CN210053725U - Liquid cooling heat dissipation circulation loop device for rack server - Google Patents
Liquid cooling heat dissipation circulation loop device for rack server Download PDFInfo
- Publication number
- CN210053725U CN210053725U CN201822147322.5U CN201822147322U CN210053725U CN 210053725 U CN210053725 U CN 210053725U CN 201822147322 U CN201822147322 U CN 201822147322U CN 210053725 U CN210053725 U CN 210053725U
- Authority
- CN
- China
- Prior art keywords
- pipe
- liquid
- branch
- cooling
- liquid supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a liquid cooling heat dissipation circulation circuit device for frame server, include: the cooling branch comprises a first branch liquid supply pipe, a second branch liquid supply pipe, a heat pipe unit, a second branch liquid return pipe and a first branch liquid return pipe; a heat pipe unit and a monitoring alarm unit are arranged. The loop device is arranged in the machine cabinet but outside the server, is an important component of a chip-level heat dissipation scheme based on the heat pipe module, is simple and reliable, is convenient to disassemble, assemble and maintain, and simultaneously improves the heat dissipation efficiency, reduces the energy consumption cost of a machine room and reduces the potential safety hazard of liquid cooling. The system pipeline structure of the whole loop device is simple, the pipeline flow resistance is reduced, the loop device does not need a circulating pump, the circulating requirement can be met only by the power of the liquid circulating pipeline of the machine room, and the loop device has the characteristic of low operation energy consumption.
Description
Technical Field
The utility model belongs to the technical field of the computer lab heat dissipation, especially, relate to a liquid cooling heat abstractor for frame server.
Background
The problem of heat dissipation and energy consumption of a data center (also called a computer room) is receiving more and more attention and attention as the scale of the data center and the power density of a cabinet increase. At present, the prior art mainly aims at the heat dissipation design of the whole machine room or a single machine cabinet, such as an air cooling air conditioner, a water cooling air conditioner, a space between columns, a liquid cooling back plate and the like, which can belong to the heat dissipation modes of the machine room level and the machine cabinet level, so that the problem of local heat dissipation of countless server chips in the machine cabinet can not be effectively solved, and the effective control of the working temperature under high power can not be realized. From the perspective of the source of the heat generated by the server, the heat generated by the main chip accounts for more than 70% of the heat generated by the server. In order to solve the problem, the development requirements of future high-power-density cabinets and high-power server chips are met, and the development of a novel machine room heat dissipation mode based on a chip-level heat dissipation mode becomes the mainstream direction in the future.
The heat pipe technology is known as a "hot superconductor" as a passive two-phase heat exchange technology, and has been primarily applied to data centers in recent years. A chip-level heat dissipation scheme based on a heat pipe module belongs to a computer room chip-level heat dissipation technology with a promising application prospect, and the heat generated by a chip is quickly transferred to an outlet position of a server or the outside of the server through a high-performance heat pipe and then is taken away by being coupled with a liquid circulation loop positioned outside the server. Compared with a single-phase liquid cooling loop and a chip immersion type liquid cooling which are led into a server, the chip-level heat dissipation scheme based on the heat pipe module greatly reduces the potential safety hazard of leakage and the complex maintenance degree, has the advantages of strong heat dissipation effect, good chip temperature control effect and extremely low refrigeration energy consumption, and can meet the green heat dissipation requirements that the power consumption of a future single chip reaches 200 + 400W and the power of a single cabinet reaches 20-40 kW.
SUMMERY OF THE UTILITY MODEL
The technical problem of the utility model is solved: the liquid cooling heat dissipation circulation loop device for the rack server is simple, convenient to disassemble, assemble and maintain, and capable of improving heat dissipation efficiency, reducing energy consumption cost and liquid cooling potential safety hazards.
In order to solve the technical problem, the utility model discloses a liquid cooling heat dissipation circulation loop device for frame server, include: the cooling branch comprises a first branch liquid supply pipe, a second branch liquid supply pipe, a heat pipe unit, a second branch liquid return pipe and a first branch liquid return pipe;
the liquid supply main pipe and the liquid return main pipe are positioned at the rear part of the cabinet; the cooling liquid enters a first branch liquid supply pipe of the cooling branch through the liquid supply main pipe, enters the inlet of the cooling end of the heat pipe unit through a second branch liquid supply pipe, flows into a second branch liquid return pipe through the outlet of the cooling end and then flows into the liquid return main pipe through the first branch liquid return pipe;
the evaporation end of the heat pipe unit is positioned in the rack server and is contacted and attached with the outer surface of the chip.
Preferably, the cooling end is located inside the rack server and proximate to the back end of the server, or outside the back end of the rack server.
Preferably, the upper end and the lower end of the liquid supply main pipe and the liquid return main pipe are both provided with valves, and the upper end of the liquid return main pipe is provided with an exhaust valve.
Preferably, a monitoring alarm unit is further arranged, liquid leakage monitoring sensors are arranged at the joints of the liquid supply main pipe, the liquid return main pipe and the valves, the joints of the valves and the liquid circulation pipeline of the machine room, the joints of the liquid supply main pipe, the liquid return main pipe and the first branch liquid supply branch pipe, the joints of the liquid supply main pipe, the liquid return main pipe and the first branch liquid return pipe, the joints of the first branch liquid return pipe and the second branch liquid return pipe, the joints of the second branch liquid supply pipe and the cooling end inlet of the heat pipe unit, and the joints of the second branch liquid return pipe and the cooling end outlet of the heat pipe unit, and the monitoring alarm unit receives signals sent by the liquid leakage monitoring sensors and monitors whether liquid leakage occurs or not.
Preferably, the pipe diameters of the liquid supply main pipe and the liquid return main pipe are larger than those of the first branch liquid supply pipe and the first branch liquid return pipe, and the pipe diameters of the first branch liquid supply pipe and the first branch liquid return pipe are larger than those of the second branch liquid supply pipe and the second branch liquid return pipe.
Preferably, the liquid supply main pipe and the liquid return main pipe are of hard pipe structures; the first branch liquid supply pipe, the first branch liquid return pipe, the second branch liquid return pipe and the second branch liquid supply pipe are of hose structures and can be bent.
Preferably, the shell material of the hard tube structure is metal, and the shell material of the hose structure is plastic.
Preferably, the liquid supply main pipe is arranged at the upper part of one side of the cabinet and is horizontally arranged; a plurality of first branch supply tubes are connected to the end of the supply main by a liquid distributor.
Preferably, the connection form of the first branch liquid supply pipe and the liquid supply main pipe and the connection form of the first branch liquid return pipe and the liquid return main pipe adopt a quick plugging mode; the connection form between the first branch liquid supply pipe and the second branch liquid supply pipe, between the second branch liquid return pipe and the first branch liquid return pipe, and between the second branch liquid supply pipe, the second branch liquid return pipe and the cooling end adopts a fixed connection mode or a quick plugging mode.
Preferably, the evaporation end of the heat pipe unit comprises a second evaporation end, a first evaporation end, a second gas pipeline, a first evaporation pipeline, a first gas pipeline, a second liquid pipeline, a first liquid pipeline and a three-way structural member; the first liquid pipeline is connected with the first evaporation end, the first evaporation end is connected with the second evaporation end through the second liquid pipeline, and the second evaporation end is connected to the three-way structural part through the second gas pipeline; the tee joint structural part is connected with a first evaporation end through a first evaporation pipeline, the tee joint structural part is connected with a first gas pipeline, the first gas pipeline is connected and stretched into a cooling end, a coil pipe is formed by winding in the cooling end, the coil pipe stretches out of the cooling end and is communicated with a first liquid pipeline, and the part, inside the cooling end, of the first gas pipeline and the first liquid pipeline and the coil pipe jointly form a heat pipe condenser.
Preferably, the first evaporation end and the second evaporation end extend into the server, and are respectively contacted and fixed with the first chip and the second chip of the server.
The utility model has the advantages of it is following:
(1) the utility model discloses the design has four valves on return liquid house steward and the confession liquid house steward of loop arrangement, and it is convenient to be connected with computer lab liquid loop system, and the design has two discharge valves on the house steward, carries out the device pipeline when being convenient for installation and debugging and exhausts, reduces the flow resistance.
(2) The utility model discloses outside whole return circuit device was located the server, and integrated at the rear portion of rack, can guarantee that the liquid in the device does not get into the server, improves server operation security, does not occupy the space outside the rack again, and it is pleasing to the eye to arrange compact symmetry. All connection parts of the loop device are also provided with leakage monitors, and the loop device has a micro leakage alarm function.
(3) The utility model discloses whole return circuit device's system pipeline simple structure, pipeline flow resistance reduces, and return circuit device does not need the circulating pump, only just can satisfy the circulation demand by the power of computer lab liquid circulation pipeline, has the characteristics that the running energy consumption is low.
(4) The utility model discloses supply liquid house steward and return the mode of adopting fast plug between liquid house steward and the first branch pipe among the loop means, realize the quick disconnection between the two and can not have the leakage emergence, the installation maintenance of the server of being convenient for.
Drawings
Fig. 1 is a schematic diagram of an overall structure of a liquid cooling heat dissipation loop device for a rack server according to an embodiment of the present invention;
fig. 2 is a schematic view of a first liquid supply header conversion structure of the liquid cooling heat dissipation loop device according to the embodiment of the present invention;
fig. 3 is a schematic view of a liquid supply header pipe conversion structure of the liquid cooling heat dissipation loop device in the embodiment of the present invention;
fig. 4 is a schematic view of a heat pipe unit in an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the following will describe in further detail common embodiments of the present invention with reference to the accompanying drawings.
Referring to fig. 1, the liquid cooling heat dissipation loop apparatus for a rack server includes: the system comprises a liquid supply main pipe 201, a liquid return main pipe 202, valves 203 positioned at the upper and lower ends of the liquid supply main pipe 201 and the liquid return main pipe 202, an exhaust valve 204 positioned near the upper ends of the liquid supply main pipe 201 and the liquid return main pipe 202, a first branch liquid supply pipe 205 and a second branch liquid supply pipe 206 which are sequentially connected with the liquid supply main pipe 201 and the liquid return main pipe 202, a second branch liquid return pipe 207, a first branch liquid return pipe 208, a heat pipe unit 103 and a monitoring alarm unit.
In this embodiment, the specific connection structure between the components in the liquid-cooled heat dissipation loop device is as follows: the liquid supply main pipe 201 and the liquid return main pipe 202 are positioned at the rear part of the cabinet 101 and are fixed close to the side wall; one end of the first branch liquid supply pipe 205 is connected with the liquid supply main pipe 201 and the liquid return main pipe 202, and the other end is connected with the second branch liquid supply pipe 206; one end of the second branch liquid supply pipe 206 is connected with the first branch liquid supply pipe 205, and the other end is connected with the liquid inlet of the cooling end 104 of the heat pipe unit 103; flows into second branch return pipe 207 through the outlet of cooling end 104 and then flows into return header 202 through first branch return pipe 208.
The cooling side 104 may be located inside the rack server 102 and proximate to the back end of the server, or outside the back end of the rack server 102; the evaporation end 105 of the heat pipe unit 103 is positioned inside the rack server 102 and is in contact fit with the outer surface of the chip;
the monitoring alarm unit is provided with a leakage monitoring sensor or a similar monitoring alarm element at the joint of the liquid supply main 201 and the liquid return main 202 with the valve 203, the joint of the valve 203 with a liquid circulation pipeline of the machine room, the joint of the liquid supply main 201 and the liquid return main 202 with the first branch liquid supply pipe 205, the joint of the liquid supply main 201 and the liquid return main 202 with the first branch liquid return pipe 208, the joint of the first branch liquid supply pipe 205 with the second branch liquid supply pipe 205, and the joint of the second branch liquid supply pipe 205 with the cooling end 104 of the heat pipe unit 103. And monitoring signals or data obtained by the monitoring alarm unit are finally gathered into the machine room moving loop monitoring software. When a micro-leakage occurs at a certain connecting part in the liquid cooling heat dissipation loop device, an alarm prompt is given to the moving ring monitoring software, and a specific leakage position is informed to remind a machine room operation and maintenance worker to overhaul.
In a preferred embodiment of the present invention, as shown in fig. 1, the pipe diameters of the liquid supply main 201 and the liquid return main 202 are larger than the pipe diameter of the first branch liquid supply pipe 205, the pipe diameter of the first branch liquid supply pipe 205 is the same as the pipe diameter of the first branch liquid return pipe 208, the pipe diameter of the first branch liquid supply pipe 205 is larger than the pipe diameter of the second branch liquid supply pipe 206, and the pipe diameter of the second branch liquid supply pipe 206 is the same as the pipe diameter of the second branch liquid return pipe 207; the liquid supply main pipe 201 and the liquid return main pipe 202 are of hard pipe structures, and the pipe shell is made of metal; the first branch liquid supply tube 205, the first branch liquid return tube 208, the second branch liquid supply tube 206 and the second branch liquid return tube 207 are flexible tubes, which can be bent freely, and the tube shell material is plastic.
The connection form of the first branch pipe 205, the liquid supply main pipe 201 and the liquid return main pipe 202 adopts a quick plugging mode; the first branch pipe 205 and the second branch liquid supply pipe 206, and the second branch liquid supply pipe 206 and the heat pipe cooling end 104 are connected in a fixed connection manner or a quick plug manner.
In this embodiment, as shown in fig. 1, one of the valves 203 at the two ends of the liquid supply main pipe 201 and the liquid return main pipe 202 is connected to the liquid circulation pipeline of the machine room and is in an open state when the circulation loop works, and the valve at the other end of the liquid supply main pipe 201 and the liquid return main pipe 202 is in a closed state.
Preferably, the lower end valve of the liquid supply main pipe 201 is selected to be connected with a liquid sending pipe interface of a liquid circulation pipeline of the machine room, and the upper end valve of the liquid return main pipe 202 is selected to be connected with a liquid return pipe interface of the liquid circulation pipeline of the machine room, so as to ensure that the first branch liquid supply pipe 205 and the cooling end 104 at different height positions in the liquid cooling heat dissipation circulation loop device obtain equal liquid flow. When the liquid cooling heat dissipation circulation loop device is used for the first joint debugging, the exhaust valve 204 needs to be opened to exhaust redundant air in the pipeline, so that smooth liquid circulation and uniform distribution in the pipeline are ensured.
In order to further improve the uniformity of the liquid flow rate obtained by the first branch liquid supply pipe 205 and the cooling end 104 at different height positions, referring to fig. 2 and fig. 3, a schematic diagram of a first liquid supply main conversion structure and a second conversion structure of the liquid cooling heat dissipation loop device in the embodiment of the present invention is shown.
Referring to fig. 2, the liquid supply main 201 is disposed at the top end of the cabinet 101, and is horizontally disposed, and the first branch pipes 205 are connected to the liquid supply main 201 in a vertically parallel manner. In this embodiment, the manifold and hoses on the return manifold 202 side remain in the same arrangement, and as shown in FIG. 1, the second branch supply line 206 on the supply manifold 201 side remains in a horizontal arrangement and is connected to the first branch supply line 205 in FIG. 2.
As shown in fig. 3, the liquid supply header 201 is disposed at the upper right side of the cabinet 101 and is horizontally disposed. A plurality of first branch supply tubes 205 are connected to the end of the supply header 201 by a liquid distributor 207. Similarly, all of the lines on the return manifold 202 side and the second branch supply line 206 on the supply manifold 201 side remain substantially unchanged.
In the embodiment shown in fig. 1, one cooling end 104 corresponds to one evaporation end 105, and heat is dissipated from one chip. In another embodiment, one cooling tip 104 corresponds to a plurality of evaporation tips 105. As shown in fig. 4, the loop heat pipe includes: the device comprises a second evaporation end 3, a first evaporation end 4, a second gas pipeline 5, a first evaporation pipeline 6, a first gas pipeline 7, a second liquid pipeline 8, a first liquid pipeline 9, a three-way structural part 10 and a cooling end 104.
The first liquid pipeline 9 is connected with the first evaporation end 4, the first evaporation end 4 is connected with the second evaporation end 3 through the second liquid pipeline 8, the second evaporation end 3 is connected with the tee joint structure 10 through the second gas pipeline 5, meanwhile, the tee joint structure 10 is connected with the first evaporation end 4 through the first evaporation pipeline 6 and is connected with the first gas pipeline 7, the first gas pipeline 7 is connected and extends into the cooling end 104, a coil 108 is formed in the cooling end 104 in a winding mode, the coil 108 extends out of the cooling end and is communicated with the first liquid pipeline 9, and the portion, inside the cooling end 104, of the first gas pipeline 7 and the first liquid pipeline 9 and the coil 108 form a heat pipe condenser together. The heat pipe condenser extends into the server and is respectively contacted and fixed with the first chip 1 and the second chip 2 which are arranged in the server, liquid in the evaporation end is evaporated into gas by heat generated in the working process of the chips, the gas is sent to the cooling end 104 through the evaporation pipeline and the gas pipeline, heat exchange is carried out between the cooling end 104 and cooling fluid in the cooling end 104, and the liquid is condensed into liquid, so that the heat dissipation of the chips is realized. The first evaporation end 4 and the second evaporation end 3 extend into the server, and are respectively contacted and fixed with the first chip 1 and the second chip 2. The cooling end 104 further comprises an inlet 101 and an outlet 102, wherein the inlet 101 is communicated with a second branch liquid supply pipe 206, and the outlet 102 is communicated with a second branch liquid return pipe 207.
Two cooling ends 104 correspond a plurality of evaporation ends in this embodiment, and those skilled in the art can understand that if there are a plurality of chips that need this branch road to dispel the heat, then the quantity of evaporation end and the quantity of chip correspond, and two evaporation ends are not right the utility model discloses a restriction, those skilled in the art can select the quantity of evaporation end according to the heat dissipation demand of reality easily.
The above description is only for the best embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are all covered by the protection scope of the present invention.
The details of the present invention not described in detail in the specification are well known to those skilled in the art.
Claims (11)
1. A liquid cooling heat dissipation circulation loop device for a rack server, comprising: the cooling system comprises a liquid supply header pipe (201), a liquid return header pipe (202), and a plurality of cooling branches arranged in parallel between the liquid supply header pipe (201) and the liquid return header pipe (202), wherein each cooling branch comprises a first branch liquid supply pipe (205), a second branch liquid supply pipe (206), a heat pipe unit (103), a second branch liquid return pipe (207) and a first branch liquid return pipe (208);
the liquid supply main pipe (201) and the liquid return main pipe (202) are positioned at the rear part of the cabinet (101); the cooling liquid enters a first branch liquid supply pipe (205) of the cooling branch through a liquid supply header pipe (201), enters an inlet of a cooling end (104) of the heat pipe unit (103) through a second branch liquid supply pipe (206), flows into a second branch liquid return pipe (207) through an outlet of the cooling end (104), and then flows into a liquid return header pipe (202) through a first branch liquid return pipe (208);
the evaporation end (105) of the heat pipe unit (103) is positioned inside the rack server (102) and is in contact joint with the outer surface of the chip.
2. The rack server liquid-cooled heat dissipation circulation loop apparatus of claim 1, wherein the cooling end (104) is located inside the rack server (102) and in close proximity to the rear end of the server, or outside the rear end of the rack server (102).
3. The liquid cooling heat dissipation circulation loop device for the rack server as claimed in claim 2, wherein the upper and lower ends of the liquid supply header pipe (201) and the liquid return header pipe (202) are provided with valves, and the upper end of the liquid return header pipe (202) is provided with an exhaust valve (204).
4. The liquid-cooled heat dissipation circulation loop device for rack servers of claim 3, wherein a monitoring alarm unit is further provided, and liquid leakage monitoring sensors are provided at the connection between the liquid supply main pipe (201) and the liquid return main pipe (202) and each valve, the connection between each valve and the machine room liquid circulation pipeline, the connection between the liquid supply main pipe (201) and the liquid return main pipe (202) and the first branch liquid supply pipe (205), the connection between the liquid supply main pipe (201) and the liquid return main pipe (202) and the first branch liquid return pipe (208), the connection between the first branch liquid return pipe (208) and the second branch liquid return pipe (207), the connection between the second branch liquid supply pipe (206) and the inlet of the cooling end (104) of the heat pipe unit (103), and the connection between the second branch liquid return pipe (207) and the outlet of the cooling end (104) of the heat pipe unit (103), and the monitoring alarm unit receives the signal sent by the liquid leakage monitoring sensors, and monitoring whether liquid leakage occurs.
5. The apparatus of claim 3, wherein the diameters of the liquid supply manifold (201) and the liquid return manifold (202) are larger than the diameters of the first branch supply pipe (205) and the first branch return pipe (208), and the diameters of the first branch supply pipe (205) and the first branch return pipe (208) are larger than the diameters of the second branch supply pipe (206) and the second branch return pipe (207).
6. The liquid-cooled heat dissipation circulation loop apparatus as claimed in claim 5, wherein the liquid supply header (201) and the liquid return header (202) are of rigid pipe construction; the first branch liquid supply pipe (205), the first branch liquid return pipe (208), the second branch liquid return pipe (207) and the second branch liquid supply pipe (206) are flexible.
7. The liquid-cooled heat dissipation circulation loop apparatus of claim 6, wherein the hard-structured shell material is metal and the soft-structured shell material is plastic.
8. The liquid-cooled heat dissipation circulation loop device as claimed in claim 6, wherein the liquid supply header pipe (201) is disposed at an upper portion of one side of the cabinet (101) and horizontally disposed; a plurality of first branch supply tubes (205) are connected to the end of the supply header (201) by second branch return tubes (207).
9. The liquid-cooled heat dissipation circulation loop device as claimed in claim 5, wherein the first branch liquid supply pipe (205) is connected with the liquid supply header pipe (201), and the first branch liquid return pipe (208) is connected with the liquid return header pipe (202) in a quick-plugging manner; the connection form between the first branch liquid supply pipe (205) and the second branch liquid supply pipe (206), between the second branch liquid return pipe (207) and the first branch liquid return pipe (208), and between the second branch liquid supply pipe (206), the second branch liquid return pipe (207) and the cooling end (104) adopts a fixed connection mode or a quick plug mode.
10. The liquid cooling heat dissipation circulation loop device as claimed in claim 5, wherein the evaporation end (105) of the heat pipe unit (103) comprises a second evaporation end (3), a first evaporation end (4), a second gas pipeline (5), a first evaporation pipeline (6), a first gas pipeline (7), a second liquid pipeline (8), a first liquid pipeline (9) and a three-way structure member (10); the first liquid pipeline (9) is connected with the first evaporation end (4), the first evaporation end (4) is connected with the second evaporation end (3) through the second liquid pipeline (8), and the second evaporation end (3) is connected with the three-way structural part (10) through the second gas pipeline (5); tee bend structure (10) are connected first evaporation end (4) through first evaporation line (6), and tee bend structure (10) are connected first gas pipeline (7), first gas pipeline (7) are connected and are stretched into cooling end (104), and at the inside winding of cooling end (104) and form coil pipe (108), coil pipe (108) stretch out cooling end (104) and first liquid pipeline (9) intercommunication, and first gas pipeline (7) and first liquid pipeline (9) are in the inside part of cooling end (104) and constitute the heat pipe condenser jointly with coil pipe (108).
11. The liquid cooling heat dissipation circulation loop device as claimed in claim 10, wherein the first evaporation end (4) and the second evaporation end (3) extend into the server, and are respectively contacted and fixed with the first chip (1) and the second chip (2) of the server.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822147322.5U CN210053725U (en) | 2018-12-20 | 2018-12-20 | Liquid cooling heat dissipation circulation loop device for rack server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822147322.5U CN210053725U (en) | 2018-12-20 | 2018-12-20 | Liquid cooling heat dissipation circulation loop device for rack server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210053725U true CN210053725U (en) | 2020-02-11 |
Family
ID=69377633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822147322.5U Active CN210053725U (en) | 2018-12-20 | 2018-12-20 | Liquid cooling heat dissipation circulation loop device for rack server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210053725U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465274A (en) * | 2020-04-21 | 2020-07-28 | 广州智冷节能科技有限公司 | Single-cabinet modular server liquid cooling system and control method thereof |
| CN112911905A (en) * | 2021-02-04 | 2021-06-04 | 华南理工大学 | Cabinet type server indirect cold plate type liquid cooling leakage-proof system and control method |
| CN113301768A (en) * | 2020-12-16 | 2021-08-24 | 阿里巴巴集团控股有限公司 | Cooling system and cooling method thereof |
| CN115003141A (en) * | 2022-08-08 | 2022-09-02 | 浪潮电子信息产业股份有限公司 | Liquid cooling server rack |
-
2018
- 2018-12-20 CN CN201822147322.5U patent/CN210053725U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465274A (en) * | 2020-04-21 | 2020-07-28 | 广州智冷节能科技有限公司 | Single-cabinet modular server liquid cooling system and control method thereof |
| CN111465274B (en) * | 2020-04-21 | 2022-11-29 | 广州智冷节能科技有限公司 | Single-cabinet modular server liquid cooling system and control method thereof |
| CN113301768A (en) * | 2020-12-16 | 2021-08-24 | 阿里巴巴集团控股有限公司 | Cooling system and cooling method thereof |
| CN112911905A (en) * | 2021-02-04 | 2021-06-04 | 华南理工大学 | Cabinet type server indirect cold plate type liquid cooling leakage-proof system and control method |
| CN112911905B (en) * | 2021-02-04 | 2022-05-24 | 华南理工大学 | Cabinet type server indirect cold plate type liquid cooling leakage-proof system and control method |
| CN115003141A (en) * | 2022-08-08 | 2022-09-02 | 浪潮电子信息产业股份有限公司 | Liquid cooling server rack |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210053725U (en) | Liquid cooling heat dissipation circulation loop device for rack server | |
| CN108235655B (en) | Easy-to-plug server cabinet adopting liquid cooling heat dissipation | |
| CN206892786U (en) | A kind of computer water-cooling radiating device | |
| CN110278691A (en) | Pump for high power density cabinet drives two-phase loop cooling system | |
| CN104049701A (en) | Water-cooled backing plate heat exchanger and performance test system thereof | |
| CN209462850U (en) | A kind of internet of things data acquisition storage platform cooling device | |
| CN105698245A (en) | Water floor heating device characterized by utilizing pulsating heat pipe as radiating coil pipe | |
| CN210075869U (en) | Liquid cooling heat dissipation circulation loop device for blade server | |
| CN210772903U (en) | Distributor of air conditioner radiator | |
| CN105704986A (en) | Water-supply water-return dual-loop cooling circulation system | |
| CN207836044U (en) | A kind of air cooling of binary channels, the concatenated server cabinet of liquid cooling | |
| CN213960614U (en) | Box liquid cooling heat dissipation stringing device | |
| CN109548380B (en) | Liquid cooling heat dissipation circulation loop device for blade server | |
| CN209763806U (en) | annular shower heat exchange device | |
| CN203982297U (en) | Water-cooled back plate type heat interchanger and Performance Test System thereof | |
| CN208704485U (en) | A kind of cooling tower and water pump electronic-control device | |
| CN206196221U (en) | Computer room of data center concentrates cooling system | |
| CN205408386U (en) | Supply return water dicyclo way cooling circulation system | |
| CN207455957U (en) | Heat exchanger | |
| CN205481248U (en) | Utilize water floor heating device of pulsation heat pipe as radiating coil pipe | |
| CN219181916U (en) | Energy-saving control device for back plate type liquid cooling system of data center | |
| CN204498532U (en) | A kind of IT rack being applicable to high heat flux application | |
| CN113720046B (en) | Integrated liquid circulation low-temperature radiator | |
| CN219718950U (en) | Cabinet backboard door for server industry | |
| CN216705496U (en) | Wire drawing machine coolant liquid secondary cooling device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |