CN113690205A - Chip heat dissipation packaging structure - Google Patents
Chip heat dissipation packaging structure Download PDFInfo
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- CN113690205A CN113690205A CN202111128582.8A CN202111128582A CN113690205A CN 113690205 A CN113690205 A CN 113690205A CN 202111128582 A CN202111128582 A CN 202111128582A CN 113690205 A CN113690205 A CN 113690205A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 61
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 16
- 239000000110 cooling liquid Substances 0.000 claims abstract description 41
- 238000001704 evaporation Methods 0.000 claims abstract description 8
- 230000008020 evaporation Effects 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000007788 liquid Substances 0.000 claims description 59
- 230000005540 biological transmission Effects 0.000 claims description 51
- 238000003860 storage Methods 0.000 claims description 35
- 238000005507 spraying Methods 0.000 claims description 23
- 238000004140 cleaning Methods 0.000 claims description 18
- 239000002826 coolant Substances 0.000 claims description 17
- 239000000428 dust Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 239000007921 spray Substances 0.000 claims description 11
- 230000009347 mechanical transmission Effects 0.000 claims description 10
- 230000005855 radiation Effects 0.000 claims description 8
- 238000007664 blowing Methods 0.000 claims description 4
- 239000011550 stock solution Substances 0.000 claims description 4
- 230000033001 locomotion Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000004071 soot Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention is suitable for the technical field of chips, and particularly relates to a chip heat dissipation packaging structure, which comprises a circuit board, a chip and a mounting part, wherein the chip is mounted on the surface of the circuit board, and the chip heat dissipation packaging structure also comprises: the fixing component is arranged on the mounting piece and used for stably arranging the mounting piece on the circuit board; and the heat conducting piece is used for absorbing the heat of the chip. By arranging the heat dissipation structure, the cooling liquid can be uniformly sprayed on the surface of the heat conducting piece in the process that the telescopic piece drives the heat conducting piece to move, and air flow blown to the surface of the heat conducting piece can be produced, so that the evaporation of the cooling liquid on the heat conducting piece is accelerated, the heat dissipation of the heat conducting piece is accelerated, and the heat dissipation efficiency of the packaging structure is improved.
Description
Technical Field
The invention relates to the technical field of chips, in particular to a chip heat dissipation packaging structure.
Background
Chips are a general term for semiconductor device products, and a large number of chips are used in electronic and electrical products. The chip has high integration level and high processing speed, and can help the product to realize miniaturization and integration. When the chip is put into use, the chip needs to be installed at a specific position on a circuit board, but because the chip is high in energy consumption and large in heat productivity and the installation position is closed, the heat dissipation efficiency of the chip is low, and the working efficiency and the service life of the chip are seriously affected.
The heat dissipation measures in the existing chip packaging structure are difficult to dissipate the heat of the chip efficiently, so that the heat dissipation efficiency of the chip is low, and the service life of the chip is seriously reduced.
Disclosure of Invention
The embodiment of the invention aims to provide a chip heat dissipation packaging structure, aiming at solving the following problems: the heat dissipation measures in the existing chip packaging structure are difficult to dissipate the heat of the chip efficiently, so that the heat dissipation efficiency of the chip is low, and the service life of the chip is seriously reduced.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a chip heat dissipation packaging structure, includes circuit board, chip and installed part, and the chip mounting is on the surface of circuit board, chip heat dissipation packaging structure still includes:
the fixing component is arranged on the mounting piece and used for stably arranging the mounting piece on the circuit board;
the heat conducting piece is used for absorbing the heat of the chip;
the telescopic piece is arranged on the surface of the mounting piece, is used for mounting the heat conducting piece and can drive the heat conducting piece to move; and
the heat radiation structure is arranged on the mounting part and the heat conducting part, the cooling liquid is stored in the heat radiation structure, the heat radiation structure is used for driving the heat conducting part to move at the telescopic part, the cooling liquid is uniformly sprayed on the surface of the heat conducting part, the heat conducting part can be used as power input and is matched with mechanical transmission to produce airflow blowing to the surface of the heat conducting part, the evaporation of the cooling liquid on the heat conducting part is accelerated, and the heat dissipation of the heat conducting part is accelerated.
Further, the fixing assembly includes:
the third transmission piece is rotatably connected to the surface of the mounting piece;
the first moving part is arranged on the surface of the third transmission part, and the third transmission part is used for driving the first moving part to move;
the limiting piece is connected to the first movable piece, and the first movable piece is used for driving the limiting piece to move; and
the retaining member is connected with the side of circuit board, and the locating part is used for driving the retaining member and removes, and can also inject the position of retaining member, and the retaining member is used for the centre gripping circuit board.
Further, the heat dissipation structure includes:
the spraying assembly is arranged on the mounting piece and the heat conducting piece and is used for uniformly spraying cooling liquid on the surface of the heat conducting piece in the process that the telescopic piece drives the heat conducting piece to move; and
and the airflow manufacturing assembly is arranged on the outer sides of the heat conducting member and the mounting member and is used for manufacturing airflow blown to the surface of the heat conducting member by taking the heat conducting member as power input and matching with mechanical transmission when the heat conducting member moves.
Further, the spray assembly includes:
the first liquid storage part is connected to the surface of the mounting part and used for storing cooling liquid;
a liquid feeding member communicated with the inside of the cooling liquid;
the second liquid storage part is connected to the outer side of the mounting part, the liquid conveying part is used for conveying the cooling liquid in the first liquid storage part into the second liquid storage part, the control part is mounted on the outer side of the liquid conveying part, and the control part is used for avoiding backflow of the cooling liquid;
the spraying part is communicated with the interior of the second liquid storage part; and
the extruded piece sets up on heat-conducting piece and second stock solution piece for use heat-conducting piece to extrude the coolant liquid in the second stock solution piece as power input, make the coolant liquid by the impressing spray in the piece, spray the piece and be used for spraying the coolant liquid on the surface of heat-conducting piece.
Further, the gas flow manufacturing assembly comprises:
a gas flow making member for making a gas flow;
the rotating part is rotatably arranged on the surface of the mounting part, is used for mounting the airflow manufacturing part and can also drive the airflow manufacturing part to rotate;
the second transmission part is arranged on the outer side of the rotating part and used for driving the rotating part to move;
the first transmission piece is connected with the second transmission piece and used for driving the second transmission piece to move; and
the traction part is connected to the heat conduction part and used for driving the first transmission part to move by taking the heat conduction part as power input.
Further, the chip heat dissipation package structure further includes: the dust cleaning component is arranged on the heat dissipation structure, is in contact with the surface of the circuit board, and is used for cleaning dust on the surface of the circuit board by taking the heat dissipation structure as power input and matching with mechanical transmission.
Further, the deashing subassembly includes:
the ash cleaning piece is contacted with the surface of the circuit board and is used for cleaning dust on the surface of the circuit board;
the second movable part is used for installing the ash removal part and can also drive the ash removal part to move;
the fourth transmission piece is arranged on the heat dissipation structure, is used for installing the second moving piece, and is also used for driving the second moving piece to move by taking the heat dissipation structure as power input; and
and the guide piece is arranged on the surface of the mounting piece and used for limiting the motion track of the second movable piece.
According to the chip heat dissipation packaging structure provided by the invention, by arranging the heat dissipation structure, the cooling liquid can be uniformly sprayed on the surface of the heat conducting piece in the process that the telescopic piece drives the heat conducting piece to move, and air flow blown to the surface of the heat conducting piece can be generated, so that the evaporation of the cooling liquid on the heat conducting piece is accelerated, the heat dissipation of the heat conducting piece is accelerated, and the heat dissipation efficiency of the packaging structure is improved.
Drawings
Fig. 1 is a schematic structural diagram of a chip heat dissipation package structure.
Fig. 2 is a schematic partial structure diagram of a heat dissipation structure in a chip heat dissipation package structure.
Fig. 3 is a schematic partial structure diagram of a spray assembly in a chip heat dissipation package structure.
Fig. 4 is a partial structure diagram of a fixing component in a chip heat dissipation packaging structure.
In the figure: 1. a mounting member; 2. a heat dissipation structure; 21. a spray assembly; 211. a control member; 212. a first liquid storage member; 213. a liquid feeding part; 214. a second reservoir; 215. an extrusion; 216. a spraying member; 22. a gas flow producing assembly; 221. an air guide member; 222. a first transmission member; 223. a second transmission member; 224. a rotating member; 225. an air stream producing member; 226. a pulling member; 3. a fixing assembly; 31. a first movable member; 32. a third transmission member; 33. a limiting member; 34. a locking member; 4. a soot cleaning assembly; 41. a guide member; 42. a fourth transmission member; 43. a second movable member; 44. a soot cleaning member; 5. a circuit board; 6. a chip; 7. a telescoping member; 8. a heat conductive member; 9. and (6) cooling the liquid.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Specific implementations of the present invention are described in detail below with reference to specific embodiments.
As shown in fig. 1 to 4, a chip heat dissipation package structure provided in an embodiment of the present invention includes a circuit board 5, a chip 6, and a mounting member 1, where the chip 6 is mounted on a surface of the circuit board 5, and the chip heat dissipation package structure further includes:
a fixing member 3 mounted on the mounting member 1 for stably disposing the mounting member 1 on the circuit board 5;
a heat-conducting member 8 for absorbing heat of the chip 6;
the telescopic piece 7 is arranged on the surface of the mounting piece 1, is used for mounting the heat conducting piece 8 and can also drive the heat conducting piece 8 to move; and
In an embodiment of the present invention, the mounting member 1 may be a supporting plate or a supporting block, the fixing member 3 may drive the clamping member to move through screw transmission, so that the clamping member can be clamped at two sides of the circuit board 5, and further, the mounting member 1 is stably connected to the circuit board 5, or the mounting member 1 may be fixed on the surface of the circuit board 5 through a threaded connection manner, preferably, the first manner may be a manner that the mounting member 1 can be conveniently fixed on circuit boards 5 of different sizes, the heat conducting member 8 may be a heat conducting plate or a heat conducting block, the telescopic member 7 may be an electric telescopic rod or a pneumatic telescopic rod, the heat dissipation structure 2 may compress the cooling liquid 9 in the closed space by the heat conducting member 8 moving when the telescopic member 7 drives the heat conducting member 8 to move, so that the cooling liquid 9 can be uniformly sprayed on the surface of the heat conducting member 8, and then use the heat-conducting member 8 as the power input and cooperate with mechanical transmission to produce the airstream blowing to the surface of the heat-conducting member 8, in order to accelerate the evaporation of the coolant on the heat-conducting member 8, accelerate the heat loss of the heat-conducting member 8, or contact the coolant 9 with the surface of the heat-conducting member 8 to take away the heat on the heat-conducting member 8 directly, drive the purpose that the heat-conducting member 8 moves through the flexible part 7, when the heat-conducting member 8 absorbs sufficient heat, make the heat-conducting member 8 not stick to chip 6 again, in order to avoid the heat-conducting member 8 to influence the heat dissipation of the chip 6.
As shown in fig. 1 and 4, in one embodiment of the present invention, the fixing assembly 3 includes:
a third transmission member 32 rotatably connected to the surface of the mounting member 1;
the first movable piece 31 is installed on the surface of the third transmission piece 32, and the third transmission piece 32 is used for driving the first movable piece 31 to move;
the limiting piece 33 is connected to the first movable piece 31, and the first movable piece 31 is used for driving the limiting piece 33 to move; and
the locking member 34 is connected with the side surface of the circuit board 5, the limiting member 33 is used for driving the locking member 34 to move, and can also limit the position of the locking member 34, and the locking member 34 is used for clamping the circuit board 5.
In this embodiment, the third driving medium 32 can be double-threaded rod or double thread lead screw, first moving part 31 can be thread circle or movable nut, locating part 33 can be connecting rod or bracing piece, retaining member 34 can be fixture block or limiting plate, when needs set up installed part 1 on circuit board 5 steadily, can rotate third driving medium 32, make two first moving parts 31 remove on third driving medium 32, and drive two locating parts 33 and be close to each other, thereby make retaining member 34 on the locating part 33 can support on circuit board 5, firmly grasp back with circuit board 5 at two retaining members 34, just can stably set up installed part 1 on circuit board 5.
As shown in fig. 1 to 3, in an embodiment of the present invention, the heat dissipation structure 2 includes:
the spraying assembly 21 is arranged on the mounting piece 1 and the heat conducting piece 8 and is used for uniformly spraying the cooling liquid 9 on the surface of the heat conducting piece 8 in the process that the telescopic piece 7 drives the heat conducting piece 8 to move; and
and the airflow manufacturing assembly 22 is arranged on the outer sides of the heat conducting member 8 and the mounting member 1 and is used for manufacturing airflow blown to the surface of the heat conducting member 8 by taking the heat conducting member 8 as power input and matching with mechanical transmission when the heat conducting member 8 moves.
In this embodiment, the spraying assembly 21 may make the heat conducting member 8 extrude the cooling liquid 9 in the enclosed space to spray the cooling liquid 9 on the surface of the heat conducting member 8 under pressure by making the heat conducting member 8 squeeze the cooling liquid 9 in the enclosed space in the process of driving the heat conducting member 8 to move by the expansion member 7, or may make the cooling liquid 9 be pumped by a water pump and sprayed on the surface of the heat conducting member 8, and the airflow manufacturing assembly 22 may drive the wind generating object to move by taking the heat conducting member 8 as power input and cooperating with gear transmission when the heat conducting member 8 moves, or directly drive the wind generating object to move by a motor, so that the airflow can be blown to the surface of the heat conducting member 8.
In this embodiment, the shower assembly 21 includes:
a first liquid storage part 212 connected to the surface of the mounting part 1 for storing the cooling liquid 9;
a liquid feeding member 213 communicating with the inside of the coolant 9;
the second liquid storage part 214 is connected to the outer side of the mounting part 1, the liquid conveying part 213 is used for conveying the cooling liquid 9 in the first liquid storage part 212 into the second liquid storage part 214, the control part 211 is installed on the outer side of the liquid conveying part 213, and the control part 211 is used for preventing the cooling liquid 9 from flowing back;
the spraying part 216 is communicated with the interior of the second liquid storage part 214; and
and the extruding part 215 is arranged on the heat conducting part 8 and the second liquid storage part 214 and is used for extruding the cooling liquid 9 in the second liquid storage part 214 by taking the heat conducting part 8 as power input so that the cooling liquid 9 is pressed into the spraying part 216, and the spraying part 216 is used for spraying the cooling liquid 9 on the surface of the heat conducting part 8.
In this embodiment, the first liquid storage part 212 may be a liquid storage tank or a liquid storage barrel, the liquid sending part 213 may be a communication pipe or a communication barrel, the control part 211 may be a one-way valve or an electromagnetic valve, the spraying part 216 may be a spraying pipe, the extrusion part 215 may be a piston plate or a piston block, the second liquid storage part 214 may be a liquid storage barrel or a liquid storage box, when the expansion part 7 drives the heat conducting part 8 to move upwards, the heat conducting part 8 drives the extrusion part 215 to extrude the cooling liquid 9 in the second liquid storage part 214, so that the cooling liquid 9 is pressed into the spraying part 216, and the cooling liquid 9 is sprayed on the surface of the heat conducting part 8 through the spraying part 216, and since the control part 211 is disposed outside the liquid sending part 213 communicated with the second liquid storage part 214, when the cooling liquid 9 is extruded, the cooling liquid does not flow back into the first liquid storage part 212, when the expansion part 7 drives the heat conducting part 8 to move downwards, the cooling liquid 9 in the first liquid storage part 212 is injected into the second liquid storage part 214 through the liquid sending part 213, to be ready for the next spray.
In this embodiment, the gas flow manufacturing assembly 22 includes:
a gas flow making member 225 for making a gas flow;
a rotating member 224 rotatably mounted on the surface of the mounting member 1 for mounting the airflow-making member 225 and further rotating the airflow-making member 225;
the second transmission piece 223 is arranged on the outer side of the rotating piece 224 and is used for driving the rotating piece 224 to move;
the first transmission piece 222 is connected with the second transmission piece 223 and is used for driving the second transmission piece 223 to move; and
the pulling member 226 is connected to the heat conducting member 8, and is configured to drive the first transmission member 222 to move by taking the heat conducting member 8 as a power input.
In this embodiment, the airflow making member 225 may be a fan blade, the rotating member 224 may be a rotating rod or a rotating column, the second transmission member 223 may be a transmission gear or a gear ring, the first transmission member 222 may be a transmission rack or a toothed plate, the traction member 226 may be a connecting plate or a traction block, the air guide member 221 is further obliquely disposed on the surface of the mounting member 1, and the air guide member 221 may be an air guide plate or an air guide block, when the heat conduction member 8 moves up and down, the heat conduction member 8 may drive the first transmission member 222 to move up and down, the first transmission member 222 may drive the second transmission member 223 and the rotating member 224 to rotate in the moving process, so that the rotating member 224 drives the airflow making member 225 to rotate, the airflow making member 225 makes an airflow, and the airflow blows towards the surface of the heat conduction member 8 under the guidance of the air guide member 221, thereby accelerating the evaporation of the cooling liquid 9 on the surface of the heat conduction member 8.
As shown in fig. 1 and 2, in an embodiment of the present invention, the chip heat dissipation package structure further includes: and the ash cleaning component 4 is arranged on the heat dissipation structure 2, is in contact with the surface of the circuit board 5, and is used for cleaning dust on the surface of the circuit board 5 by taking the heat dissipation structure 2 as power input and matching with mechanical transmission.
In this embodiment, the ash removing assembly 4 can drive the cleaning object to move on the surface of the circuit board 5 to clean the dust by using the heat dissipation structure 2 as power input and matching with the screw transmission mode when the heat dissipation structure 2 moves, and can also drive the cleaning object to move on the surface of the circuit board 5 by using the electric and pneumatic telescopic rods to clean the dust.
In this embodiment, the ash removal assembly 4 includes:
a dust removing member 44 contacting the surface of the circuit board 5 for removing dust on the surface of the circuit board 5;
the second movable member 43 is used for installing the ash removal member 44 and can also drive the ash removal member 44 to move;
the fourth transmission piece 42 is arranged on the heat dissipation structure 2, is used for installing the second movable piece 43, and is further used for driving the second movable piece 43 to move by taking the heat dissipation structure 2 as power input; and
and a guide member 41 installed on a surface of the mounting member 1 for defining a movement locus of the second movable member 43.
In this embodiment, the ash removing member 44 may be a cleaning brush or a cleaning cotton block, the second movable member 43 may be a threaded rod or a ball nut, the fourth transmission member 42 may be a threaded rod or a ball screw, the guide member 41 may be a guide sliding rail or a guide plate, and the second movable member 43 is slidably connected to the guide member 41, when the rotation member 224 rotates, the rotation member 224 may drive the fourth transmission member 42 to rotate, so that the second movable member 43 moves on the fourth transmission member 42, and the ash removing member 44 is driven to move on the surface of the circuit board 5 to remove the cleaning dust, thereby preventing the position on the surface of the circuit board 5 near the chip 6 from accumulating dust and affecting the normal heat dissipation of the chip 6.
The working mode of the invention is as follows: when the mounting member 1 needs to be stably arranged on the circuit board 5, the third transmission member 32 can be rotated, so that the two first movable members 31 move on the third transmission member 32 and drive the two limiting members 33 to approach each other, so that the locking members 34 on the limiting members 33 can abut against the circuit board 5, and after the circuit board 5 is firmly clamped by the two locking members 34, the mounting member 1 can be stably arranged on the circuit board 5;
when the telescopic member 7 drives the heat conducting member 8 to move upwards, the heat conducting member 8 drives the extrusion member 215 to extrude the coolant 9 in the second liquid storage member 214, so that the coolant 9 is pressed into the spraying member 216, and the coolant 9 is sprayed on the surface of the heat conducting member 8 through the spraying member 216, and because the control member 211 is arranged outside the liquid conveying member 213 communicated with the second liquid storage member 214, the coolant 9 does not flow back into the first liquid storage member 212 when being extruded, when the telescopic member 7 drives the heat conducting member 8 to move downwards, the coolant 9 in the first liquid storage member 212 is injected into the second liquid storage member 214 through the liquid conveying member 213 to prepare for next spraying, when the heat conducting member 8 moves upwards and downwards, the heat conducting member 8 drives the first transmission member 222 to move upwards and downwards, the first transmission member 222 drives the second transmission member 223 and the rotating member 224 to rotate, so that the rotating member 224 drives the airflow making member 225 to rotate, the airflow making member 225 makes an airflow, and the airflow is guided by the air guiding member 221 and blown to the surface of the heat conducting member 8, thereby accelerating the evaporation of the cooling liquid 9 on the surface of the heat conducting member 8;
when the rotating member 224 rotates, the rotating member 224 drives the fourth transmission member 42 to rotate, so that the second movable member 43 moves on the fourth transmission member 42 and drives the ash removing member 44 to move on the surface of the circuit board 5 to remove the cleaning dust, thereby preventing the dust from accumulating on the surface of the circuit board 5 near the chip 6 and affecting the normal heat dissipation of the chip 6.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. The utility model provides a chip heat dissipation packaging structure, includes circuit board, chip and installed part, and the chip mounting is on the surface of circuit board, its characterized in that, chip heat dissipation packaging structure still includes:
the fixing component is arranged on the mounting piece and used for stably arranging the mounting piece on the circuit board;
the heat conducting piece is used for absorbing the heat of the chip;
the telescopic piece is arranged on the surface of the mounting piece, is used for mounting the heat conducting piece and can drive the heat conducting piece to move; and
the heat radiation structure is arranged on the mounting part and the heat conducting part, the cooling liquid is stored in the heat radiation structure, the heat radiation structure is used for driving the heat conducting part to move at the telescopic part, the cooling liquid is uniformly sprayed on the surface of the heat conducting part, the heat conducting part can be used as power input and is matched with mechanical transmission to produce airflow blowing to the surface of the heat conducting part, the evaporation of the cooling liquid on the heat conducting part is accelerated, and the heat dissipation of the heat conducting part is accelerated.
2. The chip heat dissipation package structure of claim 1, wherein the fixing assembly comprises:
the third transmission piece is rotatably connected to the surface of the mounting piece;
the first moving part is arranged on the surface of the third transmission part, and the third transmission part is used for driving the first moving part to move;
the limiting piece is connected to the first movable piece, and the first movable piece is used for driving the limiting piece to move; and
the retaining member is connected with the side of circuit board, and the locating part is used for driving the retaining member and removes, and can also inject the position of retaining member, and the retaining member is used for the centre gripping circuit board.
3. The chip heat dissipation package structure of claim 1, wherein the heat dissipation structure comprises:
the spraying assembly is arranged on the mounting piece and the heat conducting piece and is used for uniformly spraying cooling liquid on the surface of the heat conducting piece in the process that the telescopic piece drives the heat conducting piece to move; and
and the airflow manufacturing assembly is arranged on the outer sides of the heat conducting member and the mounting member and is used for manufacturing airflow blown to the surface of the heat conducting member by taking the heat conducting member as power input and matching with mechanical transmission when the heat conducting member moves.
4. The chip heat dissipation package structure of claim 3, wherein the spray assembly comprises:
the first liquid storage part is connected to the surface of the mounting part and used for storing cooling liquid;
a liquid feeding member communicated with the inside of the cooling liquid;
the second liquid storage part is connected to the outer side of the mounting part, the liquid conveying part is used for conveying the cooling liquid in the first liquid storage part into the second liquid storage part, the control part is mounted on the outer side of the liquid conveying part, and the control part is used for avoiding backflow of the cooling liquid;
the spraying part is communicated with the interior of the second liquid storage part; and
the extruded piece sets up on heat-conducting piece and second stock solution piece for use heat-conducting piece to extrude the coolant liquid in the second stock solution piece as power input, make the coolant liquid by the impressing spray in the piece, spray the piece and be used for spraying the coolant liquid on the surface of heat-conducting piece.
5. The chip heat dissipation package structure of claim 3, wherein the airflow manufacturing assembly comprises:
a gas flow making member for making a gas flow;
the rotating part is rotatably arranged on the surface of the mounting part, is used for mounting the airflow manufacturing part and can also drive the airflow manufacturing part to rotate;
the second transmission part is arranged on the outer side of the rotating part and used for driving the rotating part to move;
the first transmission piece is connected with the second transmission piece and used for driving the second transmission piece to move; and
the traction part is connected to the heat conduction part and used for driving the first transmission part to move by taking the heat conduction part as power input.
6. The chip heat dissipation package structure of claim 1, further comprising: the dust cleaning component is arranged on the heat dissipation structure, is in contact with the surface of the circuit board, and is used for cleaning dust on the surface of the circuit board by taking the heat dissipation structure as power input and matching with mechanical transmission.
7. The chip heat dissipation package structure of claim 6, wherein the ash removal assembly comprises:
the ash cleaning piece is contacted with the surface of the circuit board and is used for cleaning dust on the surface of the circuit board;
the second movable part is used for installing the ash removal part and can also drive the ash removal part to move;
the fourth transmission piece is arranged on the heat dissipation structure, is used for installing the second moving piece, and is also used for driving the second moving piece to move by taking the heat dissipation structure as power input; and
and the guide piece is arranged on the surface of the mounting piece and used for limiting the motion track of the second movable piece.
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| CN202111128582.8A CN113690205B (en) | 2021-09-26 | 2021-09-26 | Chip heat dissipation packaging structure |
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| CN202111128582.8A CN113690205B (en) | 2021-09-26 | 2021-09-26 | Chip heat dissipation packaging structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117729741A (en) * | 2023-11-13 | 2024-03-19 | 江苏佰睿安新能源科技有限公司 | Heat radiation structure for printed circuit board |
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| CN113690205B (en) | 2024-02-02 |
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