CN115220545A - A non-phase-change immersion liquid-cooled server - Google Patents

Abstract

The invention discloses a non-phase-change submerged liquid-cooling server, comprising: a server box body, which is provided with a vertical partition plate, and the vertical partition plate divides the internal space of the server box body into an outer part accommodating room and an electric device liquid Cold room; cover plate, the cover is connected to the liquid cooling chamber of the electrical device, and the cover plate is provided with liquid inlet holes and liquid return holes; In the holding room, the cooling liquid outlet of the heat exchanger is connected with a liquid distribution pipe. It is connected with the external circulating water system; the circulating pump is installed in the outer part containing room, the liquid inlet of the circulating pump is connected with a liquid collecting pipe, and the end of the liquid collecting pipe is inserted into the liquid return hole and extends into the liquid of the electrical device. In the cold room, the liquid outlet of the circulating pump is connected to the cooling liquid inlet of the heat exchanger through a pipeline. The server has high heat exchange efficiency, is not easy to leak the cooling liquid, has a simple structure, and is easy to disassemble and assemble.

Description

A non-phase-change immersion liquid-cooled server

technical field

The invention relates to the technical field of servers, and more particularly to a non-phase-change immersion liquid-cooled server.

Background technique

As economic development has entered a new stage, "data" will become the core competitiveness and productivity of countries, industries and enterprises.

As the carrier of "data" - the server, if the heat dissipation is poor, the high temperature will not only reduce the working stability of the chip, but also cause excessive thermal stress due to the temperature difference between the inside of the module and the external environment, affecting the electrical performance of the chip, Operating frequency, mechanical strength and reliability. The failure rate of electronic components increases exponentially with the increase in operating temperature, and the reliability of the system will decrease by 50% for every 10 degree increase in the temperature of a single semiconductor element.

At present, there are two common cooling schemes for servers: air cooling and liquid cooling; air cooling refers to the use of low-temperature air to take away the temperature of the server's key chips (CPU/GPU) through air circulation; liquid cooling refers to the use of medium temperature The liquid, through the special CPU/GPU cold plate, takes away the temperature of the server key chip (CPU/GPU) through the flow of the liquid.

The characteristics and advantages and disadvantages of air cooling and liquid cooling are as follows:

1). Cooling method: liquid cooling server - liquid cooling, air cooling server - air.

2). Noise: Since the liquid-cooled server does not need a fan with a large flux, the relative noise is relatively low, generally not more than 55dB. The air-cooled server needs a large-flux fan to exhaust air, so the noise is relatively large. Conventional CPU servers Generally 70+dB, if equipped with GPU, the noise will be further improved, up to 90+dB.

3). Environmental requirements: The liquid-cooled server has low noise and has a dedicated heat exchange unit, so it can be used without a very professional computer room environment. The air-cooled server has high noise and is very dependent on the air-conditioning environment, so it needs a professional The computer room can isolate noise and maintain low temperature air.

4). Performance: The temperature of key chips such as CPU and GPU in the liquid-cooled server does not exceed 80℃, and the stability and performance of the chip are better. The temperature of key chips such as CPU and GPU in the air-cooled server is 85-100℃+, etc. When exposed to high temperature for a long time, the stability and performance will be affected to a certain extent.

5). Life of key chips: CPUs and GPUs in liquid-cooled servers are in a low temperature environment for a long time, and their lifespan is longer, while CPUs and GPUs in air-cooled servers are in a high temperature environment for a long time, and their lifespans are affected to a certain extent.

6) Power saving and electricity cost: Compared with air-cooled servers, a single liquid-cooled server does not have an advantage in power consumption, but if it increases to the scale of a large data center, the construction of a liquid-cooled system can rely on equipment such as cooling towers. The high-efficiency phase change heat dissipation of high-temperature liquids can save a huge amount of electricity every year compared to air-cooled servers that can only use air conditioners to support heat dissipation. Of course, this also means that a lot of electricity bills can be saved every year.

7). Computing power infrastructure, including: data centers and intelligent computing centers. At the same time, the state also has strict requirements on energy efficiency indicators. The PUE value of newly built data centers in the country does not exceed 1.4. Beijing, Shanghai, Qingdao and other places require new construction. 1.3, Hangzhou, Shenzhen and other places require new 1.4, traditional air-cooled servers to build data centers, the PUE value is between 1.9-2.2, so if you want to meet the requirements, liquid cooling is an important way to achieve it.

In addition, the so-called liquid cooling in liquid cooling technology does not simply refer to water. It refers to using a liquid with high specific heat capacity as a transmission medium to take away the heat generated by IT equipment or servers to cool it. At present, there are three main deployment methods of liquid cooling technology, namely immersion, cold plate, and spray.

1).Cold plate type:

The liquid-cooled cold plate is fixed on the main heating element of the server, and the heat is taken away by the liquid flowing through the cold plate to achieve the purpose of heat dissipation. The liquid cooling of the cold plate solves the heat dissipation of the components with large heat in the server, and other heat dissipation components have to rely on air cooling. Therefore, servers using cold plate liquid cooling are also called gas-liquid dual-channel servers. The liquid of the cold plate does not contact the device to be cooled, and the heat transfer plate is used in the middle, which is safe, but the heat dissipation efficiency of the whole machine is relatively low.

2). Spray type:

The liquid storage and openings at the top of the chassis allow the cooling liquid to spray the heating body according to the position of the heating element and the size of the calorific value, so as to achieve the purpose of cooling the equipment. The sprayed liquid is in direct contact with the cooled device, and the cooling efficiency is high; however, when the liquid encounters high-temperature objects during the spraying process, it will float and evaporate. Degraded cleanliness or impact on other equipment.

3). Immersion:

The heating element is directly immersed in the cooling liquid, and the heat generated by the operation of the server and other equipment is carried away by the circulation of the liquid. Immersion liquid cooling is a typical direct contact liquid cooling. Since the heating element is in direct contact with the cooling liquid, the heat dissipation efficiency is higher and the noise is lower.

The immersion liquid cooling is divided into phase change immersion liquid cooling and non-phase change immersion liquid cooling:

1). Phase change immersion liquid cooling: the cooling liquid undergoes a phase change during the circulation heat dissipation, and it will change from liquid to gas, taking away a lot of heat, and has high heat transfer efficiency, but the pressure will change during the phase change process. , the requirements for the container are high, the control is relatively complicated, and the coolant is easily contaminated during use.

2). Non-phase-change immersion liquid cooling: the cooling liquid always remains liquid during the process of circulating heat dissipation, and no phase change occurs, so the boiling point of the cooling liquid is required to be high, so that the control of the volatilization loss of the cooling liquid is relatively simple, which is incompatible with the elements of IT equipment. Device compatibility is good.

However, the existing liquid cooling system still has some problems. For example, the existing cooling liquid is circulated to the outside of the server for cooling and then returned to the server, and the liquid is at risk of leakage; in addition, the peripheral interfaces in the server such as USB, RJ45, audio, HDMI and power cable interfaces are generally immersed in coolant, and there is a problem that the interface is easy to leak; the interface used for cooling the CPU module is immersed in the coolant for a long time. When the cooling system fails, the interface The backflow of the cooling liquid is easy to occur, and there is a risk of leakage; in addition, the existing cooling system has a complex structure, and the inlet and outlet of the cooling liquid to the CPU module need additional fixing parts for fixing, which is not easy to disassemble and maintain.

Therefore, how to provide a cooling liquid that does not need to flow out of the server to reduce the risk of cooling liquid leakage; and that the peripheral interface is not easy to leak liquid; A non-phase-change immersion liquid-cooled server with high cooling efficiency is an urgent problem to be solved by those skilled in the art.

SUMMARY OF THE INVENTION

In view of this, the present invention provides a cooling liquid that does not need to flow out of the server, reducing the risk of cooling liquid leakage; and the peripheral interface is not easy to leak liquid; A non-phase-change immersion liquid-cooled server with simple system structure and high cooling efficiency.

In order to achieve the above object, the present invention adopts the following technical solutions:

A non-phase-change immersion liquid-cooled server, comprising:

A server box, the server box is provided with a vertical partition, and the vertical partition divides the internal space of the server box into an outer component accommodating room and an electrical device liquid cooling room;

a cover plate, the cover plate is connected to the liquid cooling chamber of the electrical device, and the cover plate is provided with a liquid inlet hole and a liquid return hole;

A heat exchanger, in which cooling liquid and water flow, is installed in the outer part accommodating room, and the cooling liquid outlet of the heat exchanger is connected with a liquid separator, and the end of the liquid separator is inserted into the liquid separator. Connected in the liquid inlet hole, and does not extend out of the lower orifice of the liquid inlet hole, the water inlet and the water return port of the heat exchanger are connected to the external circulating water system;

A circulating pump, the circulating pump is installed in the outer part accommodating chamber, a liquid collecting pipe is connected to the liquid inlet of the circulating pump, and the end of the liquid collecting pipe is inserted into the liquid return hole and extends to the In the liquid cooling chamber of the electrical device, the liquid outlet of the circulating pump is connected with the cooling liquid inlet of the heat exchanger through a pipeline.

It can be seen from the above technical solutions that, compared with the prior art, the present disclosure provides a non-phase-change immersed liquid-cooled server. The liquid-cooling chamber of the electrical components, after liquid-cooling the electrical components inside, becomes a high-temperature coolant. The high-temperature coolant is pumped by the circulating pump, returns to the circulating pump through the liquid collecting pipe, and flows into the circulating pump through the pipeline. In the heat exchanger, heat is exchanged with the circulating water inside the heat exchanger, and it becomes a low-temperature cooling liquid again, and flows into the liquid cooling chamber of the electrical device again to realize the circulating liquid cooling of the electrical device. In this server, the cooling liquid circulates inside the server box, and the cooling liquid does not need to flow out of the server, which greatly reduces the risk of cooling liquid leakage; Avoid the existing problem that the end of the distributor pipe is in contact with the cooling liquid surface, which may easily lead to the leakage risk of the backflow of the coolant when the system fails; and the distributor pipe and the liquid collector pipe are directly inserted into the corresponding liquid inlet holes. It can be fixed by itself in the liquid return hole and without additional fixing parts, which makes the disassembly and assembly structure of the liquid distribution pipe and the liquid collecting pipe simple and easy to maintain.

Further, a mainboard casing is installed in the liquid cooling chamber of the electrical device, a plurality of cooling liquid circulation holes are opened on one side wall of the mainboard casing, a circuit board is installed inside the mainboard casing, and the circuit board is A CPU module and a GPU module are installed, and a hard disk module and a power supply module are installed outside the mainboard housing in the liquid cooling chamber of the electrical device. The CPU module, the GPU module, the hard disk module, and the power supply module are installed. They are all electrically connected to the circuit board, the liquid inlet holes are multiple and are respectively corresponding to the right above the CPU module, the GPU module, the hard disk module and the power supply module, and the liquid distribution pipe includes :

a main pipe, one end of the main pipe is connected with the cooling liquid outlet of the heat exchanger;

The liquid-splitting branch pipe is a plurality of liquid-splitting branch pipes, one end of which is connected to the pipe wall of the main pipe at intervals, and the other end is inserted into the corresponding liquid inlet hole.

The beneficial effect of adopting the above technical solution is that because the liquid inlet is facing the heating electrical components of the server, the low-temperature cooling liquid can be poured down from directly above the heating electrical components, and the cooling efficiency of the heating electrical components can be improved.

Further, the liquid return hole is located above the mainboard casing, and the end of the liquid collecting pipe is inserted into the liquid return hole and protrudes into the mainboard casing.

The beneficial effect of adopting the above technical solution is that after the cooling liquid in the motherboard shell exchanges heat with the CPU module and GPU module with a large heat generation inside, it becomes a cooling liquid with a higher temperature, and the liquid collector can timely reduce the temperature to a higher temperature. The high cooling liquid is drawn out of the motherboard casing, so that the CPU module and GPU module can be rapidly cooled by liquid, and the cooling effect of the CPU module and GPU module with large heat generation can be improved.

Further, a support groove is formed at the top end of the vertical partition, and the main pipe is placed in the support groove.

The beneficial effect of adopting the above technical solution is that the main pipe can be placed by using the support groove on the vertical partition, so that the main pipe occupies less space in the server shell, and no additional support is required to support the main pipe, which makes the server structure simpler and more efficient. compact.

Further, a temperature sensor is provided in the mainboard housing, and the temperature sensor is electrically connected to the controller on the circulating pump.

The beneficial effect of the above technical solution is that the temperature sensor feeds back the monitored temperature information to the controller, and the controller automatically adjusts the flow rate of the circulating pump according to the temperature information, that is, when the temperature is high, the flow rate of the circulating pump is adjusted to be high, and when the temperature is low, the flow rate of the circulating pump is adjusted to be high. Circulation pump flow is low. Therefore, the circulating pump can automatically adjust the flow rate of the circulating cooling liquid according to the temperature of the heating electric device, without manual adjustment, with a high degree of automation and more energy saving.

Further, the cover plate is provided with a plurality of current suppression channels for passing wires and arranged obliquely, the lower end of the current suppression channel is provided with an internal interface that is electrically connected to the circuit board, and the upper end of the current suppression channel is provided. An external interface electrically connected to an external interface cable is provided, and two ends of the wire are respectively electrically connected to the internal interface and the external interface.

The beneficial effects of the above technical solutions are that the external interface is not in contact with the cooling liquid surface, thereby avoiding the existing problem of easy liquid leakage due to the contact between the external interface and the cooling liquid; and the cooling liquid is not easy to flow out of the oblique arrangement. Road, the coolant leakage prevention effect is good.

Further, a Tesla valve structure is provided on the inner wall of the flow suppression channel.

The beneficial effect of adopting the above technical solution is that the structure allows the cooling liquid to remain in the flow suppression channel, thereby improving the leakage effect of the cooling liquid.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only It is an embodiment of the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to the provided drawings without creative work.

FIG. 1 is a schematic diagram of the structural framework of a non-phase-change immersion liquid cooling server provided by the present invention.

FIG. 2 is a schematic diagram of an axial side structure of a non-phase-change immersion liquid cooling server provided by the present invention.

FIG. 3 is a schematic diagram of the internal structure of the liquid cooling chamber of the electrical device after the cover plate is lifted.

FIG. 4 is an enlarged schematic view of the structure of part A in FIG. 3 .

FIG. 5 is a schematic perspective view of the cover plate.

FIG. 6 is an enlarged schematic view of the structure of part B in FIG. 5 .

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Referring to FIG. 1 to FIG. 6 , an embodiment of the present invention discloses a non-phase-change immersion liquid-cooled server, including:

The server box 1 (which is a sealed shell, and its material is sheet metal), is provided with a vertical partition 2 inside the server box 1, and the vertical partition 2 divides the internal space of the server box 1 into outer parts to accommodate chamber 101 and electrical device liquid cooling chamber 102;

cover plate 3, the cover plate 3 is covered on the liquid cooling chamber 102 of the electrical device, and the cover plate 3 is provided with a liquid inlet hole 301 and a liquid return hole 302;

The heat exchanger 4 has cooling liquid and water flowing in the heat exchanger 4, which is installed in the outer part accommodating chamber 101, and the cooling liquid outlet of the heat exchanger 4 is connected with a liquid separation pipe 5, and the end of the liquid separation pipe 5 is plugged into In the liquid inlet hole 301, and not extending out of the lower orifice of the liquid inlet hole 301, the water inlet and the water return port of the heat exchanger 4 are connected to the external circulating water system;

Circulating pump 6, the circulating pump 6 is installed in the outer part accommodating chamber 101, the liquid inlet of the circulating pump 6 is connected with a liquid collecting pipe 7, and the end of the liquid collecting pipe 7 is inserted into the liquid return hole 302 and extends into the electrical device In the liquid cooling chamber 102 , the liquid outlet of the circulating pump 6 is connected to the cooling liquid inlet of the heat exchanger 4 through the pipeline 8 .

A mainboard casing 9 is installed in the electrical device liquid cooling chamber 102 , a plurality of cooling liquid circulation holes 901 are opened on one side wall of the mainboard casing 9 , a circuit board 10 is installed inside the mainboard casing 9 , and a CPU is installed on the circuit board 10 The module 11 and the GPU module 12, the electric device liquid cooling chamber 102 is located outside the mainboard housing 9, and the hard disk module 13 and the power supply module 14 are installed. 10 are electrically connected, the liquid inlet holes 301 are multiple and are respectively corresponding to the right above the CPU module 11, the GPU module 12, the hard disk module 13 and the power supply module 14, and the liquid distribution pipe 5 includes:

The main pipe 51, one end of the main pipe 51 is connected with the cooling liquid outlet of the heat exchanger 4;

There are a plurality of liquid distribution branch pipes 52 , one end of which is connected to the pipe wall of the main pipe 51 at intervals, and the other end is inserted into the corresponding liquid inlet hole 301 .

The liquid return hole 302 is located above the main board housing 9 , and the end of the liquid collecting pipe 7 is inserted into the liquid return hole 302 and protrudes into the main board housing 9 .

The main pipe 51 is a T-shaped pipe, a support groove 201 is formed at the top of the vertical partition 2 , and the horizontal pipe on the main pipe 51 is placed in the support groove 201 .

A temperature sensor 15 is provided in the main board housing 9 , and the temperature sensor 15 is electrically connected to the controller on the circulation pump 6 .

The cover plate 3 is provided with a plurality of current suppression channels 303 for passing wires and arranged obliquely. The lower end of the current suppression channel 303 is provided with an internal interface 16 that is electrically connected to the circuit board 10, and the upper end of the current suppression channel 303 is provided with an external interface. The cable is electrically connected to the external interface 17, and the two ends of the wire are respectively electrically connected to the internal interface 16 and the external interface 17.

A Tesla valve structure 3031 (existing structure) is provided on the inner wall of the suppression channel 303 .

In this server, the low-temperature cooling liquid flows out to the liquid distribution pipe through the cooling liquid outlet of the heat exchanger, and flows into the liquid cooling room of the electrical components, and is poured down from the heating electric components inside the liquid cooling room of the electrical components. The electrical components are rapidly liquid-cooled, and then the low-temperature coolant becomes a high-temperature coolant. The high-temperature coolant is pumped by the circulating pump, returns to the circulating pump through the liquid collector, and flows into the heat exchanger through the pipeline. , exchanges heat with the circulating water inside the heat exchanger, turns into a low-temperature cooling liquid again, and flows into the liquid cooling chamber of the electrical device again to realize the circulation and liquid cooling of the electrical device.

In this server, the cooling liquid circulates in the sealed server box, and the cooling liquid does not need to flow out of the server, which greatly reduces the risk of cooling liquid leakage; in addition, the end of the liquid distribution pipe does not protrude from the lower hole of the liquid inlet hole. , which can avoid the problem that the end of the distributor pipe is in contact with the coolant surface, which may easily lead to the risk of leakage of the coolant backflow when the system fails; moreover, the distributor pipe and the collector pipe are directly plugged into the corresponding liquid inlet holes and return pipes. It can be fixed by itself in the liquid hole, and no additional fixing parts are needed for fixing, which makes the disassembly and assembly structure of the liquid distribution pipe and the liquid collecting pipe simple and easy to maintain.

The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same and similar parts between the various embodiments can be referred to each other. As for the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant part can be referred to the description of the method.

The above description of the disclosed embodiments enables any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (7)

1. A non-phase-change immersed liquid-cooled server, characterized in that, comprising: A server box (1), the server box (1) is provided with a vertical partition (2), and the vertical partition (2) divides the internal space of the server box (1) into outer parts an accommodating chamber (101) and an electrical device liquid cooling chamber (102); A cover plate (3), the cover plate (3) is covered and connected to the liquid cooling chamber (102) of the electrical device, and the cover plate (3) is provided with a liquid inlet hole (301) and a liquid return hole (302) ); A heat exchanger (4), in which cooling liquid and water flow, is installed in the outer component accommodating chamber (101), and the cooling liquid outlet of the heat exchanger (4) is connected There is a liquid distribution pipe (5), the end of the liquid distribution pipe (5) is inserted into the liquid inlet hole (301), and does not extend out of the lower orifice of the liquid inlet hole (301), the liquid inlet hole (301) The water inlet and the water return port of the heat exchanger (4) are connected with the external circulating water system; A circulating pump (6), the circulating pump (6) is installed in the outer part accommodating chamber (101), a liquid collecting pipe (7) is connected to the liquid inlet of the circulating pump (6), and the liquid collecting The end of the pipe (7) is inserted into the liquid return hole (302) and extends into the liquid cooling chamber (102) of the electrical device, and the liquid outlet of the circulating pump (6) is connected to the liquid outlet through the pipe (8). The cooling liquid inlet of the heat exchanger (4) is connected. 2. A non-phase-change immersed liquid-cooled server according to claim 1, characterized in that, a mainboard housing (9) is installed in the electrical device liquid cooling chamber (102), and the mainboard housing ( 9) A plurality of cooling liquid circulation holes (901) are opened on one side wall, a circuit board (10) is installed inside the mainboard housing (9), and a CPU module (11) is installed on the circuit board (10) and a GPU module (12), wherein a hard disk module (13) and a power supply module (14) are installed outside the mainboard housing (9) in the electrical device liquid cooling chamber (102), and the CPU module (11) , the GPU module (12), the hard disk module (13), and the power supply module (14) are all electrically connected to the circuit board (10), and the liquid inlet holes (301) are multiple and corresponding respectively Right above the CPU module (11), the GPU module (12), the hard disk module (13) and the power supply module (14), the liquid distribution pipe (5) includes: a main pipe (51), one end of the main pipe (51) is connected with the cooling liquid outlet of the heat exchanger (4); The liquid-separating branch pipes (52) are multiple, and one end thereof is connected to the pipe wall of the main pipe (51) at intervals, and the other end is inserted into the corresponding liquid inlet hole ( 301). 3. The non-phase-change immersed liquid-cooled server according to claim 2, wherein the liquid return hole (302) is located above the mainboard shell (9), and the liquid collector (302) The end of 7) is inserted into the liquid return hole (302) and protrudes into the main board housing (9). 4. The non-phase-change submerged liquid-cooled server according to claim 2, wherein a support groove (201) is provided at the top of the vertical partition (2), and the main pipe (51) is placed in in the support groove (201). 5. The non-phase-change submerged liquid-cooled server according to any one of claims 2-4, wherein a temperature sensor (15) is provided in the mainboard housing (9), and the temperature sensor (15) is electrically connected to the controller on the circulating pump (6). 6. A non-phase-change immersion liquid-cooled server according to any one of claims 2-4, characterized in that, the cover plate (3) is provided with a plurality of cables for threading electric wires and arranged obliquely. A current suppression channel (303), the lower end of the current suppression channel (303) is provided with an internal interface (16) electrically connected to the circuit board (10), and the upper end of the current suppression channel (303) is provided with an external interface line An external interface (17) electrically connected to a cable, and the two ends of the wire are respectively electrically connected to the internal interface (16) and the external interface (17). 7. The non-phase-change submerged liquid-cooled server according to claim 6, wherein a Tesla valve structure (3031) is provided on the inner wall of the flow suppression channel (303).

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