed spray chamber through the coolant inlet. Spraying onto the hot electronic device through the spray hole, and cooling the electronic device. The heat-absorbing insulating coolant is sent to the outside of the server through the coolant outlet for heat dissipation, and the cooled insulating coolant is re-injected into the spray. The liquid cooling system, once again enters the spray-type liquid-cooled server to absorb heat, and so on.

(2) The liquid temperature sensing system set inside the server monitors the temperature of each heating device of the server, and the coordinated control system controls the start and stop of the spray liquid cooling system.

(3) The control valve is set at the inlet of the coolant of the server. The control system of the spray-type liquid cooling system is provided with a spray speed control module, and the control valve is controlled according to the feedback temperature of each component of the server to adjust the flow of liquid into the sealed spray chamber.

The embodiments of the present invention are not limited thereto, and according to the above-mentioned contents of the present invention, the specific structure of the hermetic shower cavity of the present invention and the present invention without departing from the above basic technical idea of the present invention, according to the ordinary technical knowledge and conventional means in the art. The arrangement, the distribution pattern of the spray holes on the bottom surface of the sealed spray chamber, the shape of the spray holes, the insulating coolant and the like have other embodiments, and thus the present invention can also be modified in various other forms. Any substitutions or alterations are intended to fall within the scope of the invention.

Claims

A spray-type liquid cooling server includes a chassis, a card built in the chassis, and an electronic device disposed on the card, the chassis is mainly a box having a top opening and a cover disposed on the opening of the box The composition is characterized in that: a sealing spray chamber for holding an insulating coolant is arranged on the inner surface of the cover plate, and the sealed spray chamber is provided with a coolant inlet for introducing an insulating coolant, and The coolant inlet extends to the cover plate, and a spray nozzle is arranged on the bottom surface of the sealed spray chamber, and a coolant outlet is arranged on the bottom plate of the tank, and the insulating coolant is discharged from the coolant inlet. Entering the sealed spray chamber, spraying the sprayed holes onto the heat-generating electronic device or the extended surface in contact with it, taking away the heat generated by the operation of the electronic device, and the heat-absorbing insulating coolant flows out from the coolant outlet Then, it is cooled by a cooling device outside the chassis and then returned to the coolant inlet, and thus circulated.
A shower liquid cooling server according to claim 1, wherein the shower hole located directly above the electronic device having a larger heat generation is densely arranged; the lower hole edge of the shower hole is downward The nozzle hole has a rectangular shape, a circular shape or a polygonal shape, or the spray hole is a large upper and lower cone.
The shower-type liquid cooling server according to claim 2, wherein the electronic device on the card comprises a processor, a hard disk, a memory, a system bus, and a power source, and the power source includes a power supply case and an internal portion thereof. The heat generating device is provided with a liquid inlet hole and a liquid outlet hole on the power supply casing, and the insulating coolant flows from the liquid inlet hole into the power source casing to cool the heat generating device, and then flows out from the liquid outlet hole into the tank body; or the spray type The liquid cooling server further includes a power source outside the chassis, the power source includes a power supply case and a heat generating device located therein, and the power supply case is provided with a liquid inlet hole and a liquid outlet hole, and the heat generating device in the power source case is sprayed outside the chassis The showering insulating coolant flows in from the liquid inlet hole and flows out from the liquid outlet hole to be cooled.
The spray type liquid cooling server according to claim 3, wherein the hard disk is directly sprayed by the insulating coolant, or the heat generated by the hard disk is formed by a heat conducting structure disposed on the heat generating surface of the hard disk and closely attached thereto. After being exported to the inside or outside of the chassis, the heat-conducting structure is sprayed and dissipated by the insulating coolant.
The shower liquid cooling server according to claim 4, wherein the heat conducting structure is a high efficiency heat transfer element or a heat conductive sheet, or the heat conducting structure is externally connected to the heat sink by the heat conducting sheet, or the heat conducting structure is The high-efficiency heat transfer element is composed of an external heat sink.
The spray type liquid cooling server according to claim 5, wherein the cover plate is integrally formed with the sealed spray chamber, and the top surface of the sealed spray chamber is the inner surface of the cover plate, or The cover plate and the sealed spray chamber are independently disposed, and the sealed spray chamber is fixed inside the cover plate.
The spray-type liquid cooling server according to claim 6, wherein a PCB board is added in the chassis, and the PCB board is disposed at a position of a conventional server fan and a ventilation passage, and the PCB board is provided with The chip and its extended surface, the chip is a new chip, or an original chip, or includes a new chip and an original chip, and is removed from the multi-layer conventional server fan and / or reduce the expansion of the electronic device After the surface, the height of the chassis can be lowered, making the internal space of the server compact.
The spray-type liquid cooling server according to claim 7, wherein a liquid temperature sensing system is provided in the casing, the liquid temperature sensing system comprising a controller, a control valve disposed on the coolant inlet, and a setting a heating electronic device, a temperature sensor on the coolant outlet, the temperature sensor and the control valve are respectively connected to the controller, and each temperature sensor separately collects the temperature signal of the heating electronic device and the coolant outlet and transmits the temperature signal to the controller The controller controls the temperature of the insulating coolant entering the coolant inlet, and controls the opening of the control valve to adjust the flow rate of the insulating coolant entering the sealed spray chamber, thereby realizing the automatic cooling of the electronic device. Adjustment.
The spray type liquid cooling server according to any one of claims 1 to 8, wherein a plurality of said spray type liquid cooling servers are placed in the same cabinet, and each cabinet is connected with a spray type liquid cooling system. Cooperating, that is, the spray liquid cooling system includes a circulation line, a radiator disposed on the circulation line, a fuel tank and a coolant circulation power system, and a coolant inlet and cooling of each spray type liquid cooling server in each cabinet The liquid outlet is connected to the circulation line of the spray liquid cooling system through the oil inlet and the oil return port on the cabinet where the liquid is located; the controller of the liquid temperature sensing system of each spray liquid cooling server is integrated to form a control The system automatically controls the overall working state of the spray liquid cooling system by the control system.
The shower liquid cooling server according to claim 9, wherein the insulating coolant is mineral oil, silicone oil or a fluorinated liquid.