CN113789160B - Composition containing polyethylene glycol sulfur nitrogen hybridization modifier, application of composition to liquid coolant and immersed liquid cooling system - Google Patents
Composition containing polyethylene glycol sulfur nitrogen hybridization modifier, application of composition to liquid coolant and immersed liquid cooling system Download PDFInfo
- Publication number
- CN113789160B CN113789160B CN202111063181.9A CN202111063181A CN113789160B CN 113789160 B CN113789160 B CN 113789160B CN 202111063181 A CN202111063181 A CN 202111063181A CN 113789160 B CN113789160 B CN 113789160B
- Authority
- CN
- China
- Prior art keywords
- composition
- integer
- liquid
- cooling
- polyethylene glycol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/10—Liquid materials
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
Abstract
The application discloses a composition containing polyethylene glycol sulfur nitrogen hybrid modifier, application of the composition to a liquid coolant and an immersed liquid cooling system. The composition comprises perfluoropolyether, polyethylene glycol thiazide modification, 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether and tetrafluoropropanol. Wherein the perfluoropolyether has the structure R a ‑(C(R 1 )FCF 2 O) n ‑(CF 2 O) m ‑(CF 2 ) i ‑R b Wherein R is a Selected from F, CF 3 、CF 2 CF 3 、CF 2 CF 2 CF 3 Or CF (CF) 3 )CF 3 A group R b Selected from F, CF 3 、CF 2 CF 3 、CF 2 CF 2 CF 3 Or CF (CF) 3 )CF 3 A group R 1 Selected from F, CF 3 、CF 2 CF 3 、CF 2 CF 2 CF 3 Or CF (CF) 3 )CF 3 M is an integer between 2 and 20, n is an integer between 3 and 30, m is less than or equal to n, and i is an integer between 0 and 2. The composition can be used as a liquid coolant for electronic equipment, and has the advantages of good compatibility with the electronic equipment, proper viscosity, high specific heat capacity and high heat conductivity coefficient.
Description
Technical Field
The application relates to the technical field of liquid cooling media, in particular to a composition containing polyethylene glycol sulfur nitrogen hybrid modification body, application of the composition to a liquid cooling agent and an immersed liquid cooling system.
Background
Along with the progress of technology, the electronic industry is rapidly developed, and electronic equipment such as a high-performance computer host, a data center server and the like can generate a large amount of heat in the operation process, so that the operation efficiency is reduced, and how to timely transfer and convert the heat is one of factors restricting the development of the industry.
The heat dissipation devices currently used are of two types, and air-cooled heat dissipation systems such as cooling systems based on fans are commonly adopted in the industry, but because a large amount of power is required, the power cost required for driving the systems is exponentially increased along with the increase of the density of the servers, the energy efficiency is relatively low, and the energy consumption is high. The traditional air cooling mode is carried out in an indirect contact cooling mode, and has the defects of complex heat transfer process, large total heat resistance, low heat exchange efficiency, large temperature difference between high-temperature heat sources and low-temperature heat sources in the heat exchange process, need of guiding the heat exchange process by using low-temperature outdoor heat sources and the like. In large data centers, air cooling alone is insufficient to meet the heat dissipation requirements of high heat flux servers.
Another type is to use a liquid-cooled heat sink system. Because the specific heat capacity of the liquid is far higher than that of air, the heat which can be transmitted in unit volume is far higher than that of air, and the heat dissipation speed is also far higher than that of air, a large amount of heat can be absorbed, the temperature can not be obviously changed, the temperature of a device arranged in a liquid cooling system can be well controlled, and the temperature inside the device can not be instantaneously and greatly changed due to any sudden operation. The cooling efficiency of the liquid cooling is far higher than that of an air cooling heat dissipation mode, and meanwhile, the noise of the liquid cooling can be well controlled. Therefore, compared with the traditional air-cooled heat dissipation system, the liquid-cooled heat dissipation system not only has better energy saving effect, refrigerating capacity and smaller noise, but also can reduce the size of the server by improving the power density.
The liquid cooling heat dissipation system comprises indirect contact liquid cooling and direct immersion liquid cooling. The liquid cooling agent (also referred to herein as cooling liquid) in indirect contact liquid cooling is not in direct contact with the heat generating device, such as the super computer surface-mounted evaporative cooling device disclosed in CN101751096B, and the liquid cooling plate adopted in CN102711414a is in contact with the heat generating device, so as to indirectly take away heat. The two schemes can only cool and process heat emitted by heating devices with regular heat dissipation surfaces such as a CPU (Central processing Unit), a GPU (graphics processing Unit) and the like, and cannot be used for other heating devices on a circuit board such as a memory, a resistor and the like, so that the two schemes are often combined with air cooling. In addition, the cooling liquid is not in direct contact with the heating device, and contact thermal resistance and conduction thermal resistance exist in the middle, so that the heat exchange efficiency is low. At the same heating device surface temperature, a lower coolant temperature is required than for direct liquid cooling.
Direct immersion liquid cooling is a new heat dissipation technology that has been of interest in industry in recent years. Direct immersion cooling is the complete immersion of an electronic device, such as a server, in a tank filled with a cooling fluid that directly carries away heat generated by the components of the server, such as chips, memory, etc. Immersion liquid cooling has significant advantages. Firstly, in immersed liquid cooling, the cooling liquid is in direct contact with heating equipment, so that the heat transfer coefficient is high, and the convection thermal resistance is low; secondly, the cooling liquid has higher heat conductivity and specific heat capacity, and the running temperature change rate is smaller; again, the mode does not need a fan, reduces energy consumption and noise, and has high refrigeration efficiency; finally, the cooling liquid has excellent insulating property, high flash point, no inflammability, no toxicity, no harm and no corrosion. Therefore, the liquid cooling technology is suitable for large-scale data centers, super computing, industrial and other computing fields and scientific research institutions with high heat flux density and green energy saving requirements, and particularly has obvious advantages for data centers with severe cold and high altitude areas, or data centers with special topography and limited space, high requirements for environmental noise, close offices and living places of people and need to be muted.
The direct immersion liquid cooling requires good compatibility between the cooling liquid and the device because the cooling liquid directly contacts with the electronic device, for example, swelling corrosion is not caused to chips, circuits and the like in the device, and short circuit danger is not caused to electronic equipment. Therefore, the high requirements are put on the performance of the liquid cooling agent, and the liquid cooling agent not only has the advantages of no toxicity, no harm, no corrosiveness, oxidation resistance, high flash point, incombustibility and good insulativity, but also considers a plurality of factors such as proper viscosity, high specific heat capacity, high heat flow density and the like in a balanced manner. The preparation of liquid-cooling agents meeting the above requirements has been a problem to be solved in the industry.
At present, some direct immersion liquid cooling systems have been developed, and CN108351674a provides an immersion cooling system using 3M fluorinated liquids, which are fluorine-based inert liquids composed of perfluorinated compounds, mainly perfluorinated amines. CN112135811a discloses a general formula cfy=cxn (R f )CF 2 R f ' perfluorinated amino olefin compounds are useful for direct immersion liquid cooling of electronic devices. The main component of the cooling liquid disclosed in CN111475002A is a perfluorinated amine compound which is one or a mixture of more than two of perfluorinated triethylamine, perfluorinated tripropylamine, perfluorinated tributylamine, perfluorinated tripentylamine and perfluorinated N-methylmorpholine, and can be used for a cooling system of electronic equipment. However, the existing cooling liquid containing perfluorinated amine compounds and perfluorinated amino olefin compounds has poor compatibility with electronic equipment materials, and has a large room for improvement, and the cooling liquid cannot simultaneously satisfy factors such as high specific heat capacity, proper viscosity, high thermal conductivity and the like which restrict the liquid cooling effect.
Therefore, the liquid coolant in the prior art still has much room for improvement, and the performance of the liquid coolant for electronic devices needs to be further improved.
Disclosure of Invention
In order to solve the defects of the prior liquid cooling agent, the invention solves the problem of poor compatibility of liquid cooling agent components in the prior art by providing the composition containing the polyethylene glycol sulfur nitrogen hybridization modified body, the application of the composition to the liquid cooling agent and an immersed liquid cooling system, and protects electronic equipment from being damaged.
In order to achieve the above purpose, the present application provides the following technical solutions:
a composition comprising the following components:
wherein the perfluoropolyether has the formula: r is R a -(C(R 1 )FCF 2 O) n -(CF 2 O) m -(CF 2 ) i -R b ，
Wherein R is a Selected from F, CF 3 、CF 2 CF 3 、CF 2 CF 2 CF 3 Or CF (CF) 3 )CF 3 A group R b Selected from F, CF 3 、CF 2 CF 3 、CF 2 CF 2 CF 3 Or CF (CF) 3 )CF 3 A group R 1 Selected from F, CF 3 、CF 2 CF 3 、CF 2 CF 2 CF 3 Or CF (CF) 3 )CF 3 A group, m is an integer between 2 and 20, n is an integer between 3 and 30, m is less than or equal to n, and i is an integer between 0 and 2;
the polyethylene glycol sulfur nitrogen hybridization modifier has the following general formula:
wherein p is an integer between 10 and 100, and Rh is independently selected from Cl, br or I.
Preferably, the method comprises, among other things,
preferably, m is an integer between 2 and 15, n is an integer between 3 and 20, and p is an integer between 10 and 50 in the polyethylene glycol thiazide-modified version.
More preferably, m is an integer between 2 and 10 and n is an integer between 3 and 20.
Preferably, the perfluoropolyethers of the present application are selected from one or more of the following compounds:
compound 1: r is R a -(C(R 1 )FCF 2 O) n -(CF 2 O) m -(CF 2 ) i -R b ，R a ＝CF(CF 3 )CF 3 ，R b ＝CF(CF 3 )CF 3 ，R 1 ＝CF 2 CF 3 ，m＝15，n＝20，i＝2；
Compound 2: r is R a -(C(R 1 )FCF 2 O) n -(CF 2 O) m -(CF 2 ) i -R b ，R a ＝F，R b ＝F，R 1 ＝F，m＝2，n＝3，i＝0；
Compound 3: r is R a -(C(R 1 )FCF 2 O) n -(CF 2 O) m -(CF 2 ) i -R b ，R a ＝CF 3 ，R b ＝CF 3 ，R 1 ＝CF 3 ，m＝10，n＝10，i＝1。
The application also provides the application of the composition as a liquid coolant in a cooling system.
Preferably, the composition is used as a liquid coolant in an electronic device cooling system.
Preferably, the electronic device comprises one or more of a computer server, a microprocessor, a data center, a power control semiconductor, a semiconductor wafer for manufacturing semiconductor devices, an electrochemical cell, a distribution switch gear, a power transformer, a circuit board, a multi-chip module, a packaged or unpackaged semiconductor device, a fuel cell, or a laser.
Preferably, the electronic device is partially or wholly immersed in a cooling medium comprising the composition, such that heat exchange is performed between the electronic device and the cooling medium.
Preferably, the composition is present in the cooling medium in a weight percentage of at least 25%.
Preferably, the electronics cooling system is a single phase immersion cooling system.
Further, the present application also provides an immersion cooling system comprising:
a totally enclosed or not totally enclosed housing having an interior space;
a heat generating component disposed within the interior space;
and a cooling medium liquid provided in the internal space such that the heat generating component is in contact with the cooling medium liquid;
wherein the cooling medium comprises the composition described above.
Preferably, the electronics cooling system is a single phase immersion cooling system.
For a direct immersion type liquid cooling system, because the cooling liquid is in direct contact with an electronic device, the cooling liquid is required to have the characteristic of good fluidity based on the simplicity of operation and convenience in improving the circulation flow, namely, the cooling liquid has lower viscosity, and the heat dissipation capacity of the whole liquid cooling system is effectively improved.
In order to improve the cooling effect of the cooling liquid, the cooling liquid with large specific heat capacity can absorb more heat, so that the consumption of the cooling liquid is reduced, and the size of the device can be reduced. Therefore, it is necessary to find a liquid refrigerant component having a high specific heat capacity, and in addition, by using different components for proportioning, further improvement of the specific heat capacity of the liquid refrigerant is a good way.
In addition, as a cooling liquid, a high heat conductivity coefficient also represents a better heat conduction effect, and the cooling efficiency is also higher. Therefore, preparing a cooling liquid with a high heat conductivity is one of the problems to be solved in the field of liquid cooling agents.
However, it is not easy to find a suitable liquid-cooling agent component and to obtain a combination of a suitable viscosity, a high specific heat capacity and a high thermal conductivity, and a route for selection is not given in the prior art.
The applicant has found that, when studying the components of the existing liquid coolant, the compatibility of the existing liquid coolant containing a perfluorinated amine compound or a perfluorinated amino olefin compound with electronic equipment materials is not good. The applicant has also made a series of structural improvements on the above compounds, but has not achieved satisfactory results. Through a great deal of researches, the applicant finds that the perfluoropolyether (such as the compounds 1-3) with the polyether structure has the characteristics of no color, no toxicity, incombustibility, high specific heat capacity and high heat conductivity, has enough safety performance, and has better electrical insulation performance, and the volume resistivity is far higher than the design requirement on cooling liquid in the design specification of single-phase immersed direct liquid cooling data center. The heat conductivity of the perfluoropolyether compound is 5 times or more that of a commercially available liquid coolant, and the specific heat capacity of the perfluoropolyether compound is 1100J/(kg. DEG C) or more, so that more efficient heat transfer can be provided, and more efficient cooling effect can be provided when the perfluoropolyether compound is used for a cooling system of a heat generating component. In addition, the applicant carries out compatibility test on the perfluoropolyether compound and the electronic device, adopts the perfluoropolyether to soak the electronic sample such as a net wire and a side gasket of a valve plate, records the weight, the volume and the hardness of the electronic device sample before and after soaking and changes of an infrared spectrogram, and the test result shows that the liquid cooling agent after soaking is still in a clear state, the electronic device is not swelled and corroded, and the volume and the mass of the electronic device sample before and after soaking are very small. As can be seen from the comparison of infrared spectra before and after the electronic device is soaked by the corresponding liquid cooling agent, the superposition degree of the infrared spectra is higher, no obvious change is seen, and the component perfluoropolyether of the liquid cooling agent is basically unchanged, so that the perfluoropolyether provided by the application has very good material compatibility with the electronic device, does not cause swelling corrosion to chips and circuits in the device, and does not cause short circuit hazard to the electronic device.
In view of the problem that the cost is high when perfluoropolyether is singly used, the applicant hopes to find components compatible with the perfluoropolyether, further optimizes the performances such as viscosity, specific heat capacity, heat conduction constant and the like, and tries to use various compounds to be compatible with the perfluoropolyether so as to obtain the liquid refrigerant with more excellent performances.
As compatible components of the liquid cooling agent, physical and chemical properties such as viscosity, specific heat capacity, boiling point and the like among the components are considered, and performances such as proper viscosity, high specific heat capacity, high heat conduction constant and the like are also considered.
The applicant finds that through the research, the perfluoro polyether is matched with polyethylene glycol sulfur nitrogen hybrid modified body, 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether and tetrafluoropropanol to be used, so that the composition with non-toxic, harmless, nonflammable and insulating properties and good compatibility with electronic devices is obtained, and the composition has the advantages of being suitable in viscosity, high in specific heat capacity and high in heat conductivity coefficient, can be used as an immersed liquid cooling agent, and is particularly suitable for electronic equipment.
The polyethylene glycol sulfur-nitrogen hybrid modifier can reduce the viscosity of the composition, increase the specific heat capacity, and particularly improve the heat conductivity coefficient of the composition, so that the liquid cooling effect of the composition is improved.
The 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether used in the application is usually used as a fluoroether additive in electrolyte of a lithium electronic battery, and can be used as an additive for inhibiting positive electrode surface activity (CN 104900916A); can also be used as electrolyte solvent for improving the service life of the battery (CN 111066188A). By introducing 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether, the viscosity of the composition can be reduced, the specific heat capacity can be increased, and the heat conductivity of the composition can be improved.
The 2, 3-tetrafluoropropene (HFO-1234 yf) used in the application is an excellent environment-friendly refrigerant, and has the advantages of zero Ozone Depletion Potential (ODP) and lower greenhouse effect potential (GWP 4). The use of 2, 3-tetrafluoropropene can reduce the viscosity of the composition, increase the specific heat capacity of the composition, and increase the thermal conductivity of the composition.
The composition has good material compatibility, does not cause swelling corrosion to chips and circuits in equipment after long-time contact, and can be applied to various sensitive materials including but not limited to aluminum, PMMA, butyl rubber, copper, polyethylene, natural rubber, carbon steel, polypropylene, nitrile rubber, 302 stainless steel, polycarbonate, ethylene propylene diene monomer rubber, brass, polyester, molybdenum, epoxy resin, tantalum, PET, tungsten, phenolic resin, copper alloy C172, ABS, magnesium alloy AZ32B and the like.
When the composition of the present application is used in a cooling system for electronic devices, an immersed cooling system is employed. Specifically, the electronic device is partially or entirely immersed in a cooling medium comprising the above composition, so that heat exchange is performed between the electronic device and the cooling medium.
The above-described compositions provided herein are present in the cooling medium at a weight percent of at least 25%, such as a cooling medium comprising at least 25%, at least 35%, at least 45%, at least 65%, at least 85%, or 100% of the above-described composition. In addition to the above-described liquid cooling agents, the cooling medium may also comprise up to 75 weight percent, based on the total weight of the cooling medium, of one or more of the following components: ethers, alkanes, perfluorinated olefins, halogenated olefins, perfluorinated hydrocarbons, perfluorinated tertiary amines, perfluorinated ethers, cycloalkanes, esters, perfluorinated ketones, ethylene oxides, aromatics, siloxanes, hydrochlorocarbons, hydrochlorofluorocarbons, hydrofluorocarbons, hydrofluoroolefins, hydrochloroalkenes, hydrochlorofluoroolefins, hydrofluoroethers, or mixtures thereof; or an alkane, perfluoroolefin, halogenated olefin, perfluorohydrocarbon, perfluorinated tertiary amine, perfluorinated ether, cycloalkane, perfluorinated ketone, aromatic compound, siloxane, hydrochlorofluorocarbon, hydrofluorocarbon, hydrofluoroolefin, hydrochlorofluoroolefin, hydrofluoroether or mixtures thereof based on the total weight of the working fluid. Such additional components may be selected to alter or enhance the characteristics of the composition for a particular use.
The technical scheme of the application has the following beneficial effects:
the composition has good compatibility with electronic equipment, has the characteristics of no toxicity, no harm, no corrosion, incombustibility, insulation and the like, and simultaneously has the characteristics of proper viscosity, high specific heat capacity and high heat conduction constant. When used as a liquid coolant for a cooling system of electronic equipment, the heat dissipation device has excellent heat dissipation function, good compatibility and stability, can protect the electronic equipment from being damaged, and has long service life.
Detailed Description
The present application is further described below in conjunction with specific embodiments to facilitate an understanding of the present application by those skilled in the art, and it should be understood that the embodiments are illustrative of the present application and are not intended to limit the scope of the present application.
As used herein, parts are parts by weight unless otherwise indicated.
Examples
Reagents used in the examples of this application are all commercially available. Among them, polyethylene glycol thiazide-modified product is a giant group technology center product (where p is 10 (example 1), 100 (example 2), 50 (example 3), rh is I (example 1), cl (example 2), br (example 3)).
| p | Rh | |
| Example 1 | 10 | I |
| Example 2 | 100 | Cl |
| Example 3 | 50 | Br |
Examples 1 to 6
The perfluoropolyether, polyethylene glycol thiazide modification, 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether and tetrafluoropropanol are weighed according to the weight ratio of the table 1, and the components are uniformly mixed. The obtained compositions were tested for toxicity, flammability, kinematic viscosity, specific heat capacity and thermal conductivity.
Wherein, the liquid crystal display device comprises a liquid crystal display device,
the perfluoropolyether used in example 1 was compound 1: r is R a -(C(R 1 )FCF 2 O) n -(CF 2 O) m -(CF 2 ) i -R b ，R a ＝CF(CF 3 )CF 3 ，R b ＝CF(CF 3 )CF 3 ，R 1 ＝CF 2 CF 3 ，m＝15，n＝20，i＝2。
The perfluoropolyether used in example 2 was compound 2: r is R a -(C(R 1 )FCF 2 O) n -(CF 2 O) m -(CF 2 ) i -R b ，R a ＝F，R b ＝F，R 1 ＝F，m＝2，n＝3，i＝0。
Example 3 is the perfluoropolyether used as compound 3: r is R a -(C(R 1 )FCF 2 O) n -(CF 2 O) m -(CF 2 ) i -R b ，R a ＝CF 3 ，R b ＝CF 3 ，R 1 ＝CF 3 ，m＝0，n＝0，i＝1。
Comparative examples 1 to 3 the same perfluoropolyether, compound 3, was used as in example 3, wherein comparative example 1 was not added to the polyethylene glycol thiazepine modifier, comparative example 2 was not added to the 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether, and comparative example 3 was not added to the tetrafluoropropanol.
The test results of examples 1-3 and comparative examples 1-3 are shown in Table 2.
The composition of Table 1 comprises the following components in parts by weight
Table 2 properties of the compositions
As can be seen from the test results in Table 2, the compositions of the present application are all liquid at room temperature, non-toxic and nonflammable. In addition, the compositions of examples 1-3 herein all have low kinematic viscosity, high specific heat capacity, and high thermal conductivity.
For comparative example 1, the kinematic viscosity increased from 30.50 to 33.55mm in comparison to example 3 without the addition of polyethylene glycol thiazate modifier to the composition 2 Specific heat capacity is 1.22.10 per second (25 ℃) 3 Reduced to 1.16 x 10 3 J kg -1 C -1 (25 ℃ C.) the thermal conductivity is reduced from 0.393 to 0.301W/mK (25 ℃ C.). Therefore, the viscosity of the composition becomes high, the specific heat capacity becomes small, and the thermal conductivity becomes small without adding polyethylene glycol thiazate modifier.
For comparative example 2, the kinematic viscosity increased from 30.50 to 44.11mm in comparison to example 3 without the addition of 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether to the composition 2 Specific heat capacity is 1.22.10 per second (25 ℃) 3 Reduced to 1.15 x 10 3 J kg -1 C -1 (25 ℃ C.) the thermal conductivity is reduced from 0.393 to 0.284W/mK (25 ℃ C.). From this, it was found that the viscosity of the composition was increased, the specific heat capacity was decreased, and the thermal conductivity was also decreased without adding 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether. The composition of comparative example 2 had a higher viscosity and a lower thermal conductivity than the composition of comparative example 1, relative to the composition without polyethylene glycol thiazate modification.
For comparative example 3, the kinematic viscosity increased from 30.50 to 45.18mm in comparison to example 3 without the addition of tetrafluoropropanol to the composition 2 Specific heat capacity is 1.22.10 per second (25 ℃) 3 Reduced to 1.15 x 10 3 J kg -1 C -1 (25 ℃ C.) the thermal conductivity is reduced from 0.393 to 0.277W/mK (25 ℃ C.). As can be seen, without adding tetrafluoropropanol, the viscosity of the composition became high,The specific heat capacity becomes smaller and the thermal conductivity becomes smaller. The compositions of comparative example 3 were higher in viscosity and lower in thermal conductivity than those of comparative examples 1 to 2.
From the above, it was found that when any one of polyethylene glycol thiazate modifier, 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether and tetrafluoropropanol was not added to the composition, the viscosity of the composition became large, the specific heat capacity became small, and the thermal conductivity became small. For the above three components, the specific heat capacity is reduced without adding them, and the reduction of the specific heat capacity is comparable. By comparison with example 3, the effect on the thermal conductivity is more pronounced without the addition of polyethylene glycol thiazate modifiers with respect to the effect of viscosity, specific heat capacity. And the 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether and tetrafluoropropanol are not added, so that the viscosity, the specific heat capacity and the heat conduction constant are all obviously affected.
Therefore, the liquid cooling agent with the characteristics of no toxicity, incombustibility, no corrosion, proper viscosity, high specific heat capacity and high heat conductivity coefficient is obtained by compatibility of the perfluoropolyether, the polyethylene glycol sulfur-nitrogen hybrid modified body, the 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether and the tetrafluoropropanol.
Finally, it is noted that the above embodiments are only for illustrating the technical solution of the present application and not for limiting the same, and although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present application may be modified or substituted without departing from the spirit and scope of the technical solution of the present application, and all such modifications are intended to be encompassed within the scope of the claims of the present application.
Claims (12)
1. A composition comprising the following components:
40-90 parts of perfluoropolyether
0.01-0.5 part of polyethylene glycol sulfur-nitrogen hybrid modifier
1-15 parts of 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether
Tetrafluoropropanol 1-15 parts
Wherein the perfluoropolyether has the formula: r is R a -(C(R 1 )FCF 2 O) n -(CF 2 O) m -(CF 2 ) i -R b ，
Wherein R is a Selected from F, CF 3 、CF 2 CF 3 、CF 2 CF 2 CF 3 Or CF (CF) 3 )CF 3 A group R b Selected from F, CF 3 、CF 2 CF 3 、CF 2 CF 2 CF 3 Or CF (CF) 3 )CF 3 A group R 1 Selected from F, CF 3 、CF 2 CF 3 、CF 2 CF 2 CF 3 Or CF (CF) 3 )CF 3 A group, m is an integer between 2 and 20, n is an integer between 3 and 30, m is less than or equal to n, and i is an integer between 0 and 2;
the polyethylene glycol sulfur nitrogen hybridization modifier has the following general formula:
wherein p is an integer between 10 and 100, and Rh is independently selected from Cl, br or I.
2. The composition of claim 1, wherein,
55-85 parts of perfluoropolyether
0.01-0.1 part of polyethylene glycol sulfur-nitrogen hybrid modifier
4-15 parts of 1H, 5H-octafluoropentyl-1, 2-tetrafluoroethyl ether
5-10 parts of tetrafluoropropanol.
3. The composition according to claim 1 or 2, wherein m is an integer between 2 and 15, n is an integer between 3 and 20, and p is an integer between 10 and 50.
4. The composition according to claim 1 or 2, wherein m is an integer between 2 and 10, n is an integer between 3 and 20, and p is an integer between 10 and 50.
5. The composition of claim 1 or 2, wherein the perfluoropolyether is selected from one or more of the following compounds:
compound 1: r is R a -(C(R 1 )FCF 2 O) n -(CF 2 O) m -(CF 2 ) i -R b ，R a ＝CF(CF 3 )CF 3 ，R b ＝CF(CF 3 )CF 3 ，R 1 ＝CF 2 CF 3 ，m＝15，n＝20，i＝2；
Compound 2: r is R a -(C(R 1 )FCF 2 O) n -(CF 2 O) m -(CF 2 ) i -R b ，R a ＝F，R b ＝F，R 1 ＝F，m＝2，n＝3，i＝0；
Compound 3: r is R a -(C(R 1 )FCF 2 O) n -(CF 2 O) m -(CF 2 ) i -R b ，R a ＝CF 3 ，R b ＝CF 3 ，R 1 ＝CF 3 ，m＝10，n＝10，i＝1。
6. Use of a composition according to any one of claims 1 to 5 as a liquid coolant in a cooling system.
7. The use according to claim 6, wherein the composition is used as a liquid coolant in an electronic device cooling system.
8. The use according to claim 7, wherein the electronic device comprises one or more of a computer server, a microprocessor, a data center, an electrochemical cell, a distribution switch gear, a power transformer, a circuit board, a multi-chip module, a packaged or unpackaged semiconductor device, or a laser.
9. The use according to claim 7, wherein the electronic device comprises one or more of a power control semiconductor, a semiconductor wafer for manufacturing a semiconductor device, a fuel cell.
10. Use according to claim 7, wherein the electronic device is partly or wholly immersed in a cooling medium comprising the composition, so that heat exchange takes place between the electronic device and the cooling medium.
11. Use according to claim 10, said composition being present in said cooling medium in a weight percentage of at least 25%.
12. An immersion cooling system comprising:
a totally enclosed or not totally enclosed housing having an interior space;
a heat generating component disposed within the interior space;
and a cooling medium liquid provided in the internal space such that the heat generating component is in contact with the cooling medium liquid;
wherein the cooling medium comprises the composition of any one of claims 1-5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111063181.9A CN113789160B (en) | 2021-09-10 | 2021-09-10 | Composition containing polyethylene glycol sulfur nitrogen hybridization modifier, application of composition to liquid coolant and immersed liquid cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111063181.9A CN113789160B (en) | 2021-09-10 | 2021-09-10 | Composition containing polyethylene glycol sulfur nitrogen hybridization modifier, application of composition to liquid coolant and immersed liquid cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113789160A CN113789160A (en) | 2021-12-14 |
| CN113789160B true CN113789160B (en) | 2023-07-04 |
Family
ID=79183145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111063181.9A Active CN113789160B (en) | 2021-09-10 | 2021-09-10 | Composition containing polyethylene glycol sulfur nitrogen hybridization modifier, application of composition to liquid coolant and immersed liquid cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113789160B (en) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5100569A (en) * | 1990-11-30 | 1992-03-31 | Allied-Signal Inc. | Polyoxyalkylene glycol refrigeration lubricants having pendant, non-terminal perfluoroalkyl groups |
| DE10258385A1 (en) * | 2002-12-12 | 2004-06-24 | Basf Ag | Azole derivatives are used in anti-freeze concentrates for improving the active life of 1,3-propanediol-based coolants for fuel cells especially used in vehicles |
| EP2044167A1 (en) * | 2006-07-12 | 2009-04-08 | Solvay Fluor GmbH | Method for heating and cooling using fluoroether compounds, compositions suitable therefore and their use |
| CN101751096B (en) * | 2009-12-25 | 2011-11-16 | 中国科学院电工研究所 | Evaporation-cooled device attached to surface of super computer |
| CN102190624B (en) * | 2010-03-10 | 2015-01-07 | 中国人民解放军63975部队 | Sulfur-containing/nitrogen-group-containing ionic liquid and preparation method thereof |
| CN102711414B (en) * | 2012-04-20 | 2015-07-08 | 华为技术有限公司 | Liquid cooling device |
| CN104900916A (en) * | 2015-06-26 | 2015-09-09 | 广州天赐高新材料股份有限公司 | Electrolyte solution for high-capacity lithium-ion battery, preparation method and lithium-ion battery |
| EP3379377A4 (en) * | 2015-11-16 | 2018-12-26 | Exascaler Inc. | Electronic device for liquid immersion cooling and cooling system using same |
| US11629133B2 (en) * | 2018-05-15 | 2023-04-18 | 3M Innovative Properties Company | Perfluoroaminoolefins and methods of making and using the same |
| CN111792985B (en) * | 2019-07-17 | 2022-10-14 | 泉州宇极新材料科技有限公司 | Fluorine-containing heat transfer fluid and preparation method and application thereof |
| CN111343837A (en) * | 2020-03-05 | 2020-06-26 | 浙江诺亚氟化工有限公司 | Immersed phase-change cooling medium and application thereof in cooling system of electronic equipment |
| CN111475002A (en) * | 2020-03-05 | 2020-07-31 | 浙江诺亚氟化工有限公司 | Cooling liquid and application thereof in cooling system of electronic equipment |
| CN112341319A (en) * | 2020-10-16 | 2021-02-09 | 浙江巨化技术中心有限公司 | Comprehensive utilization method of fluorine-containing vinyl ether byproduct in hydrofluoroether production process |
-
2021
- 2021-09-10 CN CN202111063181.9A patent/CN113789160B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN113789160A (en) | 2021-12-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2022267932A1 (en) | Composition, liquid cooling agent and applications thereof, and immersion cooling system | |
| CN113473801A (en) | Cold medium and system for immersing phase-change cooling electronic equipment | |
| CN111475002A (en) | Cooling liquid and application thereof in cooling system of electronic equipment | |
| CN113773812B (en) | Composition containing heterocyclic accelerator, application of composition to liquid coolant and immersed liquid cooling system | |
| CN113755140B (en) | Composition containing multi-branched hybridization accelerator, application of composition to liquid coolant and immersed liquid cooling system | |
| WO2020127771A1 (en) | Heat exchange method using fluorinated compounds having a low gwp | |
| CN111343837A (en) | Immersed phase-change cooling medium and application thereof in cooling system of electronic equipment | |
| CN113717699B (en) | Composition, silicon-containing liquid refrigerant, preparation method of silicon-containing liquid refrigerant and immersed cooling system | |
| CN113789160B (en) | Composition containing polyethylene glycol sulfur nitrogen hybridization modifier, application of composition to liquid coolant and immersed liquid cooling system | |
| CN113604202B (en) | Composition, immersed liquid coolant, application of composition and immersed liquid cooling system | |
| CN113717698B (en) | Composition, fluoroolefin oligomer liquid coolant, preparation method of fluoroolefin oligomer liquid coolant and immersed cooling system | |
| CN115717057A (en) | Single-phase immersed cooling medium, cooling system and cooling method | |
| EP3971259B1 (en) | Non-water coolant composition and cooling system | |
| KR102127188B1 (en) | Hybrid liquid-cooled electronic component cooling device and method for manufacturing thereof | |
| CN115066157A (en) | Liquid cooling heat dissipation system and data center | |
| CN113969144B (en) | Composition and application thereof in liquid coolant and liquid cooling system | |
| CN111793475B (en) | Heat transfer device and method | |
| CN114231259B (en) | Immersed single-phase liquid coolant, application thereof, liquid cooling method and immersed single-phase liquid cooling system | |
| CN113861949B (en) | Heat transfer composition, application thereof and immersed cooling system | |
| CN113416520A (en) | Cooling medium, preparation method thereof, cooling system and electronic equipment | |
| CN115572579B (en) | Liquid-cooled perfluoro compound composition and application thereof in submerged cooling | |
| CN115260019B (en) | Hyperbranched perfluoro-ketone and application thereof in heat conduction operation | |
| US20230112841A1 (en) | Methods of immersion cooling with low-gwp fluids in immersion cooling systems | |
| TW202315853A (en) | Immersion cooling dielectric working fluids | |
| CN116396730A (en) | Single-phase cooling liquid for immersed cooling thermal management, preparation method and application |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |