CN112445312A - Computer power supply with good heat dissipation effect and use method thereof - Google Patents
Computer power supply with good heat dissipation effect and use method thereof Download PDFInfo
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- CN112445312A CN112445312A CN202011315987.8A CN202011315987A CN112445312A CN 112445312 A CN112445312 A CN 112445312A CN 202011315987 A CN202011315987 A CN 202011315987A CN 112445312 A CN112445312 A CN 112445312A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 61
- 230000000694 effects Effects 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 11
- 239000000110 cooling liquid Substances 0.000 claims abstract description 79
- 239000007921 spray Substances 0.000 claims abstract description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000000741 silica gel Substances 0.000 claims abstract description 6
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 6
- 239000007788 liquid Substances 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 12
- 238000012423 maintenance Methods 0.000 claims description 12
- 239000002826 coolant Substances 0.000 claims description 10
- 239000000428 dust Substances 0.000 claims description 10
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 229920000742 Cotton Polymers 0.000 claims description 6
- 238000001179 sorption measurement Methods 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 230000009467 reduction Effects 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 239000005341 toughened glass Substances 0.000 claims description 3
- 238000000889 atomisation Methods 0.000 abstract description 5
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 230000008859 change Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 2
- 241000282414 Homo sapiens Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000006386 memory function Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D50/00—Combinations of methods or devices for separating particles from gases or vapours
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a computer power supply with good heat dissipation effect and a use method thereof, and the computer power supply comprises a shell, wherein a power supply body is fixedly arranged at the middle end of an inner cavity of the shell through a support, the top of the power supply body is adhered with a heat conduction plate through heat conduction silica gel, an air inlet pipe is fixedly arranged at the middle end of the top of the shell, a second heat dissipation fan is fixedly arranged at the lower end of the inner surface of the air inlet pipe through the support, exhaust through holes are formed in two ends of the top of the shell, a cooling liquid box is fixedly arranged at the middle end of the bottom of the shell, and a waterproof film is fixedly connected to the. According to the invention, under the mutual matching action of the heat conducting plate, the power supply body, the second heat dissipation fan, the air inlet pipe, the waterproof film, the delivery pump, the atomization spray pipe, the cooling liquid box, the heat dissipation pipe and the first heat dissipation fan, the purpose of effectively dissipating heat of the power supply body is realized, the heat dissipation effect is excellent, and the service life of the power supply body is further effectively prolonged.
Description
Technical Field
The invention relates to the technical field of computer power supplies, in particular to a computer power supply with a good heat dissipation effect and a use method thereof.
Background
An electronic computer (electronic computer) is generally called as a computer, is one of the most advanced scientific and technical inventions in the 20 th century, has extremely important influence on the production activity and social activity of human beings, is rapidly developed with strong vitality, is a modern electronic computing machine for high-speed computing, can perform numerical computation and logic computation, has a memory function, can run according to a program, automatically and quickly process mass data, is composed of a hardware system and a software system, is called as a bare computer without any software, is used as a control system of various industrial and consumer equipment, and comprises simple special-purpose equipment, industrial equipment, general equipment and the like.
The computer Power Supply (foreign name: Power Supply Unit) is a computer component which is installed in the computer and is responsible for converting the common commercial Power into the voltage which can be used by the computer, the computer Power Supply is a switch circuit, converts the common alternating current into the direct current, then controls the voltage through chopping, respectively outputs different voltages to a mainboard and a hard disk, computer components such as CD-ROM drive, computer power supply provides the required electric energy of all parts in the computer, the size of power, whether electric current and voltage are stable will directly influence the working property and the life of computer, however, current computer power supply radiating effect is unsatisfactory, can not effectual dispel the heat to the power, long-time work leads to the power easily to lead to its internal component to damage because of the high temperature, maintenance and change power not only waste time and energy, also brought not little economic loss for the user simultaneously.
Disclosure of Invention
The invention aims to provide a computer power supply with a good heat dissipation effect and a use method thereof, which have the advantage of good heat dissipation effect and solve the problems that the existing computer power supply is not ideal in heat dissipation effect, cannot effectively dissipate and cool the power supply, is easy to damage internal elements of the power supply due to overhigh temperature after long-time work, is time-consuming and labor-consuming to maintain and replace the power supply, and brings little economic loss to a user.
In order to achieve the purpose, the invention provides the following technical scheme: a computer power supply with good heat dissipation effect comprises a shell, wherein a power supply body is fixedly arranged at the middle end of an inner cavity of the shell through a support, a heat conduction plate is connected to the top of the power supply body through heat conduction silica gel, an air inlet pipe is fixedly arranged at the middle end of the top of the shell, a second heat dissipation fan is fixedly arranged at the lower end of the inner surface of the air inlet pipe through a support, exhaust through holes are formed in two ends of the top of the shell, a cooling liquid box is fixedly arranged at the middle end of the bottom of the shell, a waterproof film is fixedly connected to the top of the cooling liquid box, the top of the waterproof film is connected to the bottom of the power supply body through a heat conduction silica gel, a heat dissipation pipe is fixedly arranged between two ends of the bottom of the cooling liquid box, a delivery pump is fixedly arranged at the lower end of the left side, the output of delivery pump passes through pipeline fixedly connected with atomizing spray tube, support fixed mounting is passed through in the bottom of coolant liquid incasement chamber in the bottom of atomizing spray tube, the equal fixedly connected with bracing piece in both ends of shell surface bottom, two there is first heat dissipation fan through support fixed mounting between the lower extreme that the bracing piece is close to one side each other.
Preferably, the bottom of the supporting rod is fixedly connected with an assembly plate, and the surface of the assembly plate is provided with mounting holes.
Preferably, the upper end of the front surface of the cooling liquid tank is provided with a liquid viewing window, the inner side of the liquid viewing window comprises transparent toughened glass, the upper end of the left side of the cooling liquid tank is fixedly connected with a water injection pipe, and the left side of the water injection pipe is in threaded connection with a sealing cover.
Preferably, the upper end of the inner surface of the air inlet pipe is fixedly provided with an activated carbon adsorption net, and the surface of the exhaust through hole is fixedly provided with dust filter cotton.
Preferably, the middle end of the top of the heat conducting plate is fixedly provided with a first guide plate, and the two sides of the upper end of the inner cavity of the shell are fixedly provided with second guide plates.
Preferably, the front surface of the shell is fixedly provided with a maintenance plate through bolts, and the maintenance plate is made of organic glass.
Preferably, the use method of the computer power supply heat dissipation comprises the following steps:
A. firstly, adding a proper amount of cooling liquid into a cooling liquid tank, after the addition of the cooling liquid is completed, starting a power supply body to operate, starting a delivery pump to work, wherein the delivery pump can drive the cooling liquid in the cooling liquid tank to be delivered to an atomization spray pipe through a radiating pipe and a pipeline, the cooling liquid is fully atomized through the atomization spray pipe and then uniformly sprayed to the bottom of the power supply body, the fully atomized cooling liquid can effectively dissipate the heat of the liquid at the bottom of the power supply body, and then the cooling liquid after heat exchange can fall to the bottom of the cooling liquid tank for centralized collection;
B. then, starting a first heat dissipation fan to work, wherein the first heat dissipation fan can drive external air flow to blow to the surfaces of the heat dissipation pipes and the bottom of the cooling liquid tank, and the rapidly flowing air flow can perform heat dissipation treatment on the cooling liquid in the heat dissipation pipes and the cooling liquid in the cooling liquid tank, so that the cooling liquid can be circularly cooled and reused;
C. then start the intraductal second heat dissipation fan of air inlet and carry out work, the work of second heat dissipation fan can drive external air current and blow through the air-supply line to the surface of heat-conducting plate, and the air current that flows fast can carry out the thermal-radiating treatment to the heat-conducting plate, makes the heat-conducting plate can carry out quick cooling, and the heat-conducting plate after the cooling down can carry out continuous absorption to the heat at power body top simultaneously, and then makes the effectual reduction of power body temperature.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention can effectively absorb the heat of the power supply body during working through the arrangement of the heat conducting plate, and can quickly radiate the heat to the outside so as to achieve the purpose of radiating the top of the power supply body, can drive the outside air flow to blow to the heat conducting plate in the shell through the arrangement of the second radiating fan and the air inlet pipe so that the air flow can quickly radiate the heat conducting plate, so that the heat conducting plate can continuously absorb the heat of the power supply body, thereby further improving the radiating effect of the power supply body, improving the waterproof performance of the bottom of the power supply body through the arrangement of the waterproof film, and can uniformly spray the cooled coolant to the bottom of the power supply body while cooling the coolant in the coolant tank through the arrangement of the delivery pump, the atomizing spray pipe, the coolant tank, the radiating pipe and the first radiating fan, the purpose of effectively cooling the bottom of power body has been reached, under whole complex effect, the purpose of effectively dispelling the heat to power body has been realized, the radiating effect is splendid, and then the effectual life who improves power body, it is unsatisfactory to have solved current computer power radiating effect, can not effectually dispel the heat to the power and cool off, long-time work leads to the power to damage because of the high temperature leads to its internal component easily, the maintenance is not only wasted time and energy with the change power, the problem of not little economic loss has also been brought for the user simultaneously.
2. According to the invention, through the arrangement of the liquid viewing window, a user can conveniently observe the liquid level in the cooling liquid tank, through the arrangement of the maintenance plate, the user can conveniently maintain the components in the shell, through the arrangement of the assembly plate and the mounting hole, the user can conveniently install and fix the whole body, through the arrangement of the dust filter cotton and the activated carbon adsorption net, the dust in the external air flow can be effectively filtered, the dust is prevented from being accumulated in the shell to influence the normal work of the power supply body, and through the arrangement of the first guide plate and the second guide plate, the air flow in the shell is favorably discharged to the outside.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic cross-sectional view of the present invention;
FIG. 3 is a schematic cross-sectional view of an air inlet duct according to the present invention;
FIG. 4 is a schematic cross-sectional view of the coolant tank of the present invention.
In the figure: 1. a housing; 2. maintaining the guard plate; 3. a support bar; 4. assembling a plate; 5. a radiating pipe; 6. a first heat dissipation fan; 7. a coolant tank; 8. dust filter cotton; 9. an exhaust through hole; 10. an air inlet pipe; 11. a first baffle; 12. a heat conducting plate; 13. a second baffle; 14. a power supply body; 15. a waterproof film; 16. mounting holes; 17. a liquid viewing window; 18. an activated carbon adsorption net; 19. a second heat dissipation fan; 20. a water injection pipe; 21. an atomizing nozzle; 22. a delivery pump.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description herein, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings to facilitate the description of the patent and to simplify the description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be considered limiting of the patent. In the description of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can, for example, be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
Referring to fig. 1-4, a computer power supply with good heat dissipation effect comprises a housing 1, a maintenance plate 2 is fixedly installed on the front surface of the housing 1 through bolts, the maintenance plate 2 is arranged to facilitate a user to maintain the components inside the housing 1, the maintenance plate 2 is made of organic glass, a power supply body 14 is fixedly installed at the middle end of the inner cavity of the housing 1 through a bracket, a heat conduction plate 12 is connected to the top of the power supply body 14 through heat conduction silica gel, a first guide plate 11 is fixedly installed at the middle end of the top of the heat conduction plate 12, second guide plates 13 are fixedly installed on both sides of the upper end of the inner cavity of the housing 1 to facilitate the air flow inside the housing 1 to be discharged to the outside through the arrangement of the first guide plate 11 and the second guide plates 13, an air inlet pipe 10 is fixedly installed at the middle end of the top of the housing 1, and a second heat dissipation fan 19, both ends of the top of the shell 1 are provided with exhaust through holes 9, the upper end of the inner surface of the air inlet pipe 10 is fixedly provided with an activated carbon adsorption net 18, the surface of the exhaust through holes 9 is fixedly provided with dust filter cotton 8, the dust in the external air flow can be effectively filtered through the arrangement of the dust filter cotton 8 and the activated carbon adsorption net 18, the dust is prevented from being accumulated in the shell 1 and influencing the normal work of a power supply body 14, the middle end of the bottom of the shell 1 is fixedly provided with a cooling liquid box 7, the upper end of the front surface of the cooling liquid box 7 is provided with a liquid observation window 17, through the arrangement of the liquid observation window 17, a user can conveniently observe the liquid level in the cooling liquid box 7, the inner side of the liquid observation window 17 comprises transparent toughened glass, the upper end of the left side of the cooling liquid box 7 is fixedly connected with a water injection pipe 20, the left side of the water injection pipe 20, the top of the waterproof film 15 is connected to the bottom of the power supply body 14 through a heat-conducting silicon adhesive, a radiating pipe 5 is fixedly arranged between two ends of the bottom of the cooling liquid tank 7, a delivery pump 22 is fixedly arranged at the left lower end of the inner cavity of the cooling liquid tank 7 through a support, the input end of the delivery pump 22 is fixedly connected to the left end of the top of the radiating pipe 5, the output end of the delivery pump 22 is fixedly connected with an atomizing spray pipe 21 through a pipeline, the bottom of the atomizing spray pipe 21 is fixedly arranged at the bottom of the inner cavity of the cooling liquid tank 7 through a support, supporting rods 3 are fixedly connected to two ends of the bottom of the outer surface of the shell 1, an assembling plate 4 is fixedly connected to the bottom of the supporting rods 3, mounting holes 16 are formed in the surface of the assembling plate 4, the whole body can be conveniently installed and fixed by a user, a, through the arrangement of the heat conducting plate 12, the heat in the working process of the power supply body 14 can be effectively absorbed, and simultaneously, the heat can be rapidly dissipated to the outside, so as to achieve the purpose of dissipating the heat at the top of the power supply body 14, through the arrangement of the second heat dissipating fan 19 and the air inlet pipe 10, the external air flow can be driven to blow towards the heat conducting plate 12 inside the shell 1, so that the air flow can rapidly dissipate the heat of the heat conducting plate 12, the heat conducting plate 12 can continuously absorb the heat of the power supply body 14, the heat dissipating effect of the power supply body 14 is further improved, through the arrangement of the waterproof film 15, the waterproof performance at the bottom of the power supply body 14 is improved, through the arrangement of the delivery pump 22, the atomizing spray pipe 21, the cooling liquid box 7, the heat dissipating pipe 5 and the first heat dissipating fan 6, the cooling liquid inside the cooling liquid box 7 can be uniformly sprayed towards the bottom of the power supply body 14, the purpose of effectively cooling the bottom of power supply body 14 has been reached, under whole complex effect, the purpose of effectively dispelling the heat to power supply body 14 has been realized, the radiating effect is splendid, and then the effectual life who improves power supply body 14, it is unsatisfactory to have solved current computer power supply radiating effect, can not effectually dispel the heat the cooling to the power, long-time work leads to the power to damage because of its internal component that the high temperature leads to easily, maintenance and change power are not only wasted time and energy, also brought not little economic loss's problem for the user simultaneously.
A method for using computer power supply heat dissipation comprises the following steps:
A. firstly, adding a proper amount of cooling liquid into a cooling liquid tank 7, after the addition of the cooling liquid is completed, starting a power supply body 14 to operate, starting a delivery pump 22 to operate, wherein the delivery pump 22 can drive the cooling liquid in the cooling liquid tank 7 to be delivered to an atomization spray pipe 21 through a heat dissipation pipe 5 and a pipeline, after the cooling liquid is sufficiently atomized through the atomization spray pipe 21, the cooling liquid is uniformly sprayed to the bottom of the power supply body 14, the sufficiently atomized cooling liquid can perform effective liquid heat dissipation on the bottom of the power supply body 14, and then the cooling liquid after heat exchange can fall to the bottom of the cooling liquid tank 7 to be collected in a centralized manner;
B. then, the first heat dissipation fan 6 is started to work, the first heat dissipation fan 6 can drive external air flow to blow towards the surface of the heat dissipation pipe 5 and the bottom of the cooling liquid tank 7, and the fast flowing air flow can perform heat dissipation treatment on the cooling liquid in the heat dissipation pipe 5 and the cooling liquid in the cooling liquid tank 7, so that the cooling liquid can be circularly cooled and reused;
C. then start second heat dissipation fan 19 and work in the air-supply line 10, second heat dissipation fan 19 work can drive external air current and blow through air-supply line 10 to the surface of heat-conducting plate 12, and the air current that flows fast can carry out the thermal-radiating treatment to heat-conducting plate 12, makes heat-conducting plate 12 can carry out quick cooling, and heat-conducting plate 12 after the while cooling can carry out continuous absorption to the heat at power body 14 top, and then makes the effectual reduction of power body 14 temperature.
When the cooling device is used, firstly, a proper amount of cooling liquid is added into the cooling liquid tank 7, after the addition of the cooling liquid is completed, the power supply body 14 is started to operate, the conveying pump 22 can drive the cooling liquid in the cooling liquid tank 7 to be conveyed to the atomizing spray pipe 21 through the radiating pipe 5 and the pipeline, the cooling liquid is fully atomized through the atomizing spray pipe 21 and then uniformly sprayed to the bottom of the power supply body 14, the fully atomized cooling liquid can effectively dissipate liquid heat from the bottom of the power supply body 14, and then the cooling liquid after heat exchange can fall to the bottom of the cooling liquid tank 7 to be collected in a centralized manner; then, the first heat dissipation fan 6 is started to work, the first heat dissipation fan 6 can drive external air flow to blow towards the surface of the heat dissipation pipe 5 and the bottom of the cooling liquid tank 7, and the fast flowing air flow can perform heat dissipation treatment on the cooling liquid in the heat dissipation pipe 5 and the cooling liquid in the cooling liquid tank 7, so that the cooling liquid can be circularly cooled and reused; then start second heat dissipation fan 19 and work in the air-supply line 10, second heat dissipation fan 19 work can drive external air current and blow through air-supply line 10 to the surface of heat-conducting plate 12, and the air current that flows fast can carry out the thermal-radiating treatment to heat-conducting plate 12, makes heat-conducting plate 12 can carry out quick cooling, and heat-conducting plate 12 after the while cooling can carry out continuous absorption to the heat at power body 14 top, and then makes the effectual reduction of power body 14 temperature.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a computer power supply that radiating effect is good, includes shell (1), its characterized in that: the middle end of the inner cavity of the shell (1) is fixedly provided with a power supply body (14) through a support, the top of the power supply body (14) is bonded with a heat conducting plate (12) through heat conducting silica gel, the middle end of the top of the shell (1) is fixedly provided with an air inlet pipe (10), the lower end of the inner surface of the air inlet pipe (10) is fixedly provided with a second heat dissipation fan (19) through a support, the two ends of the top of the shell (1) are respectively provided with an exhaust through hole (9), the middle end of the bottom of the shell (1) is fixedly provided with a cooling liquid box (7), the top of the cooling liquid box (7) is fixedly connected with a waterproof film (15), the top of the waterproof film (15) is bonded with the bottom of the power supply body (14) through the heat conducting silica gel, a heat dissipation pipe (5) is fixedly arranged between the two ends of the bottom of the cooling liquid box (7), the left, input fixed connection in the left end at cooling tube (5) top of delivery pump (22), pipeline fixedly connected with atomizing spray tube (21) is passed through to the output of delivery pump (22), support fixed mounting is passed through in the bottom of coolant liquid case (7) inner chamber in the bottom of atomizing spray tube (21), the equal fixedly connected with bracing piece (3) in both ends of shell (1) surface bottom, two there is first heat dissipation fan (6) through support fixed mounting between bracing piece (3) the lower extreme that is close to one side each other.
2. The computer power supply with good heat dissipation effect of claim 1, wherein: the bottom fixedly connected with assembly plate (4) of bracing piece (3), mounting hole (16) have been seted up on the surface of assembly plate (4).
3. The computer power supply with good heat dissipation effect of claim 1, wherein: the upper end on coolant liquid case (7) obverse surface has seted up and has looked liquid window (17), and the inboard of looking liquid window (17) includes transparent toughened glass, the left upper end fixedly connected with water injection pipe (20) of coolant liquid case (7), the left side threaded connection of water injection pipe (20) has sealed lid.
4. The computer power supply with good heat dissipation effect of claim 1, wherein: the upper end of the inner surface of the air inlet pipe (10) is fixedly provided with an activated carbon adsorption net (18), and the surface of the exhaust through hole (9) is fixedly provided with dust filter cotton (8).
5. The computer power supply with good heat dissipation effect of claim 1, wherein: the middle end of the top of the heat conducting plate (12) is fixedly provided with a first guide plate (11), and two sides of the upper end of the inner cavity of the shell (1) are fixedly provided with second guide plates (13).
6. The computer power supply with good heat dissipation effect of claim 1, wherein: the maintenance plate is characterized in that a maintenance plate (2) is fixedly mounted on the front surface of the shell (1) through bolts, and the maintenance plate (2) is made of organic glass.
7. A computer power supply heat dissipation use method is characterized in that: the using method comprises the following steps:
A. firstly, adding a proper amount of cooling liquid into a cooling liquid tank (7), after the addition of the cooling liquid is completed, starting a power supply body (14) to operate, starting a delivery pump (22) to operate, wherein the delivery pump (22) can drive the cooling liquid in the cooling liquid tank (7) to operate, the cooling liquid is delivered to an atomizing spray pipe (21) through a radiating pipe (5) and a pipeline, the cooling liquid is fully atomized through the atomizing spray pipe (21), and then uniformly sprayed to the bottom of the power supply body (14), the fully atomized cooling liquid can effectively dissipate the liquid heat of the bottom of the power supply body (14), and then the cooling liquid subjected to heat exchange can fall to the bottom of the cooling liquid tank (7) for centralized collection;
B. then, the first heat dissipation fan (6) is started to work, the first heat dissipation fan (6) can drive external air flow to blow to the surface of the heat dissipation pipe (5) and the bottom of the cooling liquid tank (7), and the rapidly flowing air flow can perform heat dissipation treatment on the cooling liquid in the heat dissipation pipe (5) and the cooling liquid in the cooling liquid tank (7), so that the cooling liquid can be circularly cooled and reused;
C. then start second heat dissipation fan (19) and carry out work in air-supply line (10), second heat dissipation fan (19) work can drive external air current and blow through air-supply line (10) to the surface of heat-conducting plate (12), the air current of fast flow can carry out the thermal-radiating treatment to heat-conducting plate (12), make heat-conducting plate (12) can carry out quick cooling, heat-conducting plate (12) after the cooling simultaneously can carry out continuous absorption to the heat at power body (14) top, and then make the effectual reduction of power body (14) temperature.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011315987.8A CN112445312A (en) | 2020-11-22 | 2020-11-22 | Computer power supply with good heat dissipation effect and use method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011315987.8A CN112445312A (en) | 2020-11-22 | 2020-11-22 | Computer power supply with good heat dissipation effect and use method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113381092A (en) * | 2021-06-17 | 2021-09-10 | 苏州物睿科技有限公司 | Cooling liquid purging device for testing automobile battery assembly |
| CN113690205A (en) * | 2021-09-26 | 2021-11-23 | 深圳市铨天科技有限公司 | Chip heat dissipation packaging structure |
| CN115802696A (en) * | 2022-08-23 | 2023-03-14 | 沭阳鸿行照明有限公司 | Low-noise power supply with waterproof function for landscape lamp |
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| CN113381092A (en) * | 2021-06-17 | 2021-09-10 | 苏州物睿科技有限公司 | Cooling liquid purging device for testing automobile battery assembly |
| CN113381092B (en) * | 2021-06-17 | 2023-09-05 | 苏州物睿科技有限公司 | Cooling liquid purging device for automobile battery assembly test |
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| CN113690205B (en) * | 2021-09-26 | 2024-02-02 | 深圳市铨天科技有限公司 | Chip heat dissipation packaging structure |
| CN115802696A (en) * | 2022-08-23 | 2023-03-14 | 沭阳鸿行照明有限公司 | Low-noise power supply with waterproof function for landscape lamp |
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