CN213960614U

CN213960614U - Box liquid cooling heat dissipation stringing device

Info

Publication number: CN213960614U
Application number: CN202023180359.1U
Authority: CN
Inventors: 潘敏强; 臧义程; 李超; 陈坚泽; 陈阳
Original assignee: Foshan Liquid Cooling Times Technology Co ltd
Current assignee: Foshan Liquid Cooling Times Technology Co ltd
Priority date: 2020-12-25
Filing date: 2020-12-25
Publication date: 2021-08-13
Anticipated expiration: 2030-12-25

Abstract

The utility model discloses a box type liquid cooling heat dissipation pipe distribution device, which comprises a box body, a liquid cooling collecting pipe and a plurality of groups of quick plug modules; the liquid cooling manifold is fixed on the box body, and the quick-plug module is fixed on the liquid cooling manifold. The utility model provides a device is convenient for install in original rack rear, makes things convenient for server dismouting and maintenance, connects liquid working medium after, guarantees that the liquid supply volume is even, gives server liquid cooling module cooling through quick-operation joint, can realize the high-efficient heat dissipation of server rack, is applicable to popularization and application.

Description

Box liquid cooling heat dissipation stringing device

Technical Field

The utility model relates to a server heat dissipation technical field especially relates to a box liquid cooling heat dissipation stringing device.

Background

The Internet Data Center (IDC) plays an important role in the globalization and informatization development process, is an important infrastructure of industries such as telecommunication, Internet, finance and the like, and is an important informatization basis for promoting the network strong strategy of each country. At present, the electricity consumption of global IDC accounts for 1.5 percent of the global electricity consumption, the electricity generation amount of about 30 nuclear power stations and the electricity charge accounts for 60 to 70 percent of the operation cost of a data center, and the total electricity consumption of the Chinese data center in 2023 years is estimated to exceed 2600 billions of kilowatt hours. The problem of high energy consumption is outbreak under the sudden increase of the number of the IDCs, and the worldwide IDCs energy consumption is expected to account for 33 percent of the information communication industry in 2025. The severe high energy consumption of IDC leads to strong demands for energy saving and consumption reduction.

In recent years, along with the gradual increase of computing requirements, the power of a server chip is higher and higher, the burden of an air-cooled heat dissipation system adaptive to a traditional server room is increased, and a lower PUE cannot be realized under the condition of meeting the heat dissipation requirement of a data center. The traditional air cooling technology mainly reduces the ambient temperature of the whole data center through an air conditioner between columns, can not directly radiate heat of heating elements, and is low in efficiency.

Liquid cooling technology is a technology that uses a liquid heat transfer medium with high cooling efficiency, such as water, oil or glycol, to exchange heat. Specifically, heat is taken away by a liquid heat transfer medium flowing through a heating chip, and cold and heat exchange is realized through a heat exchanger and a cooling tower. Liquid cooling has the following advantages over air cooling: the specific heat capacity is high, the heat capacity is high, and the heat quantity taken away under the condition of same temperature rise is large; high thermal conductivity and quick heat transfer; the refrigeration effect is strong, and the supportable power density is high; the PUE value is low, and the energy consumption is low; the noise at the equipment terminal is low, so the liquid cooling technology is gradually paid attention to in the IDC cooling field.

The existing liquid cooling technology is divided into a cold plate type liquid cooling technology and an immersed type liquid cooling technology, and the working principle of the two is as follows:

the cold plate type liquid cooling technology is that working fluid is used as a medium for transferring intermediate heat, and the heat is transferred from a hot area to a remote place and then is cooled. In this technique, the working fluid is separated from the object to be cooled, and the working fluid does not directly contact the electronic device but transfers heat of the object to be cooled to the refrigerant through a high-efficiency heat transfer member such as a liquid cooling plate. Because the specific heat of liquid is big than the air, the radiating rate is greater than the air far away, therefore refrigeration efficiency is far higher than the air-cooled heat dissipation, can effectively solve the heat dissipation problem of high density server, reduces cooling system energy consumption and noise reduction.

The immersed liquid cooling technology is to immerse the heating elements, such as server mainboard, CPU, memory, etc. in refrigerant completely, and in working state, the heating elements will produce heat to raise the temperature of refrigerant. When the temperature of the refrigerant is increased to the boiling point corresponding to the system pressure, the refrigerant working medium is changed into a gas state from a liquid state, and the heat is absorbed through vaporization heat to realize the heat transfer. The immersed liquid cooling technology utilizes liquid phase change to directly take away heat, reduces thermal resistance in a heat transfer process, has higher heat transfer efficiency compared with cold plate liquid cooling, and is a novel refrigeration mode with the highest energy conservation and the highest efficiency in the liquid cooling.

The arrangement of working fluid liquid supply pipes is one of the main parts in the actual engineering no matter cold plate type liquid cooling or immersed type liquid cooling, however, the liquid conveying pipe of the liquid cooling system of the existing IT equipment is limited by the diameter and the bending radius, so that the liquid conveying pipe cannot be wired like a cable, and the liquid supply pipe is mostly exposed outside directly. The exposed pipelines are not beautiful visually, so that the machine room is messy; meanwhile, the exposed pipeline is easy to trip down the working personnel, which causes potential safety hazard. To avoid such situations, designers often need to design the liquid cooling system while paying attention to tight coupling with the racks and the equipment, which presents many difficulties with respect to piping layout, rack design, equipment routing, and equipment installation and maintenance.

This design is through accomodating the transfer line part in inserting the module soon, and the quick connector of cooperation CPU and the rearmounted unit of quick-witted case reach and pull out the function of inserting fast to the transfer line, have saved the installation time of liquid cooling system greatly, also have the aesthetic property concurrently when reducing the installation and maintaining the difficulty, make the computer lab become neater more.

Disclosure of Invention

In order to solve the technical problem, the utility model aims at providing a box liquid cooling heat dissipation stringing device of dismouting, easy maintenance is applicable to high power density liquid cooling rack and popularizes and applies.

The purpose of the utility model is realized through the following technical scheme:

a box liquid cooling heat dissipation stringing device includes: the device comprises a box body 1, a liquid cooling header 2 and a plurality of groups of quick plug-in modules 3; the liquid cooling manifold 2 is fixed on the box body 1, and the quick plug module 3 is fixed on the liquid cooling manifold 2.

Compared with the prior art, the utility model discloses an advantage can have as follows to one or more embodiments:

the utility model discloses be convenient for install on former organic cabinet, make things convenient for the dismouting and the maintenance of server, guarantee that the liquid supply volume is even, realize the high-efficient heat dissipation of server rack. Insert the module soon and realized the liquid supply pipeline rapid Assembly simultaneously and hidden the function that supplies the liquid hose, solved liquid supply pipe stringing mixed and disorderly, the difficult problem of later maintenance.

Drawings

FIG. 1 is a schematic structural view of a box-type liquid-cooled heat dissipation pipe distribution device;

FIG. 2 is a schematic diagram of a cold header configuration;

FIG. 3 is a schematic diagram of a fast-plug module;

FIG. 4 is a schematic diagram of a fast-plug module and server assembly;

fig. 5 is a schematic diagram of liquid flow after access to a liquid cooling system.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail with reference to the following embodiments and accompanying drawings.

As shown in fig. 1, the utility model discloses a box liquid cooling heat dissipation stringing device structure, include: the liquid cooling system comprises a box body 1, a liquid cooling header 2 and a plurality of groups of quick plug-in modules 3; the liquid cooling manifold 2 is fixed on the box body 1, and the quick plug module 3 is fixed on the liquid cooling manifold 2.

As shown in fig. 2, the liquid-cooled header 2 includes a header base 21, a header housing 22, a liquid inlet pipe 23, a liquid outlet pipe 24, and a gas discharge valve 25; the collecting pipe base 21 is arranged on the box body 1, and a connecting hole is formed in the collecting pipe base 21; the header housing 22 is connected to the header base 21 through the connection hole; the liquid inlet pipe 23 and the liquid outlet pipe 24 are arranged in the header shell 22; the exhaust valve 25 is disposed at the top ends of the liquid inlet pipe 23 and the liquid outlet pipe 24 for exhausting the insoluble gas of the distribution unit.

As shown in fig. 3, the quick-plug module 3 is composed of a module housing 31, a quick coupling 32, a clamp 33, a liquid supply pipe 35 and a liquid return pipe 36; the clamp 33 is fixed with the module shell 31 and used for fixing the quick connector 32; the liquid supply pipe 35 and the liquid return pipe 36 are flexible pipes, and one ends of the liquid supply pipe 35 and the liquid return pipe 36 are connected with the quick coupling 32.

The liquid inlet pipe 23 is provided with a plurality of liquid supply ports 231 and a liquid inlet main port 232, and the liquid supply ports 231 are connected with the other end of the liquid supply pipe 35 on the fast plug module 3 through a quick coupling; the liquid inlet main port 232 is arranged at the bottom of the liquid inlet pipe 23; a plurality of liquid return ports 241 and a liquid outlet main port 242 are arranged on the liquid outlet pipe 24; the liquid return port 241 is connected with the other end of the liquid return pipe 36 on the quick-plug module 3 through a quick connector; the liquid outlet main port 242 is arranged at the bottom of the liquid outlet pipe 24.

The liquid inlet port 232 at the bottom of the liquid inlet pipe 23 and the liquid outlet port 242 at the bottom of the liquid outlet pipe 24 are connected to the external liquid cooling circulation unit 5.

As shown in fig. 4, which is a schematic view of the assembly of the quick-connect module and the server, the CPU heat transfer module 41 in the server 4 has a quick connector 411, which is engaged with the quick connector 32. When the server 4 needs to be connected with the liquid cooling circulation, the server is pushed to the quick-plug module 3 with force, and the connection between the server and the quick-plug module can be completed after the quick-connector group is automatically locked. In addition, when the server is fixed, the connection between the server and the quick plug-in module can be completed by pushing and pulling the quick plug-in module back and forth.

As shown in fig. 5, a schematic diagram of a liquid flow principle after the liquid cooling system is connected is shown, and the working principle of the schematic diagram is as follows: the low-temperature liquid working medium cooled by the liquid cooling circulation unit 5 enters the module through the liquid inlet 232 and then is distributed to the liquid supply pipe 35 through the liquid inlet pipe 23, then flows through the quick connector 32 and enters the CPU heat transfer module 41, the CPU heat transfer module and the CPU carry out heat exchange, the cooling function of the CPU is realized, after the heat exchange, the low-temperature liquid working medium is heated to be high-temperature liquid working medium, the high-temperature liquid working medium flows into the liquid return pipe 36 through the quick connector 32 through the CPU heat dissipation module, the liquid outlet pipe 24 collects the high-temperature liquid working medium in the liquid return pipe 36 and then discharges the working medium out of the module through the liquid outlet 242, the working medium returns to the liquid cooling circulation unit 5, and liquid flowing circulation cooling is completed.

Although the embodiments of the present invention have been described above, the description is only for the convenience of understanding the present invention, and the present invention is not limited thereto. It will be apparent to persons skilled in the relevant art that various changes in form and detail can be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A box type liquid cooling heat dissipation pipe distribution device is characterized by comprising a box body (1), a liquid cooling collecting pipe (2) and a plurality of groups of quick plug-in modules (3); the liquid cooling header (2) is fixed on the box body (1), and the quick plug module (3) is fixed on the liquid cooling header (2);

the quick-plug module (3) is composed of a module shell (31), a quick joint (32), a clamp (33), a liquid supply pipe (35) and a liquid return pipe (36);

the clamp (33) is fixed with the module shell (31) and used for fixing the quick connector (32);

the liquid supply pipe (35) and the liquid return pipe (36) are hoses, and one ends of the liquid supply pipe (35) and the liquid return pipe (36) are connected with the quick connector (32).

2. The box-type liquid-cooled heat dissipation tube distribution device of claim 1, wherein the liquid-cooled header (2) includes a header base (21), a header housing (22), an inlet tube (23), an outlet tube (24), and an exhaust valve (25);

the collecting pipe base (21) is arranged on the box body (1), and a connecting hole is formed in the collecting pipe base (21);

the header shell (22) is connected with the header base (21) through the connecting hole;

the liquid inlet pipe (23) and the liquid outlet pipe (24) are arranged in the collecting pipe shell (22);

the exhaust valve (25) is arranged at the top ends of the liquid inlet pipe (23) and the liquid outlet pipe (24) and used for exhausting the insoluble gas of the distribution unit.

3. The box-type liquid-cooled heat dissipation pipe distribution device of claim 2,

the liquid inlet pipe (23) is provided with a plurality of liquid supply ports (231) and a liquid inlet main port (232), and the liquid supply ports (231) are connected with the other end of a liquid supply pipe (35) on the quick plug module (3) through quick connectors; the liquid inlet main port (232) is arranged at the bottom of the liquid inlet pipe (23);

a plurality of liquid return ports (241) and a liquid outlet main port (242) are arranged on the liquid outlet pipe (24); the liquid return port (241) is connected with the other end of a liquid return pipe (36) on the quick-plug module (3) through a quick connector; the liquid outlet main port (242) is arranged at the bottom of the liquid outlet pipe (24).

4. The box-type liquid-cooled heat dissipation pipe distribution device as claimed in claim 3, wherein the liquid inlet port (232) at the bottom of the liquid inlet pipe (23) and the liquid outlet port (242) at the bottom of the liquid outlet pipe (24) are connected to an external liquid-cooled circulation unit (5).