WO2011075929A1 - Dispositif de refroidissement par évaporation de type à montage en surface d'un superordinateur - Google Patents

Dispositif de refroidissement par évaporation de type à montage en surface d'un superordinateur Download PDF

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Publication number
WO2011075929A1
WO2011075929A1 PCT/CN2010/000689 CN2010000689W WO2011075929A1 WO 2011075929 A1 WO2011075929 A1 WO 2011075929A1 CN 2010000689 W CN2010000689 W CN 2010000689W WO 2011075929 A1 WO2011075929 A1 WO 2011075929A1
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WO
WIPO (PCT)
Prior art keywords
liquid
coolant
condenser
manifold
pipe
Prior art date
Application number
PCT/CN2010/000689
Other languages
English (en)
Chinese (zh)
Inventor
阮琳
顾国彪
袁佳毅
李振国
熊斌
Original Assignee
中国科学院电工研究所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中国科学院电工研究所 filed Critical 中国科学院电工研究所
Publication of WO2011075929A1 publication Critical patent/WO2011075929A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Definitions

  • the present invention relates to a supercomputer system cooling system. Background technique
  • the current supercomputer mainly uses the traditional air cooling method. Although the system is safe and reliable, the operation is simple, and the maintenance is convenient, the cooling efficiency is low. Moreover, with the increase of the integration degree, many components are arranged in the unit space, and the heat dissipating device makes the airflow difficult to be evenly distributed, which makes it difficult to ensure that the temperature of each of the cooled bodies on the main board remains relatively uniform, and it is difficult to prevent local parts. Overheating can't solve the cooling problem fundamentally. Moreover, the use of high-pressure fans often introduces significant noise and greatly increases the energy consumption of the cooling system itself.
  • Evaporative cooling technology utilizes the latent heat of vaporization of low-boiling medium to achieve heat exchange with the object to be cooled.
  • the heat absorption capacity of the unit mass of the cooling medium is much greater than that of the conventional specific heat exchange method (such as air cooling, hydrogen cooling, water cooling and oil cooling). ).
  • the evaporative cooling medium has good physical and chemical stability and insulation properties, and the evaporative cooling system can realize pump-free self-circulation and keep the cooling system running near zero pressure, and can realize adaptive adjustment according to different working conditions of the heating element. Ensure safe and reliable operation of the cooling system.
  • Chinese patent 200320129492.1 discloses a high-power power electronic device evaporative cooling device, which adopts a self-circulating mode, does not require a pump, has a small volume, and the cooling liquid has insulation property and is safe and reliable in operation.
  • the unit contains an evaporative cooling box.
  • Each power module is collectively mounted on the outer panel surface of the evaporative cooling box described above. Since there is only one evaporative cooling box, all the power modules are mounted on the outer surface of the evaporative cooling box, so the module can only be placed to accommodate the structure of the cooling box. This is not applicable to some devices that have clear industry specifications and whose structural position cannot be changed. In particular, they cannot be applied to distributed heat sources, where the structural position is relatively fixed, and at the same time, the supercomputer field with high integration of computing units is required. Summary of the invention
  • the surface mount evaporative cooling unit of the supercomputer system includes N coolant tanks, a header manifold, a header manifold, a return pipe, an outlet pipe and a condenser.
  • Each of the coolant cartridges contains a liquid introduction tube and a vapor outlet tube into which the evaporative cooling medium is injected into the surface mount evaporative cooling device of the supercomputer system.
  • the surface mount evaporative cooling device of the present invention is installed in a cabinet of a supercomputer.
  • the condenser is placed at the top of the computer machine, the liquid collecting manifold is located at the bottom of the evaporative cooling device, the cooling liquid box is located between the liquid collecting main pipe and the collecting main pipe, and the steam discharging pipe is located above the collecting main pipe and the condenser.
  • the collecting manifold is connected to the condenser through the outlet pipe, and the condenser is connected to the collecting manifold through the liquid return pipe.
  • the coolant tank is in close contact with the main heating element on the calculation unit, and the N liquid introduction tubes contained in the N coolant tanks are connected to the liquid collection manifold, and the N vapor outlet tubes included in the N coolant tanks are The manifolds are connected to form a closed circulating cooling circuit.
  • the cooling medium is injected into the coolant tank at a level that is equal to the center line of the vapor outlet tube located in the coolant tank.
  • the liquid introduction pipe and the liquid collection pipe of the present invention are connected through a joint pipe equipped with a valve, and the vapor discharge pipe and the steam collection pipe are connected through a joint pipe equipped with a valve.
  • Liquid introduction tube A sealing mechanism similar to an aviation plug is respectively arranged on the vapor outlet tube.
  • the heat generated by the heating element of the blade computing unit is transferred to the cooling medium in the coolant tank through the metal surface of the coolant tank, and the cooling medium absorbs heat and rises when the temperature reaches the saturation temperature corresponding to the pressure. Boiling vaporizes, absorbing a large amount of heat, thereby cooling the heating element.
  • the generated vapor medium acts under the action of buoyancy and the static head of the liquid column of the liquid return pipe, enters the steam collecting pipe along the steam outlet pipe, and then enters the condenser through the steam outlet pipe to be condensed into liquid through the back.
  • the liquid pipe enters the liquid collecting pipe, and then enters the cooling liquid tank through the liquid introduction pipe to perform the next round of cooling.
  • Such a recurring process forms a self-circulating closed evaporative cooling device.
  • the surface-mounted evaporative cooling device of the present invention is used in combination with the air-cooling system of the supercomputer system, and some devices with insufficient heat generation problems still use forced air cooling, so the height of the cooling liquid tank in the surface-mount evaporative cooling device should be reasonably designed. There must be sufficient cooling air ducts for forced air cooling.
  • the use of the surface-mounted evaporative cooling device of the present invention allows the temperature of the computer core processing unit to be controlled at an optimum operating point to align the temperature distribution of the cooled components. At the same time, it can reduce the number of fans in the supercomputer configuration, which can reduce wind and wear loss and fan noise.
  • the evaporative cooling medium used in the present invention is a fluorocarbon compound which meets environmental protection requirements.
  • the medium has high insulation properties and does not cause short-circuit electrical accidents like water cooling even if it leaks out.
  • the boiling temperature can be selected according to the optimal working temperature of the chip, and the boiling point is generally selected to be 45-60 degrees.
  • the coolant tank of the present invention is composed of a plurality of shaped liquid tanks, and the open sides of the liquid tanks are connected to each other by surface welding.
  • the structure and arrangement of the profiled liquid channel are the same as the shape and position of the heat generating component on the blade computing unit, Consistently, it ensures that each tank is closely matched to the shape of the heating element to be cooled, ensuring optimum heat transfer.
  • the condenser used in the present invention may be air or water as a secondary cooling medium, and may be determined in accordance with the conditions of the supercomputer room.
  • the blade calculation unit of the present invention is placed horizontally, that is, the coolant liquid tank is also placed horizontally, the liquid introduction tube and the vapor outlet tube adopt a one-way valve, so that the liquid medium can only flow into the coolant tank along the one-way valve.
  • the vapor phase medium can only flow out of the coolant tank along the one-way valve; if it is placed vertically, there is no need to use a one-way valve structure.
  • the invention is suitable for super-high-density, high-integration supercomputer equipment, and is also suitable for distributed power electronic device cooling with outstanding heat generation problems.
  • Figure 1 shows a blade computing unit that includes a main body heat generating component CPU 1, a memory bank 2, and a north-south bridge management chip 3.
  • the surface mount evaporative cooling device of the present invention is installed in a cabinet of a supercomputer, as shown in FIG. 3, which comprises N coolant tanks 9, a collecting manifold 12, a collecting manifold 11, and a back
  • the condenser 15 is placed at the top of the computer machine, the liquid collecting manifold 11 is located at the bottom of the evaporative cooling device, the coolant tank 9 is located between the liquid collecting manifold 11 and the collecting manifold 12, and the steam outlet 13 is located at the collecting steam.
  • the liquid pipe 14 is connected to the header manifold 11.
  • the coolant cartridge shown in Figure 2 will be mounted on the blade computing unit shown in Figure 1 such that the coolant cartridge 9 is in intimate contact with the primary heating elements 1, 2, 3 on the blade computing unit, N coolant cartridges 9
  • the N liquid introduction pipes 7' contained therein are all in communication with the header manifold 11, and the N vapor outlet tubes 8 included in the N coolant tanks are all in communication with the header manifold 12 to form a closed circulating cooling circuit.
  • the cooling medium is injected into the coolant tank, and the liquid level is equal to the center line of the vapor outlet tube located in the coolant tank.
  • Fig. 2 shows the structure of the coolant tank in detail.
  • the coolant tank has a plurality of mutually communicating liquid tanks 4, 5 and 6, which are shaped and positioned to correspond to the respective heat generating components on the blade calculating unit.
  • the liquid tanks 4, 5 and 6 communicate as the main body of the coolant tank 9.
  • Fig. 1 shows the example exemplarily shown in Fig.
  • the liquid tank 4 is located in the middle of the liquid tank 9, the liquid tank 5 is located on the upper right side of the coolant tank 9, and the liquid tank 6 is located on the lower left side of the coolant tank 9, the liquid tank 5 and the liquid tank Welding is performed at the contact surface of the groove 4, the internal cavity is connected, and the contact surface of the liquid tank 6 and the liquid tank 4 is welded to realize internal cavity communication, and the cavity of the liquid tanks 4, 5, 6 is welded after the contact surface is welded.
  • the bodies are all connected.
  • the coolant tank 9 includes a liquid introduction pipe 7 and a vapor outlet pipe 8.
  • the liquid introduction pipe 7 is located at a lower portion of the coolant tank 9, and the vapor outlet pipe 8 is located at an upper portion of the coolant tank 9.
  • the liquid introduction pipe 7 communicates with the header pipe 11 through a joint pipe 17 equipped with a valve 16, and the vapor outlet pipe 8 and the header pipe 12 communicate with each other through a joint pipe 17 equipped with a valve 16.
  • the liquid introduction tube 7 and the vapor outlet tube 8 are respectively provided with a sealing mechanism 7-1 similar to an aviation plug.
  • the coolant tank 9 is a plurality of profiled structural tanks 4, 5, 6 that are connected by surface welding to ensure that each tank is closely matched to the shape of the heating element to be cooled to ensure optimum heat transfer.
  • Such a recurring process forms a self-circulating closed evaporative cooling device.
  • the first coolant tank 9, ... the Nth coolant tank 10, the N coolant tanks are connected in parallel on the liquid path.
  • the value of N can be determined as needed, and its range is, for example, 1-10.
  • the condenser used in this embodiment is a water-cooled condenser, that is, the secondary cooling medium is water.
  • the evaporative cooling medium used in the present invention is a fluorocarbon compound which meets environmental protection requirements.
  • the medium has high insulation properties and does not cause short-circuit electrical accidents like water cooling even if it leaks out.
  • the boiling temperature can be selected according to the optimal working temperature of the chip, and the boiling point is generally selected to be 45-60 degrees.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un dispositif de refroidissement par évaporation de type à montage en surface d'un superordinateur. Un condenseur (15) est installé en haut du boîtier du superordinateur; et une canalisation principale de liquide d'accumulation (11) est positionnée en bas du dispositif de refroidissement par évaporation. N boîtes de liquide de refroidissement (9) sont disposées entre la canalisation principale de liquide d'accumulation (11) et une canalisation principale de vapeur d'accumulation (12). Une canalisation de sortie de vapeur (13) est installée en haut de la canalisation principale de vapeur d'accumulation (12) et en bas du condenseur (15). La canalisation principale de vapeur d'accumulation (12) est connectée au condenseur (15) par le biais de la canalisation de sortie de vapeur (13), et le condenseur (15) est connecté à la canalisation principale de liquide d'accumulation (11) par le biais d'une canalisation de retour de liquide (14). Les boîtes de liquide de refroidissement (9) sont en contact direct avec les éléments s'échauffant du superordinateur, N canalisations d'entrée de liquide (7) contenues dans les N boîtes de liquide de refroidissement sont toutes connectées à la canalisation principale de liquide d'accumulation (11), et N canalisations de fourniture de vapeur (8) contenues dans les N boîtes de liquide de refroidissement (9) sont toutes connectées à la canalisation principale de vapeur d'accumulation (12) de sorte à former un circuit de refroidissement à circulation fermée. Une pluralité de passages de liquide, dont les cavités internes sont connectées entre elles, sont montées dans les boîtes de liquide de refroidissement (9) et les N boîtes de liquide de refroidissement (9) sont disposées en parallèle dans un chemin du liquide.
PCT/CN2010/000689 2009-12-25 2010-05-14 Dispositif de refroidissement par évaporation de type à montage en surface d'un superordinateur WO2011075929A1 (fr)

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Application Number Priority Date Filing Date Title
CN200910243551.X 2009-12-25
CN200910243551XA CN101751096B (zh) 2009-12-25 2009-12-25 超级计算机表贴式蒸发冷却装置

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WO2011075929A1 true WO2011075929A1 (fr) 2011-06-30

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Cited By (1)

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CN105468118A (zh) * 2015-12-28 2016-04-06 曙光信息产业(北京)有限公司 水平分液装置、冷却设备及刀片式服务器

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CN102256477A (zh) * 2011-07-25 2011-11-23 李俊晖 机房设备并联散热系统
CN103066039B (zh) * 2012-12-25 2015-04-08 南京航空航天大学 适用于高热流密度环境的冷却系统及其冷却方法
CN103324261A (zh) * 2013-07-17 2013-09-25 曙光信息产业(北京)有限公司 散热系统、刀片式服务器
CN103327799B (zh) * 2013-07-17 2016-06-29 曙光信息产业股份有限公司 用于机架式服务器的冷却组件、及机架式服务器机组
CN103399624B (zh) * 2013-07-17 2017-11-03 曙光信息产业(北京)有限公司 用于刀片式服务器的冷却组件、刀片式服务器
CN103576812A (zh) * 2013-11-06 2014-02-12 曙光信息产业(北京)有限公司 用于服务器集群的冷媒分配装置以及散热设备
CN107553574A (zh) * 2017-09-12 2018-01-09 长园和鹰智能科技有限公司 裁剪机刀具冷却机构和裁剪机
CN109951993A (zh) * 2017-12-21 2019-06-28 中国科学院电工研究所 一种功率设备的散热系统
CN108601312B (zh) * 2018-06-25 2023-08-04 中国科学院电工研究所 一种绿色节能微模块数据中心
CN113789160B (zh) * 2021-09-10 2023-07-04 浙江巨化技术中心有限公司 一种包含聚乙二醇硫氮杂化改性体的组合物、及其用于液冷剂的用途以及浸没式液冷系统
CN113773812B (zh) * 2021-09-13 2023-07-04 浙江巨化技术中心有限公司 一种包含杂环促进剂的组合物、及其用于液冷剂的用途以及浸没式液冷系统

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CN2673048Y (zh) * 2003-12-22 2005-01-19 中国科学院电工研究所 一种大功率电力电子器件蒸发冷却装置
CN2826690Y (zh) * 2005-06-08 2006-10-11 杭州电子科技大学 一种大功耗功率器件散热装置
CN101414207A (zh) * 2008-10-22 2009-04-22 陈国英 可扩展式计算机液冷装置
CN101604195A (zh) * 2009-07-08 2009-12-16 深圳先进技术研究院 冷却超级计算机的系统及方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105468118A (zh) * 2015-12-28 2016-04-06 曙光信息产业(北京)有限公司 水平分液装置、冷却设备及刀片式服务器

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CN101751096A (zh) 2010-06-23
CN101751096B (zh) 2011-11-16

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