CN113717699B - Composition, silicon-containing liquid refrigerant, preparation method of silicon-containing liquid refrigerant and immersed cooling system - Google Patents
Composition, silicon-containing liquid refrigerant, preparation method of silicon-containing liquid refrigerant and immersed cooling system Download PDFInfo
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Abstract
The application discloses a composition, a silicon-containing liquid coolant, a preparation method thereof and an immersed cooling system, and relates to the technical field of liquid cooling. The composition provided by the application comprises the following components in parts by weight: 60-85 parts of fluorocarbon; 5-15 parts of trifluoropropyl methyl silicone oil; 0.5-2.8 parts of flow promoter; 2-10 parts of hexafluoropropylene trimer. The application solves the defects of poor fluidity, poor compatibility of a cooling liquid component system and electronic equipment materials and the like of the existing cooling liquid, and provides the liquid cooling agent with good fluidity, excellent heat dissipation function and excellent material compatibility.
Description
Technical Field
The application relates to the technical field of liquid cooling, in particular to a composition, a silicon-containing liquid coolant, a preparation method thereof and an immersed cooling system.
Background
The heating element is directly immersed in the cooling liquid, and the heat generated by the operation of the server and other equipment is taken away by the circulation of the liquid. Immersion liquid cooling is typically direct contact liquid cooling. Because the heating element is in direct contact with the cooling liquid, the heat dissipation efficiency is higher, the noise is lower, and the problem of high-heat riddle prevention can be solved. The immersed liquid cooling is divided into two-phase liquid cooling and single-phase liquid cooling, and the heat dissipation mode can be in the forms of a dry cooler, a cooling tower and the like.
The insulating cooling liquid of the immersed liquid coolant is usually silicon oil, mineral oil, fluoridation liquid and the like, and is characterized in that: the insulating and corrosion-free electronic component is completely insulated, and even if the electronic component is immersed for more than 20 years, the electronic component is not affected; the efficient heat dissipation efficiency can ensure that a machine room does not need large-scale refrigeration equipment such as an air conditioner and the like, more than 75 percent of space is saved, and the PUE close to 1.0 can exert the limited electric power with the maximum calculation capacity.
However, the liquid cooling agent in the prior art generally has the defects of poor fluidity, poor compatibility of a cooling liquid component system and electronic equipment materials, and the like, and the performance of the liquid cooling agent needs to be further improved.
Disclosure of Invention
The embodiment of the application provides a liquid cooling agent with good fluidity, excellent heat dissipation function and excellent material compatibility by providing a composition, a silicon-containing liquid cooling agent, a preparation method thereof and an immersion cooling system, and solving the defects of poor fluidity, poor compatibility of a cooling liquid component system and electronic equipment materials and the like existing in the existing cooling liquid.
In order to achieve the above purpose, the present application mainly provides the following technical solutions:
the embodiment of the application provides a composition, which comprises the following components in parts by weight:
60-85 parts of fluorocarbon;
5-15 parts of trifluoropropyl methyl silicone oil;
0.5-2.8 parts of flow promoter;
2-10 parts of hexafluoropropylene trimer.
Preferably, the fluorocarbon compound has the following structural formula: r is R i -(C(R f )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -R s Wherein R is f Selected from H, -F, -CF 3 or-CF 2 CF 3 A group; r is R i Selected from H, -F, -CF 3 、-CF 2 CF 3 、-CF 3 O or-CF 2 CF 3 An O group; r is R s Selected from-F, -CF 3 、-CF 2 CF 3 or-CF (CF) 3 )CF 3 A group; x is 1 or 2; n is an integer between 3 and 20, m is an integer between 2 and 15, and y is an integer between 0 and 2.
Preferably, the molecular weight of the trifluoropropyl methyl silicone oil is 500-2000.
Preferably, the flow promoter is a fluorine modified silane.
Preferably, the flow promoter is prepared by the following method: according to weight parts, adding 5-12 parts of tetramethyl tetravinyl cyclotetrasiloxane into 40-60 parts of dimethylbenzene, dispersing and stirring, then adding 3-8 parts of perfluorohexyl ethyl methacrylate, 0.5-1.2 parts of butylene glycol and 0.1-1 part of decenal, heating to 60-75 ℃, adding 0.001-0.01 part of benzoyl peroxide and 0.001-0.005 part of dodecyl mercaptan, carrying out nitrogen protection reaction for 4-8 hours, and then carrying out reduced pressure distillation at 140 ℃ for 0.5-2 hours to obtain the flow promoter.
Preferably, the composition is used in a cooling medium or a heat transfer medium.
Preferably, the composition is present in the cooling medium or heat transfer medium in a weight percentage of at least 20%.
The embodiment of the application also provides a silicon-containing liquid coolant which comprises the following components in parts by weight:
60-85 parts of fluorocarbon;
5-15 parts of trifluoropropyl methyl silicone oil;
0.5-2.8 parts of flow promoter;
2-10 parts of hexafluoropropylene trimer.
Preferably, the fluorocarbon compound has the following structural formula: r is R i -(C(R f )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -R s Wherein R is f Selected from H, -F, -CF 3 or-CF 2 CF 3 A group; r is R i Selected from H, -F, -CF 3 、-CF 2 CF 3 、-CF 3 O or-CF 2 CF 3 An O group; r is R s Selected from-F, -CF 3 、-CF 2 CF 3 or-CF (CF) 3 )CF 3 A group; x is 1 or 2; n is an integer between 3 and 20, m is an integer between 2 and 15, and y is an integer between 0 and 2.
Preferably, the molecular weight of the trifluoropropyl methyl silicone oil is 500-2000.
Preferably, the flow promoter is a fluorine modified silane.
Preferably, the flow promoter is prepared by the following method: according to weight parts, adding 5-12 parts of tetramethyl tetravinyl cyclotetrasiloxane into 40-60 parts of dimethylbenzene, dispersing and stirring, then adding 3-8 parts of perfluorohexyl ethyl methacrylate, 0.5-1.2 parts of butylene glycol and 0.1-1 part of decenal, heating to 60-75 ℃, adding 0.001-0.01 part of benzoyl peroxide and 0.001-0.005 part of dodecyl mercaptan, carrying out nitrogen protection reaction for 4-8 hours, and then carrying out reduced pressure distillation at 140 ℃ for 0.5-2 hours to obtain the flow promoter.
The embodiment of the application also provides a preparation method of the silicon-containing liquid coolant, which comprises the following steps: and physically mixing the fluorocarbon, the trifluoropropyl methyl silicone oil, the flow promoter and the hexafluoropropylene trimer in a liquid phase state according to corresponding proportions to obtain the liquid cooling agent.
The embodiment of the application also provides an immersion cooling system, which comprises:
a totally enclosed or not totally enclosed housing having an interior space;
a heat generating component disposed within the interior space;
and a cooling medium liquid provided in the internal space such that the heat generating component is in contact with the cooling medium liquid;
wherein the cooling medium comprises the above composition or the above liquid coolant.
Preferably, the composition or liquid coolant is present in the cooling medium in an amount of at least 20% by weight.
Preferably, the heat generating component includes an electronic device.
Preferably, the heat generating component is partially or entirely immersed in the cooling medium.
Preferably, the submerged cooling system is a single-phase submerged cooling system.
One or more technical solutions provided in the embodiments of the present application at least have the following technical effects or advantages:
1. the silicon-containing liquid refrigerant provided by the application is prepared from fluorocarbon and trifluoropropyl methyl silicone oil serving as main matrixes, and fluorine modified silane with multi-end branching is added to serve as a flow promoter, so that on one hand, a branched structure has a good flow promoting effect, and on the other hand, the system compatibility of the fluorocarbon and the trifluoropropyl methyl silicone oil can be promoted, and the silicon-containing liquid refrigerant is formed into a similar single system, so that the contact area of a silicon-containing component part with a silicon-containing material of an electronic substrate can be increased, the rapid flow transfer is realized, the heat export is greatly promoted, the compatibility of the cooling liquid component system and the electronic device material can be improved, and the electronic device material is protected from being damaged.
2. The silicon-containing liquid refrigerant provided by the application is nonflammable and good in insulating property, and the physicochemical property of the silicon-containing liquid refrigerant can be completely matched with various index requirements of a data center or an electronic equipment cooling system on a cooling medium.
Drawings
Fig. 1 is a physical diagram of an electronic device sample 1 in a compatibility test 1 according to an embodiment of the present application;
FIGS. 1-1a and 1-1b are respectively a physical comparison chart and an infrared spectrum comparison chart of a part 1 of an electronic device sample 1 before and after being immersed by a liquid coolant in an embodiment of the application;
FIGS. 1-2a and 1-2b are respectively a physical comparison chart and an infrared spectrum comparison chart of a part 2 of an electronic device sample 1 before and after being immersed by a liquid coolant in the embodiment of the application;
FIGS. 1-3a and 1-3b are respectively a physical comparison chart and an infrared spectrum comparison chart of a part 3 of an electronic device sample 1 before and after being immersed by a liquid coolant in the embodiment of the application;
FIGS. 1-4a and FIGS. 1-4b are respectively a physical comparison chart and an infrared spectrum comparison chart of a part 4 of an electronic device sample 1 before and after being immersed by a liquid coolant in the embodiment of the application;
FIGS. 1-5a and FIGS. 1-5b are respectively a physical comparison chart and an infrared spectrum comparison chart of a part 5 of an electronic device sample 1 before and after being immersed by a liquid coolant in the embodiment of the application;
FIG. 2 is a physical diagram of an electronic device sample 2 during compatibility testing in accordance with an embodiment of the present application;
FIGS. 2-a and 2-b are respectively a physical comparison chart and an infrared spectrum comparison chart of the electronic device sample 2 before and after being immersed by the liquid coolant in the embodiment of the present application;
FIG. 3 is a diagram of a test apparatus for compatibility test 2 according to an embodiment of the present application;
FIG. 4 is a graph showing the IR spectrum of the liquid coolant of compatibility test 2 of the present application before and after use.
Detailed Description
In order to facilitate understanding of the present application by those skilled in the art, the present application will be further described with reference to specific examples, and it should be understood that the examples are illustrative of the present application and are not intended to limit the scope of the present application.
The embodiment of the application provides a liquid cooling agent with good fluidity, excellent heat dissipation function and excellent material compatibility by providing a composition, a silicon-containing liquid cooling agent, a preparation method thereof and an immersion cooling system, and solving the defects of poor fluidity, poor compatibility of a cooling liquid component system and electronic equipment materials and the like existing in the existing cooling liquid.
In order to achieve the above purpose, the present application mainly provides the following technical solutions:
the embodiment of the application provides a composition, which comprises the following components in parts by weight:
60-85 parts of fluorocarbon;
5-15 parts of trifluoropropyl methyl silicone oil;
0.5-2.8 parts of flow promoter;
2-10 parts of hexafluoropropylene trimer.
In a preferred embodiment of the present application, the fluorocarbon compound has the following general structural formula: r is R i -(C(R f )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -R s Wherein R is f Selected from H, -F, -CF 3 or-CF 2 CF 3 A group; r is R i Selected from H, -F, -CF 3 、-CF 2 CF 3 、-CF 3 O or-CF 2 CF 3 An O group; r is R s Selected from-F, -CF 3 、-CF 2 CF 3 or-CF (CF) 3 )CF 3 A group; x is 1 or 2; n is an integer of 3-20, m is an integer of 2-15Y is an integer between 0 and 2.
In a preferred embodiment of the present application, the fluorocarbon is at least one of the following: h- (C (H) F (CF) 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，H-(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，H-(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，H-(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，F-(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，F-(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，F-(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，F-(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，CF 3 -(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，CF 3 -(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，CF 3 -(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，CF 3 -(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，CF 3 CF 2 -(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，CF 3 CF 2 -(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，CF 3 CF 2 -(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，CF 3 CF 2 -(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，CF 3 O-(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，CF 3 O-(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，CF 3 O-(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，CF 3 O-(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，CF 3 CF 2 O-(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，CF 3 CF 2 O-(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，CF 3 CF 2 O-(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，CF 3 CF 2 O-(C(H)F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，H-(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，H-(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，H-(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，H-(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，F-(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，F-(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，F-(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，F-(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，CF 3 -(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，CF 3 -(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，CF 3 -(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，CF 3 -(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，CF 3 CF 2 -(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，CF 3 CF 2 -(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，CF 3 CF 2 -(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，CF 3 CF 2 -(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，CF 3 O-(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，CF 3 O-(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，CF 3 O-(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，CF 3 O-(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，CF 3 CF 2 O-(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，CF 3 CF 2 O-(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，CF 3 CF 2 O-(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，CF 3 CF 2 O-(CF 2 (CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，H-(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，H-(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，H-(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，H-(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，F-(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，F-(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，F-(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，F-(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，CF 3 -(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，CF 3 -(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，CF 3 -(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，CF 3 -(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，CF 3 CF 2 -(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，CF 3 CF 2 -(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，CF 3 CF 2 -(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，CF 3 CF 2 -(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，CF 3 O-(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，CF 3 O-(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，CF 3 O-(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，CF 3 O-(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，CF 3 CF 2 O-(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，CF 3 CF 2 O-(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，CF 3 CF 2 O-(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，CF 3 CF 2 O-(C(CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，H-(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，H-(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，H-(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，H-(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，F-(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，F-(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，F-(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，F-(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，CF 3 -(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，CF 3 -(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，CF 3 -(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，CF 3 -(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，CF 3 CF 2 -(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，CF 3 CF 2 -(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，CF 3 CF 2 -(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，CF 3 CF 2 -(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，CF 3 O-(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，CF 3 O-(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，CF 3 O-(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，CF 3 O-(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 ，CF 3 CF 2 O-(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -F，CF 3 CF 2 O-(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 3 ，CF 3 CF 2 O-(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF 2 CF 3 ，CF 3 CF 2 O-(C(CF 2 CF 3 )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -CF(CF 3 )CF 3 . In these fluorocarbons, x is 1 or 2; n is an integer between 3 and 20, m is an integer between 2 and 15, and y is an integer between 0 and 2.
In a preferred embodiment of the present application, the above trifluoropropyl methyl silicone oil has a molecular weight of 500-2000.
In a preferred embodiment of the present application, the above-described flow promoter is a fluorine modified silane. Preferably, the fluorine modified silane is prepared by the following method: according to parts by weight, 5-12 parts of tetramethyl tetravinyl cyclotetrasiloxane is added into 40-60 parts of dimethylbenzene, dispersed and stirred, 3-8 parts of perfluorohexyl ethyl methacrylate, 0.5-1.2 parts of butylene glycol and 0.1-1 part of decenal are added, the temperature is raised to 60-75 ℃, 0.001-0.01 part of benzoyl peroxide and 0.001-0.005 part of dodecyl mercaptan are added, nitrogen protection reaction is carried out for 4-8 hours, then reduced pressure distillation is carried out at 140 ℃ for 0.5-2 hours, and a flow promoter is obtained, wherein the specific reaction formula is shown in the specification (1), and in the reaction, when the ratio of reaction raw materials and the reaction conditions are different, the types, the quantity and the position distribution of three chain structures of the perfluorohexyl ethyl methacrylate, the butylene glycol and the decenal connected to the tetramethyl tetravinyl cyclotetrasiloxane can be different.
In a preferred embodiment of the present application, the above composition is used for a cooling medium or a heat transfer medium.
In a preferred embodiment of the present application, the above composition is present in the cooling medium or heat transfer medium in a weight percentage of at least 20%.
The embodiment of the application also provides a silicon-containing liquid coolant which comprises the following components in parts by weight:
60-85 parts of fluorocarbon;
5-15 parts of trifluoropropyl methyl silicone oil;
0.5-2.8 parts of flow promoter;
2-10 parts of hexafluoropropylene trimer.
In a preferred embodiment of the present application, the fluorocarbon compound has the following general structural formula: r is R i -(C(R f )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -R s Wherein R is f Selected from H, -F, -CF 3 or-CF 2 CF 3 A group; r is R i Selected from H, -F, -CF 3 、-CF 2 CF 3 、-CF 3 O or-CF 2 CF 3 An O group; r is R s Selected from-F, -CF 3 、-CF 2 CF 3 or-CF (CF) 3 )CF 3 A group; x is 1 or 2; n is an integer between 3 and 20, m is an integer between 2 and 15, and y is an integer between 0 and 2.
In a preferred embodiment of the present application, the above trifluoropropyl methyl silicone oil has a molecular weight of 500-2000.
In a preferred embodiment of the present application, the above-described flow promoter is a fluorine modified silane, the preparation method of which is described above.
The embodiment of the application also provides a preparation method of the silicon-containing liquid coolant, which comprises the following steps: and physically mixing the fluorocarbon, the trifluoropropyl methyl silicone oil, the flow promoter and the hexafluoropropylene trimer in a liquid phase state according to corresponding proportions to obtain the silicon-containing liquid refrigerant.
The composition or the liquid coolant provided by the embodiment of the application can be used in an electronic device cooling system. The silicon-containing liquid refrigerant provided by the embodiment of the application has good material compatibility, does not cause swelling corrosion to chips and circuits in equipment even in long-time contact, and can be applied to various sensitive materials including but not limited to aluminum, PMMA, butyl rubber, copper, polyethylene, natural rubber, carbon steel, polypropylene, nitrile rubber, 302 stainless steel, polycarbonate, ethylene propylene diene monomer rubber, brass, polyester, molybdenum, epoxy resin, tantalum, PET, tungsten, phenolic resin, copper alloy C172, ABS, magnesium alloy AZ32B and the like.
The embodiment of the application also provides an immersion cooling system, which comprises:
a totally enclosed or not totally enclosed housing having an interior space;
a heat generating component disposed within the interior space;
and a cooling medium liquid provided in the internal space such that the heat generating component is in contact with the cooling medium liquid;
wherein the cooling medium comprises the above composition or the above liquid coolant.
In some embodiments of the present application, the composition or liquid coolant provided herein is present in the cooling medium at a level of at least 20% by weight, such as a cooling medium comprising at least 20% by weight, at least 35% by weight, at least 45% by weight, at least 65% by weight, at least 85% by weight, or 100% by weight of the composition or liquid coolant. In addition to the above-described liquid cooling agents, the cooling medium may also comprise up to 75 weight percent, based on the total weight of the cooling medium, of one or more of the following components: ethers, alkanes, perfluorinated olefins, halogenated olefins, perfluorinated hydrocarbons, perfluorinated tertiary amines, perfluorinated ethers, cycloalkanes, esters, perfluorinated ketones, ethylene oxides, aromatics, siloxanes, hydrochlorocarbons, hydrochlorofluorocarbons, hydrofluorocarbons, hydrofluoroolefins, hydrochloroalkenes, hydrochlorofluoroolefins, hydrofluoroethers, or mixtures thereof; or an alkane, perfluoroolefin, halogenated olefin, perfluorohydrocarbon, perfluorinated tertiary amine, perfluorinated ether, cycloalkane, perfluorinated ketone, aromatic compound, siloxane, hydrochlorofluorocarbon, hydrofluorocarbon, hydrofluoroolefin, hydrochlorofluoroolefin, hydrofluoroether or mixtures thereof based on the total weight of the working fluid. Such additional components may be selected to alter or enhance the characteristics of the composition for a particular use.
In some embodiments of the present application, the heat-generating component is partially or fully immersed in a cooling medium to allow heat exchange between the electronic device and the cooling medium. The heat generating component may include one or more electronic devices. The electronic device may comprise a computer server; data centers, particularly those operating at frequencies greater than 3GHz, may also be included. The data center may include, among other things, centrally managed computing resources and associated equipment or portions of the support system, as well as modular components that provide the data center along with other modules. The electronic device may further comprise one or more of a microprocessor, a semiconductor wafer for manufacturing semiconductor devices, a power control semiconductor, an electrochemical cell, a distribution switch gear, a power transformer, a circuit board, a multi-chip module, a packaged or unpackaged semiconductor device, a fuel cell, or a laser.
In some embodiments of the present application, the above-described immersion cooling system is a single-phase immersion cooling system. The submerged cooling system, when operated with single-phase submerged cooling, may also include a pump and a heat exchanger, the pump, when operated, moves cooling medium to and from the heat generating components and the heat exchanger, and the heat exchanger operates to cool the medium. The heat exchanger may be disposed within the housing or outside the housing.
Embodiments also provide a method for cooling a heat-generating component, comprising immersing the heat-generating component partially or entirely in a cooling medium comprising the above composition or a liquid coolant, so as to exchange heat between an electronic device and the cooling medium.
In order to better understand the above technical solutions, the following detailed description will be given with reference to the accompanying drawings and specific embodiments, but not limiting the present application.
Examples
The components in the composition ratios shown in table 1 were physically mixed in a liquid phase state to prepare a silicon-containing liquid-cooling agent, and physical and chemical properties of the liquid-cooling agent were measured to obtain the test results shown in table 2.
TABLE 1 composition structure and ratio of liquid cooling agent
The flow promoter of example 1 above was prepared by the following method: adding 8 parts of tetramethyl tetravinyl cyclotetrasiloxane into 50g of dimethylbenzene, dispersing and stirring, then adding 5g of perfluorohexyl ethyl methacrylate, 0.5g of butylene glycol, 0.5g of decenal, heating to 70 ℃, adding 0.01g of benzoyl peroxide and 0.005g of dodecyl mercaptan, carrying out nitrogen protection reaction for 4 hours, and then carrying out reduced pressure distillation at 140 ℃ for 2 hours to obtain a flow promoter;
the flow promoter of example 2 above was prepared by the following method: adding 5g of tetramethyl tetravinyl cyclotetrasiloxane into 40g of dimethylbenzene, dispersing and stirring, then adding 3g of perfluorohexyl ethyl methacrylate, 1.2g of butylene glycol, 0.1g of decenal, heating to 75 ℃, adding 0.005g of benzoyl peroxide and 0.001g of dodecyl mercaptan, carrying out nitrogen protection reaction for 8 hours, and then carrying out reduced pressure distillation at 140 ℃ for 0.5 hour to obtain a flow promoter;
the flow promoter of example 3 above was prepared by the following method: to 60g of xylene, 12g of tetramethyl tetravinyl cyclotetrasiloxane was added, followed by dispersion stirring, then 8g of perfluorohexyl ethyl methacrylate, 0.8g of butenediol, 1g of decenal, heating to 60 ℃, adding 0.01g of benzoyl peroxide and 0.003g of dodecyl mercaptan, carrying out nitrogen protection reaction for 6 hours, and then carrying out reduced pressure distillation at 140 ℃ for 1 hour to obtain a flow accelerator.
TABLE 2 basic physicochemical Property test results of liquid refrigerant
As can be seen from the detection data in Table 2, the silicon-containing liquid coolant provided in the embodiment of the application has the characteristics of low viscosity, low dielectric constant, high specific heat capacity and high heat conductivity, is nontoxic and nonflammable, and has enough safety performance. Wherein the silicon-containing liquid refrigerant has a thermal conductivity of 4 times or more than that of the commercially available liquid refrigerants FC40 (0.067W/mK) and Novec series (0.065W/mK), and the specific heat capacities of these silicon-containing liquid refrigerants are 1160J/(kg. DEG C) or more, thereby providing more effective heat transfer while the viscosity of the silicon-containing liquid refrigerant can be as low as 3.45mm 2 And/s, has good fluidity, and can provide more effective cooling effect when used in a cooling system of a heat-generating component.
Compatibility test 1:
the compatibility detection is carried out on the liquid coolant and the electronic device, the adopted electronic device detection sample is shown in table 2, and the adopted detection method is as follows:
(1) High boiling point liquid coolant detection treatment
Weighing 5g of material sample in a 50mL beaker, adding 50g of high-boiling liquid refrigerant, placing in an oven at 80 ℃ for soaking for 96 hours, taking out the material sample, collecting the liquid refrigerant, cleaning the sample with the liquid refrigerant for no more than 30s, then sucking the residual liquid refrigerant on the sample with filter paper, standing for 30min at room temperature, and then carrying out weight, volume and hardness changes and infrared test.
(2) Detection treatment of low boiling point liquid coolant
5g of the material sample is weighed into a Soxhlet extraction tube (if the sample is required to be filled into a filter paper barrel), and 100mL of low-boiling liquid refrigerant is weighed into a Soxhlet extraction bottle (zeolite or rotor is added into the extraction bottle). The Soxhlet extraction device is installed, the cooling water is turned on, the power supply of the oil bath pot is turned on, and the heating temperature (higher than the boiling point of polyether) is set. And heating and refluxing for 72h. And taking out the material sample, collecting the liquid coolant, sucking the residual liquid coolant on the sample by using filter paper, standing at room temperature for 30min, and then carrying out weight, volume, hardness change and infrared test.
(3) Detection class
a. Appearance: the appearance of the sample and the appearance before and after immersion in the liquid coolant were observed and recorded.
b. Mass change:
the mass in air before and after immersing the sample was measured as specified in GB/T1690, and the mass change percentage (. DELTA.W) was calculated:
wherein: Δw—percent change in weight of material sample,%;
W 1 -weight of material sample in air before soaking, g;
W 3 -weight of material sample in air after soaking, g.
c. Volume change:
the mass in air and distilled water before and after soaking of the sample were measured, respectively, as specified in GB/T1690, and the percent change in volume (. DELTA.V) was calculated:
wherein: deltaV-percent sample volume change,%;
W 1 -weight of sample in air before soaking, g;
W 2 -weight of sample in water before soaking, g;
W 3 -weight of the sample in air after soaking, g;
W 4 -weight of the sample in water after soaking, g;
d. hardness variation
The hardness of the sample before and after soaking was measured as specified in GB/T6031 to obtain a hardness change Δh=h 1 -H 0 Wherein H is 1 For hardness before soaking, H 0 Is the hardness after soaking.
e. Liquid cooling agent infrared
Coating the sample on potassium bromide window, and placing in infrared spectrometer at 4000-400 cm -1 Infrared scanning measurement is performed in the wave number range.
TABLE 3 compatibility test results of the silicon-containing liquid refrigerant with electronic devices
In the detection method, as can be seen from a comparison of the physical graphs of the electronic device before and after being soaked by the silicon-containing liquid coolant, the liquid coolant is still in a clear state, swelling corrosion of the electronic device does not occur, and the volume and mass change of the electronic device sample before and after being soaked are very small as can be seen from the detection data of the table 4. As can be seen from the comparison of infrared spectra before and after the corresponding liquid cooling agent is used for soaking the electronic device, the infrared spectrum overlap ratio is higher, no obvious change is seen, and the composition components of the liquid cooling agent are basically unchanged, so that the silicon-containing liquid cooling agent provided by the application has very good material compatibility with the electronic device, does not cause swelling corrosion on chips and circuits in the device and does not cause short circuit hazard to the electronic device.
Compatibility test 2:
the computer host is placed in a liquid cooling device, a cooling medium is filled in the liquid cooling device, the computer host is completely immersed in the cooling medium, and the computer host is externally connected with a display. The liquid cooling device is connected with a pump, and when the pump operates, the cooling medium circulates through the pump and exchanges heat with a heat exchanger outside the liquid cooling device, as shown in fig. 3. The silicon-containing liquid cooling agent is adopted as the cooling medium of the liquid cooling device, so that the computer can stably run for 24 hours under the condition of full-load running of the CPU, the temperature of the CPU is detected through a CPU-Z program, and the body is provided with a digital display thermometer to display the temperature of the cooling medium.
By contrast, the computer host only uses a common fan to exchange heat for the CPU, runs for 24 hours under the condition of full-load running of the CPU, and detects the temperature of the CPU through a CPU-Z program.
The test data are shown in Table 4 below, from which it can be seen that the CPU cooling effect is higher than that of a conventional fan heat exchange using a silicon-containing liquid coolant as the cooling medium.
After the silicon-containing liquid cooling agent is used as a cooling medium to enable a computer to continuously and stably run for 1 month, the performance of the computer is still stable, the cooling medium does not damage parts such as a main board, a CPU (Central processing Unit), a GPU (graphics processing Unit) and the like, and the silicon-containing liquid cooling agent in a case is sampled for spectral analysis, so that infrared spectrograms before, after and after the silicon-containing liquid cooling agent shown in fig. 4 is used are obtained, the composition components of the silicon-containing liquid cooling agent are not basically changed, and the fact that the liquid cooling agent does not cause swelling corrosion to all accessories of a computer host is shown, so that the silicon-containing liquid cooling agent has very good material compatibility.
Table 4 cpu temperature test data
Finally, it is noted that the above embodiments are only for illustrating the technical solution of the present application and not for limiting the same, and although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present application may be modified or substituted without departing from the spirit and scope of the technical solution of the present application, and all such modifications are intended to be encompassed within the scope of the claims of the present application.
Claims (12)
1. The composition is characterized by comprising the following components in parts by weight:
60-85 parts of fluorocarbon;
5-15 parts of trifluoropropyl methyl silicone oil;
0.5-2.8 parts of flow promoter;
2-10 parts of hexafluoropropylene trimer;
the fluorocarbon compound has the following structural general formula: r is R i -(C(R f )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -R s Wherein R is f Selected from H, -F, -CF 3 or-CF 2 CF 3 A group; r is R i Selected from H, -F, -CF 3 、-CF 2 CF 3 、-CF 3 O or-CF 2 CF 3 An O group; r is R s Selected from-F, -CF 3 、-CF 2 CF 3 or-CF (CF) 3 )CF 3 A group; x is 1 or 2; n is an integer between 3 and 20, m is an integer between 2 and 15, and y is an integer between 0 and 2;
the flow promoter is fluorine modified silane, and is prepared by the following method: according to weight parts, adding 5-12 parts of tetramethyl tetravinyl cyclotetrasiloxane into 40-60 parts of dimethylbenzene, dispersing and stirring, then adding 3-8 parts of perfluorohexyl ethyl methacrylate, 0.5-1.2 parts of butylene glycol and 0.1-1 part of decenal, heating to 60-75 ℃, adding 0.001-0.01 part of benzoyl peroxide and 0.001-0.005 part of dodecyl mercaptan, carrying out nitrogen protection reaction for 4-8 hours, and then carrying out reduced pressure distillation at 140 ℃ for 0.5-2 hours to obtain the flow promoter.
2. The composition according to claim 1, wherein the trifluoropropyl methyl silicone oil has a molecular weight of 500-2000.
3. The composition of claim 1, wherein the composition is used in a cooling medium or a heat transfer medium.
4. A composition according to claim 3, wherein the composition is present in the cooling medium or heat transfer medium in an amount of at least 20% by weight.
5. The silicon-containing liquid coolant is characterized by comprising the following components in parts by weight:
60-85 parts of fluorocarbon;
5-15 parts of trifluoropropyl methyl silicone oil;
0.5-2.8 parts of flow promoter;
2-10 parts of hexafluoropropylene trimer;
the fluorocarbon compound has the following structural general formula: r is R i -(C(R f )F(CF 2 ) x O) n -(CF 2 O) m -(CF 2 ) y -R s Wherein R is f Selected from H, -F, -CF 3 or-CF 2 CF 3 A group; r is R i Selected from H, -F, -CF 3 、-CF 2 CF 3 、-CF 3 O or-CF 2 CF 3 An O group; r is R s Selected from-F, -CF 3 、-CF 2 CF 3 or-CF (CF) 3 )CF 3 A group; x is 1 or 2; n is an integer between 3 and 20, m is an integer between 2 and 15, and y is an integer between 0 and 2;
the flow promoter is fluorine modified silane, and is prepared by the following method: according to weight parts, adding 5-12 parts of tetramethyl tetravinyl cyclotetrasiloxane into 40-60 parts of dimethylbenzene, dispersing and stirring, then adding 3-8 parts of perfluorohexyl ethyl methacrylate, 0.5-1.2 parts of butylene glycol and 0.1-1 part of decenal, heating to 60-75 ℃, adding 0.001-0.01 part of benzoyl peroxide and 0.001-0.005 part of dodecyl mercaptan, carrying out nitrogen protection reaction for 4-8 hours, and then carrying out reduced pressure distillation at 140 ℃ for 0.5-2 hours to obtain the flow promoter.
6. The silicon-containing liquid refrigerant according to claim 5, wherein the trifluoropropyl methyl silicone oil has a molecular weight of 500-2000.
7. The method for producing a silicon-containing liquid coolant according to any one of claims 5 to 6, comprising:
and physically mixing fluorocarbon, trifluoropropyl methyl silicone oil, a flow promoter and hexafluoropropylene trimer in a liquid phase state according to corresponding proportion to obtain the liquid cooling agent.
8. An immersion cooling system, comprising:
a totally enclosed or not totally enclosed housing having an interior space;
a heat generating component disposed within the interior space;
and a cooling medium liquid provided in the internal space such that the heat generating component is in contact with the cooling medium liquid;
wherein the cooling medium comprises the composition of any one of claims 1-4 or the silicon-containing liquid coolant of any one of claims 5-6.
9. An immersion cooling system according to claim 8, wherein the composition or liquid coolant is present in the cooling medium in an amount of at least 20% by weight.
10. The immersion cooling system of claim 8, wherein the heat generating component comprises an electronic device.
11. An immersion cooling system according to claim 8, wherein the heat generating component is partially or fully immersed in the cooling medium.
12. The immersion cooling system of claim 8, wherein the immersion cooling system is a single phase immersion cooling system.
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