CN218450982U - Ultra-computation/data center passive cooling system with low energy consumption - Google Patents
Ultra-computation/data center passive cooling system with low energy consumption Download PDFInfo
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- CN218450982U CN218450982U CN202221175977.3U CN202221175977U CN218450982U CN 218450982 U CN218450982 U CN 218450982U CN 202221175977 U CN202221175977 U CN 202221175977U CN 218450982 U CN218450982 U CN 218450982U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The utility model discloses an ultra-computation/data center passive form cooling system that energy consumption is low, the top of all kinds of container formula expandable machine case all through the one end of pipe connection to the passive cooler, the other end of passive cooler passes through the one end of pipe connection branch liquid system, divides the bottom of all kinds of container formula expandable machine case of liquid system's other end connection to form an inclosed pipe-line system. The heat dissipation system adopts a heat and mass transfer process of 'insulating cooling liquid immersion type cooling' + 'separated heat pipe' + 'high-efficiency compact condenser', the whole process is passive heat dissipation, the heat dissipation power consumption of the ultra-computation/data center is greatly reduced, and the ultra-low PUE value can be realized. In addition, the system can realize higher-compactness framework assembly and reduce the space occupation scale of the super computing/data center. The system has high heat dissipation power and strong expandability of heat dissipation capability, and the computer is fast and convenient to merge/disconnect, energy-saving and environment-friendly.
Description
Technical Field
The utility model belongs to the technical field of electronic equipment heat dissipation cooling, in particular to surpass calculation/data center passive form cooling system that energy consumption is low.
Background
With the rapid development of an ultra-computation/data center and a high-performance and high-power-density electronic chip, the heat productivity of large and medium computer clusters such as the ultra-computation/data center and the like is increased year by year, the annual growth rate reported by a literature reaches 20-40%, and the heat dissipation becomes a major topic. Taking the data center of China as an example, the power consumption of the data center exceeds the annual power generation capacity of the three gorges dam by multiple times in 2020, reaches more than 2.6% of the total social power generation capacity, and has huge energy consumption. However, the average PUE of the data center in China is only about 1.46, a large amount of electric energy is used for heat dissipation of a computer system instead of calculation, the effective utilization rate of the electric energy is low, and energy waste is serious. The novel ultra-computation/data center heat dissipation system with low energy consumption is developed, the PUE is greatly reduced, the annual energy can be saved by billions of kilowatt hours, and the double-carbon heat dissipation system has great significance.
The traditional air-cooled heat dissipation system has limitation on the compactness of a computer set, unsmooth airflow can be caused by overhigh compactness, and the heat dissipation problem of a high-power-density and high-power-consumption chip cannot be solved by air cooling; the traditional water-cooling heat dissipation system has the fatal risk of leakage and short circuit, the reliability is low, the structure of the water-cooling system is complex, and the arrangement of water pipes is difficult; the traditional immersion cooling technology needs to adopt components such as a pump, a water chiller and the like, and the system still has high power consumption. In order to improve the above problems, the present invention has been made.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an surpass and calculate/passive cooling system of data center that the energy consumption is low can realize surpassing calculating/effective heat dissipation of data center, and the energy consumption is extremely low, and the operation of merging into/breaking off of computer is swift convenient, energy-concerving and environment-protective.
In order to achieve the above purpose, the solution of the utility model is:
a passive heat dissipation system of a super computing/data center with low energy consumption comprises a soaking plate, a quick connection/disconnection system of a case, a passive cooler, a liquid separation system, a pressure maintenance system, a liquid supplement/discharge system, a monitoring system and a plurality of container type expandable cases, wherein the top ends of the container type expandable cases are connected to one end of the passive cooler through a pipeline, the other end of the passive cooler is connected to one end of the liquid separation system through a pipeline, and the other end of the liquid separation system is connected to the bottom ends of the container type expandable cases, so that a closed pipeline system is formed;
the container-like expandable case is used for accommodating a heat source, namely a series of circuit components such as a power supply, a mainboard, a CPU (central processing unit), a GPU (graphics processing unit), a memory and the like of a computer, and insulating cooling liquid is filled in the container-like expandable case;
the quick connection/disconnection system of the case is arranged on a pipeline connecting the top end of the container-like expandable case with the passive cooler and a pipeline connecting the bottom end of the container-like expandable case with the liquid separation system;
the inlet of the passive cooler is communicated with the steam port of the container-like expandable case, and the outlet of the passive cooler is arranged at the bottom and communicated with the liquid separation system;
the inlets of the liquid separation system are communicated with the outlets of the passive coolers, and a plurality of outlets are arranged and are respectively connected with the bottom ends of various container type expandable cabinets through the cabinet quick connection/disconnection system;
the soaking plate is arranged in the container-like expandable case and attached to the surface of the heat source;
the monitoring system is used for monitoring the running state of the system in real time and controlling the actions of the pressure maintaining system and the liquid replenishing/discharging system;
the pressure maintaining system is used for adjusting the air pressure in the pipeline system under the control of the monitoring system;
and the liquid replenishing/discharging system is used for adjusting the amount of the insulating cooling liquid in the pipeline system under the control of the monitoring system.
The container-like expandable case is a sealed structure with an openable opening, is hollow inside and is used for accommodating a heat source, and a power supply and various I/O interfaces which are connected with the accommodated heat source are arranged in the container-like expandable case.
The quick connection/disconnection system of the chassis adopts a manual valve, an electric valve or a pneumatic valve to control the on-off of fluid on two sides, and adopts a KF vacuum joint to realize the dismounting or the mounting of the chassis from the whole heat dissipation system.
The passive cooler adopts an external wrapping structure with a chimney effect, natural wind is generated through the chimney effect to enhance the heat exchange between air and the cooler, or the passive cooler is directly paved in natural cold sources such as air, river water, seawater and the like to carry out natural convection heat dissipation.
The passive cooler adopts finned tubes, finned plates, micro-channel heat exchangers or efficient compact heat exchangers.
The soaking plate is in a closed cavity structure, liquid working media are filled in the soaking plate, and the shell is made of copper/aluminum/stainless steel.
The monitoring system adopts a liquid level sensor to sense the liquid level state of the insulating cooling liquid in the container-like expandable case and controls the action of the liquid replenishing/discharging system according to the sensing result; the monitoring system adopts an air sensor and a pressure sensor to respectively sense the air content and the pressure of the pipeline system, and controls the action of the pressure maintaining system according to the sensing result.
The boiling point of the insulating cooling liquid filled in the container type expandable case is 30 to 70 ℃.
After the scheme is adopted, the utility model discloses a heat and mass transfer flow of "insulating coolant liquid submergence cooling" + "disconnect-type heat pipe" + "high-efficient compact condenser", whole journey is the passive form heat dissipation, do not need traditional radiating equipment such as pump, fan, cold water machine, water-cooling tower, heat exchanger during the operation, whole cooling system does not have the operation energy consumption almost, greatly reduce super calculation/data center's heat dissipation consumption, can realize ultralow PUE numerical value, highly accord with national energy saving and emission reduction strategy, also to carbon neutralization, carbon reaches the peak and has apparent promotion effect. In addition, the system has no obvious requirement on the compactness of the computer set, can realize the framework assembly with higher compactness, and reduces the space occupation scale of the super computing/data center. The system has high heat dissipation power and strong expandability of heat dissipation capability, and the computer is fast and convenient to merge/disconnect, energy-saving and environment-friendly.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic structural view of a vapor chamber used in the embodiment of the present invention. Wherein: 1 is an external reinforced boiling structure, 2 is a condensation side shell plate, 3 is a condensation side capillary core, 4 is a support column, 5 is an evaporation side capillary core, and 6 is an evaporation side shell plate.
Detailed Description
The technical solution and the advantages of the present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1, the utility model provides a super calculation/data center passive cooling system that energy consumption is low, including soaking plate 1, quick-witted case quick connect/disconnect system 2, passive cooler 3, divide liquid system 4, pressure maintenance system 5, liquid benefit/put system 6, monitoring system 7 and the scalable quick-witted case 8 of a plurality of types container formula, wherein, the top of the scalable quick-witted case 8 of all types container formula all is through the one end of pipe connection to passive cooler 3, the other end of passive cooler 3 passes through the one end of pipe connection minute liquid system 4, divide the bottom of the scalable quick-witted case 8 of all types container formula of the other end connection of liquid system 4, thereby form an inclosed pipe-line system; described separately below.
A plurality of container-like expandable cabinets 8 can be arranged in parallel according to requirements, and 3 groups of cabinets are taken as an example in fig. 1 for explanation; the box-like expandable case 8 is a sealed structure with an openable opening, is hollow inside, can be used for accommodating a rack-type computer and a tower-type computer which are commonly used in the market, and can be used for loading the whole computer or removing the rack-type case and the tower-type case and only loading the circuit of the computer; the power supply and the I/O interface are arranged in the box-like container type expandable case 8 and can be connected with a loaded computer, and after the box-like container type expandable case 8 is loaded, the box-like container type expandable case 8 is closed and sealed, so that the subsequently filled insulating cooling liquid/steam cannot leak.
The case rapid connecting/disconnecting system 2 is arranged on a pipeline connected with the top end of the container-like expandable case 8 and the passive cooler 3 and a pipeline connected with the liquid separating system 4 at the bottom end of the container-like expandable case 8, and is used for realizing rapid connection/disconnection of a cooling liquid/steam port of the container-like expandable case 8 and rapid connection/disconnection of the container-like expandable case 8 and a cooling liquid/steam pipeline, so that a user can conveniently extract cooling liquid of a specific case, and overhaul, maintain, newly increase and the like electronic elements in the case on the premise of not influencing the operation of other cases; in the present embodiment, in order to realize the on/off function of the coolant/steam, a manual valve, an electric valve, a pneumatic valve, etc. may be used, and the quick connection/disconnection function may be realized by a KF connector, a flange, etc. without being limited thereto.
The inlet of the passive cooler 3 is communicated with the steam port of the box-like expandable case 8, the outlet is arranged at the bottom and is communicated with the liquid separation system 4, so that the vaporized cooling liquid in the box-like expandable case 8 enters the passive cooler 3, the steam in the passive cooler 3 is cooled into liquid insulating cooling liquid, and then the liquid insulating cooling liquid flows into the liquid separation system 4 through the outlet under the action of gravity; the utility model provides an active cooler 3 of non-adopts the natural cooling mode, including but not limited to following implementation: the active cooler is paved in a wrapping space with a chimney effect, so that flowing wind is obtained on the premise of no power consumption, the cooling performance of the active cooler is improved, and the volume of the cooler is reduced (for example, the active cooler can be directly paved in a chimney, and the flowing wind is generated by utilizing the natural suction effect of the air pressure difference between the top and the bottom of the chimney, so that the cooling performance of the passive cooler is enhanced); or the water-cooling heat exchanger is directly paved in natural cold sources such as rivers, oceans and the like, and the natural convection heat exchange of water is stronger than the natural convection of air, so that the cooling performance is improved, and the volume is reduced; or the cooling agent is laid at the position of a mountain opening and an air opening, and convection is forced by natural wind so as to improve the cooling performance and reduce the volume; or directly laid on the roof and naturally convected by air to dissipate heat. In particular, but not limited to, finned tubes, finned plates, microchannel heat exchangers, high efficiency compact heat exchangers, and the like can be used.
The liquid separation system is used for distributing the returned insulating cooling liquid, so that the cooling liquid in each container type expandable case 8 is not too much or too little, the inlet of the liquid separation system is communicated with the outlet of the passive cooler 3, and the outlets of the liquid separation system are respectively connected with the bottom end of each container type expandable case 8 through the case quick connection/disconnection system 2; specifically, the liquid separation system can adopt a structural form of, but is not limited to, "case liquid level monitoring + case cooling liquid inlet regulating valve".
The soaking plate 1 is arranged in a container-like expandable case 8 and attached to the surface of a heat source, so that the heat of high-power and high-heat-flux components is reduced in heat flux density through an enlarged radiating surface, and then is rapidly transferred to an insulating cooling liquid based on a reinforced boiling structure, as shown in fig. 1, the heat source in the case is usually various electronic chips, such as a series of circuit components of a power supply, a mainboard, a CPU, a GPU, a memory and the like of a computer, only 1 heat source is drawn in each case in fig. 1, and the number of heat sources in the actual case is usually multiple. The soaking plate 1 in the embodiment adopts an immersion type cooling high-performance soaking plate which is one of generalized heat pipes and is of a multilayer structure as shown in a matched graph 2, a shell is made of copper/aluminum/stainless steel, a porous capillary structure and a supporting structure are arranged inside the shell, and the materials are mostly the same as those of the shell; the soaking plate is of a closed cavity structure, and liquid working media, such as water, ethanol, methanol, ethylene glycol, fluorinated liquid, ammonia and the like, are filled in the soaking plate. The inside of the soaking plate is usually almost free of air, and only the liquid working medium and the gaseous working medium are in a saturated state. The position (called as an evaporation end) where the shell of the soaking plate is attached to the heating element absorbs heat and raises the temperature, the adjacent liquid working medium inside the soaking plate is gasified to take away the heat, the gaseous working medium flows to the part of the shell with relatively low temperature in the soaking plate to be condensed, and the heat is transferred to the shell (called as a condensation end). The condensate flows back to the evaporation end under the capillary force of the porous capillary structure. The condensation end absorbs heat and then is heated to reach a boiling point higher than that of the external insulating cooling liquid. The outer surface of the condensation end is provided with an enhanced boiling structure (usually a wire mesh, a foam metal, a porous metal sintered body, a groove and the like), and heat is rapidly transferred to the insulating cooling liquid through phase change. The soaking plate 1 is usually a multi-step structure to avoid short circuit caused by touching other components on the circuit board.
Monitoring system 7 is used for real-time supervision the utility model discloses the running state of well all subsystems to carry out real-time automatic regulation and control to all subsystems, specifically include level sensor D, temperature sensor E, air sensor F, pressure sensor G etc, wherein, level sensor D is used for the level state of the expanded quick-witted incasement of sensing class container type 8 internal insulation coolant liquid, temperature sensor E, air sensor F, pressure sensor G can set up on the pipeline of system, be used for the temperature in the sensing system respectively, air content, states such as pressure, and carry out corresponding control according to the sensing result. Furthermore, the utility model discloses can also be equipped with one set of manual regulation and control scheme as the alternative to improve operational reliability.
The pressure maintaining system 5 is used for regulating and controlling the air pressure of the whole closed internal space filled with the insulating cooling liquid/steam under the control of the monitoring system 7, and the two main regulation and control aspects are as follows: one is to exhaust non-condensable gas such as air in the sealed internal space to further reduce the saturation pressure of the insulating cooling liquid and the boiling point of the insulating cooling liquid, so as to reduce the temperature of heat sources such as chips; and secondly, when the total heating power of the chips in the system is too high, the generation speed of insulating cooling liquid steam is higher than the cooling speed of the passive cooler, and the steam pressure in the sealed space is continuously increased, part of the cooling liquid steam is discharged to reduce the steam pressure, and an instruction is sent to the computer cluster, so that the computer cluster can properly reduce the calculation power consumption and the heating value. The subsystem may take the form of, but is not limited to, a combination of "atmosphere monitoring + pressure sensing + vacuum pump + cold trap".
The liquid supplementing/discharging system 6 is used for regulating and controlling the insulating cooling liquid amount of the whole sealed internal space filled with the insulating cooling liquid/steam under the control of the monitoring system 7, and supplementing liquid in real time when the cooling liquid quality in the space is insufficient, so that the liquid shortage problem is avoided; when the cooling liquid in the space is too much, the liquid is discharged in real time (the liquid flows into a recovery container, so that the waste is avoided), and the problem of too much liquid is avoided. The present subsystem may take the form of, but is not limited to, "level monitoring + automatic valve".
In the working process of the utility model, the box-like expandable case 8 is filled with insulating cooling liquid, and in the figure 1, A and B are respectively liquid and gaseous insulating cooling liquid, the boiling point of the insulating cooling liquid needs to be lower than the junction temperature of the chip in the case, usually 30 to 70 ℃, and insulating fluorinated liquid such as 3M HFE-7100 is often selected.
The utility model discloses a whole heat dissipation process as follows:
the circuits and various electronic elements inside the box 8 are completely immersed in the insulating cooling liquid with low boiling point, and the heat dissipated by the chip elements is taken away in the form of phase change latent heat through the boiling of the insulating cooling liquid. The heating power and the heat flux density of general low-power electronic elements such as capacitors, resistors and the like are low, an additional intensified boiling technology is not needed generally, the elements are directly immersed in cooling liquid, heat can be taken away by means of natural convection or boiling, and the elements are prevented from being over-heated; high-power elements such as a CPU (central processing unit) and a GPU (graphics processing unit) have high heating power and high heat flux density, and the phase-change heat exchange performance of the insulating cooling liquid needs to be improved by a reinforced boiling technology, otherwise, heat cannot be taken away quickly, and the temperature cannot be reduced effectively. The utility model discloses in adopt the area to be greater than the high performance soaking plate (Vapor Chamber, VC, also known as the soaking plate) of component surface area and such high power density components such as CPU, GPU in close contact with and press firmly fixedly, install indium piece or thin coating on both contact surfaces and possess the thermal interface material of self-curing nature in order to reduce thermal contact resistance (like self-curing liquid metal heat conduction cream, these thermal interface material can not take place the reaction with insulating coolant liquid, also can not drop and get into in the coolant liquid). The high-performance soaking plate quickly and uniformly spreads high-density heat flow of elements such as a CPU (central processing unit), a GPU (graphic processing unit) and the like into medium-low density heat flow, and the heat is taken away by the rapid phase change of a cooling liquid by virtue of an enhanced boiling structure on the surface of the soaking plate.
The gasified insulating cooling liquid gas flows upwards due to pressure difference, is collected in a heat-free area at the upper part of the case, enters a gas main pipe through an upper valve of the case quick connection/disconnection system 2, and then enters the high-efficiency compact passive cooler 3. The gaseous insulating cooling liquid performs passive heat exchange with the external environment in the passive cooler 3, is condensed into liquid insulating cooling liquid, and flows into the liquid separating system 4 through the liquid return pipe under the action of gravity. The liquid separation system 4 reasonably distributes the cooling liquid to each case, completes the heat and mass transfer circulation of the cooling liquid, and ensures that heating elements in each case are effectively immersed by the cooling liquid. In the process, the monitoring system 7 can detect the components and pressure conditions of the gas space of the whole system in real time, and firstly, non-condensable gas such as air in the sealed internal space is discharged, so that the saturation pressure of the insulating cooling liquid is further reduced, the boiling point of the insulating cooling liquid is reduced, and the temperature of heat sources such as chips is further reduced; when the total heating power of the chips in the system is too high, the generation speed of the insulating cooling liquid steam is higher than the cooling speed of the passive cooler, and the steam pressure in the sealed space is continuously increased, part of the cooling liquid steam is discharged to reduce the steam pressure, and an instruction is sent to the computer cluster, so that the computer cluster can properly reduce the calculation power consumption and the heating value; the monitoring system 7 can also detect the total amount of the cooling liquid of the whole system in real time, and control the liquid replenishing/discharging system 6 to replenish the cooling liquid when the total amount is insufficient (usually, the heating elements in the case are not effectively immersed). Generally, the utility model discloses get into steady state operation back, pressure maintenance system 5 and liquid are mended/are put system 6 and need be operated seldom, do not produce the power consumption basically. Monitoring system 7 is through installing the sensor in each subsystem (monitoring index includes pressure, liquid level, temperature, gas composition, dielectric constant etc. the sensor kind and the quantity in each subsystem are not necessarily the same), monitors the utility model discloses holistic operational aspect to in time adjust the circumstances such as trouble, operation anomaly. Generally, the total power of the sensors of the monitoring system 7 is generally less than 10w, and basically no electricity consumption is generated.
The monitoring system 7 monitors the liquid level condition D in each case and displays the liquid level condition D on a monitoring screen, controls the case with too low liquid level, increases the liquid inlet amount, and ensures that heating elements in the case are always kept in an immersed state to obtain effective heat dissipation; and monitoring the pressure condition G of the system, and opening the pressure maintaining system to extract some gas in the system when the pressure exceeds a threshold value, so that the pressure in the heat dissipation system does not exceed the threshold value. The over-pressure of the system is mainly caused by air in the gas phase space in the system, because the air is difficult to liquefy. Generally, after the air is pumped for several times, the gas space in the system is basically free of air, the sensor F has almost no air signal, the gas phase space is only provided with gaseous fluorinated liquid, the pressure of the system is always stable under the condition of sufficient cooling capacity, and the pressure maintaining system is basically not required to be started; monitoring the liquid level condition D of the whole heat dissipation system, opening the liquid replenishing/discharging system 6 when the liquid amount of the whole heat dissipation system is insufficient/excessive, adjusting the amount of the fluorinated liquid in the whole heat dissipation system, ensuring that all the cases have enough fluorinated liquid and ensuring that the upper part of the system has enough gas phase space.
The above embodiment is only for explaining the technical thought of the utility model, can not be limited with this the utility model discloses a protection scope, all according to the utility model provides a technical thought, any change of doing on the technical scheme basis all falls into the utility model discloses within the protection scope.
Claims (8)
1. A passive cooling system of a supercomputing/data center with low energy consumption is characterized in that: the device comprises a soaking plate, a quick connecting/disconnecting system of a case, a passive cooler, a liquid separating system, a pressure maintaining system, a liquid supplementing/discharging system, a monitoring system and a plurality of container type expandable cases, wherein the top ends of the container type expandable cases are connected to one end of the passive cooler through a pipeline, the other end of the passive cooler is connected with one end of the liquid separating system through a pipeline, and the other end of the liquid separating system is connected with the bottom ends of the container type expandable cases, so that a closed pipeline system is formed;
the container-like expandable case is used for accommodating a heat source and filled with insulating cooling liquid;
the quick connection/disconnection system of the case is arranged on a pipeline connecting the top end of the container-like expandable case with the passive cooler and a pipeline connecting the bottom end of the container-like expandable case with the liquid separation system;
the inlet of the passive cooler is communicated with a steam port of the container-like expandable case, and the outlet of the passive cooler is arranged at the bottom and communicated with a liquid separation system;
the inlets of the liquid separation system are communicated with the outlets of the passive coolers, and a plurality of outlets are arranged and are respectively connected with the bottom ends of various container type expandable cabinets through the cabinet quick connection/disconnection system;
the soaking plate is arranged in the container-like expandable case and attached to the surface of the heat source;
the monitoring system is used for monitoring the running state of the system in real time and controlling the actions of the pressure maintaining system and the liquid replenishing/discharging system;
the pressure maintaining system is used for adjusting the air pressure in the pipeline system under the control of the monitoring system;
and the liquid replenishing/discharging system is used for adjusting the amount of the insulating cooling liquid in the pipeline system under the control of the monitoring system.
2. The low energy consumption supercomputing/data center passive heat removal system of claim 1, wherein: the container-like expandable case is a sealed structure with an openable opening, is hollow inside and is used for accommodating a heat source, and a power supply and an I/O interface which are connected with the accommodated heat source are arranged in the container-like expandable case.
3. The low energy consumption supercomputing/data center passive heat removal system of claim 1, wherein: the quick connection/disconnection system of the chassis adopts a manual valve, an electric valve or a pneumatic valve to control the on-off of fluid at two sides, and adopts a KF vacuum joint to realize the detachment or installation of the chassis from the whole heat dissipation system.
4. The low energy consumption supercomputing/data center passive heat removal system of claim 1, wherein: the passive cooler adopts an external wrapping structure with a chimney effect, natural wind is generated through the chimney effect to enhance the heat exchange between air and the cooler, or the passive cooler is directly paved in a natural cold source for natural convection heat dissipation.
5. The low energy consumption supercomputing/data center passive heat removal system of claim 1, wherein: the passive cooler adopts a finned tube, a finned plate, a micro-channel heat exchanger or a high-efficiency compact heat exchanger.
6. The low energy consumption supercomputing/data center passive heat removal system of claim 1, wherein: the soaking plate is of a closed cavity structure, liquid working media are filled in the soaking plate, and the shell is made of copper/aluminum/stainless steel.
7. The low energy consumption supercomputing/data center passive heat removal system of claim 1, wherein: the monitoring system senses the liquid level state of the insulating cooling liquid in the container-like expandable case by adopting a liquid level sensor and controls the action of the liquid replenishing/discharging system according to a sensing result; the monitoring system adopts an air sensor and a pressure sensor to respectively sense the air content and the pressure of the pipeline system and controls the action of the pressure maintaining system according to the sensing result.
8. The low energy consumption supercomputing/data center passive heat removal system of claim 1, wherein: the boiling point of the insulating cooling liquid filled in the container-like expandable case is 30 to 70 ℃.
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