CN207780709U - A kind of fountain liquid cooling server - Google Patents
A kind of fountain liquid cooling server Download PDFInfo
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- CN207780709U CN207780709U CN201820161928.1U CN201820161928U CN207780709U CN 207780709 U CN207780709 U CN 207780709U CN 201820161928 U CN201820161928 U CN 201820161928U CN 207780709 U CN207780709 U CN 207780709U
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- server
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model discloses a kind of fountain liquid cooling servers, including cabinet, board and electronic device, cabinet is mainly made of the babinet and the cover board on box opening of top surface opening, a closed spray cavity for containing insulating and cooling liquid is equipped on the inner face of cover board, closed spray cavity is equipped with the coolant inlet for introducing insulating and cooling liquid, and coolant inlet extends on cover board, perforative spray apertures are distributed on the bottom surface of closed spray cavity, the bottom plate of babinet is equipped with cooling liquid outlet.The utility model uses fountain liquid refrigerating mode, improve the space availability ratio in server, and the radiator used in device extended surface can reduce, so that the height of cabinet reduces, even closer device layout can be formed in original framework space, integrated level is high, improves the computing capability of server;In addition, the utility model reduces noise, power consumption, and good heat dissipation effect are reduced, service life is extended.
Description
Technical field
The utility model is related to a kind of liquid cooling server more particularly to a kind of fountain liquid cooling servers.
Background technology
With the high speed development of the computer communications industry and electronics industry, IDC computer rooms high density server is being continuously increased, clothes
Business device integrated level and processing capacity are also gradually increased, but the consumption power of server also increases therewith simultaneously so that in server
The heat dissipation problem of portion's electronic device becomes industry technical barrier urgently to be resolved hurrily.
Currently, server carries out forced convertion heat dissipation, still, wind-cooling heat dissipating pattern by air-cooled to its electronic device mostly
It is a kind of mediate contact type of cooling that heat transfer efficiency is very low, it occupies the larger space of server internal, entire thermal resistance
Height, heat dissipation effect are poor.When in order to take away or realize lower entire thermal resistance the waste heat of higher power device, the industry is typically
The temperature of electronic device is controlled using the higher fan of power or lower inlet air temperature, however, former mode can draw
The noise of bigger is played, latter approach then easy tos produce the too low caused humid air condensation trouble of temperature.
Because the heat-carrying capacity for the working medium that the liquid working substance density of liquid-cooling heat radiation and the product of specific heat are embodied is dissipated than air-cooled
The heat-carrying capacity of heat pattern will be higher by close to 2000 times, and therefore, liquid-cooling heat radiation inherently dissipates as server in the near future
The mainstream technology of heat.The fountain liquid-cooling system researched and developed by our company is directly to spray insulating and cooling liquid to server to send out
On the surface of thermal device or on spray to the extended surface being in contact with heating device, coolant liquid takes away what heating device was discharged
Waste heat, to carry out High Efficiency Thermal management to heating device.
Although the cooling efficiency of the above this fountain liquid-type cooling system is than the cooling efficiency of wind-cooling heat dissipating pattern
It is several orders of magnitude higher, still, the structure of traditional server is the framework suitable for wind-cooling heat dissipating pattern, and structure is simultaneously uncomfortable
For fountain liquid-cooling heat radiation mode, the low disadvantage of waste and integrated level to cause server internal space.
Utility model content
The purpose of this utility model is to provide one kind, and space availability ratio can be improved, reduces noise, reduction energy consumption, integrated level
Height, good heat dissipation effect, the fountain liquid cooling server that can prolong the service life.
The purpose of this utility model is realized by following technical measures:A kind of fountain liquid cooling server, including cabinet,
The board being built in cabinet and the electronic device on board, the cabinet mainly by the babinet of top surface opening and are set to case
Cover board composition in body opening, it is characterised in that:One is equipped on the inner face of the cover board for containing the close of insulating and cooling liquid
Spray cavity is closed, the closed spray cavity is equipped with the coolant inlet for introducing insulating and cooling liquid, and the coolant liquid
Entrance extends on cover board, and perforative spray apertures, the bottom plate of the babinet is distributed on the bottom surface of the closed spray cavity
It is equipped with cooling liquid outlet, insulating and cooling liquid enters from coolant inlet in closed spray cavity, passes through spray apertures spray to hair
On the electronic device of heat or the extended surface being in contact with it, heat caused by electronic device work is taken away, it is exhausted after heat absorption
Edge coolant liquid is flowed out from cooling liquid outlet, then by being back to coolant inlet after the cooling device cooling outside cabinet, so
Cycle.
The utility model uses fountain liquid refrigerating mode, instead of traditional wind-cooling heat dissipating pattern, due to not making
With fan, server internal space has been saved, has improved the space availability ratio of server, simultaneously as the utility model is using spray
Liquid cooling mode is drenched, the radiator used in the extended surface of electronic device can reduce, can be with so that the height of cabinet reduces
Even closer device layout is formed in original framework space, integrated level is high, improves the computing capability of server, experience
Card, the utility model improve about four times compared to performance in the air-cooled server unit space of tradition.Moreover, because the utility model
Fan is not used, noise is reduced, optimizes the working environment of operating personnel, while reducing the power consumption of server.
In addition, the good heat dissipation effect of the utility model, the operating temperature rise of electronic device is substantially reduced, and server internal device temperature
Uniformity and stability it is preferable, keep the device in server to be operated in most efficient temperature range, reduce power consumption, and extend
Service life.
As a kind of preferred embodiment of the utility model, it is located at the spray of the surface of the bigger electronic device of calorific value
Leaching hole is arranged more intensive;The lower peritreme of the spray apertures extends downwardly as short tubular, and the cross section of the spray apertures is side
Shape, circle or polygon or the spray apertures are up big and down small bullet.
As a kind of improvement of the utility model, the electronic device on the board includes processor, hard disk, memory, is
Bus of uniting and power supply, the power supply include outer casing of power supply and heating device on its interior, and feed liquor is equipped on outer casing of power supply
Hole and fluid hole, insulating and cooling liquid are flowed into outer casing of power supply from inlet opening and are cooled down to heating device, then are flowed out from fluid hole
Into babinet.The insulating and cooling liquid of this programme can be directly to spray the insulating and cooling liquid flowed down, can also be including directly spraying
The insulating and cooling liquid flowed down and the insulating and cooling liquid for having passed through other electronic devices, wherein have passed through other electronic devices
Insulating and cooling liquid the related heating device of power source internal is cooled down to fluid hole by the inlet opening of outer casing of power supply again, this
Refer to the case where power supply is not at same layer with other heating devices.
Fountain liquid cooling server described in the utility model further includes the power supply being located at outside cabinet, and the power supply includes power supply
Shell and heating device on its interior are equipped with inlet opening and fluid hole, the heater in outer casing of power supply on outer casing of power supply
Part is flowed into from inlet opening by the insulating and cooling liquid sprayed outside cabinet and is cooled down again from fluid hole outflow.
Hard disk described in the utility model is directly by insulating and cooling liquid spray cooling, or by being set to hard disk heating surface simultaneously
It is close to therewith after the heat derives to cabinet inside or outside that conductive structure generates hard disk again by insulating and cooling liquid to heat conduction
Structure carries out spray cooling.
As the utility model recommend embodiment, the conductive structure be high-performance heat transfer components or thermally conductive sheet or
Conductive structure described in person is made of thermally conductive sheet external radiator or the conductive structure is by high-performance heat transfer components external radiator
Composition.
Cover board described in the utility model is made into integration with closed spray cavity, and the top surface of closed spray cavity is cover board
Inner face or the cover board and closed spray cavity are independently arranged, and the closed spray cavity is fixed on the inside of the cover board.
The utility model adds pcb board in the cabinet, and the pcb board is set to traditional server fan and vent passages
Position on, the pcb board is equipped with chip and its extended surface, the chip be newly-increased chip or be original chip,
Or including newly-increased chip and original chip, and is removing multilayer traditional server fan and/or reducing the expansion of electronic device
After opening up surface, the height of cabinet can be reduced so that server internal spaces compact greatly improves the calculating of server unit space
Ability.
In order to which the temperature to each electronic device of server is precisely controlled, as a further improvement of the utility model,
Fluid temperature induction system is equipped in cabinet, the fluid temperature induction system includes controller, is set in coolant inlet
Control valve and the temperature sensor that is arranged on the electronic device, cooling liquid outlet of fever, the temperature sensor, control valve
It is connected respectively with controller, each temperature sensor acquires the temperature signal at the electronic device and cooling liquid outlet of fever simultaneously respectively
It is sent to controller, the temperature for entering the insulating and cooling liquid of coolant inlet is controlled by controller, is controlled simultaneously
The aperture of control valve enters the flow of the closed insulating and cooling liquid for spraying cavity to adjust, cold to electronic device spray to realize
But automatic adjustment.
As preferred embodiments of the present invention, the insulating and cooling liquid is mineral oil, silicone oil or fluorination liquid etc.,
In practical application, as long as insulating and cooling liquid heat conductive insulating.
The utility model can also do following improvement, and multiple fountain liquid cooling servers are positioned over same cabinet
In, each cabinet is matched with fountain liquid-cooling system, i.e., the described fountain liquid-cooling system includes circulation line, is set to
Radiator, fuel tank on circulation line and coolant liquid Circulated power system, each fountain liquid cooling server is cold in each cabinet
But liquid entrance and cooling liquid outlet are connected to fountain liquid cooling system by oil inlet on the cabinet where it and oil return opening
In the circulation line of system;The controller collection of the fluid temperature induction system of each fountain liquid cooling server is integrally formed composition control
System carries out automatically controlling the working condition of fountain liquid-cooling system entirety by control system.
Compared with prior art, the utility model has following significant effect:
(1) the utility model uses fountain liquid refrigerating mode, instead of traditional wind-cooling heat dissipating pattern, due to not having
Using fan, the inner space of server has been saved, has improved the space availability ratio of server, i.e. one layer of traditional server Central Plains
Position for placing fan can be used for placing pcb board, in addition, high density server number of fans is more, it is sometimes desirable to be divided into
Two layers of placement, after removing fan, can reduce server height, simultaneously as the utility model uses spray liquid cooling mode,
Radiator used in the extended surface of electronic device can reduce, so that the height of cabinet reduces, it therefore, can be in tradition
Even closer device layout is formed in the original framework space of server, integrated level is high, improves the computing capability of server,
Verified, the utility model improves about four times compared to performance in the air-cooled server unit space of tradition.
(2), since the utility model does not use fan, noise is reduced, optimizes the working environment of operating personnel, simultaneously
Reduce the power consumption of server.
(3) the operating temperature rise of the good heat dissipation effect of the utility model, electronic device is substantially reduced, and server internal device
The uniformity and stability of part temperature are preferable, and the device in server is kept to be operated in most efficient temperature range, reduce power consumption,
And prolong the service life.
Description of the drawings
The utility model is described in further detail in the following with reference to the drawings and specific embodiments.
Fig. 1 is one of overall structure diagram of the utility model;
Fig. 2 is two (removing side plate) of the overall structure diagram of the utility model;
Fig. 3 is three (removing side plate, cover board and closed spray cavity) of the overall structure diagram of the utility model;
Fig. 4 is the structural schematic diagram of the closed spray cavity of the utility model.
Specific implementation mode
As shown in figures 1-4, a kind of fountain liquid cooling server, including cabinet 1, the board 2 that is built in cabinet 1 and set
Electronic device on board 2, cabinet 1 is mainly by the babinet 11 of top surface opening and 12 groups of the cover board in the opening of babinet 11
At equipped with a closed spray cavity 3 for containing insulating and cooling liquid on the inner face of cover board 12, insulating and cooling liquid can be mine
Object oil, silicone oil or fluorination liquid etc., as long as insulating and cooling liquid heat conductive insulating.In the present embodiment, cover board 12 and closed spray
Cavity 3 is made into integration, and the top surface of closed spray cavity 3 is the inner face of cover board 12, in other embodiments, cover board 12 and closed
Spray cavity 3 can also be independently arranged, and closed spray cavity 3 is fixed on 12 inside of cover board.Closed spray cavity 3 is equipped with
Coolant inlet 4 for introducing insulating and cooling liquid, and coolant inlet 4 extends on cover board, at the bottom of closed spray cavity 3
Perforative spray apertures 5 are distributed on face, the spray apertures 5 of the surface of the electronic device bigger positioned at calorific value are arranged closeer
Collection;The lower peritreme of spray apertures 5 extends downwardly as short tubular, and specifically, the cross section of spray apertures can be rectangular, round or more
The shapes such as side shape, or when requiring cooling liquid speed big, spray apertures can be designed to up big and down small bullet.The bottom plate of babinet 11
It is equipped with cooling liquid outlet 6, insulating and cooling liquid enters in closed spray cavity 3 from coolant inlet 4, sprayed by spray apertures 5
On to the electronic device or the extended surface that is in contact with it of fever, by electronic device work caused by heat take away, after heat absorption
Insulating and cooling liquid flowed out from cooling liquid outlet 6, then by being back to coolant inlet after the cooling of cooling device outside cabinet
4, so recycle.
Electronic device on server board 2 includes processor 7, hard disk 8, memory, system bus and power supply 9, and power supply 9 wraps
Outer casing of power supply and heating device on its interior are included, inlet opening and fluid hole, insulation cooling are respectively equipped on outer casing of power supply
Liquid is flowed into outer casing of power supply from inlet opening and is cooled down to heating device, then is flowed out in babinet from fluid hole.Preferably, feed liquor
Hole is located at the top surface of outer casing of power supply, and fluid hole is then located on the bottom surface of outer casing of power supply.In other embodiments, fountain liquid cooling
The power supply of server is located at outside cabinet, and power supply includes outer casing of power supply and heating device on its interior, is set on outer casing of power supply
There are inlet opening and fluid hole, the heating device in outer casing of power supply is flowed by the insulating and cooling liquid sprayed outside cabinet from inlet opening
It is cooled down again from fluid hole outflow.
Hard disk 8 is directly by insulating and cooling liquid spray cooling, or by set on 8 heating surface of hard disk and that is close to therewith lead
Heat structure again will spray conductive structure by insulating and cooling liquid after heat derives to cabinet inside or outside that hard disk generates
Leaching heat dissipation.Solid state disk, helium hard disk etc. can take above two radiating mode, mechanical hard disk preferably to be dissipated by conductive structure
Heat.Specifically, conductive structure can be high-performance heat transfer components or thermally conductive sheet or conductive structure by thermally conductive sheet external radiator
Composition or conductive structure are made of high-performance heat transfer components external radiator.
The utility model adds pcb board in cabinet 1, and pcb board is set to the position of traditional server fan and vent passages
On, pcb board is equipped with chip and its extended surface, and chip is newly-increased chip or is original chip or including newly-increased core
Piece and original chip, and after removing multilayer traditional server fan and/or reducing the extended surface of electronic device, can reduce
The height of cabinet has saved server internal space, improves the space availability ratio of server, simultaneously as the utility model is adopted
With liquid cooling mode is sprayed, the radiator used in the extended surface of electronic device can reduce, so that the height of cabinet reduces,
Even closer device layout can be formed in original framework space, integrated level is high, improves the computing capability of server.
In order to which the temperature to each electronic device of server is precisely controlled, fluid temperature induction system is equipped in cabinet 1
System, fluid temperature induction system include controller, the control valve in coolant inlet and be arranged fever electronic device,
Temperature sensor on cooling liquid outlet, temperature sensor, control valve are connected with controller respectively, and each temperature sensor is adopted respectively
Collect the temperature signal at the electronic device and cooling liquid outlet of fever and be sent to controller, is cooled down by controller to entering
The temperature of the insulating and cooling liquid of liquid entrance is controlled, while controlling the aperture of control valve to adjust into closed spray cavity
The flow of insulating and cooling liquid, to realize the automatic adjustment to electronic device spraying cooling.
Multiple fountain liquid cooling servers are positioned in same cabinet, and each cabinet matches with fountain liquid-cooling system
It closes, i.e., fountain liquid-cooling system includes that circulation line, the radiator on circulation line, fuel tank and coolant liquid cycle are dynamic
Force system, the coolant inlet 4 of each fountain liquid cooling server and cooling liquid outlet 6 pass through the cabinet where it in each cabinet
On oil inlet and oil return opening be connected in the circulation line of fountain liquid-cooling system;The liquid of each fountain liquid cooling server
The controller collection of temperature induction system is integrally formed composition control system, whole to fountain liquid-cooling system by control system
The working condition of body carries out automatically controlling.
The course of work of the utility model is as follows:
(1) before server start-up operation, fountain liquid-cooling system starts, when server formally starts, service
Core devices in device start to generate heat, and the insulating and cooling liquid of fountain liquid-cooling system is transferred to closed by coolant inlet
It in spray chamber body, is sprayed on the electronic device of fever by spray apertures, and electronic device is cooled down, the insulation after heat absorption
Coolant liquid is transported to outside server by cooling liquid outlet and carries out cooling, and insulating and cooling liquid after cooling reenters spray
Leaching formula liquid-cooling system is again introduced into the heat absorption of fountain liquid cooling server, so recycles.
(2) the fluid temperature induction system of server internal setting is monitored each heating device temperature of server, cooperates with
Control system controls the start and stop etc. of fountain liquid-cooling system.
(3) control valve, the set-up of control system spray speed of fountain liquid-cooling system are set at server coolant inlet
Control module is spent, control valve is controlled according to each part temperatures of the server of feedback, adjusts and enters closed spray cavity
Fluid flow.
The embodiment of the utility model is without being limited thereto, the above according to the present utility model, according to the general of this field
Logical technological know-how and customary means, under the premise of not departing from the utility model above-mentioned basic fundamental thought, the utility model is closed
Spray distribution form on closed spray cavity bottom surface of the concrete structure and set-up mode, spray apertures of cavity, spray apertures shape
Shape, insulating and cooling liquid etc. also have other embodiments, therefore the utility model can also make other diversified forms
Modification is replaced or is changed, and is all fallen within the utility model rights protection scope.
Claims (10)
1. a kind of fountain liquid cooling server, including cabinet, the board that is built in cabinet and the electronic device on board,
The cabinet is mainly made of the babinet and the cover board on box opening of top surface opening, it is characterised in that:In the cover board
Inner face be equipped with one for containing the closed spray cavity of insulating and cooling liquid, the closed spray cavity is equipped with for introducing
The coolant inlet of insulating and cooling liquid, and the coolant inlet extends on cover board, in the bottom surface of the closed spray cavity
On be distributed with perforative spray apertures, the bottom plate of the babinet is equipped with cooling liquid outlet, insulating and cooling liquid from coolant inlet into
Enter in closed spray cavity, by spray apertures spray to the electronic device or the extended surface that is in contact with it of fever, by electronics
Device work caused by heat take away, the insulating and cooling liquid after heat absorption from cooling liquid outlet flow out, then by cabinet outside
It is back to coolant inlet after cooling device cooling, is so recycled.
2. fountain liquid cooling server according to claim 1, it is characterised in that:The electronic device bigger positioned at calorific value
The spray apertures of surface arrange more intensive;The lower peritreme of the spray apertures extends downwardly as short tubular, the spray apertures
Cross section be rectangular, round or polygon or the spray apertures are up big and down small bullet.
3. fountain liquid cooling server according to claim 2, it is characterised in that:Electronic device on the board includes
Processor, hard disk, memory, system bus and power supply, the power supply include outer casing of power supply and heating device on its interior,
Outer casing of power supply is equipped with inlet opening and fluid hole, and insulating and cooling liquid flows into cold to heating device progress in outer casing of power supply from inlet opening
But it, then from fluid hole flows out in babinet;Or the fountain liquid cooling server further includes the power supply being located at outside cabinet, it is described
Power supply includes outer casing of power supply and heating device on its interior, inlet opening and fluid hole is equipped on outer casing of power supply, outside power supply
Heating device in shell is flowed by the insulating and cooling liquid sprayed outside cabinet from inlet opening to be cooled down from fluid hole outflow again.
4. fountain liquid cooling server according to claim 3, it is characterised in that:The hard disk is directly by insulating and cooling liquid
Spray cooling, or the heat derives by generating hard disk set on hard disk heating surface and the conductive structure be close to therewith are to machine
Case either internally or externally after again by insulating and cooling liquid to conductive structure carry out spray cooling.
5. fountain liquid cooling server according to claim 4, it is characterised in that:The conductive structure is efficient heat transfer member
Part or thermally conductive sheet or the conductive structure are by thermally conductive sheet external radiator group or the conductive structure by efficient heat transfer
Element external radiator forms.
6. fountain liquid cooling server according to claim 5, it is characterised in that:The cover board and closed spray cavity one
System is at the top surface of closed spray cavity is that the inner face of cover board or the cover board and closed spray cavity are independently arranged, institute
Closed spray cavity is stated to be fixed on the inside of the cover board.
7. fountain liquid cooling server according to claim 6, it is characterised in that:Pcb board, institute are added in the cabinet
Pcb board is stated on the position of traditional server fan and vent passages, the pcb board is equipped with chip and its extended surface,
The chip is newly-increased chip or is original chip or including newly-increased chip and original chip, and is removing multilayer
After the extended surface of traditional server fan and/or reduction electronic device, the height of cabinet can be reduced so that server internal is empty
Between it is compact.
8. fountain liquid cooling server according to claim 7, it is characterised in that:Fluid temperature is equipped in cabinet to incude
System, the fluid temperature induction system include controller, the control valve in coolant inlet and are arranged the electricity in fever
Temperature sensor on sub- device, cooling liquid outlet, the temperature sensor, control valve are connected with controller respectively, each temperature
Sensor acquires the temperature signal at the electronic device and cooling liquid outlet of fever and is sent to controller respectively, by controlling
Device controls the temperature for entering the insulating and cooling liquid of coolant inlet, while controlling the aperture of control valve to adjust into close
The flow for closing the insulating and cooling liquid of spray cavity, to realize the automatic adjustment to electronic device spraying cooling.
9. according to claim 1~8 any one of them fountain liquid cooling server, it is characterised in that:Multiple sprays
Formula liquid cooling server is positioned in same cabinet, and each cabinet is matched with fountain liquid-cooling system, i.e., the described fountain liquid
Body cooling system includes circulation line, the radiator on circulation line, fuel tank and coolant liquid Circulated power system, each cabinet
In each fountain liquid cooling server coolant inlet and cooling liquid outlet by oil inlet on the cabinet where it and return
Hydraulic fluid port is connected in the circulation line of fountain liquid-cooling system;The fluid temperature induction system of each fountain liquid cooling server
Controller collection be integrally formed composition control system, by control system to the working condition of fountain liquid-cooling system entirety into
Row automatically controls.
10. fountain liquid cooling server according to claim 9, it is characterised in that:The insulating and cooling liquid be mineral oil,
Silicone oil or fluorination liquid.
Priority Applications (1)
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CN201820161928.1U CN207780709U (en) | 2018-01-29 | 2018-01-29 | A kind of fountain liquid cooling server |
Applications Claiming Priority (1)
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CN201820161928.1U CN207780709U (en) | 2018-01-29 | 2018-01-29 | A kind of fountain liquid cooling server |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108563305A (en) * | 2018-01-29 | 2018-09-21 | 广东合新材料研究院有限公司 | A kind of fountain liquid cooling server |
CN113690205A (en) * | 2021-09-26 | 2021-11-23 | 深圳市铨天科技有限公司 | Chip heat dissipation packaging structure |
CN114144016A (en) * | 2020-09-03 | 2022-03-04 | 中国联合网络通信集团有限公司 | Cabinet cooling system and control method thereof |
CN115190736A (en) * | 2022-06-02 | 2022-10-14 | 超聚变数字技术有限公司 | Computing equipment and cabinet |
CN115449576A (en) * | 2022-10-19 | 2022-12-09 | 中冶华天工程技术有限公司 | Automatic thermal induction blast furnace late stage spraying cooling equipment and implementation method |
CN115942697A (en) * | 2022-11-29 | 2023-04-07 | 珠海科创储能科技有限公司 | Temperature control system and method suitable for immersed liquid cooling energy storage system |
-
2018
- 2018-01-29 CN CN201820161928.1U patent/CN207780709U/en active Active
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108563305A (en) * | 2018-01-29 | 2018-09-21 | 广东合新材料研究院有限公司 | A kind of fountain liquid cooling server |
CN108563305B (en) * | 2018-01-29 | 2023-12-19 | 广东西江数据科技有限公司 | Spray type liquid cooling server |
CN114144016A (en) * | 2020-09-03 | 2022-03-04 | 中国联合网络通信集团有限公司 | Cabinet cooling system and control method thereof |
CN114144016B (en) * | 2020-09-03 | 2024-07-26 | 中国联合网络通信集团有限公司 | Cabinet cooling system and control method thereof |
CN113690205A (en) * | 2021-09-26 | 2021-11-23 | 深圳市铨天科技有限公司 | Chip heat dissipation packaging structure |
CN113690205B (en) * | 2021-09-26 | 2024-02-02 | 深圳市铨天科技有限公司 | Chip heat dissipation packaging structure |
CN115190736A (en) * | 2022-06-02 | 2022-10-14 | 超聚变数字技术有限公司 | Computing equipment and cabinet |
CN115449576A (en) * | 2022-10-19 | 2022-12-09 | 中冶华天工程技术有限公司 | Automatic thermal induction blast furnace late stage spraying cooling equipment and implementation method |
CN115942697A (en) * | 2022-11-29 | 2023-04-07 | 珠海科创储能科技有限公司 | Temperature control system and method suitable for immersed liquid cooling energy storage system |
CN115942697B (en) * | 2022-11-29 | 2024-01-30 | 珠海科创储能科技有限公司 | Temperature control system and method suitable for immersed liquid cooling energy storage system |
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