CN112015250A - Whole parallel flow cold plate liquid cooling system of server - Google Patents
Whole parallel flow cold plate liquid cooling system of server Download PDFInfo
- Publication number
- CN112015250A CN112015250A CN202010834350.3A CN202010834350A CN112015250A CN 112015250 A CN112015250 A CN 112015250A CN 202010834350 A CN202010834350 A CN 202010834350A CN 112015250 A CN112015250 A CN 112015250A
- Authority
- CN
- China
- Prior art keywords
- flow guide
- cold
- liquid
- cpu
- hot liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 224
- 238000001816 cooling Methods 0.000 title claims abstract description 26
- 125000006850 spacer group Chemical group 0.000 claims abstract description 43
- 230000017525 heat dissipation Effects 0.000 claims abstract description 23
- 238000005192 partition Methods 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 3
- 239000000110 cooling liquid Substances 0.000 abstract description 6
- 238000009434 installation Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 238000009826 distribution Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an integral parallel-flow cold plate liquid cooling system of a server, wherein cooling liquid enters a cold liquid sub-runner through a cold liquid joint and is distributed into a cold liquid diversion runner through the cold liquid sub-runner, the cooling liquid enters a CPU diversion spacer block, a chip diversion spacer block and a memory bank diversion heat dissipation module through a cold liquid inlet through the cold liquid diversion runner, becomes hot through heat exchange, flows into a hot liquid outlet through a hot liquid outlet, flows into the hot liquid sub-runner through the outlet of the diversion runner and finally flows out through a hot liquid joint. The cold liquid flow channel among the CPU flow guide spacer block, the chip flow guide spacer block and the memory bar flow guide heat dissipation module is connected in parallel. The invention has the advantages that: reasonable in design, simple structure, easily installation and dismantlement adapt to the server installation, and the radiating effect is good.
Description
Technical Field
The invention relates to the technical field of server heat dissipation, in particular to an integral parallel-flow cold plate liquid cooling system of a server.
Background
In a typical computer server ("server"), multiple computer server modules ("modules") are stacked together on a rack or enclosure to concentrate network resources and minimize the area used. A typical feature of modules designed for use in server configurations is that the motherboard includes heat-generating electronic components (e.g., IC devices) mounted in a combined chassis or housing, which in turn mounts the module, along with other similar modules, to a rack, blade server cabinet, blade server, or other support structure. In practice, multiple servers (each containing multiple modules) are typically installed in an enclosed space, such as a server room or data center. During operation, the electronic components in the individual modules generate heat, which must be dissipated for efficient operation of the server.
For electronic devices, especially servers with high density heat flow, the heat dissipation problem is more and more prominent. The traditional electronic equipment mainly adopts air cooling heat dissipation, has low heat dissipation efficiency and has higher requirement on environmental conditions. And along with the improvement of electronic equipment performance, the requirement of air cooling heat dissipation on the environment is more and more rigorous, especially in places where numerous electronic equipment gathers, the noise of air cooling is huge, causes noise pollution, and the cleanliness requirement on the environment is very high simultaneously, and in order to satisfy the requirement on the computer lab environment, its investment and energy consumption are all higher.
Liquid cooling has the characteristics of large specific heat capacity, good heat dissipation effect and low dependence on environment compared with air cooling.
In the existing pipeline cold plate liquid cooling technology, liquid cooling pipelines are designed by plastic hoses or copper pipes, and interfaces or welding ports of the liquid cooling pipelines have great leakage risks. And the traditional liquid cooling pipeline layout is complex, occupies the internal space of the server, and greatly influences the layout mode of each electronic device in the system, so that the layout of each electronic device in the system can only be one or more of templating, and the random layout can not be realized.
Meanwhile, as the power consumption of core heating devices such as a CPU (central processing unit), a GPU (graphics processing unit) and the like is larger and larger, and the heat production quantity is more and more, a traditional pipeline cold plate liquid cooling device has to replace a liquid cooling pipeline with a larger diameter to meet the heat dissipation requirement, the physical occupied space of the pipeline is further increased, and the heat dissipation of small devices can not be carried out except large devices such as the CPU, the GPU, a memory and the like.
In addition, the liquid cooling tube layout in the prior art adopts a series flow method for heat dissipation, and the series flow method transfers the heat of one CPU to another CPU, so that the heat dissipation efficiency is not high. And the traditional pipeline type design can be realized only by placing and taking the bracket when being installed or disassembled.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the server integral parallel-flow cold plate liquid cooling system, which solves the defects in the prior art.
In order to realize the purpose, the technical scheme adopted by the invention is as follows:
a server integrated co-current cold plate liquid cooling system, comprising: the cold plate heat-conducting device comprises a cold plate upper cover plate 1, a middle partition plate 2, a joint shunting seat 3, a CPU (central processing unit) flow guide spacer block 4, a chip flow guide spacer block 5, a CPU heat-conducting base 6, a chip heat-conducting base 7 and a mainboard 9; the mainboard 9 is provided with electronic components such as a CPU, a chip and a memory bank, the number of the CPU flow guide spacing blocks 4 and the number of the chip flow guide spacing blocks 5 correspond to the number of the CPU and the chip, one CPU heat conduction base 6 corresponds to one CPU flow guide spacing block 4, and one chip heat conduction base 7 corresponds to one chip flow guide spacing block 5.
The surface of the cold plate upper cover plate 1 is provided with a plurality of rectangular memory windows A1-3 which penetrate through, the memory windows A1-3 are used for penetrating the memory banks to prevent the upper surfaces of the memory banks from propping against the cold plate upper cover plate 1, and the number of the memory windows A1-3 corresponds to the number of the memory banks.
The lower surface of the cold plate upper cover plate 1 is dug with a plurality of cold liquid flow guide channels 1-1 and a plurality of hot liquid flow guide channels 1-2, the number of the cold liquid flow guide channels 1-1 is the same as that of the hot liquid flow guide channels 1-2, and the cold liquid flow guide channels 1-1 and the hot liquid flow guide channels 1-2 are parallel to each other.
The surface of the middle partition board 2 is provided with a plurality of penetrating memory windows B2-3, and the memory windows B2-3 and A1-3 are overlapped in position and have the same shape.
The surface of the middle clapboard 2 is also provided with a plurality of cold liquid inlet ports 2-1 and a plurality of hot liquid outlet ports 2-2 which penetrate through the surface, the number of the cold liquid inlet ports 2-1 is the same as that of the hot liquid outlet ports 2-2, one CPU flow guide clapboard corresponds to one cold liquid inlet port 2-1 and one hot liquid outlet port 2-2, and one chip flow guide clapboard 5 corresponds to one cold liquid inlet port 2-1 and one hot liquid outlet port 2-2.
The surface of the middle clapboard 2 is also provided with a plurality of guide way inlets 2-4 and a plurality of guide way outlets 2-5 which penetrate through the middle clapboard, the number of the guide way inlets 2-4 is the same as that of the cold liquid guide way 1-1, and the number of the guide way outlets 2-5 is the same as that of the hot liquid guide way 1-2.
The upper surface of the middle clapboard 2 is attached to the lower surface of the cold plate upper cover plate 1, the upper surface of the middle clapboard 2 seals the cold liquid flow guide channel 1-1 and the hot liquid flow guide channel 1-2, the cold liquid inflow port 2-1 is communicated with the sealed cold liquid flow guide channel 1-1, and the hot liquid outflow port 2-2 is communicated with the hot liquid flow guide channel 1-2. One guide way inlet 2-4 is communicated with a cold liquid guide way 1-1, and one guide way outlet 2-5 is communicated with a hot liquid guide way 1-2.
The side surface of the joint shunting seat 3 is provided with a cold liquid joint 3-1 and a hot liquid joint 3-4, and the upper surface of the joint shunting seat 3 is dug with a cold liquid shunting passage 3-2 and a hot liquid shunting passage 3-3. The cold liquid joint 3-1 is communicated with the cold liquid sub-channel 3-2, and the hot liquid joint 3-4 is communicated with the hot liquid sub-channel 3-3.
The upper surface of the joint diversion seat 3 is attached to the lower surface of the middle partition plate 2, the middle partition plate 2 seals the cold liquid diversion passage 3-2 and the hot liquid diversion passage 3-3, the cold liquid diversion passage 3-2 is communicated with all diversion passage inlets 2-4, and the hot liquid diversion passage 3-3 is communicated with all diversion passage outlets 2-5.
The CPU flow guide spacer block 4 and the chip flow guide spacer block 5 are both hollow rectangles made of heat conducting metal, and the surfaces of the CPU flow guide spacer block 4 and the chip flow guide spacer block 5 are both provided with a cold liquid inlet 4-1 and a hot liquid outlet 4-2;
the upper surfaces of the CPU flow guide spacer 4 and the chip flow guide spacer 5 are attached to the lower surface of the middle partition plate 2, a cold liquid inlet 4-1 of the CPU flow guide spacer 4 is communicated with a cold liquid inlet 2-1 in an overlapping mode, a hot liquid outlet 4-2 is communicated with a hot liquid outlet 2-2 in an overlapping mode, a cold liquid inlet 4-1 of the chip flow guide spacer 5 is communicated with a cold liquid inlet 2-1 in an overlapping mode, and a hot liquid outlet 4-2 is communicated with a hot liquid outlet 2-2 in an overlapping mode;
the CPU heat-conducting base 6 and the chip heat-conducting base 7 are sheet heat-conducting metals, the shape and the size of the CPU heat-conducting base 6 correspond to the shape and the size of a CPU, the shape and the size of the chip heat-conducting base 7 correspond to the shape and the size of a chip,
the upper surface of the CPU heat conduction base 6 is in contact with the lower surface of the CPU flow guide spacer 4, the lower surface of the CPU heat conduction base 6 is in contact with the CPU, the upper surface of the chip heat conduction base 7 is in contact with the lower surface of the chip flow guide spacer 5, and the lower surface of the chip heat conduction base 7 is in contact with the chip.
Further, the whole parallel flow cold plate liquid cooling system of server still includes DRAM water conservancy diversion heat dissipation module 8, and DRAM water conservancy diversion heat dissipation module 8 includes: a cold liquid end 8-1, a hot liquid end 8-2 and two channels 8-3, wherein the cold liquid end 8-1 and the hot liquid end 8-2 are hollow rectangular bodies, the upper surface of the cold liquid end 8-1 is provided with a cold liquid inlet 4-1, the upper surface of the hot liquid end 8-2 is provided with a hot liquid outlet 4-2, the side surfaces of the cold liquid end 8-1 and the hot liquid end 8-2 are provided with holes for connecting the channels 8-3, the channels 8-3 are hollow strip rectangular bodies, the two ends of the channel 8-3 are respectively connected with the cold liquid end 8-1 and the hot liquid end 8-2, the two channels 8-3 are parallel and have a gap in the middle, the gap is used for being sleeved with a memory bank and enabling the side wall of the channel 8-3 to contact with a chip of the memory bank, the cold liquid inlet 4-1 of the memory bank flow guide and heat dissipation module 8 is connected with a cold liquid inlet 2-1 in an overlapping way, the hot liquid outlet 4-2 is communicated with one hot liquid outlet 2-2 in an overlapping way.
Compared with the prior art, the invention has the advantages that:
1. copper pipes or plastic pipes are removed, and cooling liquid is transported by adopting a flow channel formed by grooving, so that the risk of liquid leakage is avoided;
2. the parallel flow channel design is adopted, so that the cooling liquid can absorb heat to all the main board components at the earliest stage without absorbing heat, the problem of heat transfer among the components caused by series flow is avoided, and the heat dissipation effect is good;
3. the flat design does not influence the physical position layout of the components of the bottom main board, and is suitable for the installation of the server;
4. reasonable in design, simple structure, easily installation and dismantlement.
Drawings
FIG. 1 is a schematic illustration of a liquid cooling system according to an embodiment of the present invention;
FIG. 2 is a top view of a cold plate upper cover plate according to an embodiment of the present invention;
FIG. 3 is a bottom view of a cold plate upper cover plate according to an embodiment of the present invention;
FIG. 4 is a perspective view of a spacer in an embodiment of the present invention;
FIG. 5 is a perspective view of a diverter base according to an embodiment of the present invention;
FIG. 6 is a perspective view of a CPU flow guide spacer block according to an embodiment of the present invention;
FIG. 7 is a perspective view of a chip flow guide spacer according to an embodiment of the present invention;
fig. 8 is a perspective view of a memory bank flow guiding and heat dissipating module according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings by way of examples.
As shown in fig. 1, a server integrated parallel flow cold plate liquid cooling system includes: the cold plate heat dissipation device comprises a cold plate upper cover plate 1, a middle partition plate 2, a joint shunting seat 3, a CPU (central processing unit) diversion spacer block 4, a chip diversion spacer block 5, a CPU heat conduction base 6, a chip heat conduction base 7, a memory bank diversion heat dissipation module 8 and a mainboard 9; the mainboard 9 is provided with electronic components such as a CPU, a chip and a memory bank, the number of the CPU flow guide spacing blocks 4 and the number of the chip flow guide spacing blocks 5 correspond to the number of the CPU and the chip, one CPU heat conduction base 6 corresponds to one CPU flow guide spacing block 4, and one chip heat conduction base 7 corresponds to one chip flow guide spacing block 5.
As shown in fig. 2, the surface of the cold plate upper cover plate 1 is provided with a plurality of rectangular memory windows a1-3, the memory windows a1-3 are used for penetrating the memory banks to prevent the upper surfaces of the memory banks from propping against the cold plate upper cover plate 1, and the number of the memory windows a1-3 corresponds to the number of the memory banks.
As shown in fig. 3, three cold liquid flow guide channels 1-1 and three hot liquid flow guide channels 1-2 are dug on the lower surface of the upper cover plate 1 of the cold plate, and each cold liquid flow guide channel 1-1 is parallel to one hot liquid flow guide channel 1-2.
As shown in FIG. 4, a plurality of internal memory windows B2-3 are formed on the surface of the middle partition board 2, and the internal memory window B2-3 and the internal memory window A1-3 are overlapped in position and have the same shape.
The surface of the middle clapboard 2 is also provided with a plurality of cold liquid inlet ports 2-1 and a plurality of hot liquid outlet ports 2-2 which penetrate through, and the number of the cold liquid inlet ports 2-1 is the same as that of the hot liquid outlet ports 2-2.
The surface of the middle clapboard 2 is also provided with a plurality of guide way inlets 2-4 and a plurality of guide way outlets 2-5 which penetrate through the middle clapboard, the number of the guide way inlets 2-4 is the same as that of the cold liquid guide way 1-1, and the number of the guide way outlets 2-5 is the same as that of the hot liquid guide way 1-2.
The upper surface of the middle clapboard 2 is attached to the lower surface of the cold plate upper cover plate 1, the upper surface of the middle clapboard 2 seals the cold liquid flow guide channel 1-1 and the hot liquid flow guide channel 1-2, the cold liquid inflow port 2-1 is communicated with the sealed cold liquid flow guide channel 1-1, and the hot liquid outflow port 2-2 is communicated with the hot liquid flow guide channel 1-2. One guide way inlet 2-4 is communicated with a cold liquid guide way 1-1, and one guide way outlet 2-5 is communicated with a hot liquid guide way 1-2.
As shown in fig. 5, a cold liquid joint 3-1 and a hot liquid joint 3-4 are arranged on the side surface of the joint flow distribution seat 3, and a cold liquid flow distribution channel 3-2 and a hot liquid flow distribution channel 3-3 are dug on the upper surface of the joint flow distribution seat 3. The cold liquid joint 3-1 is communicated with the cold liquid sub-channel 3-2, and the hot liquid joint 3-4 is communicated with the hot liquid sub-channel 3-3.
The upper surface of the joint diversion seat 3 is attached to the lower surface of the middle partition plate 2, the middle partition plate 2 seals the cold liquid diversion passage 3-2 and the hot liquid diversion passage 3-3, the cold liquid diversion passage 3-2 is communicated with all diversion passage inlets 2-4, and the hot liquid diversion passage 3-3 is communicated with all diversion passage outlets 2-5.
As shown in fig. 6 and 7, the CPU flow guide spacer 4 and the chip flow guide spacer 5 are both hollow rectangles made of heat conducting metal, and the surfaces of the CPU flow guide spacer 4 and the chip flow guide spacer 5 are both provided with a cold liquid inlet 4-1 and a hot liquid outlet 4-2;
the upper surfaces of the CPU flow guide spacer 4 and the chip flow guide spacer 5 are attached to the lower surface of the middle partition plate 2, a cold liquid inlet 4-1 of the CPU flow guide spacer 4 is communicated with a cold liquid inlet 2-1 in an overlapping mode, a hot liquid outlet 4-2 is communicated with a hot liquid outlet 2-2 in an overlapping mode, a cold liquid inlet 4-1 of the chip flow guide spacer 5 is communicated with a cold liquid inlet 2-1 in an overlapping mode, and a hot liquid outlet 4-2 is communicated with a hot liquid outlet 2-2 in an overlapping mode;
the CPU heat-conducting base 6 and the chip heat-conducting base 7 are sheet heat-conducting metals, the shape and the size of the CPU heat-conducting base 6 correspond to the shape and the size of a CPU, the shape and the size of the chip heat-conducting base 7 correspond to the shape and the size of a chip,
the upper surface of the CPU heat conduction base 6 is contacted with the lower surface of the CPU flow guide spacer block 4, the lower surface of the CPU heat conduction base 6 is contacted with the CPU, the upper surface of the chip heat conduction base 7 is contacted with the lower surface of the chip flow guide spacer block 5, and the lower surface of the chip heat conduction base 7 is contacted with the chip;
as shown in fig. 8, the memory bank flow guiding and heat dissipating module 8 includes: the chip-type memory chip comprises a cold liquid end 8-1, a hot liquid end 8-2 and two channels 8-3, wherein the cold liquid end 8-1 and the hot liquid end 8-2 are hollow rectangular bodies, a cold liquid inlet 4-1 is formed in the upper surface of the cold liquid end 8-1, a hot liquid outlet 4-2 is formed in the upper surface of the hot liquid end 8-2, holes for communicating the channels 8-3 are formed in the side surfaces of the cold liquid end 8-1 and the hot liquid end 8-2, the channels 8-3 are hollow strip rectangular bodies, two ends of each channel 8-3 are communicated with the cold liquid end 8-1 and the hot liquid end 8-2 respectively, gaps are formed in the two parallel channels 8-3, and are used for being sleeved with a memory chip of the memory chip and enabling the side walls of the channels 8-3 to be in contact with the memory chip. The cold liquid inlet 4-1 of the memory bank flow guide heat dissipation module 8 is communicated with a cold liquid inlet 2-1 in an overlapping mode, and the hot liquid outlet 4-2 is communicated with a hot liquid outlet 2-2 in an overlapping mode.
During operation, cooling liquid enters the cold liquid diversion channel 3-2 through the cold liquid joint 3-1 and is diverted into the cold liquid diversion channel 1-1 through the cold liquid diversion channel 3-2, the cooling liquid enters the CPU diversion spacer 4, the chip diversion spacer 5 and the memory bank diversion and heat dissipation module 8 through the cold liquid inlet 4-1 through the cold liquid diversion channel 1-1, becomes hot through heat exchange, flows into the hydrothermal liquid diversion channel 1-2 through the hydrothermal liquid outlet 4-2, flows into the hydrothermal liquid diversion channel 3-3 through the hydrothermal liquid diversion channel outlet 2-5 and finally flows out through the hydrothermal liquid joint 3-4. The cold liquid flow channel among the CPU flow guide spacer 4, the chip flow guide spacer 5 and the memory bar flow guide heat radiation module 8 is in parallel connection.
It will be appreciated by those of ordinary skill in the art that the examples described herein are intended to assist the reader in understanding the manner in which the invention is practiced, and it is to be understood that the scope of the invention is not limited to such specifically recited statements and examples. Those skilled in the art can make various other specific changes and combinations based on the teachings of the present invention without departing from the spirit of the invention, and these changes and combinations are within the scope of the invention.
Claims (2)
1. The utility model provides a whole parallel flow cold plate liquid cooling system of server which characterized in that includes: the cooling plate comprises a cooling plate upper cover plate (1), a middle partition plate (2), a joint shunting seat (3), a plurality of CPU (central processing unit) flow guide spacing blocks (4), a plurality of chip flow guide spacing blocks (5), a plurality of CPU heat conduction bases (6), a plurality of chip heat conduction bases (7) and a main plate (9); a CPU, chips and a memory bank are arranged on a mainboard (9), the number of CPU flow guide spacing blocks (4) and chip flow guide spacing blocks (5) corresponds to the number of the CPU and the chips, one CPU heat conduction base (6) corresponds to one CPU flow guide spacing block (4), and one chip heat conduction base (7) corresponds to one chip flow guide spacing block (5);
the surface of the cold plate upper cover plate (1) is provided with a plurality of rectangular memory windows A (1-3) which penetrate through the surface, the memory windows A (1-3) are used for penetrating through the memory bank to prevent the upper surface of the memory bank from propping against the cold plate upper cover plate (1), and the number of the memory windows A (1-3) is related to the number of the memory bank;
a plurality of cold liquid flow guide channels (1-1) and a plurality of hot liquid flow guide channels (1-2) are dug on the lower surface of the cold plate upper cover plate (1), the number of the cold liquid flow guide channels (1-1) is the same as that of the hot liquid flow guide channels (1-2), and the cold liquid flow guide channels (1-1) and the hot liquid flow guide channels (1-2) are parallel to each other;
the surface of the middle partition plate (2) is provided with a plurality of penetrating memory windows B (2-3), and the memory windows B (2-3) are overlapped with the memory windows A (1-3) in position and have the same shape;
the surface of the middle partition plate (2) is also provided with a plurality of cold liquid inlet ports (2-1) and a plurality of hot liquid outlet ports (2-2) which penetrate through the surface, the number of the cold liquid inlet ports (2-1) is the same as that of the hot liquid outlet ports (2-2), one CPU flow guide partition block corresponds to one cold liquid inlet port (2-1) and one hot liquid outlet port (2-2), and one chip flow guide partition block (5) corresponds to one cold liquid inlet port (2-1) and one hot liquid outlet port (2-2);
the surface of the middle partition plate (2) is also provided with a plurality of flow guide channel inlets (2-4) and a plurality of flow guide channel outlets (2-5) which penetrate through the middle partition plate, the number of the flow guide channel inlets (2-4) is the same as that of the cold liquid flow guide channels (1-1), and the number of the flow guide channel outlets (2-5) is the same as that of the hot liquid flow guide channels (1-2);
the upper surface of the middle partition plate (2) is attached to the lower surface of the cold plate upper cover plate (1), the upper surface of the middle partition plate (2) seals the cold liquid flow guide channel (1-1) and the hot liquid flow guide channel (1-2), the cold liquid inflow port (2-1) is communicated with the sealed cold liquid flow guide channel (1-1), and the hot liquid outflow port (2-2) is communicated with the hot liquid flow guide channel (1-2); one guide way inlet (2-4) is communicated with a cold liquid guide way (1-1), and one guide way outlet (2-5) is communicated with a hot liquid guide way (1-2);
a cold liquid joint (3-1) and a hot liquid joint (3-4) are arranged on the side surface of the joint shunting seat (3), and a cold liquid shunting passage (3-2) and a hot liquid shunting passage (3-3) are dug on the upper surface of the joint shunting seat (3); the cold liquid joint (3-1) is communicated with the cold liquid sub-runner (3-2), and the hot liquid joint (3-4) is communicated with the hot liquid sub-runner (3-3);
the upper surface of the joint diversion seat (3) is attached to the lower surface of the middle partition plate (2), the middle partition plate (2) seals the cold liquid diversion channel (3-2) and the hot liquid diversion channel (3-3), the cold liquid diversion channel (3-2) is communicated with all diversion channel inlets (2-4), and the hot liquid diversion channel (3-3) is communicated with all diversion channel outlets (2-5);
the CPU flow guide spacer block (4) and the chip flow guide spacer block (5) are both hollow rectangular bodies made of heat-conducting metal, and the surfaces of the CPU flow guide spacer block (4) and the chip flow guide spacer block (5) are both provided with a cold liquid inlet (4-1) and a hot liquid outlet (4-2);
the upper surfaces of the CPU flow guide spacer block (4) and the chip flow guide spacer block (5) are attached to the lower surface of the middle partition plate (2), a cold liquid inlet (4-1) of the CPU flow guide spacer block (4) is communicated with a cold liquid inlet (2-1) in an overlapping mode, a hot liquid outlet (4-2) is communicated with a hot liquid outlet (2-2) in an overlapping mode, a cold liquid inlet (4-1) of the chip flow guide spacer block (5) is communicated with a cold liquid inlet (2-1) in an overlapping mode, and a hot liquid outlet (4-2) is communicated with a hot liquid outlet (2-2) in an overlapping mode;
the CPU heat conduction base (6) and the chip heat conduction base (7) are sheet heat conduction metals, the shape and the size of the CPU heat conduction base (6) correspond to the shape and the size of a CPU, the shape and the size of the chip heat conduction base (7) correspond to the shape and the size of a chip,
the upper surface of the CPU heat conduction base (6) is in contact with the lower surface of the CPU flow guide spacing block (4), the lower surface of the CPU heat conduction base (6) is in contact with the CPU, the upper surface of the chip heat conduction base (7) is in contact with the lower surface of the chip flow guide spacing block (5), and the lower surface of the chip heat conduction base (7) is in contact with the chip.
2. The server integrated co-current cold plate liquid cooling system of claim 1, wherein: the whole parallel flow cold plate liquid cooling system of server still includes DRAM water conservancy diversion heat dissipation module (8), and DRAM water conservancy diversion heat dissipation module (8) include: the device comprises a cold liquid end (8-1), a hot liquid end (8-2) and two channels (8-3), wherein the cold liquid end (8-1) and the hot liquid end (8-2) are hollow rectangular bodies, a cold liquid inlet (4-1) is arranged on the upper surface of the cold liquid end (8-1), a hot liquid outlet (4-2) is arranged on the upper surface of the hot liquid end (8-2), holes for communicating the channels (8-3) are formed in the side surfaces of the cold liquid end (8-1) and the hot liquid end (8-2), the channels (8-3) are hollow strip rectangular bodies, the two ends of each channel (8-3) are respectively communicated with the cold liquid end (8-1) and the hot liquid end (8-2), the two channels (8-3) are arranged in parallel, a gap is formed in the middle of the two channels (8-3), the gap is used for sleeving a memory bar and enabling the side wall of each channel (8-3) to be in contact with a, a cold liquid inlet (4-1) of the memory bank flow guide heat dissipation module (8) is communicated with a cold liquid inlet (2-1) in an overlapping mode, and a hot liquid outlet (4-2) is communicated with a hot liquid outlet (2-2) in an overlapping mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010834350.3A CN112015250B (en) | 2020-08-19 | 2020-08-19 | Integrated parallel-flow cold plate liquid cooling system of server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010834350.3A CN112015250B (en) | 2020-08-19 | 2020-08-19 | Integrated parallel-flow cold plate liquid cooling system of server |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112015250A true CN112015250A (en) | 2020-12-01 |
| CN112015250B CN112015250B (en) | 2024-05-03 |
Family
ID=73505479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010834350.3A Active CN112015250B (en) | 2020-08-19 | 2020-08-19 | Integrated parallel-flow cold plate liquid cooling system of server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112015250B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1448040A2 (en) * | 2003-02-14 | 2004-08-18 | Hitachi, Ltd. | Liquid cooling system for a rack-mount server system |
| WO2017190676A1 (en) * | 2016-05-06 | 2017-11-09 | 中兴通讯股份有限公司 | Liquid cooling heat dissipation cabinet |
| CN207833444U (en) * | 2017-12-29 | 2018-09-07 | 华南理工大学 | A kind of water-cooling heat radiating device of server |
| WO2019144740A1 (en) * | 2018-01-29 | 2019-08-01 | 广东合一新材料研究院有限公司 | Spray type liquid-cooled server |
| CN210986824U (en) * | 2019-11-07 | 2020-07-10 | 苏州浪潮智能科技有限公司 | Data center liquid cooling board device |
| CN111506176A (en) * | 2020-05-08 | 2020-08-07 | 广州高澜节能技术股份有限公司 | Efficient immersion type liquid cooling server based on tapered flow channel design |
| CN212873401U (en) * | 2020-08-19 | 2021-04-02 | 成都珑微系统科技有限公司 | Whole parallel flow cold plate liquid cooling system of server |
-
2020
- 2020-08-19 CN CN202010834350.3A patent/CN112015250B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1448040A2 (en) * | 2003-02-14 | 2004-08-18 | Hitachi, Ltd. | Liquid cooling system for a rack-mount server system |
| WO2017190676A1 (en) * | 2016-05-06 | 2017-11-09 | 中兴通讯股份有限公司 | Liquid cooling heat dissipation cabinet |
| CN207833444U (en) * | 2017-12-29 | 2018-09-07 | 华南理工大学 | A kind of water-cooling heat radiating device of server |
| WO2019144740A1 (en) * | 2018-01-29 | 2019-08-01 | 广东合一新材料研究院有限公司 | Spray type liquid-cooled server |
| CN210986824U (en) * | 2019-11-07 | 2020-07-10 | 苏州浪潮智能科技有限公司 | Data center liquid cooling board device |
| CN111506176A (en) * | 2020-05-08 | 2020-08-07 | 广州高澜节能技术股份有限公司 | Efficient immersion type liquid cooling server based on tapered flow channel design |
| CN212873401U (en) * | 2020-08-19 | 2021-04-02 | 成都珑微系统科技有限公司 | Whole parallel flow cold plate liquid cooling system of server |
Non-Patent Citations (2)
| Title |
|---|
| 刘宁;朱彩霞;路向阳;刘青;: "液冷系统中冷板的设计及网络建模优化研究", 中原工学院学报, no. 06, 25 December 2016 (2016-12-25) * |
| 肖新文;曾春利;邝旻;: "直接接触冷板式液冷在数据中心的运用探讨", 制冷与空调, no. 06, 28 June 2018 (2018-06-28) * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112015250B (en) | 2024-05-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9282678B2 (en) | Field-replaceable bank of immersion-cooled electronic components and separable heat sinks | |
| CN102419623B (en) | Memory liquid-cooling heat dissipation method and device as well as system | |
| US8947873B2 (en) | Immersion-cooled and conduction-cooled electronic system | |
| US8179677B2 (en) | Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack | |
| WO2021129889A1 (en) | Heat dissipating panel for chip heat dissipation, server heat dissipating system, and heating apparatus | |
| CN104094682B (en) | Liquid cooling system and liquid cooling method for electronic device rack | |
| US9025331B2 (en) | Inlet-air-cooling door assembly for an electronics rack | |
| CN100499090C (en) | Liquid cooling thermolysis device | |
| WO2013061250A1 (en) | Cooling unit | |
| CN107979962A (en) | Water-cooled circuit plate heat dissipating device | |
| CN113543595B (en) | Mobile immersion server, workstation and work system | |
| CN106604618B (en) | Liquid cooling and air cooling composite cooling device for data center | |
| CN111506169B (en) | Solid immersion type liquid cooling server and solid immersion type liquid cooling service system | |
| CN111031770A (en) | Server rack and heat exchange equipment cabinet for server | |
| CN212873401U (en) | Whole parallel flow cold plate liquid cooling system of server | |
| CN107515657A (en) | A kind of liquid-cooled suit business device containing preposition liquid-cooled air-cooling apparatus | |
| CN213960614U (en) | Box liquid cooling heat dissipation stringing device | |
| CN112015250B (en) | Integrated parallel-flow cold plate liquid cooling system of server | |
| CN115413183A (en) | Server and cabinet | |
| CN207820432U (en) | Water-cooled circuit plate heat dissipating device | |
| CN207491450U (en) | A kind of liquid cooling plate | |
| CN209765429U (en) | Heat dissipation system and cooling liquid distribution module thereof | |
| CN107820380A (en) | A kind of liquid cooling plate and its cold and hot exchange method | |
| RU167555U1 (en) | COOLER OF COMPUTER COMPUTER MODULES | |
| CN219660260U (en) | Server cabinet and data center |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |