WO2011075929A1

WO2011075929A1 - Surface mount type evaporating cooling device of super computer

Info

Publication number: WO2011075929A1
Application number: PCT/CN2010/000689
Authority: WO
Inventors: 阮琳; 顾国彪; 袁佳毅; 李振国; 熊斌
Original assignee: 中国科学院电工研究所
Priority date: 2009-12-25
Filing date: 2010-05-14
Publication date: 2011-06-30
Also published as: CN101751096A; CN101751096B

Abstract

A surface mount type evaporating cooling device of a super computer is disclosed. A condenser (15) is set on the top of the cabinet of the super computer; and an accumulating liquid main pipe (11) is positioned at the bottom of the evaporating cooling device. N cooling liquid boxes (9) are settled between the accumulating liquid main pipe (11) and an accumulating steam main pipe (12). A steam outlet pipe (13) is set on the top of the accumulating steam main pipe (12) and the bottom of the condenser (15). The accumulating steam main pipe (12) is connected with the condenser (15) through the steam outlet pipe (13), and the condenser (15) is connected with the accumulating liquid main pipe (11) through a liquid return pipe (14). The cooling liquid boxes (9) are closely contacted with the heating elements of the super computer, N liquid ingress pipes (7) contained on the N cooling liquid boxes are all connected with the accumulating liquid main pipe (11), and N steam delivery pipes (8) contained on the N cooling liquid boxes (9) are all connected with the accumulating steam main pipe (12), so as to form a sealed circulation cooling circuit. A plurality of liquid troughs, whose inner cavities are connected with each other, are set in the cooling liquid boxes (9), and the N cooling liquid boxes (9) are parallel on a liquid path.

Description

Supercomputer surface mount evaporative cooling device

The present invention relates to a supercomputer system cooling system. Background technique

In recent years, the development of supercomputers has developed rapidly and has been widely used in various fields. However, while supercomputers continue to increase in integration, data processing capabilities, and computing speeds, their energy consumption is increasing. The heat of chips and machines is becoming more and more serious. The cooling of supercomputers is an urgent and urgent bottleneck.

The current supercomputer mainly uses the traditional air cooling method. Although the system is safe and reliable, the operation is simple, and the maintenance is convenient, the cooling efficiency is low. Moreover, with the increase of the integration degree, many components are arranged in the unit space, and the heat dissipating device makes the airflow difficult to be evenly distributed, which makes it difficult to ensure that the temperature of each of the cooled bodies on the main board remains relatively uniform, and it is difficult to prevent local parts. Overheating can't solve the cooling problem fundamentally. Moreover, the use of high-pressure fans often introduces significant noise and greatly increases the energy consumption of the cooling system itself.

Evaporative cooling technology utilizes the latent heat of vaporization of low-boiling medium to achieve heat exchange with the object to be cooled. The heat absorption capacity of the unit mass of the cooling medium is much greater than that of the conventional specific heat exchange method (such as air cooling, hydrogen cooling, water cooling and oil cooling). ). The evaporative cooling medium has good physical and chemical stability and insulation properties, and the evaporative cooling system can realize pump-free self-circulation and keep the cooling system running near zero pressure, and can realize adaptive adjustment according to different working conditions of the heating element. Ensure safe and reliable operation of the cooling system.

Chinese patent 200320129492.1 discloses a high-power power electronic device evaporative cooling device, which adopts a self-circulating mode, does not require a pump, has a small volume, and the cooling liquid has insulation property and is safe and reliable in operation. The unit contains an evaporative cooling box. Each power module is collectively mounted on the outer panel surface of the evaporative cooling box described above. Since there is only one evaporative cooling box, all the power modules are mounted on the outer surface of the evaporative cooling box, so the module can only be placed to accommodate the structure of the cooling box. This is not applicable to some devices that have clear industry specifications and whose structural position cannot be changed. In particular, they cannot be applied to distributed heat sources, where the structural position is relatively fixed, and at the same time, the supercomputer field with high integration of computing units is required. Summary of the invention

It is an object of the present invention to provide a surface mount evaporative cooling device for a supercomputer system for cooling the main heating elements (including CPUs, memory banks, on N (1 < N < 10) blade computing units of the supercomputer described above, North and South Bridge management chips, etc.). The surface mount evaporative cooling unit of the supercomputer system includes N coolant tanks, a header manifold, a header manifold, a return pipe, an outlet pipe and a condenser. Each of the coolant cartridges contains a liquid introduction tube and a vapor outlet tube into which the evaporative cooling medium is injected into the surface mount evaporative cooling device of the supercomputer system.

The surface mount evaporative cooling device of the present invention is installed in a cabinet of a supercomputer. The condenser is placed at the top of the computer machine, the liquid collecting manifold is located at the bottom of the evaporative cooling device, the cooling liquid box is located between the liquid collecting main pipe and the collecting main pipe, and the steam discharging pipe is located above the collecting main pipe and the condenser. Below, the collecting manifold is connected to the condenser through the outlet pipe, and the condenser is connected to the collecting manifold through the liquid return pipe. The coolant tank is in close contact with the main heating element on the calculation unit, and the N liquid introduction tubes contained in the N coolant tanks are connected to the liquid collection manifold, and the N vapor outlet tubes included in the N coolant tanks are The manifolds are connected to form a closed circulating cooling circuit. The cooling medium is injected into the coolant tank at a level that is equal to the center line of the vapor outlet tube located in the coolant tank.

The liquid introduction pipe and the liquid collection pipe of the present invention are connected through a joint pipe equipped with a valve, and the vapor discharge pipe and the steam collection pipe are connected through a joint pipe equipped with a valve. Liquid introduction tube A sealing mechanism similar to an aviation plug is respectively arranged on the vapor outlet tube. When the valve on the joint tube is closed and the calculation unit is pulled out, the liquid introduction tube and the vapor outlet tube are automatically sealed, and the evaporative cooling medium does not leak.

The heat generated by the heating element of the blade computing unit is transferred to the cooling medium in the coolant tank through the metal surface of the coolant tank, and the cooling medium absorbs heat and rises when the temperature reaches the saturation temperature corresponding to the pressure. Boiling vaporizes, absorbing a large amount of heat, thereby cooling the heating element. The generated vapor medium acts under the action of buoyancy and the static head of the liquid column of the liquid return pipe, enters the steam collecting pipe along the steam outlet pipe, and then enters the condenser through the steam outlet pipe to be condensed into liquid through the back. The liquid pipe enters the liquid collecting pipe, and then enters the cooling liquid tank through the liquid introduction pipe to perform the next round of cooling. Such a recurring process forms a self-circulating closed evaporative cooling device.

The surface-mounted evaporative cooling device of the present invention is used in combination with the air-cooling system of the supercomputer system, and some devices with insufficient heat generation problems still use forced air cooling, so the height of the cooling liquid tank in the surface-mount evaporative cooling device should be reasonably designed. There must be sufficient cooling air ducts for forced air cooling.

The use of the surface-mounted evaporative cooling device of the present invention allows the temperature of the computer core processing unit to be controlled at an optimum operating point to align the temperature distribution of the cooled components. At the same time, it can reduce the number of fans in the supercomputer configuration, which can reduce wind and wear loss and fan noise.

The evaporative cooling medium used in the present invention is a fluorocarbon compound which meets environmental protection requirements. The medium has high insulation properties and does not cause short-circuit electrical accidents like water cooling even if it leaks out. The boiling temperature can be selected according to the optimal working temperature of the chip, and the boiling point is generally selected to be 45-60 degrees.

The coolant tank of the present invention is composed of a plurality of shaped liquid tanks, and the open sides of the liquid tanks are connected to each other by surface welding. The structure and arrangement of the profiled liquid channel are the same as the shape and position of the heat generating component on the blade computing unit, Consistently, it ensures that each tank is closely matched to the shape of the heating element to be cooled, ensuring optimum heat transfer.

The condenser used in the present invention may be air or water as a secondary cooling medium, and may be determined in accordance with the conditions of the supercomputer room.

If the blade calculation unit of the present invention is placed horizontally, that is, the coolant liquid tank is also placed horizontally, the liquid introduction tube and the vapor outlet tube adopt a one-way valve, so that the liquid medium can only flow into the coolant tank along the one-way valve. The vapor phase medium can only flow out of the coolant tank along the one-way valve; if it is placed vertically, there is no need to use a one-way valve structure.

The invention is suitable for super-high-density, high-integration supercomputer equipment, and is also suitable for distributed power electronic device cooling with outstanding heat generation problems. DRAWINGS

Schematic diagram of the blade computing unit;

Schematic diagram of the structure of the coolant tank;

Supercomputer surface mount evaporative cooling device working principle diagram. detailed description

The invention is further described below in conjunction with the drawings and specific embodiments.

Figure 1 shows a blade computing unit that includes a main body heat generating component CPU 1, a memory bank 2, and a north-south bridge management chip 3.

The surface mount evaporative cooling device of the present invention is installed in a cabinet of a supercomputer, as shown in FIG. 3, which comprises N coolant tanks 9, a collecting manifold 12, a collecting manifold 11, and a back The liquid pipe 14, an outlet pipe 13 and a condenser 15. The condenser 15 is placed at the top of the computer machine, the liquid collecting manifold 11 is located at the bottom of the evaporative cooling device, the coolant tank 9 is located between the liquid collecting manifold 11 and the collecting manifold 12, and the steam outlet 13 is located at the collecting steam. Above the manifold 12, below the condenser 15, the header manifold 12 is connected to the condenser 15 through the outlet pipe 13, and the condenser 15 is passed back. The liquid pipe 14 is connected to the header manifold 11. The coolant cartridge shown in Figure 2 will be mounted on the blade computing unit shown in Figure 1 such that the coolant cartridge 9 is in intimate contact with the primary heating elements 1, 2, 3 on the blade computing unit, N coolant cartridges 9 The N liquid introduction pipes 7' contained therein are all in communication with the header manifold 11, and the N vapor outlet tubes 8 included in the N coolant tanks are all in communication with the header manifold 12 to form a closed circulating cooling circuit. The cooling medium is injected into the coolant tank, and the liquid level is equal to the center line of the vapor outlet tube located in the coolant tank.

Fig. 2 shows the structure of the coolant tank in detail. The coolant tank has a plurality of mutually communicating liquid tanks 4, 5 and 6, which are shaped and positioned to correspond to the respective heat generating components on the blade calculating unit. The liquid tanks 4, 5 and 6 communicate as the main body of the coolant tank 9. In the example exemplarily shown in Fig. 2, the liquid tank 4 is located in the middle of the liquid tank 9, the liquid tank 5 is located on the upper right side of the coolant tank 9, and the liquid tank 6 is located on the lower left side of the coolant tank 9, the liquid tank 5 and the liquid tank Welding is performed at the contact surface of the groove 4, the internal cavity is connected, and the contact surface of the liquid tank 6 and the liquid tank 4 is welded to realize internal cavity communication, and the cavity of the liquid tanks 4, 5, 6 is welded after the contact surface is welded. The bodies are all connected. The coolant tank 9 includes a liquid introduction pipe 7 and a vapor outlet pipe 8. The liquid introduction pipe 7 is located at a lower portion of the coolant tank 9, and the vapor outlet pipe 8 is located at an upper portion of the coolant tank 9.

The liquid introduction pipe 7 communicates with the header pipe 11 through a joint pipe 17 equipped with a valve 16, and the vapor outlet pipe 8 and the header pipe 12 communicate with each other through a joint pipe 17 equipped with a valve 16. The liquid introduction tube 7 and the vapor outlet tube 8 are respectively provided with a sealing mechanism 7-1 similar to an aviation plug. When the valve 16 on the joint tube 17 is closed and the calculation unit is pulled out, the liquid introduction tube 7 and the vapor outlet tube 8 are removed. Automatically sealed, the media will not leak out. The coolant tank 9 is a plurality of profiled structural tanks 4, 5, 6 that are connected by surface welding to ensure that each tank is closely matched to the shape of the heating element to be cooled to ensure optimum heat transfer.

As shown in Fig. 3, when the heating elements 1, 2, 3 are operated, heat is dissipated, and heat is transferred to the cooling medium in the cooling liquid tank through the metal surface of the cooling liquid tank 9. The cooling medium absorbs heat and rises. When the temperature reaches the saturation temperature corresponding to the pressure, it vaporizes and absorbs a large amount of heat, thereby cooling the heating element. The generated vapor medium enters the header manifold 12 along the vapor outlet tube 8 under the action of buoyancy and the liquid column static head of the liquid return pipe 14, and then enters the condenser 15 through the outlet pipe 13 The condensed liquid enters the liquid collecting header 11 via the liquid return pipe 14, and enters the cooling liquid tank 9 through the liquid introducing pipe 7, and performs the next round of cooling. Such a recurring process forms a self-circulating closed evaporative cooling device. The first coolant tank 9, ... the Nth coolant tank 10, the N coolant tanks are connected in parallel on the liquid path. The value of N can be determined as needed, and its range is, for example, 1-10. The condenser used in this embodiment is a water-cooled condenser, that is, the secondary cooling medium is water.

Claims

1. A supercomputer surface-mounted evaporative cooling device comprising a header manifold (12), a header manifold (11), a return conduit (14), an outlet conduit (13) and a condenser (15), characterized in that The condenser (15) is placed at the top of the supercomputer cabinet for condensing the coolant gas into a liquid; the liquid collecting manifold (11) is located at the bottom of the evaporative cooling device for collecting the coolant The N coolant tanks (9) are located between the header manifold (11) and the header manifold (12) in close contact with the heating elements of the supercomputer that are expected to be cooled; the outlet tubes (13) are located in the header manifold ( 12) Above the condenser (15), connect the collector manifold (12) to the condenser (15), and the evaporated coolant gas flows from the header manifold (12) to the condenser through the outlet pipe (13). (15) for condensation; the condenser (15) is connected to the header (11) through the liquid return pipe (14), so that the condensed coolant flows through the liquid return pipe (14) to the liquid collecting pipe (11); Each coolant tank contains a liquid guide that communicates with the header manifold (11) a tube (7) and a vapor outlet tube (8) in communication with the header manifold (12), wherein the liquid introduction tube (7) is for introducing a cooling liquid, and the vapor outlet tube (8) is used for deriving evaporation Coolant vapor.

2. The supercomputer surface-mounted evaporative cooling device according to claim 1, wherein the coolant tank (9) has a plurality of liquid chambers in which internal chambers communicate with each other, and N coolant tanks ( 9) Parallel in the liquid path.

3. The supercomputer surface mount evaporative cooling device according to claim 1, wherein N has a value ranging from 1 to 10.

The supercomputer surface mount evaporative cooling device according to claim 1, wherein the cooling liquid is a fluorocarbon compound.

5. A supercomputer provided with a surface-mounted evaporative cooling device, the surface-mounted evaporative cooling device comprising a collecting manifold (12), a collecting manifold (11), a liquid returning pipe (14), and an outlet pipe (13) and a condenser (15), characterized in that said cold a condenser (15) is placed on top of the supercomputer cabinet for condensing the coolant gas into a liquid; a liquid collection manifold (11) is located at the bottom of the evaporative cooling device for collecting the coolant; The coolant tank (9) is located between the header manifold (11) and the header manifold (12) in close contact with the heating element of the supercomputer desired to be cooled; the outlet tube (13) is located above the header manifold (12) , below the condenser (15), connecting the header (12) and the condenser (15), and the evaporated coolant gas flows from the header (12) to the condenser (15) through the outlet pipe (13). For condensation; the condenser (15) is connected to the header (11) through the liquid return pipe (14), so that the condensed coolant flows through the liquid return pipe (14) to the liquid collecting pipe (11); each cooling The liquid cartridges each include a liquid introduction pipe (7) communicating with the header manifold (11) and a vapor outlet pipe (8) communicating with the header manifold (12), wherein the liquid introduction pipe (7) is used for introduction The coolant, the vapor outlet tube (8) is used to derive the vaporized vapor of the coolant.

The supercomputer according to claim 5, wherein the coolant tank (9) has a plurality of liquid chambers in which internal chambers communicate with each other, and the N coolant tanks (9) are on the liquid path. Parallel.

7. The supercomputer according to claim 5, wherein N has a value ranging from 1 to 10.

The supercomputer according to claim 5, wherein the cooling liquid is a fluorocarbon compound.