CN211956400U

CN211956400U - Computer power supply overheat protection device

Info

Publication number: CN211956400U
Application number: CN202020978418.0U
Authority: CN
Inventors: 朱昱林; 王翰钊
Original assignee: Zhengzhou School For Surveying And Mapping
Current assignee: Zhengzhou School For Surveying And Mapping
Priority date: 2020-06-02
Filing date: 2020-06-02
Publication date: 2020-11-17
Anticipated expiration: 2030-06-02

Abstract

The utility model discloses a computer power supply overheat protection device, which comprises a housin, the interior diapire fixedly connected with circuit board of casing, the last fixed surface of circuit board is connected with the heat-conducting plate, and the fixed condenser pipe that inlays in the front of heat-conducting plate, the last fixed surface of heat-conducting plate are connected with the heat dissipation scale, the last fixed surface of heat dissipation scale is connected with temperature sensor, the interior roof fixedly connected with condensing box of casing. This computer power supply overheat protection device can effectively guide the produced heat on the circuit board through the heat-conducting plate, make the temperature on the circuit board reduce, and with heat transfer to heat dissipation scale, the realization gives off the heat fast, can carry out the pump drainage to the coolant liquid in the condensing box through being provided with the water pump, the condenser pipe through setting up can make the coolant liquid flow in the condenser pipe, the heat that gives off on the heat-conducting plate that can be fine absorbs, make the temperature reduction in the circuit board, slow down the ageing speed of circuit board, the life of power has been prolonged.

Description

Computer power supply overheat protection device

Technical Field

The utility model relates to a computer power technology field specifically is a computer power supply overheat protection device.

Background

The computer belongs to weak current products, that is to say, the working voltage of the components is relatively low, generally within plus or minus 12 volts, and is direct current. However, the common commercial power is 220 v ac, which cannot be directly used on computer components, so the computer needs a power supply part as many household appliances, which is responsible for converting the common commercial power into voltage that can be used by the computer, and is generally installed in the computer.

Computer power is indispensable when using the computer, computer power is when the long term is used, often can be because of the weather high temperature or because the operation of the inside high-power device of power can produce too high heat, consequently need the radiating equipment to dispel the heat to the power, and present computer power radiating equipment is T type or L type heat dissipation scale mostly, it is relatively limited and the radiating effect is poor during the use, damage the circuit board easily, cause the life of power to shorten greatly, we provide a computer power overheat protection device for this and solve above problem.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a computer power supply overheat protection device to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a computer power supply overheating protection device comprises a shell, wherein a circuit board is fixedly connected to the inner bottom wall of the shell, a heat conducting plate is fixedly connected to the upper surface of the circuit board, a condensing pipe is fixedly inlaid in the front of the heat conducting plate, a heat dissipation scale is fixedly connected to the upper surface of the heat conducting plate, a temperature sensor is fixedly connected to the upper surface of the heat dissipation scale, a condensing box is fixedly connected to the inner top wall of the shell, a water pump is fixedly connected to the inner bottom wall of the condensing box, the output end of the water pump is fixedly communicated with a first water pipe, the output end of the first water pipe sequentially penetrates through the condensing box and the heat dissipation scale and is fixedly communicated with the input end of the condensing pipe through a first clamp, the output end of the condensing pipe is fixedly communicated with a second water pipe through a second clamp, the top end of the second water pipe penetrates through the heat dissipation scale and, the interior roof fixedly connected with signal sensor of casing, the interior diapire fixed of casing is inlayed and is had the singlechip, the right flank fixedly connected with control switch of casing, the front fixedly connected with pilot lamp of casing, the back fixedly connected with air discharge window of casing.

Preferably, the left side face and the right side face of the condensation box are fixedly connected with fixing blocks, and the upper surfaces of the fixing blocks are fixedly connected with the inner bottom wall of the shell.

Preferably, the front surface of the heat conducting plate is provided with heat dissipation holes which are arranged equidistantly, and the number of the heat dissipation holes is at least twelve.

Preferably, a set of symmetrical ventilation holes is formed in the inner side wall of the shell, and each ventilation hole is fixedly connected with a dust cover.

Preferably, a nameplate is arranged in front of the shell, and the back surface of the nameplate is fixedly connected with the front surface of the shell.

Preferably, two sets of symmetrical supporting pads are arranged below the shell, and the upper surface of each supporting pad is fixedly connected with the bottom surface of the shell.

Advantageous effects

The utility model discloses possess following beneficial effect:

1. the heat that produces on can effectively guiding the circuit board through the heat-conducting plate that sets up, make the temperature on the circuit board reduce, and with heat transfer to heat dissipation scale, the realization gives off the heat fast, can carry out the pump drainage to the coolant liquid in the condensing box through being provided with the water pump, the condenser pipe through setting up can make the coolant liquid flow in the condenser pipe, the heat that gives off on the heat-conducting plate that can be fine absorbs, make the temperature in the circuit board reduce, slow down the ageing speed of circuit board, the life of power has been prolonged.

2. The temperature sensor through setting up can be accurate the definite temperature of measuring on the heat dissipation scale to change the temperature value into digital signal, can receive the digital signal that temperature sensor transmitted through the signal sensor who sets up, and in time send the signal of telecommunication for the singlechip, the signal of telecommunication that singlechip received signal sensor sent in time controls control switch, makes the water pump carry out work, removes the coolant liquid in the condenser pipe, absorbs the heat on the heat-conducting plate.

Drawings

Fig. 1 is a sectional view of a front view of a housing of the present invention;

fig. 2 is a front view of the housing of the present invention;

fig. 3 is a rear view of the housing of the present invention.

In the figure: 1 casing, 2 second water pipes, 3 condensing tanks, 4 water pumps, 5 temperature sensor, 6 fixed blocks, 7 first water pipes, 8 singlechips, 9 control switch, 10 ventilation holes, 11 dust covers, 12 first clamps, 13 circuit boards, 14 supporting pads, 15 condenser pipes, 16 louvres, 17 heat-conducting plates, 18 second clamps, 19 heat dissipation scales, 20 signal sensor, 21 air discharge window, 22 pilot lamps, 23 data plates.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a computer power supply overheat protection device comprises a shell 1, a circuit board 13 is fixedly connected with the inner bottom wall of the shell 1, the upper surface of the circuit board 13 is fixedly connected with a heat conducting plate 17, a condensing pipe 15 is fixedly embedded in the front surface of the heat conducting plate 17, heat dissipation holes 16 are arranged on the front surface of the heat conducting plate 17 at equal intervals, the number of the heat dissipation holes 16 is at least twelve, the heat conducting plate 17 is subjected to heat dissipation, heat dissipation scales 19 are fixedly connected with the upper surface of the heat conducting plate 17, temperature sensors 5 are fixedly connected with the upper surfaces of the heat dissipation scales 19, a condensing box 3 is fixedly connected with the inner top wall of the shell 1, fixed blocks 6 are fixedly connected with the left side surface and the right side surface of the condensing box 3, the upper surfaces of the two fixed blocks 6 are fixedly connected with the inner bottom wall of the shell 1, the condensing box 3 is more stable, a, the output end of a first water pipe 7 sequentially penetrates through a condensation box 3 and a radiating scale 19 and is fixedly communicated with the input end of the condensation box 15 through a first clamp 12, the output end of the condensation box 15 is fixedly communicated with a second water pipe 2 through a second clamp 18, the top end of the second water pipe 2 penetrates through the radiating scale 19 and is fixedly communicated with the left side surface of the condensation box 3, the inner top wall of a shell 1 is fixedly connected with a signal sensor 20, the inner bottom wall of the shell 1 is fixedly embedded with a single chip microcomputer 8, the right side surface of the shell 1 is fixedly connected with a control switch 9, the inner side wall of the shell 1 is provided with a group of symmetrical ventilation holes 10, the inner wall of each ventilation hole 10 is fixedly connected with a dust cover 11 for ventilating the inside of the shell 1, the front surface of the shell 1 is fixedly connected with an indicator lamp 22, the front surface of the shell 1 is provided with a nameplate 23, the back surface of the name, the back fixedly connected with air discharge window 21 of casing 1, the below of casing 1 is equipped with two sets of symmetrical supporting pads 14, and the upper surface of every supporting pad 14 all supports casing 1 with the bottom surface fixed connection of casing 1.

The working principle is as follows: when the computer power supply works, the circuit board 13 can generate a large amount of heat, the heat conducting plate 17 absorbs the heat on the circuit board 13, then the heat conducting plate 17 transmits the heat to the heat dissipating scale 19 to transmit and dissipate the heat, when the temperature of the heat dissipating scale 19 reaches a certain value, the temperature sensor works and transmits a digital signal to the signal sensor 21, the signal sensor 21 transmits an electric signal to the single chip microcomputer 8, the single chip microcomputer 8 sends a command to the control switch 9 to enable the water pump 4 to work to extract the cooling liquid in the condensation box 3, the cooling liquid flows in the internal circulation of the condensation pipe 15 to absorb the heat on the heat conducting plate 17, the temperature inside the shell 1 is reduced, when the temperature is reduced to a certain degree, the single chip microcomputer 8 commands the control switch 9, and the water pump 4 stops.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A computer power supply overheat protection device comprising a case (1), characterized in that: the solar water heater is characterized in that the inner bottom wall of the shell (1) is fixedly connected with a circuit board (13), the upper surface of the circuit board (13) is fixedly connected with a heat-conducting plate (17), the front of the heat-conducting plate (17) is fixedly inlaid with a condensing tube (15), the upper surface of the heat-conducting plate (17) is fixedly connected with a heat-dissipating scale (19), the upper surface of the heat-dissipating scale (19) is fixedly connected with a temperature sensor (5), the inner top wall of the shell (1) is fixedly connected with a condensing box (3), the inner bottom wall of the condensing box (3) is fixedly connected with a water pump (4), the output end of the water pump (4) is fixedly communicated with a first water pipe (7), the output end of the first water pipe (7) sequentially penetrates through the condensing box (3) and the heat-dissipating scale (19) and is fixedly communicated with the input end of the condensing tube (15) through a first clamp (12), the output end of the condensing tube (, the top of second water pipe (2) runs through heat dissipation scale (19) and communicates with the left surface of condensing box (3) is fixed, the interior roof fixedly connected with signal sensor (20) of casing (1), the interior bottom wall fixed of casing (1) is inlayed and is had singlechip (8), the right flank fixedly connected with control switch (9) of casing (1), the positive fixedly connected with pilot lamp (22) of casing (1), the back fixedly connected with air discharge window (21) of casing (1).

2. The computer power supply overheat protection apparatus according to claim 1, wherein: the left side surface and the right side surface of the condensation box (3) are fixedly connected with fixing blocks (6), and the upper surfaces of the fixing blocks (6) are fixedly connected with the inner bottom wall of the shell (1).

3. The computer power supply overheat protection apparatus according to claim 1, wherein: the front surface of the heat conducting plate (17) is provided with heat dissipation holes (16) which are arranged equidistantly, and the number of the heat dissipation holes (16) is at least twelve.

4. The computer power supply overheat protection apparatus according to claim 1, wherein: a set of symmetrical ventilation holes (10) are formed in the inner side wall of the shell (1), and each ventilation hole (10) is fixedly connected with a dust cover (11).

5. The computer power supply overheat protection apparatus according to claim 1, wherein: a nameplate (23) is arranged in front of the shell (1), and the back surface of the nameplate (23) is fixedly connected with the front surface of the shell (1).

6. The computer power supply overheat protection apparatus according to claim 1, wherein: two sets of symmetrical supporting pads (14) are arranged below the shell (1), and the upper surface of each supporting pad (14) is fixedly connected with the bottom surface of the shell (1).