CN112015250B - Integrated parallel-flow cold plate liquid cooling system of server - Google Patents
Integrated parallel-flow cold plate liquid cooling system of server Download PDFInfo
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- CN112015250B CN112015250B CN202010834350.3A CN202010834350A CN112015250B CN 112015250 B CN112015250 B CN 112015250B CN 202010834350 A CN202010834350 A CN 202010834350A CN 112015250 B CN112015250 B CN 112015250B
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- 239000007788 liquid Substances 0.000 title claims abstract description 230
- 238000001816 cooling Methods 0.000 title claims abstract description 23
- 125000006850 spacer group Chemical group 0.000 claims abstract description 61
- 230000017525 heat dissipation Effects 0.000 claims abstract description 23
- 239000000110 cooling liquid Substances 0.000 claims abstract description 8
- 238000005192 partition Methods 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 150000002739 metals Chemical class 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 238000009434 installation Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 239000002245 particle Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a parallel-flow cold plate liquid cooling system of a server, wherein cooling liquid enters a cold liquid diversion channel through a cold liquid joint, is shunted into a cold liquid diversion channel through the cold liquid diversion channel, enters a CPU diversion spacer block, a chip diversion spacer block and a memory bank diversion heat dissipation module through a cold liquid diversion channel through a cold liquid inlet, heats up through heat exchange cooling liquid, flows into a hot liquid flow outlet through a hot liquid outlet, flows into a hot liquid diversion channel through a hot liquid joint, and finally flows out through the hot liquid joint. The cold liquid flow channels among the CPU flow guide spacer blocks, the chip flow guide spacer blocks and the memory strip flow guide heat dissipation modules are connected in parallel. The invention has the advantages that: reasonable in design, simple structure, easy installation and dismantlement adapt to the server installation, the radiating effect is good.
Description
Technical Field
The invention relates to the technical field of server heat dissipation, in particular to a parallel-flow cold plate liquid cooling system for a whole server.
Background
In a typical computer server ("server"), a plurality of computer server modules ("modules") are stacked together on a cabinet or within a housing to centralize network resources and minimize usage area. A typical feature of a module designed for use in a server configuration is that the motherboard includes heat-generating electronic components (e.g., IC devices) mounted in a modular chassis or housing, which in turn mounts the module with other similar modules on a rack, blade server enclosure, blade server, or other support structure. In practice, multiple servers (each containing multiple modules) are typically installed in an enclosed space, such as a server room or data center. During operation, the electronic components in the individual modules generate heat, which must be dissipated for efficient operation of the server.
For electronic devices, particularly servers with high density heat flows, heat dissipation problems are becoming more and more pronounced. Traditional electronic equipment mainly adopts air cooling to dissipate heat, and the radiating efficiency is low, and the requirement on environmental conditions is relatively high. With the improvement of the performance of the electronic equipment, the requirements of air cooling and heat dissipation on the environment are more and more severe, particularly, in places where a plurality of electronic equipment gather, the air cooling noise is huge, noise pollution is caused, meanwhile, the requirements on the cleanliness of the environment are very high, and in order to meet the requirements on the environment of a machine room, the investment and the energy consumption are relatively high.
Compared with air cooling, the liquid cooling has the characteristics of large specific heat capacity, good heat dissipation effect and low dependence on environment.
In the existing pipeline cold plate liquid cooling technology, liquid cooling pipelines are all designed by adopting plastic hoses or copper pipes, and the interfaces or welded joints of the liquid cooling pipelines have great leakage risks. The traditional liquid cooling pipeline layout is complex, occupies the internal space of the server, and very influences the layout mode of each electronic device in the system, so that the layout of each electronic device in the system can be only one or more of templatized, and any layout can not be realized.
Meanwhile, as the power consumption of core heating devices such as a CPU (Central processing Unit), a GPU (graphics processing Unit) and the like is larger and larger, the heat generation amount is more and more, the traditional pipeline cold plate liquid cooling device is required to replace a liquid cooling pipeline with larger diameter so as to meet the heat dissipation requirement, the physical occupation space of the pipeline is further enlarged, and besides large devices such as the CPU, the GPU and a memory, the small devices cannot be subjected to heat dissipation.
In addition, the liquid cooling tube layout in the prior art adopts a series flow mode to dissipate heat, and the series flow mode can transfer the heat of one CPU to the other CPU, so that the heat dissipation efficiency is low. And the traditional pipeline design can be realized only by holding the bracket during installation or disassembly.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a parallel-flow cold plate liquid cooling system for the whole server, which solves the defects in the prior art.
In order to achieve the above object, the present invention adopts the following technical scheme:
A server-integrated parallel flow cold plate liquid cooling system, comprising: the device comprises a cold plate upper cover plate 1, an intermediate partition plate 2, a joint split seat 3, CPU flow guide spacer blocks 4, chip flow guide spacer blocks 5, a CPU heat conduction base 6, a chip heat conduction base 7 and a main board 9; the main board 9 is provided with electronic components such as a CPU, a chip, a memory bar and the like, the number of the CPU flow guide spacer particles 4 and the number of the chip flow guide spacer particles 5 correspond to the number of the CPU and the chip, one CPU heat conduction base 6 corresponds to one CPU flow guide spacer particle 4, and one chip heat conduction base 7 corresponds to one chip flow guide spacer particle 5.
The surface of the cold plate upper cover plate 1 is provided with a plurality of rectangular memory windows A1-3 which penetrate through the cold plate upper cover plate, the memory windows A1-3 are used for penetrating through memory strips, the upper surface of the memory strips is prevented from propping against the cold plate upper cover plate 1, and the number of the memory windows A1-3 corresponds to the number of the memory strips.
The lower surface of the upper cover plate 1 of the cold plate is provided with a plurality of cold liquid guide channels 1-1 and a plurality of hot liquid guide channels 1-2, the number of the cold liquid guide channels 1-1 is the same as that of the hot liquid guide channels 1-2, and the cold liquid guide channels 1-1 and the hot liquid guide channels 1-2 are parallel to each other.
The surface of the middle partition plate 2 is provided with a plurality of through memory windows B2-3, and the memory windows B2-3 are overlapped with the memory windows A1-3 in position and have the same shape.
The surface of the middle partition plate 2 is also provided with a plurality of cold liquid inlets 2-1 and a plurality of hot liquid outlets 2-2 which penetrate through, the quantity of the cold liquid inlets 2-1 and the hot liquid outlets 2-2 is the same, one CPU flow guide partition block corresponds to one cold liquid inlet 2-1 and one hot liquid outlet 2-2, and one chip flow guide partition block 5 corresponds to one cold liquid inlet 2-1 and one hot liquid outlet 2-2.
The surface of the middle partition plate 2 is also provided with a plurality of through guide channel inlets 2-4 and a plurality of guide channel outlets 2-5, the number of the guide channel inlets 2-4 is the same as that of the cold liquid guide channels 1-1, and the number of the guide channel outlets 2-5 is the same as that of the hot liquid guide channels 1-2.
The upper surface of the middle partition plate 2 is attached to the lower surface of the cold plate upper cover plate 1, the cold liquid guide channel 1-1 and the hot liquid guide channel 1-2 are sealed on the upper surface of the middle partition plate 2, the cold liquid inlet 2-1 is communicated with the sealed cold liquid guide channel 1-1, and the hot liquid outlet 2-2 is communicated with the hot liquid guide channel 1-2. One of the guide channel inlets 2-4 is connected with one of the cold liquid guide channels 1-1, and one of the guide channel outlets 2-5 is connected with one of the hot liquid guide channels 1-2.
The side of the joint flow dividing seat 3 is provided with a cold liquid joint 3-1 and a hot liquid joint 3-4, and the upper surface of the joint flow dividing seat 3 is dug with a cold liquid flow dividing channel 3-2 and a hot liquid flow dividing channel 3-3. The cold liquid joint 3-1 is communicated with the cold liquid split channel 3-2, and the hot liquid joint 3-4 is communicated with the hot liquid split channel 3-3.
The upper surface of the joint flow dividing seat 3 is attached to the lower surface of the middle partition plate 2, the middle partition plate 2 seals the cold liquid flow dividing channel 3-2 and the hot liquid flow dividing channel 3-3, the cold liquid flow dividing channel 3-2 is communicated with all flow guiding channel inlets 2-4, and the hot liquid flow dividing channel 3-3 is communicated with all flow guiding channel outlets 2-5.
The CPU flow guide spacer block 4 and the chip flow guide spacer block 5 are hollow rectangular bodies and are made of heat conducting metal, and the surfaces of the CPU flow guide spacer block 4 and the chip flow guide spacer block 5 are provided with a cold liquid inlet 4-1 and a hot liquid outlet 4-2;
The upper surfaces of the CPU flow guide spacer blocks 4 and the chip flow guide spacer blocks 5 are attached to the lower surface of the middle partition plate 2, the cold liquid inlets 4-1 of the CPU flow guide spacer blocks 4 are connected with the cold liquid inlets 2-1 in an overlapping manner, the hot liquid outlets 4-2 are connected with the hot liquid outlets 2-2 in an overlapping manner, the cold liquid inlets 4-1 of the chip flow guide spacer blocks 5 are connected with the cold liquid inlets 2-1 in an overlapping manner, and the hot liquid outlets 4-2 are connected with the hot liquid outlets 2-2 in an overlapping manner;
the CPU heat conducting base 6 and the chip heat conducting base 7 are sheet heat conducting metals, the shape and the size of the CPU heat conducting base 6 correspond to the shape and the size of the CPU, the shape and the size of the chip heat conducting base 7 correspond to the shape and the size of the chip,
The upper surface of the CPU heat conduction base 6 contacts with the lower surface of the CPU flow guide spacer 4, the lower surface of the CPU heat conduction base 6 contacts with the CPU, the upper surface of the chip heat conduction base 7 contacts with the lower surface of the chip flow guide spacer 5, and the lower surface of the chip heat conduction base 7 contacts with the chip.
Further, the whole parallel-flow cold plate liquid cooling system of the server further comprises a memory bar diversion heat dissipation module 8, and the memory bar diversion heat dissipation module 8 comprises: the cold liquid end 8-1, the hot liquid end 8-2 and two channels 8-3 are hollow rectangular bodies, the cold liquid end 8-1 and the hot liquid end 8-2 are both hollow rectangular bodies, a cold liquid inlet 4-1 is formed in the upper surface of the cold liquid end 8-1, a hot liquid outlet 4-2 is formed in the upper surface of the hot liquid end 8-2, holes for connecting the channels 8-3 are formed in the side surfaces of the cold liquid end 8-1 and the hot liquid end 8-2, the channels 8-3 are hollow rectangular bodies, the two ends of the channels 8-3 are respectively connected with the cold liquid end 8-1 and the hot liquid end 8-2, a gap is formed between the two channels 8-3 in parallel, the gap is used for sleeving a memory bank and enabling the side wall of the channels 8-3 to contact a chip of the memory bank, the cold liquid inlet 4-1 of the memory bank diversion heat dissipation module 8 is connected with one cold liquid inlet 2-1 in an overlapping mode, and the hot liquid outlet 4-2 is connected with one hot liquid outlet 2-2 in an overlapping mode.
Compared with the prior art, the invention has the advantages that:
1. The copper pipe or the plastic pipe is removed, and a runner formed by grooving is adopted to transport the cooling liquid, so that the risk of liquid leakage is avoided;
2. The parallel flow channel design is adopted, so that the cooling liquid absorbs heat to all the main board components at the same time at the earliest stage without absorbing heat, the heat transfer problem among the components caused by series flow is avoided, and the heat dissipation effect is good;
3. the flattening design does not affect the physical position layout of the bottom main board components and is suitable for the installation of a server;
4. Reasonable in design, simple structure, easy installation and dismantlement.
Drawings
FIG. 1 is a schematic diagram illustrating a liquid cooling system according to an embodiment of the present invention;
FIG. 2 is a top view of a cold plate top cover plate according to an embodiment of the present invention;
FIG. 3 is a bottom view of the cold plate upper cover plate of an embodiment of the present invention;
FIG. 4 is a perspective view of a septum in an embodiment of the present invention;
FIG. 5 is a perspective view of a splice manifold according to an embodiment of the present invention;
FIG. 6 is a perspective view of a CPU baffle block according to an embodiment of the present invention;
FIG. 7 is a perspective view of a chip guide spacer according to an embodiment of the present invention;
Fig. 8 is a perspective view of a memory bank heat dissipation module according to an embodiment of the present invention.
Detailed Description
The invention will be described in further detail below with reference to the accompanying drawings and by way of examples in order to make the objects, technical solutions and advantages of the invention more apparent.
As shown in fig. 1, a parallel flow cooling system for a server, comprising: the device comprises a cold plate upper cover plate 1, an intermediate partition plate 2, a joint split seat 3, CPU flow guide spacer blocks 4, chip flow guide spacer blocks 5, a CPU heat conduction base 6, a chip heat conduction base 7, a memory strip flow guide heat dissipation module 8 and a main board 9; the main board 9 is provided with electronic components such as a CPU, a chip, a memory bar and the like, the number of the CPU flow guide spacer particles 4 and the number of the chip flow guide spacer particles 5 correspond to the number of the CPU and the chip, one CPU heat conduction base 6 corresponds to one CPU flow guide spacer particle 4, and one chip heat conduction base 7 corresponds to one chip flow guide spacer particle 5.
As shown in fig. 2, the surface of the upper cover plate 1 of the cold plate is provided with a plurality of rectangular memory windows A1-3 penetrating through, the memory windows A1-3 are used for penetrating through the memory strips, the upper surface of the memory strips is prevented from propping against the upper cover plate 1 of the cold plate, and the number of the memory windows A1-3 corresponds to the number of the memory strips.
As shown in fig. 3, three cold liquid guide channels 1-1 and three hot liquid guide channels 1-2 are dug on the lower surface of the upper cover plate 1 of the cold plate, and each cold liquid guide channel 1-1 is parallel to one hot liquid guide channel 1-2.
As shown in FIG. 4, the surface of the middle partition plate 2 is provided with a plurality of through memory windows B2-3, and the memory windows B2-3 are overlapped with the memory windows A1-3 in position and have the same shape.
The surface of the middle partition plate 2 is also provided with a plurality of cold liquid inlets 2-1 and a plurality of hot liquid outlets 2-2 which penetrate through, and the quantity of the cold liquid inlets 2-1 and the hot liquid outlets 2-2 is the same.
The surface of the middle partition plate 2 is also provided with a plurality of through guide channel inlets 2-4 and a plurality of guide channel outlets 2-5, the number of the guide channel inlets 2-4 is the same as that of the cold liquid guide channels 1-1, and the number of the guide channel outlets 2-5 is the same as that of the hot liquid guide channels 1-2.
The upper surface of the middle partition plate 2 is attached to the lower surface of the cold plate upper cover plate 1, the cold liquid guide channel 1-1 and the hot liquid guide channel 1-2 are sealed on the upper surface of the middle partition plate 2, the cold liquid inlet 2-1 is communicated with the sealed cold liquid guide channel 1-1, and the hot liquid outlet 2-2 is communicated with the hot liquid guide channel 1-2. One of the guide channel inlets 2-4 is connected with one of the cold liquid guide channels 1-1, and one of the guide channel outlets 2-5 is connected with one of the hot liquid guide channels 1-2.
As shown in fig. 5, the side surface of the joint flow dividing seat 3 is provided with a cold liquid joint 3-1 and a hot liquid joint 3-4, and the upper surface of the joint flow dividing seat 3 is dug with a cold liquid flow dividing channel 3-2 and a hot liquid flow dividing channel 3-3. The cold liquid joint 3-1 is communicated with the cold liquid split channel 3-2, and the hot liquid joint 3-4 is communicated with the hot liquid split channel 3-3.
The upper surface of the joint flow dividing seat 3 is attached to the lower surface of the middle partition plate 2, the middle partition plate 2 seals the cold liquid flow dividing channel 3-2 and the hot liquid flow dividing channel 3-3, the cold liquid flow dividing channel 3-2 is communicated with all flow guiding channel inlets 2-4, and the hot liquid flow dividing channel 3-3 is communicated with all flow guiding channel outlets 2-5.
As shown in fig. 6 and 7, the CPU guide spacer 4 and the chip guide spacer 5 are hollow rectangular bodies, the materials are heat-conducting metals, and the surfaces of the CPU guide spacer 4 and the chip guide spacer 5 are provided with a cold liquid inlet 4-1 and a hot liquid outlet 4-2;
The upper surfaces of the CPU flow guide spacer blocks 4 and the chip flow guide spacer blocks 5 are attached to the lower surface of the middle partition plate 2, the cold liquid inlets 4-1 of the CPU flow guide spacer blocks 4 are connected with the cold liquid inlets 2-1 in an overlapping manner, the hot liquid outlets 4-2 are connected with the hot liquid outlets 2-2 in an overlapping manner, the cold liquid inlets 4-1 of the chip flow guide spacer blocks 5 are connected with the cold liquid inlets 2-1 in an overlapping manner, and the hot liquid outlets 4-2 are connected with the hot liquid outlets 2-2 in an overlapping manner;
the CPU heat conducting base 6 and the chip heat conducting base 7 are sheet heat conducting metals, the shape and the size of the CPU heat conducting base 6 correspond to the shape and the size of the CPU, the shape and the size of the chip heat conducting base 7 correspond to the shape and the size of the chip,
The upper surface of the CPU heat conduction base 6 contacts with the lower surface of the CPU flow guide spacer 4, the lower surface of the CPU heat conduction base 6 contacts with the CPU, the upper surface of the chip heat conduction base 7 contacts with the lower surface of the chip flow guide spacer 5, and the lower surface of the chip heat conduction base 7 contacts with the chip;
As shown in fig. 8, the memory bank heat dissipation module 8 includes: the cold liquid end 8-1, the hot liquid end 8-2 and two channels 8-3, the cold liquid end 8-1 and the hot liquid end 8-2 are hollow rectangular bodies, a cold liquid inlet 4-1 is arranged on the upper surface of the cold liquid end 8-1, a hot liquid outlet 4-2 is arranged on the upper surface of the hot liquid end 8-2, holes for connecting the channels 8-3 are formed in the side surfaces of the cold liquid end 8-1 and the hot liquid end 8-2, the channels 8-3 are hollow rectangular bodies, the two ends of the channels 8-3 are respectively connected with the cold liquid end 8-1 and the hot liquid end 8-2, and a gap exists between the two channels 8-3 in parallel and is used for sleeving a memory bank and enabling the side wall of the channels 8-3 to be in contact with a chip of the memory bank. The cold liquid inlet 4-1 of the memory strip flow guiding heat dissipating module 8 is connected with one cold liquid inlet 2-1 in an overlapping way, and the hot liquid outlet 4-2 is connected with one hot liquid outlet 2-2 in an overlapping way.
In operation, the cooling liquid enters the cold liquid diversion channel 3-2 through the cold liquid joint 3-1, is diverted into the cold liquid diversion channel 1-1 through the cold liquid diversion channel 3-2, enters the CPU diversion spacer 4, the chip diversion spacer 5 and the memory bank diversion heat dissipation module 8 through the cold liquid diversion channel 1-1 and the cold liquid inlet 4-1, heats up through the heat exchange cooling liquid, flows into the hot liquid diversion channel 1-2 through the hot liquid outlet 4-2, flows into the hot liquid diversion channel 3-3 through the diversion channel outlet 2-5, and finally flows out through the hot liquid joint 3-4. Wherein cold liquid flow channels among the CPU flow guide spacer 4, the chip flow guide spacer 5 and the memory strip flow guide heat dissipation module 8 are connected in parallel.
Those of ordinary skill in the art will appreciate that the embodiments described herein are intended to aid the reader in understanding the practice of the invention and that the scope of the invention is not limited to such specific statements and embodiments. Those of ordinary skill in the art can make various other specific modifications and combinations from the teachings of the present disclosure without departing from the spirit thereof, and such modifications and combinations remain within the scope of the present disclosure.
Claims (1)
1. A server-integrated parallel-flow cold plate liquid cooling system, comprising: the device comprises a cold plate upper cover plate (1), an intermediate baffle (2), a joint split seat (3), a plurality of CPU flow guide spacer blocks (4), a plurality of chip flow guide spacer blocks (5), a plurality of CPU heat conduction bases (6), a plurality of chip heat conduction bases (7) and a main board (9); the CPU, the chips and the memory strips are arranged on the main board (9), the number of the CPU flow guide spacer blocks (4) and the number of the chip flow guide spacer blocks (5) correspond to the number of the CPU and the number of the chips, one CPU heat conduction base (6) corresponds to one CPU flow guide spacer block (4), and one chip heat conduction base (7) corresponds to one chip flow guide spacer block (5);
The surface of the cold plate upper cover plate (1) is provided with a plurality of rectangular memory windows A (1-3) penetrating through the cold plate upper cover plate, the memory windows A (1-3) are used for penetrating through the memory strips, the upper surface of the memory strips is prevented from propping against the cold plate upper cover plate (1), and the number of the memory windows A (1-3) is related to the number of the memory strips;
A plurality of cold liquid guide channels (1-1) and a plurality of hot liquid guide channels (1-2) are dug on the lower surface of the cold plate upper cover plate (1), the number of the cold liquid guide channels (1-1) is the same as that of the hot liquid guide channels (1-2), and the cold liquid guide channels (1-1) and the hot liquid guide channels (1-2) are parallel to each other;
the surface of the middle partition plate (2) is provided with a plurality of through memory windows B (2-3), and the memory windows B (2-3) and the memory windows A (1-3) are overlapped in position and have the same shape;
The surface of the middle partition plate (2) is also provided with a plurality of cold liquid flow inlets (2-1) and a plurality of hot liquid flow outlets (2-2) which penetrate through, the quantity of the cold liquid flow inlets (2-1) and the quantity of the hot liquid flow outlets (2-2) are the same, one CPU flow guide partition block corresponds to one cold liquid flow inlet (2-1) and one hot liquid flow outlet (2-2), and one chip flow guide partition block (5) corresponds to one cold liquid flow inlet (2-1) and one hot liquid flow outlet (2-2);
The surface of the middle partition plate (2) is also provided with a plurality of penetrating guide channel inlets (2-4) and a plurality of guide channel outlets (2-5), the number of the guide channel inlets (2-4) is the same as that of the cold liquid guide channels (1-1), and the number of the guide channel outlets (2-5) is the same as that of the hot liquid guide channels (1-2);
The upper surface of the middle partition plate (2) is attached to the lower surface of the cold plate upper cover plate (1), the cold liquid guide channel (1-1) and the hot liquid guide channel (1-2) are sealed on the upper surface of the middle partition plate (2), the cold liquid inlet (2-1) is communicated with the sealed cold liquid guide channel (1-1), and the hot liquid outlet (2-2) is communicated with the hot liquid guide channel (1-2); one guide channel inlet (2-4) is communicated with a cold liquid guide channel (1-1), and one guide channel outlet (2-5) is communicated with a hot liquid guide channel (1-2);
the side surface of the joint flow dividing seat (3) is provided with a cold liquid joint (3-1) and a hot liquid joint (3-4), and the upper surface of the joint flow dividing seat (3) is provided with a cold liquid flow dividing channel (3-2) and a hot liquid flow dividing channel (3-3); the cold liquid joint (3-1) is communicated with the cold liquid split channel (3-2), and the hot liquid joint (3-4) is communicated with the hot liquid split channel (3-3);
the upper surface of the joint flow dividing seat (3) is attached to the lower surface of the middle partition plate (2), the middle partition plate (2) seals the cold liquid flow dividing channel (3-2) and the hot liquid flow dividing channel (3-3), the cold liquid flow dividing channel (3-2) is communicated with all flow guiding channel inlets (2-4), and the hot liquid flow dividing channel (3-3) is communicated with all flow guiding channel outlets (2-5);
the CPU flow guide spacer block (4) and the chip flow guide spacer block (5) are hollow rectangular bodies, the materials are heat conduction metals, and the surfaces of the CPU flow guide spacer block (4) and the chip flow guide spacer block (5) are provided with a cold liquid inlet (4-1) and a hot liquid outlet (4-2);
The upper surfaces of the CPU flow guide spacer blocks (4) and the chip flow guide spacer blocks (5) are attached to the lower surface of the middle partition plate (2), the cold liquid inlets (4-1) of the CPU flow guide spacer blocks (4) are connected with one cold liquid inlet (2-1) in an overlapping mode, the hot liquid outlets (4-2) are connected with one hot liquid outlet (2-2) in an overlapping mode, and the cold liquid inlets (4-1) of the chip flow guide spacer blocks (5) are connected with one cold liquid inlet (2-1) in an overlapping mode;
The CPU heat conducting base (6) and the chip heat conducting base (7) are sheet heat conducting metals, the shape and the size of the CPU heat conducting base (6) correspond to the shape and the size of the CPU, the shape and the size of the chip heat conducting base (7) correspond to the shape and the size of the chip,
The upper surface of the CPU heat conduction base (6) is contacted with the lower surface of the CPU flow guide spacer block (4), the lower surface of the CPU heat conduction base (6) is contacted with the CPU, the upper surface of the chip heat conduction base (7) is contacted with the lower surface of the chip flow guide spacer block (5), and the lower surface of the chip heat conduction base (7) is contacted with the chip;
the whole parallel-flow cold plate liquid cooling system of server still includes memory strip water conservancy diversion heat dissipation module (8), and memory strip water conservancy diversion heat dissipation module (8) include: the cold liquid end (8-1), the hot liquid end (8-2) and two channels (8-3), the cold liquid end (8-1) and the hot liquid end (8-2) are hollow rectangular bodies, a cold liquid inlet (4-1) is formed in the upper surface of the cold liquid end (8-1), a hot liquid outlet (4-2) is formed in the upper surface of the hot liquid end (8-2), holes for connecting the channels (8-3) are formed in the side surfaces of the cold liquid end (8-1) and the hot liquid end (8-2), the channels (8-3) are hollow rectangular bodies, the two ends of the channels (8-3) are respectively connected with the cold liquid end (8-1) and the hot liquid end (8-2), gaps exist in the middle of the two channels (8-3) in parallel, the gaps are used for sleeving a memory bank and enabling the side wall of the channels (8-3) to be in contact with a chip of the memory bank, and the cold liquid inlet (4-1) of the memory bank flow guide heat dissipation module (8) is connected with one cold liquid inlet (2-1) in an overlapping mode;
The cooling liquid enters the cold liquid diversion channel (3-2) through the cold liquid joint (3-1), is diverted into the cold liquid diversion channel (1-1) through the cold liquid diversion channel (3-2), enters the CPU diversion spacer block (4), the chip diversion spacer block (5) and the memory strip diversion heat dissipation module (8) through the cold liquid diversion channel (1-1) through the cold liquid inlet (4-1), heats up through the heat exchange cooling liquid, flows into the hot liquid diversion channel (1-2) through the hot liquid outlet (4-2), flows into the hot liquid diversion channel (3-3) through the hot liquid outlet (2-5), and finally flows out through the hot liquid joint (3-4); wherein cold liquid flow channels among the CPU flow guide spacer blocks (4), the chip flow guide spacer blocks (5) and the memory strip flow guide heat dissipation modules (8) are connected in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010834350.3A CN112015250B (en) | 2020-08-19 | 2020-08-19 | Integrated parallel-flow cold plate liquid cooling system of server |
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