CN113773812B - Composition containing heterocyclic accelerator, application of composition to liquid coolant and immersed liquid cooling system - Google Patents
Composition containing heterocyclic accelerator, application of composition to liquid coolant and immersed liquid cooling system Download PDFInfo
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- 239000007788 liquid Substances 0.000 title claims abstract description 66
- 239000000203 mixture Substances 0.000 title claims abstract description 65
- 238000001816 cooling Methods 0.000 title claims abstract description 55
- 239000002826 coolant Substances 0.000 title claims abstract description 49
- 125000000623 heterocyclic group Chemical group 0.000 title claims abstract description 20
- 239000010702 perfluoropolyether Substances 0.000 claims abstract description 25
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 8
- 150000001412 amines Chemical class 0.000 claims abstract description 4
- 238000007654 immersion Methods 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 8
- 229950008618 perfluamine Drugs 0.000 claims description 7
- JAJLKEVKNDUJBG-UHFFFAOYSA-N perfluorotripropylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)F JAJLKEVKNDUJBG-UHFFFAOYSA-N 0.000 claims description 7
- 229940126214 compound 3 Drugs 0.000 claims description 4
- 229940125904 compound 1 Drugs 0.000 claims description 3
- 229940125782 compound 2 Drugs 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 2
- 239000000446 fuel Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 claims 1
- AQZYBQIAUSKCCS-UHFFFAOYSA-N perfluorotripentylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F AQZYBQIAUSKCCS-UHFFFAOYSA-N 0.000 claims 1
- PQJOLFTWPSZESR-UHFFFAOYSA-N 2,4-difluoro-1-(trifluoromethyl)benzene Chemical compound FC1=CC=C(C(F)(F)F)C(F)=C1 PQJOLFTWPSZESR-UHFFFAOYSA-N 0.000 abstract description 9
- 239000000110 cooling liquid Substances 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 17
- 230000017525 heat dissipation Effects 0.000 description 13
- 230000002829 reductive effect Effects 0.000 description 13
- -1 perfluorinated amino olefin compounds Chemical class 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 229920000728 polyester Polymers 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 231100000956 nontoxicity Toxicity 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000006872 improvement Effects 0.000 description 4
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 150000001336 alkenes Chemical class 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 150000002170 ethers Chemical class 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- 230000008961 swelling Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
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- 230000008859 change Effects 0.000 description 2
- 150000001924 cycloalkanes Chemical class 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
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- 230000004907 flux Effects 0.000 description 2
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- 150000002576 ketones Chemical class 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
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- 150000003512 tertiary amines Chemical class 0.000 description 2
- OHMHBGPWCHTMQE-UHFFFAOYSA-N 2,2-dichloro-1,1,1-trifluoroethane Chemical compound FC(F)(F)C(Cl)Cl OHMHBGPWCHTMQE-UHFFFAOYSA-N 0.000 description 1
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical class C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical class CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229920001774 Perfluoroether Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical class CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
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- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- OOHAUGDGCWURIT-UHFFFAOYSA-N n,n-dipentylpentan-1-amine Chemical class CCCCCN(CCCCC)CCCCC OOHAUGDGCWURIT-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- UGFMBZYKVQSQFX-UHFFFAOYSA-N para-methoxy-n-methylamphetamine Chemical compound CNC(C)CC1=CC=C(OC)C=C1 UGFMBZYKVQSQFX-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical class CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical class CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/10—Liquid materials
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses a composition containing a heterocyclic accelerator, application of the composition to a liquid coolant and an immersed liquid cooling system. The composition comprises perfluoropolyether, a heterocyclic accelerator, 2, 4-difluorobenzotrifluoride, perfluorinated amine, and 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether. Wherein the perfluoropolyether has the structure Ri- (C (R) f )F(CF 2 ) x O) n ‑(CF 2 O) m ‑(CF 2 ) y -Rs, where R f Selected from F, CF 3 ，CF 2 CF 3 ，CF 2 CF 2 CF 3 Or CF (CF) 3 )CF 3 The method comprises the steps of carrying out a first treatment on the surface of the Ri is selected from F, CF 3 ，CF 2 CF 3 ，CF 2 CF 2 CF 3 ，CF(CF 3 )CF 3 ，OCF 3 ，OCF 2 CF 3 ，OCF 2 CF 2 CF 3 Or OCF (CF) 3 )CF 3 A group; rs is selected from F, CF 3 ，CF 2 CF 3 ，CF 2 CF 2 CF 3 Or CF (CF) 3 )CF 3 A group; x is 1 or 2; n is an integer between 3 and 50, m is an integer between 2 and 30, and y is an integer between 0 and 2. The composition can be used as a liquid coolant for electronic equipment, and has the advantages of good compatibility with the electronic equipment, low viscosity, high specific heat capacity and high heat conductivity coefficient.
Description
Technical Field
The application relates to the technical field of liquid cooling media, in particular to a composition containing a heterocyclic accelerator, application of the composition to a liquid cooling agent and an immersed liquid cooling system.
Background
Along with the progress of technology, the electronic industry is rapidly developed, and electronic equipment such as a high-performance computer host, a data center server and the like can generate a large amount of heat in the operation process, so that the operation efficiency is reduced, and how to timely transfer and convert the heat is one of factors restricting the development of the industry.
The heat dissipation devices currently used are of two types, and air-cooled heat dissipation systems such as cooling systems based on fans are commonly adopted in the industry, but because a large amount of power is required, the power cost required for driving the systems is exponentially increased along with the increase of the density of the servers, the energy efficiency is relatively low, and the energy consumption is high. The traditional air cooling mode is carried out in an indirect contact cooling mode, and has the defects of complex heat transfer process, large total heat resistance, low heat exchange efficiency, large temperature difference between high-temperature heat sources and low-temperature heat sources in the heat exchange process, need of guiding the heat exchange process by using low-temperature outdoor heat sources and the like. In large data centers, air cooling alone is insufficient to meet the heat dissipation requirements of high heat flux servers.
Another type is to use a liquid-cooled heat sink system. Because the specific heat capacity of the liquid is far higher than that of air, the heat which can be transmitted in unit volume is far higher than that of air, and the heat dissipation speed is also far higher than that of air, a large amount of heat can be absorbed, the temperature can not be obviously changed, the temperature of a device arranged in a liquid cooling system can be well controlled, and the temperature inside the device can not be instantaneously and greatly changed due to any sudden operation. The cooling efficiency of the liquid cooling is far higher than that of an air cooling heat dissipation mode, and meanwhile, the noise of the liquid cooling can be well controlled. Therefore, compared with the traditional air-cooled heat dissipation system, the liquid-cooled heat dissipation system not only has better energy saving effect, refrigerating capacity and smaller noise, but also can reduce the size of the server by improving the power density.
The liquid cooling heat dissipation system comprises indirect contact liquid cooling and direct immersion liquid cooling. The liquid cooling agent (also referred to herein as cooling liquid) in indirect contact liquid cooling is not in direct contact with the heat generating device, such as the super computer surface-mounted evaporative cooling device disclosed in CN101751096B, and the liquid cooling plate adopted in CN102711414a is in contact with the heat generating device, so as to indirectly take away heat. The two schemes can only cool and process heat emitted by heating devices with regular heat dissipation surfaces such as a CPU (Central processing Unit), a GPU (graphics processing Unit) and the like, and cannot be used for other heating devices on a circuit board such as a memory, a resistor and the like, so that the two schemes are often combined with air cooling. In addition, the cooling liquid is not in direct contact with the heating device, and contact thermal resistance and conduction thermal resistance exist in the middle, so that the heat exchange efficiency is low. At the same heating device surface temperature, a lower coolant temperature is required than for direct liquid cooling.
Direct immersion liquid cooling is a new heat dissipation technology that has been of interest in industry in recent years. Direct immersion cooling is the complete immersion of an electronic device, such as a server, in a tank filled with a cooling fluid that directly carries away heat generated by the components of the server, such as chips, memory, etc. Immersion liquid cooling has significant advantages. Firstly, in immersed liquid cooling, the cooling liquid is in direct contact with heating equipment, so that the heat transfer coefficient is high, and the convection thermal resistance is low; secondly, the cooling liquid has higher heat conductivity and specific heat capacity, and the running temperature change rate is smaller; again, the mode does not need a fan, reduces energy consumption and noise, and has high refrigeration efficiency; finally, the cooling liquid has excellent insulating property, high flash point, no inflammability, no toxicity, no harm and no corrosion. Therefore, the liquid cooling technology is suitable for large-scale data centers, super computing, industrial and other computing fields and scientific research institutions with high heat flux density and green energy saving requirements, and particularly has obvious advantages for data centers with severe cold and high altitude areas, or data centers with special topography and limited space, high requirements for environmental noise, close offices and living places of people and need to be muted.
The direct immersion liquid cooling requires good compatibility between the cooling liquid and the device because the cooling liquid directly contacts with the electronic device, for example, swelling corrosion is not caused to chips, circuits and the like in the device, and short circuit danger is not caused to electronic equipment. Therefore, the high requirements are put on the performance of the liquid cooling agent, and the liquid cooling agent not only has the advantages of no toxicity, no harm, no corrosiveness, oxidation resistance, high flash point, incombustibility and good insulativity, but also has the advantages of balancing the factors of low viscosity, high specific heat capacity, high heat flow density and the like. The preparation of liquid-cooling agents meeting the above requirements has been a problem to be solved in the industry.
At present, some direct immersion liquid cooling systems have been developed, and CN108351674a provides an immersion cooling system using 3M fluorinated liquids, which are fluorine-based inert liquids composed of perfluorinated compounds, mainly perfluorinated amines. CN112135811a discloses a general formula cfy=cxn (R f )CF 2 R f ' perfluorinated amino olefin compounds are useful for direct immersion liquid cooling of electronic devices. The main component of the cooling liquid disclosed in CN111475002A is a perfluorinated amine compound which is one or a mixture of more than two of perfluorinated triethylamine, perfluorinated tripropylamine, perfluorinated tributylamine, perfluorinated tripentylamine and perfluorinated N-methylmorpholine, and can be used for a cooling system of electronic equipment. However, the existing cooling liquid containing perfluorinated amine compounds and perfluorinated amino olefin compounds has poor compatibility with electronic equipment materials, and has a large room for improvement, and the cooling liquid cannot simultaneously satisfy factors such as high specific heat capacity, low viscosity and high thermal conductivity, which restrict the liquid cooling effect.
Therefore, the liquid coolant in the prior art still has much room for improvement, and the performance of the liquid coolant for electronic devices needs to be further improved.
Disclosure of Invention
In order to solve the defects of the prior liquid cooling agent, the invention solves the problem of poor compatibility of liquid cooling agent components in the prior art by providing the composition containing the heterocyclic accelerator, the application of the composition to the liquid cooling agent and the immersed liquid cooling system, and protects electronic equipment from being damaged.
In order to achieve the above purpose, the present application provides the following technical solutions:
a composition comprising the following components:
wherein the perfluoropolyether has the formula: ri- (C (R) f )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -Rs，
Wherein R is f Selected from F, CF 3 ，CF 2 CF 3 ，CF 2 CF 2 CF 3 Or CF (CF) 3 )CF 3 The method comprises the steps of carrying out a first treatment on the surface of the Ri is selected from F, CF 3 ，CF 2 CF 3 ，CF 2 CF 2 CF 3 ，CF(CF 3 )CF 3 ，OCF 3 ，OCF 2 CF 3 ，OCF 2 CF 2 CF 3 Or OCF (CF) 3 )CF 3 A group; rs is selected from F, CF 3 ，CF 2 CF 3 ，CF 2 CF 2 CF 3 Or CF (CF) 3 )CF 3 A group; x is 1 or 2; n is an integer between 3 and 50, m is an integer between 2 and 30, and y is an integer between 0 and 2;
the heterocyclic accelerator has the following general formula:
wherein Rf1 is selected from F, CF 3 ，CF 2 CF 3 Rf2 is selected from F or CF 3 P and q are integers of 3-10 and q is less than or equal to p, k is 1,2 or 3, rh is H or CH 3 。
Preferably, the composition comprises the following components:
preferably, m in the perfluoropolyether is an integer between 2 and 15, and n is an integer between 3 and 20.
Preferably, the perfluoropolyether is selected from one or more of the following compounds:
compound 1: ri- (C (R) f )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -Rs, where R f ＝CF 2 CF 3 ，Ri＝OCF(CF 3 )CF 3 ，Rs＝CF(CF 3 )CF 3 ，x＝2，n＝20，m＝15，y＝2；
Compound 2: ri- (C (R) f )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -Rs, where R f ＝F，Ri＝F，Rs＝F，x＝1，n＝3，m＝2，y＝0；
Compound 3: ri- (C (R) f )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -Rs, where R f ＝CF 3 ，Ri＝CF 3 ，Rs＝CF 3 ，x＝1，n＝10，m＝10，y＝1。
The application also provides the application of the composition as a liquid coolant in a cooling system.
Preferably, the composition is used as a liquid coolant in an electronic device cooling system.
Preferably, the electronic device comprises one or more of a computer server, a microprocessor, a data center, a power control semiconductor, a semiconductor wafer for manufacturing semiconductor devices, an electrochemical cell, a distribution switch gear, a power transformer, a circuit board, a multi-chip module, a packaged or unpackaged semiconductor device, a fuel cell, or a laser.
Preferably, the electronic device is partially or wholly immersed in a cooling medium comprising the composition, such that heat exchange is performed between the electronic device and the cooling medium.
Preferably, the composition is present in the cooling medium in a weight percentage of at least 25%.
Preferably, the electronics cooling system is a single phase immersion cooling system.
Further, the present application also provides an immersion cooling system comprising:
a totally enclosed or not totally enclosed housing having an interior space;
a heat generating component disposed within the interior space;
and a cooling medium liquid provided in the internal space such that the heat generating component is in contact with the cooling medium liquid;
wherein the cooling medium comprises the composition described above.
Preferably, the electronics cooling system is a single phase immersion cooling system.
For a direct immersion type liquid cooling system, because the cooling liquid is in direct contact with an electronic device, the cooling liquid is required to have the characteristic of good fluidity based on the simplicity of operation and convenience in improving the circulation flow, namely, the cooling liquid has lower viscosity, and the heat dissipation capacity of the whole liquid cooling system is effectively improved.
In order to improve the cooling effect of the cooling liquid, the cooling liquid with large specific heat capacity can absorb more heat, so that the consumption of the cooling liquid is reduced, and the size of the device can be reduced. Therefore, it is necessary to find a liquid refrigerant component having a high specific heat capacity, and in addition, by using different components for proportioning, further improvement of the specific heat capacity of the liquid refrigerant is a good way.
In addition, as a cooling liquid, a high heat conductivity coefficient also represents a better heat conduction effect, and the cooling efficiency is also higher. Therefore, preparing a cooling liquid with a high heat conductivity is one of the problems to be solved in the field of liquid cooling agents.
However, it is not easy to find a suitable liquid coolant component and thus achieve a combination of low viscosity, high specific heat capacity and high thermal conductivity, and no route has been given in the prior art.
The applicant has found that, when studying the components of the existing liquid coolant, the existing liquid coolant mainly composed of a perfluorinated amine compound and a perfluorinated amino olefin compound has poor compatibility with electronic equipment materials. The applicant has also made a series of structural improvements on the above compounds, but has not achieved satisfactory results. Through a great deal of researches, the applicant finds that the perfluoropolyether (such as the compounds 1-3) with the polyether structure has the characteristics of no color, no toxicity, incombustibility, high specific heat capacity and high heat conductivity, has enough safety performance, and has better electrical insulation performance, and the volume resistivity is far higher than the design requirement on cooling liquid in the design specification of single-phase immersed direct liquid cooling data center. The perfluoropolyether compounds have high thermal conductivity and the specific heat capacity of the perfluoropolyether compounds is above 1100J/(kg. DEG C.), so that more efficient heat transfer can be provided and more efficient cooling effect can be provided when the perfluoropolyether compounds are used in a cooling system of a heat generating component. In addition, the applicant carries out compatibility test on the perfluoropolyether compound and the electronic device, adopts the perfluoropolyether to soak the electronic sample such as a net wire and a side gasket of a valve plate, records the weight, the volume and the hardness of the electronic device sample before and after soaking and changes of an infrared spectrogram, and the test result shows that the liquid cooling agent after soaking is still in a clear state, the electronic device is not swelled and corroded, and the volume and the mass of the electronic device sample before and after soaking are very small. As can be seen from the comparison of infrared spectra before and after the electronic device is soaked by the corresponding liquid cooling agent, the superposition degree of the infrared spectra is higher, no obvious change is seen, and the component perfluoropolyether of the liquid cooling agent is basically unchanged, so that the perfluoropolyether provided by the application has very good material compatibility with the electronic device, does not cause swelling corrosion to chips and circuits in the device, and does not cause short circuit hazard to the electronic device.
In view of the problem that the cost is high when perfluoropolyether is singly used, the applicant hopes to find components compatible with the perfluoropolyether, further optimizes the performances such as viscosity, specific heat capacity, heat conduction constant and the like, and tries to use various compounds to be compatible with the perfluoropolyether so as to obtain the liquid refrigerant with more excellent performances.
As compatible components of the liquid cooling agent, physical and chemical properties of the components, such as viscosity, specific heat capacity, boiling point and the like, are considered, and performances of low viscosity, high specific heat capacity, high heat conduction constant and the like are also considered.
The applicant has found through research that by using perfluoropolyether in combination with heterocyclic accelerator, 2, 4-difluorobenzotrifluoride, perfluorinated amine, and 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether, a composition having non-toxic, harmless, nonflammable, insulating properties and good compatibility with electronic devices is obtained, and the composition has the advantages of low viscosity, high specific heat capacity and high thermal conductivity, and can be used as an immersion liquid cooling agent, and is particularly suitable for electronic equipment.
The heterocyclic accelerator can reduce the viscosity of the composition, increase the specific heat capacity, and particularly improve the heat conductivity coefficient of the composition, so that the liquid cooling effect of the composition is improved.
The 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether used in the application is usually used as a fluoroether additive in electrolyte of a lithium electronic battery, and can be used as an additive for inhibiting positive electrode surface activity (CN 104900916A); can also be used as electrolyte solvent for improving the service life of the battery (CN 111066188A). By introducing 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether, the viscosity of the composition can be reduced, the specific heat capacity can be increased, and the heat conductivity of the composition can be improved.
The composition has good material compatibility, does not cause swelling corrosion to chips and circuits in equipment after long-time contact, and can be applied to various sensitive materials including but not limited to aluminum, PMMA, butyl rubber, copper, polyethylene, natural rubber, carbon steel, polypropylene, nitrile rubber, 302 stainless steel, polycarbonate, ethylene propylene diene monomer rubber, brass, polyester, molybdenum, epoxy resin, tantalum, PET, tungsten, phenolic resin, copper alloy C172, ABS, magnesium alloy AZ32B and the like.
When the composition of the present application is used in a cooling system for electronic devices, an immersed cooling system is employed. Specifically, the electronic device is partially or entirely immersed in a cooling medium comprising the above composition, so that heat exchange is performed between the electronic device and the cooling medium.
The above-described compositions provided herein are present in the cooling medium at a weight percent of at least 25%, such as a cooling medium comprising at least 25%, at least 35%, at least 45%, at least 65%, at least 85%, or 100% of the above-described composition. In addition to the above-described liquid cooling agents, the cooling medium may also comprise up to 75 weight percent, based on the total weight of the cooling medium, of one or more of the following components: ethers, alkanes, perfluorinated olefins, halogenated olefins, perfluorinated hydrocarbons, perfluorinated tertiary amines, perfluorinated ethers, cycloalkanes, esters, perfluorinated ketones, ethylene oxides, aromatics, siloxanes, hydrochlorocarbons, hydrochlorofluorocarbons, hydrofluorocarbons, hydrofluoroolefins, hydrochloroalkenes, hydrochlorofluoroolefins, hydrofluoroethers, or mixtures thereof; or an alkane, perfluoroolefin, halogenated olefin, perfluorohydrocarbon, perfluorinated tertiary amine, perfluorinated ether, cycloalkane, perfluorinated ketone, aromatic compound, siloxane, hydrochlorofluorocarbon, hydrofluorocarbon, hydrofluoroolefin, hydrochlorofluoroolefin, hydrofluoroether or mixtures thereof based on the total weight of the working fluid. Such additional components may be selected to alter or enhance the characteristics of the composition for a particular use.
The technical scheme of the application has the following beneficial effects:
the composition has good compatibility with electronic equipment, has the characteristics of no toxicity, no harm, no corrosion, incombustibility, insulation and the like, and simultaneously has the characteristics of low viscosity, high specific heat capacity and high heat conduction constant. When used as a liquid coolant for a cooling system of electronic equipment, the heat dissipation device has excellent heat dissipation function, good compatibility and stability, can protect the electronic equipment from being damaged, and has long service life.
Detailed Description
The present application is further described below in conjunction with specific embodiments to facilitate an understanding of the present application by those skilled in the art, and it should be understood that the embodiments are illustrative of the present application and are not intended to limit the scope of the present application.
As used herein, parts are parts by weight unless otherwise indicated.
Examples
Reagents used in the examples of this application are all commercially available. Wherein the heterocyclic accelerator is a huge self-made product.
Specifically, the heterocyclic accelerators used in examples 1-3 have the following structures:
examples 1 to 6
The perfluoropolyether, heterocyclic accelerator, 2, 4-difluorobenzotrifluoride, perfluorotripropylamine, 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether were weighed according to the weight ratio of Table 1 and the above components were uniformly mixed. The obtained compositions were tested for toxicity, flammability, kinematic viscosity, specific heat capacity and thermal conductivity.
Wherein,,
the perfluoropolyether used in example 1 was compound 1: ri- (C (R) f )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -Rs, where R f ＝CF 2 CF 3 ，Ri＝OCF(CF 3 )CF 3 ，Rs＝CF(CF 3 )CF 3 ，x＝2，n＝20，m＝15，y＝2。
The perfluoropolyether used in example 2 was compound 2: ri- (C (R) f )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -Rs, where R f ＝F，Ri＝F，Rs＝F，x＝1，n＝3，m＝2，y＝0。
Example 3 is the perfluoropolyether used as compound 3: ri- (C (R) f )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -Rs, where R f ＝CF 3 ，Ri＝CF 3 ，Rs＝CF 3 ，x＝1，n＝10，m＝10，y＝1。
Comparative examples 1-3 the same perfluoropolyether, compound 3, was used as in example 3, wherein comparative example 1 did not add a heterocyclic accelerator, comparative example 2 did not add 2, 4-difluorobenzotrifluoride, and comparative example 3 did not add perfluorotripropylamine. Comparative example 4 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether was not added.
The test results of examples 1-3 and comparative examples 1-3 are shown in Table 2.
The composition of Table 1 comprises the following components in parts by weight
Table 2 properties of the compositions
For comparative example 1, the composition was not added with a heterocyclic accelerator, and the kinematic viscosity increased from 35.77 to 38.11mm, as compared to example 3 2 Specific heat capacity is 1.22.10 per second (25 ℃) 3 Reduced to 1.06 x 10 3 J kg -1 C -1 (25 ℃ C.) the thermal conductivity is reduced from 0.384 to 0.312W/mK (25 ℃ C.). Thus, without adding a heterocyclic accelerator, the viscosity of the composition becomes high, the specific heat capacity becomes small, and the thermal conductivity becomes small.
For comparative example 2, the kinematic viscosity increased from 35.77 to 45.42mm in comparison to example 3 without the addition of 2, 4-difluorobenzotrifluoride to the composition 2 Specific heat capacity is 1.22.10 per second (25 ℃) 3 Reduced to 1.07 x 10 3 J kg -1 C -1 (25 ℃ C.) the thermal conductivity is reduced from 0.384 to 0.281W/mK (25 ℃ C.). From this, it was found that the viscosity of the composition became high, the specific heat capacity became small, and the thermal conductivity became small without adding 2, 4-difluorobenzotrifluoride. The composition of comparative example 2 had a higher viscosity and a lower thermal conductivity than the composition of comparative example 1, relative to the composition without the heterocyclic accelerator.
For comparative example 3, the kinematic viscosity increased from 35.77 to 42.28mm in comparison to example 3 without the addition of perfluorotripropylamine to the composition 2 Specific heat capacity is 1.22.10 per second (25 ℃) 3 Reduced to 1.08 x 10 3 J kg -1 C -1 (25 ℃ C.) the thermal conductivity is reduced from 0.384 to 0.257W/mK (25 ℃ C.). It can be seen that no perfluoro is addedTripropylamine, the viscosity of the composition becomes high, the specific heat capacity becomes small, and the thermal conductivity becomes small. The thermal conductivity of comparative example 3 was reduced to a higher extent than the compositions of comparative examples 1-2 relative to comparative examples 1 and 2.
For comparative example 4, the kinematic viscosity increased from 35.77 to 40.11mm in comparison to example 3 without the addition of 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether to the composition 2 Specific heat capacity is 1.22.10 per second (25 ℃) 3 Reduced to 1.07 x 10 3 J kg -1 C -1 (25 ℃ C.) the thermal conductivity is reduced from 0.384 to 0.233W/mK (25 ℃ C.). From this, it was found that the viscosity of the composition became high, the specific heat capacity became small, and the thermal conductivity became small without adding 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether. The compositions of comparative example 4 had a smaller magnitude of thermal conductivity than the compositions of comparative examples 1-3.
From the above, it was found that the composition was increased in viscosity, decreased in specific heat capacity and decreased in thermal conductivity without adding any of the heterocyclic accelerator, 2, 4-difluorobenzotrifluoride, perfluorotripropylamine, and 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether. For the above four components, the addition of them does not lead to a reduction in specific heat capacity, and the reduction in specific heat capacity is comparable. By comparison with example 3, the effect on the thermal conductivity is more pronounced without the addition of a heterocyclic accelerator with respect to the effect on viscosity, specific heat capacity. And the viscosity, specific heat capacity and heat conduction constant of the mixture are obviously affected by not adding 2, 4-difluoro benzotrifluoride, perfluoro tripropylamine and 1H, 5H-octafluoro amyl-1, 2-tetrafluoroethyl ether.
Therefore, the liquid cooling agent with non-toxicity, incombustibility, non-corrosion, low viscosity, high specific heat capacity and high heat conductivity coefficient is obtained by matching the perfluoropolyether with the heterocyclic accelerator, the 2, 4-difluoro-benzotrifluoride, the perfluoro-tripropylamine and the 1H, 5H-octafluoro-pentyl-1, 2-tetrafluoroethyl ether.
Finally, it is noted that the above embodiments are only for illustrating the technical solution of the present application and not for limiting the same, and although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present application may be modified or substituted without departing from the spirit and scope of the technical solution of the present application, and all such modifications are intended to be encompassed within the scope of the claims of the present application.
Claims (12)
1. A composition comprising the following components:
wherein the perfluoropolyether has the formula: ri- (C (R) f )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -Rs，
Wherein R is f Selected from F, CF 3 ，CF 2 CF 3 ，CF 2 CF 2 CF 3 Or CF (CF) 3 )CF 3 The method comprises the steps of carrying out a first treatment on the surface of the Ri is selected from F, CF 3 ，CF 2 CF 3 ，CF 2 CF 2 CF 3 ，CF(CF 3 )CF 3 ，OCF 3 ，OCF 2 CF 3 ，OCF 2 CF 2 CF 3 Or OCF (CF) 3 )CF 3 A group; rs is selected from F, CF 3 ，CF 2 CF 3 ，CF 2 CF 2 CF 3 Or CF (CF) 3 )CF 3 A group; x is 1 or 2; n is an integer between 3 and 50, m is an integer between 2 and 30, and y is an integer between 0 and 2;
the heterocyclic accelerator has the following general formula:
wherein Rf1 is selected from F, CF 3 ，CF 2 CF 3 Rf2 is selected from F or CF 3 P and q are integers of 3-10 and q is less than or equal to p, k is 1,2 or 3, rh is H or CH 3 。
2. The composition of claim 1, wherein,
3. the composition according to claim 1 or 2, wherein m is an integer between 2 and 15 and n is an integer between 3 and 20.
4. The composition according to claim 1 or 2, wherein the perfluorinated amine is selected from one or more of perfluorotripropylamine, perfluorotributylamine, perfluorotripentylamine.
5. The composition of claim 1 or 2, wherein the perfluoropolyether is selected from one or more of the following compounds:
compound 1: ri- (C (R) f )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -Rs, where R f ＝CF 2 CF 3 ，Ri＝OCF(CF 3 )CF 3 ，Rs＝CF(CF 3 )CF 3 ，x＝2，n＝20，m＝15，y＝2；
Compound 2: ri- (C (R) f )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -Rs, where R f ＝F，Ri＝F，Rs＝F，x＝1，n＝3，m＝2，y＝0；
Compound 3: ri- (C (R) f )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -Rs, where R f ＝CF 3 ，Ri＝CF 3 ，Rs＝CF 3 ，x＝1，n＝10，m＝10，y＝1。
6. Use of a composition according to any one of claims 1 to 5 as a liquid coolant in a cooling system.
7. The use according to claim 6, wherein the composition is used as a liquid coolant in an electronic device cooling system.
8. The use according to claim 7, wherein the electronic device comprises one or more of a computer server, a microprocessor, a data center, an electrochemical cell, a distribution switch gear, a power transformer, a circuit board, a multi-chip module, a packaged or unpackaged semiconductor device, or a laser.
9. The use according to claim 7, wherein the electronic device comprises one or more of a power control semiconductor, a semiconductor wafer for manufacturing a semiconductor device, a fuel cell.
10. Use according to claim 7, wherein the electronic device is partly or wholly immersed in a cooling medium comprising the composition, so that heat exchange takes place between the electronic device and the cooling medium.
11. Use according to claim 10, wherein the composition is present in the cooling medium in a weight percentage of at least 25%.
12. An immersion cooling system comprising:
a totally enclosed or not totally enclosed housing having an interior space;
a heat generating component disposed within the interior space;
and a cooling medium liquid provided in the internal space such that the heat generating component is in contact with the cooling medium liquid;
wherein the cooling medium comprises the composition of any one of claims 1-5.
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